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1.
Based on the MIS model, a simple method to extract parameters of
SiC Schottky diodes is presented using the $I$-$V$ characteristics.
The interface oxide capacitance $C_\i$ is extracted for the first time,
as far as we know. Parameters of 4H-SiC Schottky diodes fabricated
for testing in this paper are: the ideality factor $n$, the series
resistance $R_{\rm s}$, the zero-field barrier height $\phi_{\rm B0}$,
the interface state density $D_{\rm it}$, the interface oxide
capacitance $C_\i$ and the neutral level
of interface states $\phi_0$. 相似文献
2.
Topological surface measurement of thin metal film using a conducting probe atomic force microscope (C-AFM) shows that thin metal film deposited on Ni/n-Si Schottky diode (SD) consists of patches. These patches are sets of parallel connected and electrically cooperating nano-contacts of size between 50 and 100nm. Every individual patch acts as an individual diode with different I-V curve, barrier height (BH) and ideality factor (n). Between these diodes or patches, there are spot field distributions; the patches with different local work functions are in direct electric contact with surrounding patches. As a result, a potential difference between surfaces of patches, the so-called electrostatic spot field Ef, is formed. It is shown that in real metal-semiconductor (MS) contacts, patches with quite different configurations, various geometrical sizes and local work functions are randomly distributed on the surface of metal; hence direction and intensity of spot field are non-uniformly distributed along the surface of metal. There is a linear dependence between barrier height and ideality factor, which is the consequence of reduction of distance of the maximum of BH from the interface. This dependency is the sign of reduction of contribution of a peripheral current. 相似文献
3.
S. Dalui 《Applied Surface Science》2008,254(11):3540-3547
Phosphorous rich BP in thin film form was deposited onto fused silica substrates by co-evaporating boron (99.99%) and phosphorous (99.995%) from a tantalum boat and indirectly heated alumina crucible, respectively. Schottky diode structures for n-type BP (Al/n-BP/Sb) were fabricated out of these films. Corresponding current-voltage and capacitance-voltage characteristics of the Schottky diodes were recorded and analyzed in the light of the existing theories. 相似文献
4.
This paper develops a new and easy to implement analytical model for the specific on-resistance and electric field distribution along the critical path for 4H-SiC multi-floating junction Schottky barrier diode. Considering the charge compensation effects by the multilayer of buried opposite doped regions, it improves the breakdown voltage a lot in comparison with conventional one with the same on-resistance. The forward resistance of the floating junction Schottky barrier diode consists of several components and the electric field can be understood with superposition concept, both are consistent with MEDICI simulation results. Moreover, device parameters are optimized and the analyses show that in comparison with one layer floating junction, multilayer of floating junction layer is an effective way to increase the device performance when specific resistance and the breakdown voltage are traded off. The results show that the specific resistance increases 3.2 mΩ·cm 2 and breakdown voltage increases 422 V with an additional floating junction for the given structure. 相似文献
5.
Recently GaN-based high electron mobility transistors (HEMTs) have
revealed the superior properties of a high breakdown field and high
electron saturation velocity. Reduction of the gate leakage current
is one of the key issues to be solved for their further improvement.
This paper reports that an Al layer as thin as 3 nm was inserted
between the conventional Ni/Au Schottky contact and n-GaN epilayers,
and the Schottky behaviour of Al/Ni/Au contact was investigated
under various annealing conditions by current--voltage (I--V)
measurements. A non-linear fitting method was used to extract the
contact parameters from the I--V characteristic curves.
Experimental results indicate that reduction of the gate leakage
current by as much as four orders of magnitude was successfully
recorded by thermal annealing. And high quality Schottky contact
with a barrier height of 0.875 eV and the lowest reverse-bias
leakage current, respectively, can be obtained under 12 min
annealing at 450°C in N2 ambience. 相似文献
6.
Analysis and simulation of a 4H-SiC semi-superjunction Schottky barrier diode for softer reverse-recovery 下载免费PDF全文
In this paper,a 4H-SiC semi-superjunction (SJ) Schottky barrier diode is analysed and simulated.The semi-SJ structure has an optimized design and a specific on-resistance lower than that of conventional SJ structures,which can be achieved without increasing the process difficulty.The simulation results show that the specific on-resistance and the softness factor depend on the aspect and thickness ratios,and that by using the semi-SJ structure,specific on-resistance can be reduced without decreasing the softness factor.It is observed that a trade-off exists between the specific on-resistance and the softness of the diode. 相似文献
7.
Analysis and simulation of a 4H-SiC semi-superjunction Schottky barrier diode for softer reverse-recovery 下载免费PDF全文
In this paper, a 4H-SiC semi-superjunction (SJ) Schottky barrier diode is analysed and simulated. The semi-SJ structure has an optimized design and a specific on-resistance lower than that of conventional SJ structures, which can be achieved without increasing the process difficulty. The simulation results show that the specific on-resistance and the softness factor depend on the aspect and thickness ratios, and that by using the semi-SJ structure, specific on-resistance can be reduced without decreasing the softness factor. It is observed that a trade-off exists between the specific on-resistance and the softness of the diode. 相似文献
8.
Hybrid-anode structure designed for a high-performance quasi-vertical GaN Schottky barrier diode 下载免费PDF全文
Qiliang Wang 《中国物理 B》2022,31(5):57702-057702
A quasi-vertical GaN Schottky barrier diode with a hybrid anode structure is proposed to trade off the on-resistance and the breakdown voltage. By inserting a SiN dielectric between the anode metal with a relatively small length, it suppresses the electric field crowding effect without presenting an obvious effect on the forward characteristics. The enhanced breakdown voltage is ascribed to the charge-coupling effect between the insulation dielectric layer and GaN. On the other hand, the current density is decreased beneath the dielectric layer with the increasing length of the SiN, resulting in a high on-resistance. Furthermore, the introduction of the field plate on the side wall forms an metal-oxide-semiconductor (MOS) channel and decreases the series resistance, but also shows an obvious electric field crowding effect at the bottom of the mesa due to the quasi-vertical structure. 相似文献
9.
10.
In this paper, we propose a novel Schottky barrier MOSFET structure,
in which the silicide source/drain is designed on the buried metal
(SSDOM). The source/drain region consists of two layers of silicide
materials. Two Schottky barriers are formed between the silicide
layers and the silicon channel. In the device design, the top barrier
is lower and the bottom is higher. The lower top contact barrier is
to provide higher {on-state} current, and the higher bottom contact
barrier to reduce the off-state current. To achieve this, ErSi is
proposed for the top silicide and CoSi2 for the bottom in the
n-channel case. The 50~nm n-channel SSDOM is thus simulated to
analyse the performance of the SSDOM device. In the simulations, the
top contact barrier is 0.2e~V (for ErSi) and the bottom barrier is
0.6eV (for CoSi2. Compared with the corresponding conventional
Schottky barrier MOSFET structures (CSB), the high on-state
current of the SSDOM is maintained, and the off-state current is
efficiently reduced. Thus, the high drive ability (1.2mA/μm
at Vds=1V,
Vgs=2V) and the high Ion/Imin ratio (106)
are both achieved by applying the SSDOM
structure. 相似文献
11.
提出了改进型的肖特基二极管整流数理模型,用加速迭代法和四阶精度龙格-库塔法编制了计算程序,并结合实验测量得到了整流效率与输入功率、频率和负载等关系曲线:负载一定时,输入功率从零开始增大,整流效率先快速上升,然后上升趋势变缓;输入功率一定时,负载从零开始增大,整流效率先增大后减小,对于某一固定的输入功率,存在着一个最佳负载值;当输入功率和负载都相同时,降低工作频率,整流效率上升。型号为2DV10B的X波段管子在负载为525 W、输入功率为10 mW、频率为3.2 GHz时获得的整流效率为75.2%;频率为10 GHz时获得50.2%的效率,实验测量结果与理论分析一致。 相似文献
12.
Design of vertical diamond Schottky barrier diode with junction terminal extension structure by using the n-Ga2O3/p-diamond heterojunction 下载免费PDF全文
A novel junction terminal extension structure is proposed for vertical diamond Schottky barrier diodes (SBDs) by using an n-Ga2O3/p-diamond heterojunction. The depletion region of the heterojunction suppresses part of the forward current conduction path, which slightly increases the on-resistance. On the other hand, the reverse breakdown voltage is enhanced obviously because of attenuated electric field crowding. By optimizing the doping concentration, length, and depth of n-Ga2O3, the trade-off between on-resistance and breakdown voltage with a high Baliga figure of merit (FOM) value is realized through Silvaco technology computer-aided design simulation. In addition, the effect of the work functions of the Schottky electrodes is evaluated. The results are beneficial to realizing a high-performance vertical diamond SBD. 相似文献
13.
This paper reports that the 4H-SiC Schottky barrier diode, PiN diode and junction barrier Schottky diode terminated by field guard rings are designed, fabricated and characterised. The measurements for forward and reverse characteristics have been done, and by comparison with each other, it shows that junction barrier Schottky diode has a lower reverse current density than that of the Schottky barrier diode and a higher forward drop than that of the PiN diode. High-temperature annealing is presented in this paper as well to figure out an optimised processing. The barrier height of 0.79 eV is formed with Ti in this work, the forward drop for the Schottky diode is 2.1 V, with an ideality factor of 3.2, and junction barrier Schottky diode with blocking voltage higher than 400 V was achieved by using field guard ring termination. 相似文献
14.
J.M. Bluet D. Ziane G. Guillot D. Tournier P. Brosselard J. Montserrat P. Godignon 《Superlattices and Microstructures》2006,40(4-6):399
4.5 kV SiC Schottky diodes have been fabricated using Ni as the Schottky contact. A manufacturing yield of 40% is reached for the bigger area diodes (1.6×1.6 mm2) and of 70% for the smaller ones (0.4×0.4 mm2). The measured variations of barrier height and ideality factor with temperature do not agree with the thermionic model. This has been interpreted in terms of barrier height inhomogeneities using the Werner model. We extracted an average barrier height and its standard deviation . These two parameters are almost independent of the diode size. The variation of the barrier height distribution with field has also been investigated and shows a dependence similar to that of Schottky diodes realized from other semiconductor materials. 相似文献
15.
准垂直GaN肖特基势垒二极管(SBD)因其低成本和高电流传输能力而备受关注.但其主要问题在于无法很好地估计器件的反向特性,从而影响二极管的设计.本文考虑了GaN材料的缺陷以及多种漏电机制,建立了复合漏电模型,对准垂直Ga N SBD的特性进行了模拟,仿真结果与实验结果吻合.基于此所提模型设计出具有高击穿电压的阶梯型场板结构准垂直GaN SBD.根据漏电流、温度和电场在反向电压下的相关性,分析了漏电机制和器件耐压特性,设计的阶梯型场板结构准垂直GaN SBD的Baliga优值BFOM达到73.81 MW/cm~2. 相似文献
16.
A thin poly(ethylmethacrylate) (PEMA) layer is deposited on n-InP as an interlayer for electronic modification of Au/n-InP Schottky structure. The electrical properties of Au/PEMA/n-InP Schottky diode have been investigated by current–voltage (I–V) and capacitance–voltage (C–V) measurements at different annealing temperatures. Experimental results show that Au/PEMA/n-InP structure exhibit a good rectifying behavior. An effective barrier height as high as 0.83 eV (I–V) and 1.09 eV (C–V) is achieved for the Au/PEMA/n-InP Schottky structure after annealing at 150 °C compared to the as-deposited and annealed at 100 and 200 °C. Modified Norde's functions and Cheung method are also employed to calculate the barrier height, series resistance and ideality factors. Results show that the barrier height increases upon annealing at 150 °C and then slightly decreases after annealing at 200 °C. The PEMA layer increases the effective barrier height of the structure as this layer creates a physical barrier between the Au metal and the n-InP. Terman's method is used to determine the interface state density and it is found to be 5.141 × 1012 and 4.660 × 1012 cm?2 eV?1 for the as-deposited and 200 °C annealed Au/PEMA/n-InP Schottky diodes. Finally, it is observed that the Schottky diode parameters change with increasing annealing temperature. 相似文献
17.
Design optimization of high breakdown voltage vertical GaN junction barrier Schottky diode with high-K/low-K compound dielectric structure 下载免费PDF全文
Kuiyuan Tian 《中国物理 B》2023,32(1):17306-017306
A vertical junction barrier Schottky diode with a high-$K$/low-$K$ compound dielectric structure is proposed and optimized to achieve a high breakdown voltage (BV). There is a discontinuity of the electric field at the interface of high-$K$ and low-$K$ layers due to the different dielectric constants of high-$K$ and low-$K$ dielectric layers. A new electric field peak is introduced in the n-type drift region of junction barrier Schottky diode (JBS), so the distribution of electric field in JBS becomes more uniform. At the same time, the effect of electric-power line concentration at the p-n junction interface is suppressed due to the effects of the high-$K$ dielectric layer and an enhancement of breakdown voltage can be achieved. Numerical simulations demonstrate that GaN JBS with a specific on-resistance ($R_{\rm on, sp}$) of 2.07 m$\Omega\cdot$cm$^{2}$ and a BV of 4171 V which is 167% higher than the breakdown voltage of the common structure, resulting in a high figure-of-merit (FOM) of 8.6 GW/cm$^{2}$, and a low turn-on voltage of 0.6 V. 相似文献
18.
19.
Electronic and interface state distribution properties of Ag/p-Si Schottky diode have been investigated. The diode indicates non-ideal current-voltage behavior with an ideality factor greater than unity. The capacitance-voltage (C-V) characteristic is linear in reverse bias indicating rectification behavior and charge density within depletion layer is uniform. From I-V and C-V characteristics, junction parameters such as diode ideality factor and barrier height were found as 1.66 and ?B(I-V) = 0.84 eV (?B(C-V) = 0.90 eV), respectively. The interface state density Nss and relaxation time τ of the Schottky diode were determined by means of Schottky capacitance spectroscopy method. The results show the presence of thin interfacial layer between the metal and semiconductor. 相似文献
20.
Effect of diode size and series resistance on barrier height and ideality factor in nearly ideal Au/n type-GaAs micro Schottky contact diodes 下载免费PDF全文
Small high-quality Au/n type-GaAs Schottky barrier diodes (SBDs) with low reverse leakage current are produced using lithography. Their effective barrier heights (BHs) and ideality factors from current-voltage (I-V) characteristics are measured by a Pico ampere meter and home-built I-V instrument. In spite of the identical preparation of the diodes there is a diode-to-diode variation in ideality factor and barrier height parameters. Measurement of topology of a surface of a thin metal film with atomic force microscope (AFM) shows that Au-n type-GaAS SD consists of a set of parallel-connected micro and nanocontacts diodes with sizes approximately in a range of 100-200 nm. Between barrier height and ideality factor there is an inversely proportional dependency. With the diameter of contact increasing from 5 μm up to 200 μm, the barrier height increases from 0.833 up to 0.933 eV and its ideality factor decreases from 1.11 down to 1.006. These dependencies show the reduction of the contribution of the peripheral current with the diameter of contact increasing. We find the effect of series resistance on barrier height and ideality factor. 相似文献