Fe-Cr-Al合金高温氧化行为电子理论研究

从电子层面系统研究Fe-Cr-Al合金氧化膜的形成机理,杂质硫对氧化膜黏附性的影响,稀土元素在改善氧化膜黏附性方面的作用,揭示合金氧化的物理本质.研究表明氧使Al在合金表层的环境敏感镶嵌能最低,促使Al原子从合金内部向合金表面扩散,最终在合金表面偏聚.由于氧与Al间的亲和力较大,氧原子易与Al结合生成Al2O3保护膜.杂质S在基体/氧化膜界面的环境敏感镶嵌能较低,可通过扩散偏聚在基体/氧化膜界面,削弱氧化膜与合金基体的结合力.当合金中加入Y后,Y易与S结合形成稳定的硫化物,阻碍S向基体/氧化膜界面的偏聚,显著提高氧化膜的黏附性,提高合金抗高温氧化能力.     

Nb-Al合金高温氧化机理

通过自编软件建立了铝氧化膜与基体铌界面的原子集团模型,用递归法计算了合金的原子埋置能、原子结合能等电子参数,从电子层面分析铌合金高温氧化机理.研究表明:铝通过晶界扩散偏聚在合金表面,并与氧结合生成致密的Al2O3氧化膜,阻挡氧向铌基体扩散.晶界和稀土元素能提高氧化膜与基体间的原子结合能,增加其界面的结合强度,加强氧化膜与基体铌间的黏附性.因此,通过在合金中添加稀土元素或细化合金晶粒均能提高铌合金的抗高温氧化性能.     

Nb-Ti-Al合金高温氧化机理电子理论研究

采用递归法计算了Nb合金的电子态密度、原子镶嵌能、亲和能和团簇能等电子结构参数,研究Nb合金高温氧化机理.研究表明,氧在Nb合金表面的吸附能较低,易在合金表面吸附,并逐渐扩散到Nb合金的基体中.氧在合金基体中镶嵌能为负值,氧的态密度和Nb相似,在Nb中具有很高的溶解度.Ti,Al在合金晶内的镶嵌能均高于各自在合金表面的镶嵌能,Ti,Al从合金内部向合金表面扩散,最终在Nb合金表面偏聚,形成富Ti,Al的表层.团簇能计算结果表明Nb合金表面的Ti,Al原子各自均有聚集倾向,分别形成Ti和Al原子团.氧与合金     

镁合金电子结构与腐蚀特性研究

采用递归法计算了镁合金电子结构.研究发现Mg的态密度在晶内与表面接近,当表面有氧或氢氧时态密度形状改变很大,因此Mg在晶内、表面性质是接近的,但当合金表面渗透氧或氢时,合金性质有明显变化.Al,Y,La三种元素在晶体表面的掺杂原子镶嵌能均低于各自在晶内的掺杂原子镶嵌能,Al, Y, La从晶内向晶体表面扩散、并在合金表面偏聚.Al-O, Y-O, La-O, Mg-O及Mg-O-H间的亲和能均为负数,这些原子间存在亲和力,可以在合金中相互作用形成化合物.由于Mg-O-H间的亲和能远低于Mg-O的亲和能,因此Mg(OH)₂比MgO更稳定.氧化初期氧与Mg, Al, Y, La等生成氧化物,当合金与腐蚀介质接触时,MgO与腐蚀介质中的水发生反应生成Mg(OH)₂.Al₂O₃,（Y,La）₂O₃及Mg(OH)₂能对合金起到保护作用,提高合金的耐腐蚀性能. 关键词： 电子结构 Mg合金 腐蚀特性     

铜基大块非晶合金添加微量元素对腐蚀行为的影响机理研究

通过分子动力学方法模拟了Cu-Al合金液相,然后模拟降温过程得到Cu-Al非晶合金.通过计算机编程建立了Cu-Al-M非晶基体、Cu-Al-M非晶表面及吸附O原子Cu-Al-M非晶表面原子结构模型.利用实空间连分数方法,研究了添加微量合金元素Zr,Nb,Ta,V,Y,Sc对Cu基大块非晶合金的腐蚀行为的影响机理.研究发现合金元素Zr,Nb,Ta,V,Sc不向清洁Cu基非晶表面偏聚,但除Y外向有氧吸附的表面偏聚,说明有氧吸附后Cu基非晶表面偏聚发生逆转.键级积分计算表明Zr,Nb,Ta,V,Y,Sc元素均增大与氧之间的结合力,易形成氧化膜,提高Cu基大块非晶的耐蚀性.稀土Y提高Cu基大块非晶的耐蚀性可能是由于它向合金与氧化膜界面偏聚并提高了合金与氧化膜的结合力.     

镁合金电子结构与腐蚀特性研究

采用递归法计算了镁合金电子结构.研究发现Mg的态密度在晶内与表面接近,当表面有氧或氢氧时态密度形状改变很大,因此Mg在晶内、表面性质是接近的,但当合金表面渗透氧或氢时,合金性质有明显变化.Al,Y,La三种元素在晶体表面的掺杂原子镶嵌能均低于各自在晶内的掺杂原子镶嵌能,Al, Y, La从晶内向晶体表面扩散、并在合金表面偏聚.Al-O, Y-O, La-O, Mg-O及Mg-O-H间的亲和能均为负数,这些原子间存在亲和力,可以在合金中相互作用形成化合物.由于Mg-O-H间的亲和能远低于Mg-O的亲和能,因此Mg(OH)₂比MgO更稳定.氧化初期氧与Mg, Al, Y, La等生成氧化物,当合金与腐蚀介质接触时,MgO与腐蚀介质中的水发生反应生成Mg(OH)₂.Al₂O₃,（Y,La）₂O₃及Mg(OH)₂能对合金起到保护作用,提高合金的耐腐蚀性能.     

杂质S对Fe/Al_2O_3界面结合影响的第一性原理研究

采用基于密度泛函理论的第一性原理平面波赝势方法,研究了杂质S对Fe/Al_2O_3界面结合的影响.计算结果表明:S在界面上Fe3原子处的界面偏析能最小,因此S易于向Fe3原子处偏析.Fe/Al_2O_3界面的结合主要受界面两侧Fe和O原子间相互作用控制.态密度、键重叠布居数和电子密度的计算结果均表明:S在界面处的偏析减弱了界面处Fe原子和O原子之间的相互作用,而且S的存在会引起Fe和O原子之间较强的静电排斥,这些导致了界面结合力的下降.研究结果可以使我们深入理解S在Fe-Cr-Al合金界面处的偏析造成氧化膜与合金基体结合减弱及氧化膜在S偏聚处剥离的机理.     

铌合金电子结构及其高温氧化行为

为了从电子层面揭示Nb合金高温氧化的物理本质,采用递归法计算了Nb合金的电子态密度、原子镶嵌能、亲和能等电子结构参数,探索Nb合金高温氧化机理.研究表明:氧在Nb中具备较高的扩散速率和溶解度,且氧与Nb较易发生反应,生成氧化物,这使Nb的抗高温氧化性较差.原子镶嵌能的计算结果表明,合金元素Ti,Si,Cr在基体中稳定性较低,易向Nb合金表面扩散,形成富Ti,Si,Cr的表层.合金表层中氧与Nb,Ti,Si,Cr间具有较大亲和性,可以生成相应的氧化物,形成对合金具有保护作用的氧化膜. 关键词： 递归法 高温氧化 Nb合金     

600℃高温钛合金燃烧组织演变及机理

采用摩擦氧浓度法测定600℃高温钛合金的阻燃性能,通过聚焦离子束技术和高分辨电子显微镜对燃烧组织的燃烧区、熔凝区和热影响区内不同价态的氧化产物进行表征与界面结构分析,发现燃烧产物Al₂O₃,Ti₂O₃以及TiO₂具有不同于氧化过程的形成方式;结合自由能和蒸气压计算,揭示燃烧组织演变的机理及其对合金阻燃性能的影响.结果表明,合金中6%的Al元素含量导致熔凝区/热影响区界面不能形成连续性Al₂O₃保护层;1800 K左右TiO蒸气压的显著增加造成熔凝区形成Ti₂O₃和Ti构成的疏松结构,为氧的快速内扩散提供路径;此外,燃烧区中形成的TiO₂熔体对基体不具有保护作用.因此,600℃高温钛合金不具备良好的阻燃性能.     

镁合金稀土阻燃机理电子理论研究

通过计算机软件建立镁合金的晶体,液态及其固/液界面模型.采用递归法计算了稀土元素在α-Mg、固/液界面、镁液态等原子环境中的环境敏感镶嵌能,定义并计算了Mg,La及Y与氧的原子亲和能.计算结果表明：La,Y在镁晶体中的环境敏感镶嵌能较高,不能稳定固溶于晶体中,因此在固体中的溶解度较小.合金凝固时稀土元素扩散到环境能较低的液体中,向液面聚集.由于稀土与氧的原子亲和能低于镁与氧的亲和能(镁、稀土与氧的亲和能分别为Mg-O：-14.9338 eV,La-O：-19.0608 eV,Y-O：-19.5050 eV 关键词： 电子结构 阻燃 Mg合金     

钛铝合金高温氧化机理电子理论研究

为了从电子层面揭示钛铝合金高温氧化的物理本质,采用递归法与Castep相结合的方式, 计算了原子埋置能、亲和能、结合能等电子结构参数,探索合金氧化机理.研究表明: 氧在钛中有较大固溶度,氧原子可以在钛表面的基体内聚集,逐步向深层扩散. 氧与钛具备较强的亲和力,能形成钛的氧化膜.钛基体中铝原子间具有相互吸引力, 能形成铝的原子团簇.铝原子团簇中的钛原子间相互排斥与铝形成化合物. 铝、钛与氧的亲和能相近,不易发生铝的优先氧化,而是同时生成钛的氧化物和铝的氧化物. Al₂O₃比TiO₂的结合能略低,因而更加稳定,铝在TiO₂中有较大的固溶度, 能替换其中的钛形成更稳定的Al₂O₃氧化物.     

氧化铝与Al(100)基体间界面原子结构研究

本文介绍了用MeV离子散射和沟道效应研究单晶铝表面无定型氧化层与基体之间界面原子结构的方法。报道了Al₂O₃/Al(100)界面原子结构的实验结果。实验表明,在纯氧气氛围中400℃下生成的氧化铝膜,铝和氧原子浓度比例严格为2与3之比;Al₂O₃膜和Al(100)基体之间的界面极其陡峭,氧化铝膜下Al(100)基体表面的再构层不大于一个原子层。由实验测量与用Monte Carlo方法计算结果比较,得到再构层原子离开原来晶 关键词：     

Effect of surface roughness on the development of protective Al2O3 on Fe-10Al (at.%) alloys containing 0-10 at.% Cr

The effect of alloy surface roughness, achieved by different degrees of surface polishing, on the development of protective alumina layer on Fe-10 at.% Al alloys containing 0, 5, and 10 at.% Cr was investigated during oxidation at 1000 °C in 0.1 MPa oxygen. For alloys that are not strong Al₂O₃ formers (Fe-10Al and Fe-5Cr-10Al), the rougher surfaces increased Fe incorporation into the overall surface layer. On the Fe-10Al, more iron oxides were formed in a uniform layer of mixed aluminum- and iron-oxides since the layer was thicker. On the Fe-5Cr-10Al, more iron-rich nodules developed on an otherwise thin Al₂O₃ surface layer. These nodules nucleated preferentially along surface scratch marks but not on alloy grain boundaries. For the strong Al₂O₃-forming Fe-10Cr-10Al alloy, protective alumina surface layers were observed regardless of the surface roughness. These results indicate that the formation of a protective Al₂O₃ layer on Fe-Cr-Al surfaces is not dictated by Al diffusion to the surface. More cold-worked surfaces caused an enhanced Fe diffusion, hence produced more Fe-rich oxides during the early stage of oxidation.     

Co on thin Al2O3 films grown on Ni3Al(1 0 0)

The growth of Co on thin Al₂O₃ layers on Ni₃Al(1 0 0) was investigated by Auger electron spectroscopy, high resolution electron energy loss spectroscopy (EELS), and scanning tunneling microscopy. At 300 K, Co grows in three-dimensional clusters on top of the Al₂O₃ layer. A defect structure of the alumina layer plays a crucial role during the early stage of Co growth. After deposition of 10 Å of Co, a complete screening of the dipoles of the Al₂O₃ layer due to the Co film is found in the EELS measurements. Annealing the Co film reveals a process of coalescence of Co clusters and, above 700 K, diffusion of the Co atoms through the oxide film into the substrate takes place.     

Free Surface and Interface Thermodynamics of Liquid Nickel in Contact with Alumina

Sessile drop experiments of Ni and Ni(2at.%Al) were conducted under controlled working conditions, at 1500°C, P(O₂) 10^–9 Torr. It is shown that Al and oxygen atoms engaged in the capillary driven mass transport at the interface have a significant impact on the surface/interface thermodynamics. The surface energy of liquid Ni determined from experiments in which Ni comes into contact with Al₂O₃ is significantly lower than that of high purity Ni, due to the segregation of Al. The free energy of segregation of Al to the free surface of Ni ( G _S) was found to range from –164 to –152 kJ/mol, indicating a relatively strong tendency for segregation of Al to the free surface of Ni(Al). It is proposed that an Al(O)-rich liquid layer forms adjacent to the Ni-Al₂O₃ interface, which improves interfacial adhesion. In the Ni(Al)-Al₂O₃ system, an increase in the Al content of the alloy leads to the improvement of both wetting and adhesion of the alloy on the ceramic, correlating with the improvement in the interface strength after solidification.     

Electron microscopic study on interfacial characterization of electroless Ni-W-P plating on aluminium alloy

The interface between electroless plating Ni-W-P deposit and aluminium alloy (Al) matrix at different temperature heated for 1 h was studied using transmission electron microscope. The results show that the interface between as-deposited Ni-W-P deposit and Al matrix is clear. There are no crack and cavity. The bonding of Ni-W-P deposit and Al matrix is in good condition. The Ni-W-P plating is nanocrystalline phase (5-6 nm) in diameter. After being heated at 200 °C for 1 h, the interface of Ni-W-P deposit and Al matrix is clear, without the appearance of the diffusion layer. There exist a diffusion layer and educts of intermetallic compounds of nickle and aluminium such as Al₃Ni, Al₃Ni₂, NiAl, Ni₅Al₃ and so on between Ni-W-P deposit and Al matrix after being heated at 400 °C for 1 h.     

Properties of an Al<Subscript>2</Subscript>O<Subscript>3</Subscript>/Si interface

The phase chemical composition of an Al₂O₃/Si interface formed upon molecular deposition of a 100-nm-thick Al₂O₃ layer on the Si(100) (c-Si) surface is investigated by depth-resolved ultrasoft x-ray emission spectroscopy. Analysis is performed using Al and Si L_{2, 3} emission bands. It is found that the thickness of the interface separating the c-Si substrate and the Al₂O₃ layer is approximately equal to 60 nm and the interface has a complex structure. The upper layer of the interface contains Al₂O₃ molecules and Al atoms, whose coordination is characteristic of metallic aluminum (most likely, these atoms form sufficiently large-sized Al clusters). The shape of the Si bands indicates that the interface layer (no more than 10-nm thick) adjacent to the substrate involves Si atoms in an unusual chemical state. This state is not typical of amorphous Si, c-Si, SiO₂, or SiO_x (it is assumed that these Si atoms form small-sized Si clusters). It is revealed that SiO₂ is contained in the vicinity of the substrate. The properties of thicker coatings are similar to those of the 100-nm-thick Al₂O₃ layer and differ significantly from the properties of the interfaces of Al₂O₃ thin layers.