Curing and thermal behaviour of a flame retardant cycloaliphatic epoxy resin based on phosphorus containing poly(amide–imide)s

The curing behaviour of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexane carboxylate was investigated by the dynamic differential scanning calorimetry (DSC) using phosphorus-containing poly(amide–imide)s (PAIs) having free amine groups, 4,4′-diaminodiphenylmethane (PM) and p-phenylenediamine (PA), in the ratio of 1:1. The PAIs were prepared by co-polymerization of diimide–diacid (DIDA) and phosphorus-containing triamines having phenylene moiety. l-Tryptophan and pyromellitic anhydride were used to synthesize DIDA. Triamines used in the synthesis PAIs were tris(3-aminophenyl) phosphine (TAP), tris(3-aminophenyl) phosphine oxide (TAPO) and bis(3-aminophenyl) aminotolyl phosphine (BAP). TAP-, TAPO- and BAP-containing PAIs were designated as PTAP, PTAPO and PBAP, respectively. These PAIs with free amine groups were characterized by FTIR, ¹H NMR, ¹³C NMR spectroscopic techniques and elemental analysis. The mixture of PAIs and PM or/and PA in the ratios of 0:1, 1:0 and 0.5:0.5 was used for investigation. DSC was used to study the curing of epoxy by recording the DSC scans at heating rates of 10 °C min^?1. Thermal stability of epoxy resin cured isothermally was evaluated by recording thermo gravimetric traces in nitrogen atmosphere at the heating rate of 20 °C min^?1. All samples are highly stable, and the 10 % mass loss found was in the range of 335–520 °C. The percent char yield was highest in case of resin sample E/PM/PTAPO. The flame-retardant properties of cured epoxy resins were investigated by the limiting oxygen index test (LOI) and UL94 test. When phosphorus was incorporated in epoxy resin, the epoxy resin system met the UL94 V-0 classification and the LOI reached at 37.8, because of nitrogen–phosphorus synergistic effect.     

Synthesis and thermal characteristics of bisimides. I

Ten structurally different bisimide resins were prepared by reacting maleic anhydride/citraconic anhydride and benzophenone tetracarboxylic dianhydride with aromatic diamines and fused aromatic structures or heterocyclic groups. The amines included were 1,5-diaminonaphthalene, 2,5-bis(p-aminophenyl)1,3,4-oxadiazole, 3,3-bis(p-aminophenyl)phthalide, 9,9-bis(p-aminophenyl)fluorene. and 10,10-bis(p-aminophenyl)anthrone. These monomers were characterized by infrared (IR). ¹H-NMR, mass spectroscopy, and elemental analysis. Thermal polymerization of these monomers was investigated by differential scanning calorimetry. Broad exothermic peaks were observed for a temperature range of 225–380°C. Temperature of exothermic peak position was influenced by the presence of substituents at the olefinic bond, and in biscitraconimides it was 40–50°C lower than in the corresponding bismaleimides. Anaerobic char yields of cured bisimide resins ranged from 44 to 64%. Oxadiazole-containing bisimides had low thermal stability. Increase in formula weight between the imide groups did not influence the char yields in a systematic manner. Graphite cloth laminates with two of these bisimide resins were fabricated and tested for a number of physical properties. Their limiting oxygen index was 70–72%.     

Effect of structure on thermal behaviour of epoxy resins

The paper deals with the curing behaviour of diglycidyl ether of bisphenol-A (DGEBA) using three novel multifunctional aromatic amines having phosphine oxide and amide-acid linkages. The amines were prepared by reacting tris(3-aminophenyl)phosphine oxide (TAP) with 1,2,4,5-benzenetetracarboxylic acid anhydride (P)/4,4^′-(hexafluoroisopropylidene)diphthalic acid anhydride (F)/3,3^′,4,4^′-benzophenonetetracarboxylic acid dianhydride (B). Amide-acid linkage in these amines is converted to thermally stable imide linkage during curing reaction. Curing temperatures of DGEBA were higher with phosphorylated amines than the conventional amine 4,4^′-diamino diphenyl sulphone (D). A decrease in initial decomposition temperature and higher char yields were observed when phosphorus containing amide-acid amines were used as curing agents for DGEBA.     

A Simple and Convenient Strategy for the Synthesis of Novel Ten,Twelve, and Fourteen‐membered Phosphorus Macrocyclic Compounds

Synthesis of the title compounds 4(a – i) was accomplished through a two‐step process. The synthetic route involves the cyclization of equimolar quantities of 2,2′‐methylene(methyl)bis(4,6‐di‐tert‐butyl‐phenol) ( 1 ) with tris‐(2‐chloro‐ethyl) phosphite ( 2a ), tris‐(2‐bromo‐ethyl) phosphine ( 2b ), and tris‐bromo methyl phosphine ( 2c ) in the presence of sodium hydride in dry tetrahydrofuran at 45–50°C. They were further converted to the corresponding oxides, sulfides, and selenides under N₂ atmosphere by reacting them with hydrogen peroxide, sulfur, and selenium, respectively ( 4a – c , 4d – f, and 4g – i ). But the compounds 6a , b were prepared by the direct cyclocondensation of equimolar quantities of 1 with (2‐chloro‐ethyl)‐phosphonic acid dibromomethyl ester ( 5a ) and (2‐chloro‐ethyl)‐phosphonic acid bis(2‐bromo‐ethyl) ester ( 5b ) in the presence of sodium hydride in dry tetrahydrofuran at 45–50°C in moderate yields. All the newly synthesized compounds 4 ( a – i ) and 6 ( a – b ) exhibited moderate in vitro antibacterial and antifungal activities.     

Tris(tert-butyl)phosphine selenide,the missing link in tris(tert-butyl)­phosphine chalcogenide structures tBu3P=X (X = O,S, Se,Te)

In tris(tert-butyl)­phosphine selenide, C₁₂H₂₇PSe, all the methyl ligands are disordered over two sites in the ratio 70/30. The mol­ecule displays crystallographic C₃ symmetry. The bond angles at the P atom are distorted tetrahedral [C—P—C 110.02 (5)° and Se=P—C 108.91 (5)°]. The P—C and P=Se bond lengths are 1.908 (1) and 2.1326 (6) Å, respectively. A comparison of the structural data of the complete series of tris(tert-butyl)­phosphine chalcogenides (^tBu₃PO, ^tBu₃PS, ^tBu₃PSe and ^tBu₃PTe) with the corresponding data of other phosphine chalcogenides substituted by smaller organic groups shows the great influence of the bulky tert-butyl ligands.     

Soluble poly(amide–imide)s prepared by one‐pot solution condensation

A new one‐pot procedure for imide–acid monomer synthesis and polymerization is reported for four new poly(amide–imide)s. Bisphenol A dianhydride (BPADA) was reacted with twice the molar amount of 3‐aminobenzoic acid (3ABA) or 3‐amino‐4‐methylbenzoic acid (3A4MBA) in 1‐methyl‐2‐pyrrolidinone (NMP) and toluene mixture, and the amic acid intermediates cyclized in solution to give two diimide‐containing dicarboxylic acid monomers. Without isolation, the diacid monomers were then polymerized with either 1,3‐diaminomesitylene (DAM) or 1,5‐diaminonaphthalene (1,5NAPda) using triphenyl phosphite‐activation to give a series of four soluble poly(amide–imide)s, PAI. Isolation and purification of the dicarboxylic acid monomers was not necessary for formation of high molecular weight polymers as indicated by intrinsic viscosities of 0.64–1.04 dL/g determined in N,N‐dimethylacetamide (DMAc). All of the PAI were soluble in polar aprotic solvents such as NMP, DMAc, and dimethyl sulfoxide (DMSO). Glass transition temperatures ranged from 243 to 279°C by DSC, and 5% weight loss temperatures were above 400°C in both air and nitrogen. Flexible films cast from DMAc were light yellow, transparent, and tough. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1183–1188, 1999     

N‐[Tris(hydroxymethyl)methyl]glycine (tricine)

The title compound, C₆H₁₃NO₅, adopts a zwitterionic form where the carboxylic acid H atom is transferred to the amino group. The methyl–glycine backbone is planar. The tris(hydroxy­methyl)­methyl group is rotated as a rigid group around the amino–methyl bond by 22 (1)° and the carboxylic acid plane is rotated by 19.76 (12)° from the plane of the main skeleton. Apart from their H atoms, the three hydroxy­methyl groups adopt a propeller‐like conformation around the amino–methyl bond, close to C₃ symmetry.     

Preparation and characterization of hyperbranched polyaspartimides from bismaleimides and triamines

Hyperbranched polyaspartimides were successfully prepared from bismaleimides (A₂) and triamines (B₃) through the Michael addition reaction. Two bismaleimides of 4,4′‐bismaleimidodiphenylmethane (BMDM) and bis(3‐ethyl‐5‐methyl‐4‐ maleimidophenyl)methane (BEMM) and two triamines of tris(3‐aminophenyl)phosphine oxide (TAPPO) and tris(4‐aminophenyl)amine (TAPA) were employed in the preparation of these hyperbranched polyaspartimides. The chemical structures of the polymers were characterized with Fourier transform infrared (FTIR), ¹H and ³¹P NMR, and elemental analysis. Degrees of branching ranging from 0.51 to 0.69 were found with the polyaspartimides, ensuring their hyperbranched structure. The polymers also showed good solubility in common solvents, high glass‐transition temperatures of 256 °C, and excellent thermal stability above 370 °C. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 5921–5928, 2004     

Bismaleimides and bisnadimides derived from 2,5-bis(4-aminophenyl)-3,4-diphenylthiophene and their polymerization to heat-resistant matrix resins

Six new structurally different bismaleimides or bisnadimides based on 2,5-bis(4-aminophenyl)-3,4-diphenylthiophene (BADT) were synthesized and characterized by infrared (IR) and proton nuclear magnetic resonance (¹H-NMR) spectroscopy. Chain-extension of several bismaleimides was accomplished by incorporating various imide, amide, and urea groups. The bismaleimide and bisnadimide prepared by reacting BADT with maleic or nadic anhydride, respectively, were soluble in various organic solvents. The monomers were thermally polymerized or by a Michael reaction with certain aromatic diamines. Curing behavior was investigated by differential thermal analysis (DTA). The thermal and thermo-oxidative stability of polymers was evaluated by dynamic thermogravimetric analysis (TGA) and isothermal gravimetric analysis (IGA). The polymers derived from bismaleimide of BADT as well as from the bismaleimides chain-extended by imide groups were stable up to 355–392°C in N₂ or air and afforded anaerobic char yield 66–74% at 800°C. The polymers obtained by curing the bismaleimide-diamine adducts showed a relatively lower thermal stability.     

Ionic IPNs as novel candidates for highly conductive solid polymer electrolytes

Five ionic imidazolium based monomers, namely 1‐vinyl‐3‐ethylimidazolium bis(trifluoromethylsulfonyl)imide (ILM1), 1‐vinyl‐3‐(diethoxyphosphinyl)‐propylimidazolium bis(trifluoromethylsulfonyl)imide (ILM2), 1‐[2‐(2‐methyl‐acryloyloxy)‐propyl]‐3‐methylimidazolium bis(trifluoromethylsulfonyl)imide (ILM3), 1‐[2‐(2‐methyl‐acryloyloxy)‐undecyl]‐3‐methylimidazolium bis(trifluoromethylsulfonyl)imide (ILM4), 1‐vinyl‐3‐ethylimidazolium dicyanamide (ILM5) were prepared and used for the synthesis of linear polymeric ionic liquids (PILs), crosslinked networks with polyethyleneglycol dimethacrylate (PEGDM) and interpenetrating polymer networks (IPNs) based on polybutadiene (PB). The ionic conductivities of IPNs prepared using an in situ strategy were found to depend on the ILM nature, T_g and the ratio of the other components. Novel ionic IPNs are characterized by increased flexibility, small swelling ability in ionic liquids (ILs) along with high conductivity and preservation of mechanical stability even in a swollen state. The maximum conductivity for a pure IPN was equal to 3.6 × 10^?5 S/cm at 20 °C while for IPN swollen in [1‐Me‐3‐Etim] (CN)₂N σ reached 8.5 × 10^?3 S/cm at 20 °C or 1.4 × 10^?2 S/cm at 50 °C. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 4245–4266, 2009     

Structural and Thermal Characterisation of Nadimide Resins

A series of hexachloronadimides containing phosphine oxide in the backbone were synthesized by the reaction of bis(3-amino phenyl) methyl phosphine oxide (BAP) with pyromellitic dianhydride (PMDA)/3,3’,4,4’-benzophenone tetracarboxylic acid dianhydride (BTDA)/2,2-bis(3,4-dicarboxy phenyl) hexafluoropropane dianhydride (6F) and hexachloronadic anhydride in glacial acetic acid/acetone. Structural characterisation of the resins was carried out by infrared, nuclear magnetic resonance spectroscopy and elemental analysis. Thermal characterisation of uncured resin was done by differential scanning calorimetry and thermogravimetric analysis. The decomposition temperature of uncured resins were above 310±10°C with T _max 330±10°C in nitrogen atmosphere. Char yield at 800°C ranged from 37–42%. This revised version was published online in July 2006 with corrections to the Cover Date.     

Water-Soluble imide-amide copolymers. I. Preparation and characterization of poly [acrylamide-co-sodium N-(4-sulfophenyl) maleimide]

Sodium N-(4-sulfophenyl) maleimide (SPMI) and its saturated succinimide counterpart were first prepared according to established methods. Hydrolysis experiments on these monomers monitored by ¹H-NMR showed that although SPMI monomer was about 15% hydrolyzed in D₂O at 23°C in 24 h. Sodium N-(4-sulfophenyl) succinimide, which is similar in structure to the imide units in the copolymers, was only 1% hydrolyzed after 18 days at 23°C and 29% hydrolyzed after 18 days at 60°C. This indicated that the saturated imide rings in the copolymer might be sufficiently stable to hydrolysis for the copolymers to be useful. However, hydrolysis at high pH demonstrated that the imide rings would be rapidly saponified under alkaline conditions, destroying the structural rigidity that the intact rings might have provided in the copolymer chains. Sodium N-(4-sulfophenyl) maleimide (SPMI) was copolymerized with acrylamide in water at 30°C without cleavage of the imide ring. Water-soluble poly [acrylamide-co-sodium-N-(4-sulfophenyl) maleimide] (PAMSM) samples containing from 7.4 to 64 mol % imide were prepared. Photoacoustic FTIR and ¹³C-NMR spectra were used to confirm the structure of the copolymers obtained. Elemental analysis was used to determine the imide content of the copolymers, and from this composition data reactivity ratios were calculated for the two component monomers.     

A series of new high‐performance materials based on poly[4′‐fluorophenyl‐bis(4‐phenyl)phosphine oxide]

A new series of high‐performance poly(arylene phosphine oxide) (PAPO) materials were synthesized postpolymerization from fluorinated poly(arylene phosphine oxide) (f‐PAPO). The new materials had increased solubility and film‐forming ability over the parent f‐PAPO. With the careful choice of the nucleophile, the thermal stability was also increased. The parent polymer f‐PAPO was synthesized via Ni(0) coupling from aromatic chloride and mesylate monomers. Both monomers were polymerized successfully to create polymers with intrinsic viscosities of 0.235 and 0.123 dL/g, respectively. The higher molecular weight f‐PAPO gave a glass transition of 320 °C and a char yield of 54% at 650 °C in air. The substitution of f‐PAPO via nucleophilic aromatic substitution produced PAPO thermoplastics with significant changes in the properties. The largest increase in the thermal stability relative to f‐PAPO was from 563 to 600 °C 10% weight‐loss values in nitrogen after the displacement of fluoride by 4‐aminophenol, which yielded poly[4‐(4‐aminopheonxyphenyl)bis(4′‐phenyl)phosphine oxide]. Additionally, the char yield increased from 54 to 71% in air at 650 °C. The solubility of the parent polymer was improved after substitution with 3‐tert‐butylphenol, n‐nonylamine, and poly(ethylene glycol)monomethyl ether. All of these became soluble in chloroform, N,N‐dimethylacetamide, and dimethyl sulfoxide. Copolymers were synthesized with 2,5‐dichloro‐4′‐fluorobenzophenone to improve the solubility of f‐PAPO without the loss of thermal stability. These copolymers also underwent nucleophilic aromatic substitution to create an epoxy cure agent that was used with the DEN 431 resin. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2277–2287, 2003     

Tris(2‐pyridyl)­phosphine oxide: how C—H⃛O and C—H⃛N interactions can affect crystal packing efficiency

Tris(2‐pyridyl)­phosphine oxide, (I), C₁₅H₁₂N₃OP, is isomorphous with tris(2‐pyridyl)­phosphine. Because of a combination of C—H⋯O and C—H⋯N interactions, the crystal packing is denser in the title compound than in the related compounds tri­phenyl­phosphine oxide and tris(2‐pyridyl)­phosphine.     

Synthesis and characterization of new aromatic poly(amide-imide)s derived from bis(3-trimellitimidophenyl) phenyl phosphine oxide and various aromatic diamines

New aromatic poly(amide-imide)s with high inherent viscosities were prepared by direct polycondensation reaction of diimide-diacid (I) and aromatic diamines using triphenyl phosphite in N-methyl-2-pyrrolidone (NMP)/pyridine solution containing dissolved CaCl₂. The bis(3-trimellitimidophenyl) phenyl phosphine oxide (I) was readily obtained by the condensation reaction of bis(3-aminophenyl) phenyl phosphine oxide (BAPPO) with trimellitic anhydride. The resulting poly(amide-imide)s showed high thermostability. Their decomposition temperatures at 10% weight loss in nitrogen atmosphere were above 532 °C and the anaerobic char yield at 800 °C ranged from 56% to 74%. Almost all the poly(amide-imide)s showed high glass transition temperature above 233 °C by differential scanning calorimetry (DSC) measurements. These polymers were readily soluble in various organic solvents and by their casting into transparent, tough and flexible films can be easily achieved.     

Reaction of tetramethyl-1,2-dioxetane with triphenylphosphine: Activation parameters for the formation of 2,2-dihydro-4,4,5,5-tetramethyl-2,2,2-triphenyl-1,3,2-dioxaphospholane

The reaction of tetramethyl-1,2-dioxetane ( 1 ) and triphenylphosphine ( 2 ) in benzene-d₆ produced 2,2-dihydro-4,4,5,5-tetramethyl-2,2,2-triphenyl-1,3,2-dioxaphospholane ( 3 ) in ?90% yield over the temperature range of 6–60°. Pinacolone and triphenylphosphine oxide ( 4 ) were the major side products [additionally acetone (from thermolysis of 1 ) and tetramethyloxirane ( 5 ) were noted at the higher temperatures]. Thermal decomposition of 3 produced only 4 and 5 . Kinetic studies were carried out by the chemiluminescence method. The rate of phosphorane was found to be first order with respect to each reagent. The activation parameters for the reaction of 1 and 2 were: Ea ? 9.8 ± 0.6 kcal/mole; ΔS^≠ = ?28 eu; k_30° = 1.8 m^?1sec^?1 (range = 10–60°). Preliminary results for the reaction of 1 and tris (p-chlorophenyl)phosphine were: Ea ? 11 kcal/mole, ΔS^≠ = ?24 eu, k_30° = 1.3 M^?1sec^?1 while those for the reaction of 1 and tris(p-anisyl)phosphine were: Ea ? 8.6 kcal/mole, ΔS^≠ = ?29 eu, k_30° = 4.9 M^?1 sec^?1.     

Thiol–ene polymerizations using imide‐based monomers

New diene and dithiol monomers, based on aromatic imides such as benzophenone‐3,3′,4,4′‐tetracarboxylic diimide were synthesized and used in thiol‐ene polymerizations which yield poly(imide‐co‐thioether)s. These linear polymers exhibit limited solubility in various organic solvents. The molecular weights of the polymers were found to decrease with increasing imide content. The glass transition temperature (T_g) of these polymers is dependent on imide content, with T_g values ranging from ?55 °C (with no imide) up to 13 °C (with 70% imide). These thermal property improvements are due to the H‐bonding and rigidity of the aromatic imide moieties. Thermal degradation, as studied by thermogravimetric analysis, was not significantly different to the nonimide containing thiol‐ene polymers made using trimethyloylpropane diallyl ether and 3,5‐dioxa‐1,8‐dithiooctane. It is expected that such monomers may lead to increased glass transition temperatures in other thiol‐ene polymer systems as these normally exhibit low glass transition temperatures. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2013 , 51, 4637–4642     

Poly(ether imide)s derived from phthalazinone‐containing dianhydrides

An unsymmetrical and noncoplanar heterocyclic dianhydride was synthesized from a bisphenol‐like phthalazinone, 4‐(4‐hydroxylphenyl)‐2,3‐phthalazin‐1‐one, and a series of novel poly(ether imide)s based on it, with intrinsic viscosities of 0.67–1.42 dL/g, were obtained by one‐step solution polymerization in m‐cresol at 200 °C for 20 h. The polymers were readily soluble in N‐methyl‐2‐pyrrolidinone and m‐cresol. The poly(ether imide)s derived from 4,4′‐oxydianiline and 4,4′‐methylenedianiline were also very soluble in chloroform, 1,1′,2,2′‐tetrachloroethane, and N,N‐dimethylacetamide. The glass‐transition temperatures were 289–326 °C, as determined by differential scanning calorimetry. All the degradation temperatures for 5% weight loss occurred above 482 °C in nitrogen. The tensile strength of thin films of some of the polymers varied from 103.1 to 121.4 MPa. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 6089–6097, 2004     

Thermal stability of the silica-aminopropylsilane-polyimide interface

Thermal degradation of the silica–aminopropylsilane–amic acid/imide interface was studied by modifying a high-surface-area, neutral silica gel with a number of substituted aminopropylsilanes (APS). These substrates were reacted further with phthalic anhydride or aromatic amic acid monomers and the thermal decomposition of the adsorbed/reacted materials was monitored by thermogravimetric analysis (TGA) and infrared (IR) spectroscopy. The 3-aminopropyltriethoxysilane/poly[N,N′-(p,p′-oxydiphenylene)pyromellitimide] interface was also evaluated by this method. Comparison clearly distinguishes the thermal decomposition of surface-bound APS from surface-bound alkylphthalimides, the adhesion product of alkylamines and aromatic amic acids. Alkylamine imidization with the elimination of aromatic amine (analogous to polymer scission) and the decomposition of the surface-bound imide are shown in the amic acid TGA profiles. This imidization and the accompanying aniline elimination begin at about 130°C, under nitrogen, to form the surface alkyl imide which slowly decomposes at 400°C. TGA analysis indicates that the surface-bound imide undergoes minimal degradation under nitrogen at 370 ± 10°C; temperatures above this threshold range produce changes in the APS–imide interface.     

Partially bio‐based poly(amide imide)s by polycondensation of aromatic diacylhydrazides based on lignin‐derived phenolic acids and aromatic dianhydrides: Synthesis,characterization, and computational studies

Two new bio‐based diacylhydrazide monomers, namely, 4,4′‐(propane‐1,3‐diylbis(oxy))bis(3‐methoxybenzohydrazide) and 4,4′‐(propane‐1,3‐diylbis(oxy))bis(3,5‐dimethoxybenzohydrazide) were synthesized starting from lignin‐derived phenolic acids, namely, vanillic acid and syringic acid. A series of poly(amide imide)s was synthesized by polycondensation of these diacylhydrazide monomers with commercially available aromatic dianhydrides. Poly(amide imide)s showed inherent viscosity in the range 0.44–0.56 dL g^?1 and exhibited good solubility in organic solvents. Poly(amide imide)s could be cast into transparent, flexible, and tough films from their N ,N‐dimethylacetamide solutions. Poly(amide imide)s showed 10% weight loss in the temperature range 340–364 °C indicating their good thermal stability. Glass transition temperature (T _g) of poly(amide imides)s were measured by DSC and DMA which were in the range 201–223 °C and 214–248 °C, respectively. The T _g values of poly(amide imide)s were dependent on the number methoxy substituents on aromatic rings of diacylhydrazide monomers. Molecular dynamics simulation studies revealed that chain rigidity is the dominant factor for observed trends in T _g. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2017 , 55 , 3636–3645