Morphological control of MgxZn1−xO layers grown on Ga:ZnO/glass substrates for photovoltaics

Mg_xZn_1?xO has been used in various photovoltaic cells because its energy bandgap can be tailored by controlling the Mg composition in this ternary compound. The Mg_xZn_1?xO layers with different surface morphologies including two-dimensional (2-D) films and one-dimensional (1-D) nanostructures are preferred for conventional p–n junction solar cells and polymer–inorganic hybrid solar cells, respectively. The Mg_xZn_1?xO layers are sequentially grown on Ga-doped ZnO (GZO) transparent conductive electrode using metalorganic chemical vapor deposition (MOCVD). The effect of the buffer layers on Mg_xZn_1?xO surface morphology is investigated. It is observed that Mg_xZn_1?xO deposited at ～500 °C on a low-temperature (～250 °C) ZnO buffer layer is in the form of 2-D dense and smooth films, whereas, on a high-temperature (～520 °C) ZnO buffer layer is in the form of 1-D nanostructures. Based on the structure characterization results, a growth mechanism in terms of nucleation and texturing is proposed to explain the buffer layer effect.     

Edge misfit dislocations in the GeSi/Si(001) pair: Conditions and specific features of high-quantity generation

Dislocation structure of Ge_xSi_1?x films (x=0.4?0.8) grown by molecular-beam epitaxy on Si(001) substrates was studied by means of transmission electron microscopy. It was found that the density of edge MDs formed at the early stage of plastic strain relaxation in the films could exceed the density of 60° MDs. In our previous publications, a predominant mechanism underlying the early formation of edge misfit dislocations (MD) in Ge_xSi_1?x/Si films with x>0.4 was identified; this mechanism involves the following processes. A 60° glissile MD provokes nucleation of a complementary 60° MD gliding on a mirror-like tilted plane (111). A new edge MD forms as a result of interaction of the two complementary 60° MDs, and the length of the newly formed edge MD can then be increased following the motion of the “arms” of the complementary 60° MDs. Based on this scenario of the edge MD generation process, we have calculated the critical thickness of insertion of an edge MD into GeSi layers of different compositions using the force balance model. The obtained values were found to be more than twice lower than the similar values for 60° MDs. This result suggests that a promising strategy towards obtaining dislocation arrays dominated by 90° dislocations in MBE-grown Ge_xSi_1?x/Si films can be implemented through preliminary growth on the substrate of a thin, slightly relaxed buffer layer with 60° MDs present in this layer. The dislocated buffer layer, acting as a source of threading dislocations, promotes the strain relaxation in the main growing film through nucleation of edge MDs in the film/buffer interface. It was shown that in the presence of threading dislocations penetrating from the relaxed buffer into the film nucleation of edge MDs in the stressed film can be initiated even if the film thickness remains small in comparison with the critical thickness for insertion of 60° MDs. Examples of such unusual MD generation processes are found in the literature.     

Preparation and Characterization of MBE-grown Si/CaF2 Heterostructures

Growth and fabrication of silicon-on-insulator structures, based on heteroepitaxial growth of insulating films on Si, is an area of research that has rapidly developed in recent years. Thin CaF₂ films and Si/CaF₂ multilayers were prepared on {111}-oriented Si substrates by molecular beam epitaxy (MBE) and were investigated by RHEED and RBS. For epitaxial growth the Si substrates were cleaned using the ultraviolet/ozone surface cleaning method which is an effective tool to remove contaminants from the surface by low-temperature in-vacuo preheating. The growth of CaF₂ on such Si{111} substrates provides epitaxial layers with a high structural perfection. When this layer system, however, is used as a substrate for epitaxial Si growth the Si layers show always twin formation. Si layers without twins could be obtained only after deposition of thin amorphous Si buffer layers at room temperature, immediately followed by Si growth at 700 °C.     

Influence of amorphous buffer layers on the crystallinity of sputter-deposited undoped ZnO films

Undoped ZnO films were deposited by radio frequency (RF) magnetron sputtering on amorphous buffer layers such as SiO_x, SiO_xN_y, and SiN_x prepared by plasma enhanced chemical vapor deposition (PECVD) for dielectric layer in thin film transistor (TFT) application. ZnO was also deposited directly on glass and quartz substrate for comparison. It was found that continuous films were formed in the thickness up to 10 nm on all buffer layers. The crystallinity of ZnO films was improved in the order on quartz>SiO_x >SiO_xN_y>glass>SiN_x according to the investigated intensities of (0 0 2) XRD peaks. The crystallite sizes of ZnO were in the order of SiO_x～glass >SiN_x. Stable XRD parameters of ZnO thin films were obtained to the thickness from 40 to 100 nm grown on SiO_x insulator for TFT application. Investigation of the ZnO thin films by atomic force microscope (AFM) revealed that grain size and roughness obtained on SiN_x were larger than those on SiO_x and glass. Hence, both nucleation and crystallinity of sputtered ZnO thin films remarkably depended on amorphous buffer layers.     

ZnO growth on Si with low-temperature ZnO buffer layers by ECR-assisted MBE

High-quality ZnO films were grown on Si(1 0 0) substrates with low-temperature (LT) ZnO buffer layers by an electron cyclotron resonance (ECR)-assisted molecular-beam epitaxy (MBE). In order to investigate the optimized buffer layer temperature, ZnO buffer layers of about 1.1 μm were grown at different growth temperatures of 350, 450 and 550 °C, followed by identical high-temperature (HT) ZnO films with the thickness of 0.7 μm at 550 °C. A ZnO buffer layer with a growth temperature of 450 °C (450 °C-buffer sample) was found to greatly enhance the crystalline quality of the top ZnO film compared to others. The root mean square (RMS) roughness (3.3 nm) of its surface is the smallest, compared to the 350 °C-buffer sample (6.7 nm), the 550 °C-buffer sample (7.4 nm), and the sample without a buffer layer (6.8 nm). X-ray diffraction (XRD), photoluminescence (PL) and Raman scattering measurements were carried out on these samples at room temperature (RT) in order to characterize the crystalline quality of ZnO films. The preferential c-axis orientations of (0 0 2) ZnO were observed in the XRD spectra. The full-width at half-maximum (FWHM) value of the 450 °C-buffer sample was the narrowest as 0.209°, which indicated that the ZnO film with a buffer layer grown at this temperature was better for the subsequent ZnO growth at elevated temperature of 550 °C. Consistent with these results, the 450 °C-buffer sample exhibits the highest intensity and the smallest FWHM (130 meV) of the ultraviolet (UV) emission at 375 nm in the PL spectrum. The ZnO characteristic peak at 438.6 cm⁻¹ was found in Raman scattering spectra for all films with buffers, which is corresponding to the E₂ mode.     

High quality MOCVD GaN film grown on sapphire substrates using HT-AlN buffer layer

In this work we report on the growth and characterization of high quality MOCVD GaN film grown on Al₂O₃ substrates by using a HT (>1150 °C)-AlN buffer layer. We have investigated the most favorable growth conditions in terms of temperature, thickness and growth rate of AlN buffer layer in order to optimize the high temperature GaN layer. The improved morphological and structural properties of GaN layer were verified by AFM and XRD measurements. The optimized GaN layer presents a smooth surface with a rms value of 1.4 Å. The full width at half maximum (FWHM) for 800 nm thick GaN films is 144″. Furthermore PL measurements and C–V analysis confirm that in GaN layer grown on HT-AlN buffer layer defect density is drastically reduced.     

Effects of oxide buffer layers on the microstructure and electrical properties of PLZST 2/87/10/3 antiferroelectric thin films

In the present work, the effects of oxide buffer layers, such as ZrO₂, CeO₂ and TiO₂, on the microstructure and electrical properties of (Pb_0.97La_0.02)(Zr_0.87Sn_0.10Ti_0.03)O₃ (PLZST 2/87/10/3) antiferroelectric (AFE) thin films were investigated systematically. X-ray diffraction (XRD) patterns and scanning electron microscopy (SEM) pictures illustrated that the crystalline orientation and surface microstructure of PLZST 2/87/10/3 AFE thin films had a close relation with these oxide buffer layers. As a result, the final electrical properties of AFE films were tuned by these buffer layers. Electrical measurements result showed that the dielectric properties, polarization characteristic and current–field curves of AFE thin films could be tailored by selecting a proper oxide buffer layer.     

Structure characterization of MHEMT heterostructure elements with In<Subscript>0.4</Subscript>Ga<Subscript>0.6</Subscript>As quantum well grown by molecular beam epitaxy on GaAs substrate using reciprocal space mapping

The crystallographic parameters of elements of a metamorphic high-electron-mobility transistor (MHEMT) heterostructure with In_0.4Ga_0.6As quantum well are determined using reciprocal space mapping. The heterostructure has been grown by molecular-beam epitaxy (MBE) on the vicinal surface of a GaAs substrate with a deviation angle of 2° from the (001) plane. The structure consists of a metamorphic step-graded buffer (composed of six layers, including an inverse step), a high-temperature buffer of constant composition, and active high-electron-mobility transistor (HEMT) layers. The InAs content in the metamorphic buffer layers varies from 0.1 to 0.48. Reciprocal space mapping has been performed for the 004 and 224 reflections (the latter in glancing exit geometry). Based on map processing, the lateral and vertical lattice parameters of In_xGa_1–xAs ternary solid solutions of variable composition have been determined. The degree of layer lattice relaxation and the compressive stress are found within the linear elasticity theory. The high-temperature buffer layer of constant composition (on which active MHEMT layers are directly formed) is shown to have the highest (close to 100%) degree of relaxation in comparison with all other heterostructure layers and a minimum compressive stress.     

GaAs LPE growth and its application to FET

Residual impurities and deep levels in the LPE GaAs layers grown by a sliding boat method were studied. Residual impurities were investigated by monitoring oxygen and water vapor contents in the exhaust gas during heat treatment. The results are satisfactorily explained by assuming oxygen as a dominant residual impurity. Electron traps with a density higher than 5 × 10¹² cm^-3 were not observed in the LPE layers, whereas in VPE layers, 0.82 eV electron traps were always observed. LPE double layers (high purity buffer layer and active layer) were fabricated into FET's. GaAs FET's with a 1 μm gate showed no hysteresis loops in the I–V characteristics and had fairly good high-frequency characteristic (f_max = 70 GHz, NF = 2.4 dB at 10.4 GHz).     

Structural,magnetic and transport properties of ion beam deposited Co thin films

Magnetic nanostructures display new and interesting physical phenomena and are currently used in a large variety of applications. We studied the structural, magnetic and transport properties of Co thin films deposited by ion beam sputtering. We probed the influence of the buffer layer material (Al, Cu, Ru or Ta) and thickness (10–100 Å) on the structural properties of Co thin films. Using X-ray diffraction we observed that textured fcc Co films can be grown on amorphous Ta as thin as 20 Å but for the other buffer layers no texture is observed. We also studied by magneto-optical Kerr effect (MOKE) the magnetic properties of the Co thin films as a function of Co thickness (100–1000 Å). Finally, the electrical resistivity and anisotropic magnetoresistance (AMR) of our Co thin films (on a Ta buffer) was obtained as a function of Co thickness.     

TEM study of defects in AlxGa1−xN layers with different polarity

Transmission electron microscopy (TEM) studies of defects in Al_xGa_1?xN layers with various Al mole fractions (x=0.2, 0.4) and polarities were carried out. The samples were grown by ammonia molecular beam epitaxy on sapphire substrates and consisted of low-temperature AlN (LT-AlN) and high-temperature AlN (HT-AlN) buffer layers, a complex AlN/AlGaN superlattice (SL) and an Al_xGa_1?xN layer (x=0.2, 0.4). It was observed that at the first growth stages a very high density of dislocations is introduced in both Al-polar and N-polar structures. Then, at the interface of the LT-AlN and HT-AlN layers half-loops are formed and the dislocation density considerably decreases in Al-polar structures, whereas in the N-polar structures such a behavior was not observed.The AlN/AlGaN superlattice efficiently promotes the bend and annihilation of threading dislocations and respectively the decrease of the dislocation density in the upper Al_xGa_1?xN layer with both polarities.The lattice relaxation of metal-polar Al_0.2Ga_0.8N was observed, while N-polar Al_0.2Ga_0.8N did not relax. The dislocation densities in the N-polar Al_0.2Ga_0.8N and Al_0.4Ga_0.6N layers were 5.5×10⁹ cm^?2 and 9×10⁹ cm^?2, respectively, and in metal-polar Al_0.2Ga_0.8N and Al_0.4Ga_0.6N layers these were 1×10¹⁰ cm^?2 and 6×10⁹ cm^?2, respectively.Moreover, from TEM images the presence of inversion domains (IDs) in N-polar structures has been observed. The widths of IDs varied from 10 to 30 nm. Some of the IDs widen during the growth of the AlN buffer layers. The IDs formed hills on the surface of the N-polar structures.     

Strain relaxation in multilayer III–N structures on Si(111) substrates

X-ray diffractometry and X-ray scattering reciprocal space maps have been used to study strain relaxation in a complex buffer composed of seven intermediate layers of Al _x Ga_{1 ? x} N composition with different values of x, decreasing with an increase in the distance from the substrate. The layers have been grown by hydride metalorganic vapor phase epitaxy on silicon and sapphire substrates. Differences in the structural quality of the first four layers of a multilayer buffer grown on different substrates have been revealed. A gradual smoothing out of these differences in the next three layers with an increase in the layer serial number has been shown. The last grown intermediate Al _x Ga_{1 ? x} N layer and the GaN layer grown on it have identical thicknesses and degrees of mosaicity, regardless of the substrate type. Device structures grown on a complex buffer demonstrate emission in approximately the same wavelength range.     

Effect of the inhomogeneous structure of freely suspended smectic-A films on the dynamics of fluctuations of smectic-layer displacements

The dynamics of fluctuations of smectic-layer displacements in freely suspended smectic-A films is studied theoretically with due regard for the dependence of the transverse-bending moduli K and extension (or compression) of smectic-B layers on the distance to the free surfaces of the films. The temperature dependences of the dynamic correlation functions are calculated for fluctuations of layer displacements in films of various thicknesses and then used to calculate the correlations between the X-ray intensities scattered by the film at different moments of time. The calculations were performed within a wide temperature range. It is shown that the influence of temperature on the X-ray dynamics of fluctuations of layer displacements in freely suspended smectic-A films can be detected in the experiments on the dynamical scattering by rather thick films (layer number N ≥ 100) at considerably high values of the recoil-momentum component in the film plane (≥10⁶ cm^?1).     

Growth of ultrathin twin-free <Emphasis Type="Italic">b</Emphasis>-oriented YBa<Subscript>2</Subscript>Cu<Subscript>3</Subscript>O<Subscript>7 – <Emphasis Type="Italic">x</Emphasis></Subscript> films

Twin-free b-oriented YBa₂Cu₃O_{7 – x} films with a thickness less than 40 nm have been epitaxially grown on (100)SrLaGaO₄ crystals. Based on the temperature dependence of resistance, the onset temperature of the transition to the superconducting state is found to be 90 K; the transition width is 4 K. The film growth has been performed in two stages. A (100)PrBa₂Cu₃O_{7 – x} buffer layer was previously grown on a (100)SrLaGaO₄ substrate by rf magnetron sputtering in an Ar–O₂ gas mixture at a continuous and monotonic increase in temperature from 660 to 830°C. The main YBa₂Cu₃O_{7 – x} film was grown on the buffer layer surface by pulsed laser deposition in an oxygen medium at a fixed temperature (800°C). The above processes were implemented in different chambers, which were connected by a vacuum channel for transporting samples. Both films were grown in situ, without contacting atmosphere in all growth stages. An X-ray diffraction study has shown that the YBa₂Cu₃O_{7 – x} films are single-crystal and free of precipitates of other phases and domains of other orientations.     

A route to single-crystalline ZnO films with low residual electron concentration

Single-crystalline ZnO films have been grown on a-plane sapphire in plasma assisted molecular beam epitaxy by introducing a high-temperature ZnO buffer layer. The residual electron concentration of the films can be lowered to 1.5×10¹⁶ cm⁻³, comparable with the best value ever reported for ZnO films grown on a rare and costly substrate of ScAlMgO₄. A 3×3 reconstruction has been observed on the films grown in this route, which reveals that the films have very smooth surface. X-ray phi-scan spectrum of the films shows six peaks with 60° intervals, and two-dimensional X-ray diffraction datum indicates the single-crystalline nature of the films. Low temperature photoluminescence spectrum of the films shows a dominant free exciton emission and five phonon replicas, confirming the high quality of the films.     

Epitaxial growth of ZnO films on thin FeO(1 1 1) layers

Thin FeO(1 1 1) buffer layers prepared on Mo(1 1 0) substrate were used to grow ordered ZnO films under ultrahigh vacuum condition, and were in situ characterized by various surface analytical techniques. A chemical interaction between Zn (or ZnO) and FeO(1 1 1) can effectively lower the interfacial energy, which is in favor of an epitaxial growth of ZnO on FeO layers. Compared with the MgO(1 1 1) buffer layer used for the growth of ZnO(0 0 0 1) on sapphire (0 0 0 1) surface, the FeO(1 1 1) thin films might be a better one because it is more thermally stable. Our experimental results provide constructive information on the growth mechanism of ZnO-based materials, which is helpful for further understanding the growth mechanism of related oxide materials.     

Improvement of amorphous silicon n-i-p solar cells by incorporating double-layer hydrogenated nanocrystalline silicon structure

We develop a double-layer p-type hydrogenated nanocrystalline silicon (p-nc-Si:H) structure consisting of a low hydrogen diluted i/p buffer layer and a high hydrogen diluted p-layer to improve the hydrogenated amorphous silicon (a-Si:H) n-i-p solar cells. The electrical, optical and structural properties of p-nc-Si:H films with different hydrogen dilution ratio (R_H) are investigated. High conductivity, low activation energy and wide band gap are achieved for the thin films. Raman spectroscopy and high-resolution transmission electron microscopy (HRTEM) analyses indicate that the thin films contain nanocrystallites with grain size around 3-5 nm embedded in the amorphous silicon matrix. By inserting a p-nc-Si:H buffer layer at the i/p interface, the overall performance of the solar cell is improved significantly compared to the bufferless cell. The improvement is correlated with the reduction of the density of defect states at the i/p interface.     

Low-temperature/high-temperature AlN superlattice buffer layers for high-quality AlxGa1−xN on Si (1 1 1)

We present MOVPE-grown, high-quality Al_xGa_1−x N layers with Al content up to x=0.65 on Si (1 1 1) substrates. Crack-free layers with smooth surface and low defect density are obtained with optimized AlN-based seeding and buffer layers. High-temperature AlN seeding layers and (low temperature (LT)/high temperature (HT)) AlN-based superlattices (SLs) as buffer layers are efficient in reducing the dislocation density and in-plane residual strain. The crystalline quality of Al_xGa_1−xN was characterized by high-resolution X-ray diffraction (XRD). With optimized AlN-based seeding and SL buffer layers, best ω-FWHMs of the (0 0 0 2) reflection of 540 and 1400 arcsec for the (1 0 1¯ 0) reflection were achieved for a ∼1-μm-thick Al_0.1Ga_0.9N layer and 1010 and 1560 arcsec for the (0 0 0 2) and (1 0 1¯ 0) reflection of a ∼500-nm-thick Al_0.65Ga_0.35N layer. AFM and FE-SEM measurements were used to study the surface morphology and TEM cross-section measurements to determine the dislocation behaviour. With a high crystalline quality and good optical properties, Al_xGa_1−x N layers can be applied to grow electronic and optoelectronic device structures on silicon substrates in further investigations.     

Thermally stimulated relaxation of misfit strains in Si<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>Ge<Subscript>x</Subscript>/Si(100) heterostructures with different buffer layers

The regularities of the defect formation in Si_1−x Ge_x/Si heterostructures (x = 0.15 and 0.30), consisting of a low-temperature Si buffer layer and a SiGe solid solution, during their growth and subsequent annealings at temperatures 550–650°C are investigated by the methods of optical and transmission electron microscopy and X-ray diffraction. It is shown that the misfit-strain relaxation by plastic deformation under the conditions studied occurs most intensively in heterostructures with low-temperature SiGe buffer layers. The maximum degree of misfit-strain relaxation (no higher than 45%) is observed in the heterostructures with x = 0.30 after annealing at 650°C. The results obtained are explained by the effect of the nature and concentration of dislocation-nucleation centers, existing in low-temperature buffer layers, on the characteristics of the formation of a dislocation structure in the heterostructures under consideration.     

Enhancement of photoluminescence in SiCxNy nanoparticle films by addition of a Ni buffer layer

This work reports the effect of the presence of a Ni buffer layer on the photoluminescence (PL) of SiC_xN_y nanoparticle films prepared by RF plasma magnetron sputtering process in a reactive N₂ + Ar + H₂ gas mixture. An introduction of a Ni buffer of 80 nm or thicker remarkably improves the PL of the films. Annealing in a temperature range of 400–1100 °C is found to significantly affect the PL intensity. Optimal PL is achievable at 600 °C. X-ray photoelectron and Fourier-transform infrared spectroscopy suggest that the strong PL is directly related to the composition of the SiC_xN_y nanoparticle and the concentration of Si–O, and Si–N bonds. The results are relevant to the development of wide bandgap optoelectronic devices.