In situ time-resolved optical measurements of a-Si thin films during excimer laser crystallization

An in situ time-resolved optical reflection and transmission (TRORT) monitoring system combining two He-Ne probe lasers, a digital oscilloscope and three fast photodetectors is developed to investigate the crystallization processes of Si thin films during excimer laser crystallization (ELC). The physical meaning of optical spectra obtained by TRORT measurements has been interpreted in detail. The melt duration and transient phase transformation dynamics of Si thin films can be determined and interpreted immediately. A high efficiency and non-destructive evaluation approach is proposed for determining the grain size of polycrystalline Si after ELC directly and immediacy under appropriate experimental conditions.     

Influences of hydrogen contents in precursor Si film to excimer laser crystallization

This paper presents for the first time experimental results which show a crucial role of the local Si-H bonding structures in Si precursors for crystallinity of polycrystalline silicon (p-Si), obtained by an excimer laser crystallization (ELC) process. This role was revealed in the distinct differences among (111) lattice plane spacings of p-Si according to deposition and dehydrogenation conditions of the precursors. It was also found that preablation behaviors, especially ebullition of the melt, are highly sensitive to the precursors. These results provide an important guide for the selection of the most adequate precursor in production, and also contribute an understanding of the mechanism of the ELC process.     

Analyses of surface coloration on TiO2 film irradiated with excimer laser

TiO₂ film of around 850 nm in thickness was deposited on a soda-lime glass by PVD sputtering and irradiated using one pulse of krypton-fluorine (KrF) excimer laser (wavelength of 248 nm and pulse duration of 25 ns) with varying fluence. The color of the irradiated area became darker with increasing laser fluence. Irradiated surfaces were characterized using optical microscopy, scanning electron microscopy, Raman spectroscopy and atomic force microscopy. Surface undergoes thermal annealing at low laser fluence of 400 and 590 mJ/cm². Microcracks at medium laser fluence of 1000 mJ/cm² are attributed to surface melting and solidification. Hydrodynamic ablation is proposed to explain the formation of micropores and networks at higher laser fluence of 1100 and 1200 mJ/cm². The darkening effect is explained in terms of trapping of light in the surface defects formed rather than anatase to rutile phase transformation as reported by others. Controlled darkening of TiO₂ film might be used for adjustable filters.     

Effect of excimer laser annealing on the properties of ZnO thin film prepared by sol-gel method

Pristine ZnO thin films have been deposited with zinc acetate [Zn(CH₃COO)₂], mono-ethanolamine (stabilizer), and isopropanol solutions by sol-gel method. After deposition, pristine ZnO thin films have been irradiated by excimer laser (λ = 248, KrF) source with energy density of 50 mJ/cm² for 30 sec. The effect of excimer laser annealing on the optical and structural properties of ZnO thin films are investigated by photoluminescence and field emission scanning electron microscope. As-grown ZnO thin films show a huge peak of visible region and a wide full width at half maximum (FWHM) of UV region due to low quality with amorphous ZnO thin films. After KrF excimer laser annealing, ZnO thin films show intense near-band-edge (NBE) emission and weak deep-level emission. The optically improved pristine ZnO thin films have demonstrated that excimer laser annealing is novel treatment process at room temperature.     

Characterization of polycrystalline Ge thin films fabricated by short-pulse XeF excimer laser crystallization

XeF excimer laser-induced melting and recrystallization dynamics of amorphous germanium are investigated using time-resolved optical reflection and transmission measurements with a nanosecond time resolution, field-emission scanning electron microscopy, and micro-Raman spectroscopy. It is found that the disc-shaped grain with a diameter of approximately 0.8 μm is located in the complete melting regime with a melt phase duration of approximately 141–200 ns. The significant change of transmissivity is a key phenomenon revealing the excessive excimer laser fluence during excimer laser crystallization by in-situ optical measurements. Differences between the melting and recrystallization phenomenon for Si and Ge thin films are also discussed.     

KrF excimer laser ablation of thin Cr film on glass substrate

Received: 5 October 1998 / Accepted: 14 December 1998 / Published online: 24 February 1999     

飞秒双脉冲激光照射金属薄膜的热行为

通过双温方程对飞秒单脉冲与双脉冲照射金薄膜进行了计算模拟分析,得到了金靶的电子温度和晶格温度随着时间空间的变化。在同样激光能量密度下,单脉冲与双脉冲使得金膜温度的变化表明双脉冲使得更多的激光能量渗透到靶材内部,这些能量可以使得烧蚀深度更深,有利于提高激光烧蚀靶材的效率。计算结果显示随着激光能量密度的增加熔化面深度逐渐增加,单脉冲与双脉冲熔化面深度的变化明显不同。在激光能量密度高于损伤阈值附近,单脉冲的烧蚀深度大于双脉冲的烧蚀深度,随着激光能量密度增加,双脉冲的烧蚀深度将大于单脉冲的烧蚀深度。     

飞秒双脉冲激光照射金属薄膜的热行为

通过双温方程对飞秒单脉冲与双脉冲照射金薄膜进行了计算模拟分析,得到了金靶的电子温度和晶格温度随着时间空间的变化。在同样激光能量密度下,单脉冲与双脉冲使得金膜温度的变化表明双脉冲使得更多的激光能量渗透到靶材内部,这些能量可以使得烧蚀深度更深,有利于提高激光烧蚀靶材的效率。计算结果显示随着激光能量密度的增加熔化面深度逐渐增加,单脉冲与双脉冲熔化面深度的变化明显不同。在激光能量密度高于损伤阈值附近,单脉冲的烧蚀深度大于双脉冲的烧蚀深度,随着激光能量密度增加,双脉冲的烧蚀深度将大于单脉冲的烧蚀深度。     

Ultra fast melting process in femtosecond laser crystallization of thin a-Si layer

In this paper, we investigated the mechanism of crystallization induced by femtosecond laser irradiation for an amorphous Si (a-Si) thin layer on a crystalline Si (c-Si) substrate. The fundamental, SHG, THG wavelength of a Ti:Sapphire laser was used for the crystallization process. To investigate the processed areas we performed Laser Scanning Microscopy (LSM), Transmission Electron Microscopy (TEM) and Imaging Pump-Probe measurements. Except for 267 nm femtosecond laser irradiation, the crystallization occurred well. The threshold fluences for the crystallization using 800 nm and 400 nm femtosecond laser irradiations were 100 mJ/cm² and 30 mJ/cm², respectively. TEM observation revealed that the crystallization occurred by epitaxial growth from the boundary surface between the a-Si layer and c-Si substrate. The melting depths estimated by Imaging Pump-Probe measurements became shallower when the shorter wavelength was used.     

Evolution of microstructure in polycrystalline silicon thin films upon excimer laser crystallization

Polycrystalline silicon (poly-Si) films fabricated by pulsed excimer laser crystallization (ELC) have been investigated using time-resolved optical measurements, scanning-electron microscopy, and cross-sectional transmission-electron microscopy. Detailed crystallization mechanisms are proposed to interpret the microstructure evolution of poly-Si films for both frontside and backside ELC. It is found that the backside ELC is a good candidate for the manufacturing of low-temperature polycrystalline silicon because of the high laser efficiency and low surface roughness of the poly-Si films.     

10.6μm激光辐照下光学薄膜的微弱吸收测量

 建立了表面热透镜技术测量光学薄膜微弱吸收的实验装置，对10.6μm CO₂激光辐照下镀制在Ge基底上的不同厚度的单层ZnS，YbF₃薄膜，以及镀制在Ge基底上不同膜系的（YbF₃/ZnSe）多层分光膜的弱吸收进行了测量，并对实验结果作了分析和讨论。实验结果表明，利用本实验系统已测得的待测样品的最低吸收为2.87×10^-4，测量系统的灵敏度为10^-5。     

Crystalline SiC thin film deposition by laser ablation: influence of laser surface activation

2 ) of the growing SiC film improved the film microstructure equivalent to an increase of the substrate temperature by 150–200 °C. Received: 18 August 1997/Accepted: 8 September 1997     

Pulsed laser crystallization of hydrogen-free a-Si thin films for high-mobility poly-Si TFT fabrication

The possibility to fabricate high-mobility polysilicon TFTs by nanosecond pulsed laser crystallization of unhydrogenated amorphous Si thin films has been investigated. Two types of lasers have been used: a large area ( 1 cm²) single ArF excimer laser pulse and a small diameter ( 100 m) frequency-doubled Nd:YAG laser beam, working in the scanning regime. Processed films have been characterized in detail by different optical and microscopic techniques. Device performances indicate that the best results are achieved with the excimer laser leading to high mobility values (up to 140 cm²/Vs) which are much larger than in polysilicon TFTs fabricated onto the same quartz substrates by low-temperature thermal (630° C) crystallization of amorphous Si films (_fe55 cm²/Vs).     

Effect of boron-doping on the hydrogen evolution from a-Si:H films

We have found that the hydrogen evolution from boron-doped a-Si:H films prepared by the glow-discharge decomposition of silane-diborane mixtures, differs appreciably from that of undoped or phosphorus-doped material. Firstly, the peaks in the hydrogen evolution rate are shifted to lower temperature by as much as 160°C and, secondly, the peak position is almost independent of the film thickness. Differences in the hydrogen content are also observed. These findings indicate the presence of strong microstructural inhomogeneities in boron-doped films. Implications of this property are consistent with recent transport data.     

Evaluation of excimer laser ablation of thin Cr film on glass substrate by analysing acoustic emission

Excimer laser ablation of a thin Cr film on a glass substrate was evaluated through detecting acoustic emission arising from the ablation process and observing surface morphology. In the experiment, an acoustic emission transducer was coupled to the sample to acquire acoustic emissions of laser–material interaction and an oscilloscope was used to record the signals. The patterned areas were examined by using an optical microscope. Characteristics of the acoustic emissions were studied through applying a range of signal analysis tools. Several features (e.g., average power, RMS) showed a clear linkage with the ablation mechanism of thin Cr film when varying the fluence of the laser source. Moreover, the damage to the glass substrate was well discriminated by the extracted features. In sum, evaluation of acoustic emissions not only provided a tool to study the ablation mechanisms of the thin metal film but also addressed a monitoring strategy for excimer laser micromachining.     

Effect of α-irradiation of energy 0.5 MeV on the hydrogen bonding in a-Si:H thin films

Hydrogenated amorphous silicon thin films (a-Si:H) have been prepared by the rf glow discharge technique. The configuration of bonded hydrogen was investigated by infrared absorption measurements of Si:H vibrational modes before and after bombardment with an α-particle beam energy of 125 keV/n. The results showed an increase in the absorption mode near 2100, 890 and 850 cm^?1 and a decrease in the absorption mode near 2000 cm^?1 after bombardment. These observations are interpreted in terms of changes of the oscillator strengths of vibrational modes.     

Semiconductor laser crystallization of a-Si:H on conducting tin-oxide-coated glass for solar cell and display applications

Semiconductor laser (=805 nm) crystallization of hydrogenated amorphous silicon (a-Si:H) deposited on a low-cost fluoride-doped tin-oxide-coated glass substrate is demonstrated. X-ray diffraction confirms that the structure of the polycrystalline silicon thus formed shows (111), (220), and (311) peaks. A sharp Raman peak at 520 cm^-1 further confirms the crystallization. Atomic force microscope images of a Secco-etched laser-treated sample reveal the granular structure of the poly-Si. Grains as big as 10 times the film thickness are readily obtained and sample as thick as 5000 Å is easily crystallized. The method can be extended to films with a thickness of several microns. PACS 42.55.Px; 42.62.Cf; 81.05.Gc     

Morphological and structural modifications induced in a-Si1−x C x :H films by excimer laser annealing

Hydrogenated amorphous silicon carbon films of different carbon content deposited by plasma enhanced chemical vapour deposition on Corning glass and crystalline silicon substrates have been irradiated by an excimer (KrF) laser. The properties of these samples were investigated by X-ray diffraction, field emission scanning electron microscopy and Fourier transform infrared spectroscopy before and after laser treatment, in order to understand the role of the carbon content as well as the substrate in the structural modifications. It has been demonstrated that the changes induced in the films by the laser treatment are independent of the substrate but depend on the carbon content which facilitates the crystallization process.     

A poly-Si thin film transistor fabricated by new excimer laser recrystallization employing floating active structure

We fabricated a high-performance polycrystalline silicon (poly-Si) thin film transistor (TFT) by new excimer laser annealing (ELA) method employing floating active structure. The new simple ELA method produces large lateral grains exceeding 4 μm. A novel poly-Si TFT that exhibits very high mobility (μ_FE=331 cm²/V s) and low leakage current has been successfully fabricated by single laser irradiation on selectively floating a-Si layer. Uniform lateral grains have been obtained with wide ELA process window.