Improvement on the breakdown voltage for silicon-on-insulator devices based on epitaxy-separation by implantation oxygen by a partial buried n~+-layer

A novel silicon-on-insulator (SOI) high-voltage device based on epitaxy-separation by implantation oxygen (SIMOX) with a partial buried n +-layer silicon-on-insulator (PBN SOI) is proposed in this paper.Based on the proposed expressions of the vertical interface electric field,the high concentration interface charges which are accumulated on the interface between top silicon layer and buried oxide layer (BOX) effectively enhance the electric field of the BOX (E_I),resulting in a high breakdown voltage (BV) for the device.For the same thicknesses of top silicon layer (10 μm) and BOX (0.375 μm),the E I and BV of PBN SOI are improved by 186.5% and 45.4% in comparison with those of the conventional SOI,respectively.     

Partial-SOI high voltage laterally double-diffused MOS with a partially buried n~+-layer

A novel partial silicon-on-insulator laterally double-diffused metal-oxide-semiconductor transistor （PSOI LDMOS） with a thin buried oxide layer is proposed in this paper. The key structure feature of the device is an n＋-layer, which is partially buried on the bottom interface of the top silicon layer （PBNL PSOI LDMOS）. The undepleted interface n＋-layer leads to plenty of positive charges accumulated on the interface, which will modulate the distributions of the lateral and vertical electric fields for the device, resulting in a high breakdown voltage （BV）. With the same thickness values of the top silicon layer （10 p.m） and buried oxide layer （0.375 μm）, the BV of the PBNL PSOI LDMOS increases to 432 V from 285 V of the conventional PSOI LDMOS, which is improved by 51.6%.     

高剂量注氮对注氧隔离硅材料埋氧层中正电荷密度的影响

为研究注氮改性对注氧隔离硅材料中埋氧层性质的影响,向其埋氧层内注入了10¹⁶ cm^-2的高剂量氮.实验结果表明,与未注氮的埋氧层相比,所有注氮的埋氧层中的正电荷密度显著增加.实验还发现,注氮后的退火可使埋氧层内的正电荷密度进一步上升.但与注氮导致的埋氧层内正电荷密度的显著上升相比,退火时间对注氮的埋氧层内正电荷密度的影响不大.电容-电压测量结果显示,在埋氧层内部,注氮后未退火的样品与在1100 ℃的氮气气氛下退火2.5 h的样品相比,二者具有近似相同的等效正电荷 关键词： 注氧隔离 埋氧 注氮 正电荷密度     

Improvement of total-dose irradiation hardness of silicon-on-insulator materials by modifying the buried oxide layer with ion implantation

The hardening of the buried oxide (BOX) layer of separation by implanted oxygen (SIMOX) silicon-on-insulator (SOI) wafers against total-dose irradiation was investigated by implanting ions into the BOX layers. The tolerance to total-dose irradiation of the BOX layers was characterized by the comparison of the transfer characteristics of SOI NMOS transistors before and after irradiation to a total dose of 2.7 Mrad(SiO₂. The experimental results show that the implantation of silicon ions into the BOX layer can improve the tolerance of the BOX layers to total-dose irradiation. The investigation of the mechanism of the improvement suggests that the deep electron traps introduced by silicon implantation play an important role in the remarkable improvement in radiation hardness of SIMOX SOI wafers.     

A novel partial silicon on insulator high voltage LDMOS with low-k dielectric buried layer

A novel partial silicon-on-insulator (PSOI) high voltage device with a low-k (relative permittivity) dielectric buried layer (LK PSOI) and its breakdown mechanism are presented and investigated by MEDICI.At a low k value the electric field strength in the dielectric buried layer (E I) is enhanced and a Si window makes the substrate share the vertical drop,resulting in a high vertical breakdown voltage;in the lateral direction,a high electric field peak is introduced at the Si window,which modulates the electric field distribution in the SOI layer;consequently,a high breakdown voltage (BV) is obtained.The values of EI and BV of LK PSOI with kI=2 on a 2 μm thick SOI layer over 1 μm thick buried layer are enhanced by 74% and 19%,respectively,compared with those of the conventional PSOI.Furthermore,the Si window also alleviates the self-heating effect.     

A novel partial SOI LDMOSFET with a trench and buried P layer for breakdown voltage improvement

In this paper for the first time, a partial silicon-on-insulator (PSOI) lateral double-diffused metal-oxide-semiconductor-field-effect-transistor (LDMOSFET) is proposed with a novel trench which improves breakdown voltage. The introduced trench in the partial buried oxide enhances peak of the electric field and is positioned in the drain side of the drift region to maximize breakdown voltage. We demonstrate that the electric field is modified by producing two additional electric field peaks, which decrease the common peaks near the drain and gate junctions in the trench-partial-silicon-on-insulator (T-PSOI) structure. Hence, a more uniform electric field is obtained. Two dimensional (2D) simulations show that the breakdown voltage of T-PSOI is nearly 64% higher in comparison with partial silicon on insulator (PSOI) structure and alleviate self heating effect approximately 9% and 15% in comparison with its conventional PSOI (C-PSOI) and conventional SOI (C-SOI) counterparts respectively. In addition the current of the T-PSOI, C-PSOI, conventional SOI (C-SOI), and fully depleted conventional SOI (FC-SOI) structures are 90, 82, 74, and 44 μA, respectively for a drain–source voltage V_DS = 30 V and gate–source voltage V_GS = 10 V.     

A new structure and its analytical model for the vertical interface electric field of a partial-SOI high voltage device

A new partial-SOI (PSOI) high voltage device structure called a CI PSOI (charge island PSOI) is proposed for the first time in this paper. The device is characterized by a charge island layer on the interface of the top silicon layer and the dielectric buried layer in which a series of equidistant high concentration n⁺-regions is inserted. Inversion holes resulting from the vertical electric field are located in the spacing between two neighbouring n⁺-regions on the interface by the force with ionized donors in the undepleted n⁺-regions, and therefore effectively enhance the electric field of the dielectric buried layer (E_I) and increase the breakdown voltage (BV), thereby alleviating the self-heating effect (SHE) by the silicon window under the source. An analytical model of the vertical interface electric field for the CI PSOI is presented and the analytical results are in good agreement with the 2D simulation results. The BV and E_I of the CI PSOI LDMOS increase to 631~V and 584~V/μ m from 246~V and 85.8~V/μ m for the conventional PSOI with a lower SHE, respectively. The effects of the structure parameters on the device characteristics are analysed for the proposed device in detail.     

退火氧压对YBa2Cu3O7-x薄膜中的激光感生热电电压效应的影响

测量了在不同氧压下退火生长的YBa₂Cu₃O_7-x(YBCO)薄膜中的激光感生热电电压(LITV)信号,发现随退火氧压的增大可使LITV信号的峰值有2—4倍的增强,并且变化趋势与薄膜热电势的各向异性随氧含量的变化规律相同.波长在473—808nm范围内的连续激光辐照,在5000Pa的氧压下退火生长的YBCO薄膜中探测到的LITV信号最大;而紫外脉冲激光辐照时,LITV信号的最大值出现在退火氧压为10⁵Pa 关键词： 2Cu₃O_7-x薄膜')" href="#">YBa₂Cu₃O_7-x薄膜 激光感生热电电压 各向异性的Seebeck系数 氧含量