Effect of Candida antarctica lipase B immobilization on the porous structure of the carrier

A series of poly(GMA-co-EGDMA) resins with identical composition but varying particle sizes, pore radii, specific surface areas and specific volumes are studied to assess how Candida antarctica lipase B immobilization affects the porosity of the copolymer particles. Mercury porosimetry reveals a significant change in the average pore size (up to 6.1-fold), the specific surface area (up to 3.2-fold) and the specific volume (up to 2.1-fold) of the epoxy resin. A similar behaviour is observed for glutaraldehyde-modified epoxy resins. The influences of the resin porosity properties on the loading of Candida antarctica lipase B during immobilization and on the hydrolytic activity (hydrolysis of p-nitrophenyl acetate) of the immobilized lipase are studied.     

丁腈羟增韧环氧树脂形态与力学性能

研究了丁腈羟增韧环氧树脂的力学性能和形态结构，丁腈羟的用量、丁腈羟中丙烯腈的含量、固化条件对所形成的微区尺寸都有较大影响，并进一步影响固化物的力学性能。     

Reactive Core-Shell Bottlebrush Copolymer as Highly Effective Additive for Epoxy Toughening

Herein,we designed a core-shell structured bottlebrush copolymer (BBP),which is composed of rubbery poly(butyl acrylate) (PBA)core and an epoxy miscible/reactive poly(glycidyl methacrylate) (PGMA) shell,as an epoxy toughening agent.The PGMA shell allows BBP to be uniformly dispersed within the epoxy matrix and to react with the epoxy groups,while the rubbery PBA block simultaneously induced nanocavitation effect,leading to improvement of mechanical properties of the epoxy resin.The mechanical properties were measured by the adhesion performance test,and the tensile and fracture test using universal testing machine.When BBP additives were added to the epoxy resin,a significant improvement in the adhesion strength (2-fold increase) and fracture toughness (2-fold increase in Klc and 5-fold increase in Glc)compared to the neat epoxy was observed.In contrast,linear additives exhibited a decrease in adhesion strength and no improvement of fracture toughness over the neat epoxy.Such a difference in mechanical performance was investigated by comparing the morphologies and fracture surfaces of the epoxy resins containing linear and BBP additives,confirming that the nanocavitation effect and void formation play a key role in strengthening the BBP-modified epoxy resins.     

Adhesives and coatings based on phenolic/epoxy resins

Low molecular weight epoxy resin based on bis (4‐hydroxy phenyl) 1,1 cyclohexane was prepared and modified with various types of the prepared phenolic resins. Phenol–, cresol–, resorcinol–and salicylic acid–formaldehyde resins were used. The optimum conditions of formulation and curing process were studied to obtain modified wood adhesives characterized by high tensile shear strength values. This study indicated that the more suitable conditions are 1:2 weight ratio of phenol–or cresol–formaldehyde to epoxy resin in the presence of phthalic anhydride (20 wt%) of the resin content as a curing agent at 150°C for 80 min. Resorcinol–or salicylic acid–formaldehyde/epoxy resins formulated at 1:2 weight ratio were cured in the presence of paraformaldehyde (20 wt%) at 150°C for 60 min. The effect of the structure of phenolic resins on the tensile shear strength values of formulated resin samples, when mixed with the epoxy resins and cured under the previously mentioned optimum conditions for different times, was investigated. Metallic and glass coatings from the previous resins were also prepared and evaluated as varnishes or paints. Copyright © 1999 John Wiley & Sons, Ltd.     

PHASE STRUCTURE AND PROPERTIES OF EPOXY RESIN MODIFIED BY POLYSILOXANE BEARING PENDANT AMINO GROUPS

Polysiloxane-modified epoxy resins were prepared through the reaction of epoxy resin with polydimethylsiloxanesbearing pendant N-(β-aminoethyl)-γ-aminopropyl groups. The morphology and properties of the cured epoxy resins modifiedby the polysiloxanes were investigated. It was found that the phase structure and properties of the cured epoxy resins dependmainly on the amino group content in the polydimethylsiloxane and the level of the modifier. The change of phase structurein the cured epoxy resin systems was responsible for the dramatic change in their mechanical and surface properties.     

Synthesis and properties of novel fluorinated epoxy resins based on 1,1-bis(4-glycidylesterphenyl)-1-(3′-trifluoromethylphenyl)-2,2,2-trifluoroethane

A novel fluorinated epoxy resin, 1,1-bis(4-glycidylesterphenyl)-1-(3′-trifluoromethylphenyl)-2,2,2-trifluoroethane (BGTF), was synthesized through a four-step procedure, which was then cured with hexahydro-4-methylphthalic anhydride (HMPA) and 4,4′-diaminodiphenyl-methane (DDM). As comparison, a commercial available epoxy resin, bisphenol A diglycidyl ether (BADGE), cured with the same curing agents was also investigated. We found that the BGTF gave the exothermic starting temperature lower than BADGE no mater what kind of curing agents applied, implying the reactivity of the former is higher than the latter. The fully cured fluorinated BGTF epoxy resins have good thermal stability with glass transition temperature of 170-175 °C and thermal decomposition temperature at 5% weight loss of 370-382 °C in nitrogen. The fluorinated BGTF epoxy resins also showed the mechanical properties as good as the commercial BADGE epoxy resins. The cured BGTF epoxy resins exhibited improved dielectric properties as compared with the BADGE epoxy resins with the dielectric constants and the dissipation factors lower than 3.3 and dissipation 2.8 × 10⁻³, respectively, which is related to the low polarizability of the C-F bond and the large free volume of CF₃ groups in the polymer. The BGTF epoxy resins also gave low water absorption because of the existence of hydrophobic fluorine atom.     

Determination of glass transition temperature,thermal expansion and,shrinkage of epoxy resins

On the basis of measurements of linear thermal expansion of hardened epoxy resins the influence of some modifiers on the thermal expansion of epoxy resin Epidian-5 has been examined. The glass transition temperatures of examined samples were determined.The paper presents also results of the examinations of changes in thermal and cure shrinkage for epoxy resins that occur under the influence of such modifiers as plasticizers and fillers.Five different compositions were examined. A simple and fast measuring method was applied, in which sample elongations vs temperature were determined with a cathetometer. Specific volume changes of liquid resins with temperature were measured with a quartz dilatometer and a cathetometer.     

Nano- and micro-structured random copolymer modified cycloaliphatic epoxy resins for use as light-emitting diode encapsulation

Poly(2,2,3,4,4,4-Hexafluorobutylmethacrylate–random–glycidolmethacrylate) random copolymer (P(HFBMA-r-GMA)) was synthesized via free radical polymerization. The novel reactive random copolymer was incorporated to modify cycloaliphatic epoxy resins and obtain the nano- or micro- structured composites. The chemical structures of P(HFBMA-r-GMA) were confirmed by Fourier transform infrared spectroscopy (FTIR) and nuclear magnetic resonance (NMR). The morphology and light transmittance of the cured epoxy resins were observed by scanning electron microscopy (SEM), transmission electron microscope (TEM) and ultraviolet-visible spectrophotometry (UV-vis), respectively. It is indicated that the optical transmittance of composites were basically kept although the microphase separation occurred in the curing process, which has a profound influence on the mechanical properties and refractive indexes. The thermal properties, surface dewettability and water absorbency of the cured epoxy resins were examined by differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), contact angle measurement and immersion test respectively. The experimental results revealed that the values of glass transition temperatures (Tg), surface dewettability and water resistance were effectively improved by the high cross-linking density and the enrichment of the fluorinated random copolymer dispersing in the composites. With respect to the corresponding properties of the neat epoxy resin, P (HFBMA-r-GMA)-0.25 hybrimer embraced the relatively good comprehensive properties, making the modified epoxy resins as good candidates for LED encapsulation.     

Factors affecting H2O absorption of the epoxy tetraglycidyl-4,4′-diaminodiphenyl methane cured with diaminodiphenyl sulfone

It was found that the amount of water absorbed at room temperature in cured tetraglycidyl-4,4′-diaminodiphenyl methane/diaminodiphenyl sulfone epoxy resins increases as the curing time or temperature increases while the amount of tetrahydrofuran-soluble extractables and the room temperature density decreases. These data suggest that the free volume increases with the extent of cure and the resins become more accessible to water. While the driving force for water absorption is the electrostatic attraction between water and the functional groups in the epoxy, the results suggest that equilibrium H₂O absorption is determined primarily by unoccupied volume of the epoxy resin.     

一种液晶环氧增韧环氧树脂的研究

环氧树脂具有优异的机械性能 ,耐高温以及良好的加工工艺性 .被广泛用于机械、航天、船舶等领域 .由于环氧树脂固化后断裂延伸率小 ,脆性大 ,使其应用受到了一定的限制 .为此 ,国内外学者对环氧树脂进行了大量的改性研究工作 .用含有“柔性链段”的固化剂固化环氧 ,在交联网络中引入柔性链段[1] ;在环氧基体中加入橡胶弹性体[2 ] 、热塑性树脂[3 ,4] 、液晶聚合物[5,6] 等分散相或用热固性树脂连续贯穿于环氧树脂网络中形成互穿、半互穿网络结构[7] ,以改善环氧树脂的韧性 .本文采用液晶环氧化合物原位复合增韧环氧树脂 ,考察了液晶环氧对环…     

自由体积与亲水性对环氧涂层防护性能的影响

报道了涂层聚合物自由体积和亲水性对涂层腐蚀防护性能影响的初步研究结果.实验表明,相对于自由体积,树脂的亲水性是决定树脂吸水率的更主要因素.低亲水性涂层腐蚀防护性能的提高主要源自到达涂层/金属界面的水量的显著降低.但由于采用活性酯固化的环氧树脂涂层中水通道的尺寸相对较大,水合离子扩散较容易,因此该类涂层覆盖下的金属基体被润湿部分的腐蚀趋势反而较一般涂层为大.     

Imidazole‐type thermal latent curing agents with high miscibility for one‐component epoxy thermosetting resins

Epoxy resins are important thermosetting resins widely employed in industrial fields. Although the epoxy–imidazole curing system has attracted attention because of its reactivity, solidification of a liquid epoxy resin containing imidazoles proceeds gradually even at room temperature. This makes it difficult to use them for one‐component epoxy resin materials. Though powder‐type latent curing agents have been used for one‐component epoxy resin materials, they are difficult to apply for fabrication of fine industrial products due to their poor miscibility. To overcome this situation and to improve the shelf life of epoxy–imidazole compositions, we have developed a liquid‐type thermal latent curing agent 1 , generating an imidazole with a thermal trigger via a retro‐Michael addition reaction. The latent curing agent 1 has superior miscibility toward epoxy resins; in addition, it was confirmed that the epoxy resin composition has both high reactivity at 150 °C, and long‐term storage stability at room temperature. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 2680–2688     

Effect of acetone on mechanical properties of epoxy used for surface treatment before adhesive bonding

A thin layer of un-cured resin over metal substrates applied by using an acetone-diluted resin solution (without hardener) has been found to be beneficial to strong adhesive bonding. The resin pre-coating (RPC) solution can effectively seal sub-surface micro-cavities and increase the substrate wettability. This study examines possible aftermath effects of the acetone dilution on mechanical properties of epoxy through comparison of samples made from as-received resin and resins diluted once and twice by acetone. RPC can be accepted with confidence in substrate pre-treatments for strong adhesive bonding if no detrimental effect on epoxy properties is observed. Fourier transform infrared spectrum (FTIR) was conducted, showing the spectrogram of the resin previously diluted by acetone was the same as that of as-received resin, i.e. no change in epoxy molecular structures after complete evaporation of acetone. Strength and modulus of elasticity measured by flexural and compressive tests were compared using samples made from as-received resin, and resins diluted once and twice by acetone. Variations among results from the three groups were less than 2%, or negligible, affirming the RPC method can be used for substrate pre-treatments and stronger adhesive bonding.     

端羟基丁腈橡胶增韧环氧树脂研究

本文研究了端羟基丁腈橡胶(HTBN)对环氧树脂的增韧作用。加入10—20phr的HTBN,环氧树脂性能可以大幅度提高,粘接碳钢剪切强度30MPa,冲击强度9×10~(-2)J/cm~2,浇注试样抗张强度61MPa,伸长10％,玻璃化温度115℃;不加HTBN的环氧树脂固化物,剪切强度24MPa,冲击强度34×10~(-2)J/cm~2,抗张强度30MPa,伸长5％,玻璃化温度124℃。 本文还通过DSC、SEM研究观察到增韧环氧树脂的两相结构。     

Preparation and properties of epoxy resins cured with silyl esters of phenol novolak and cresol novolak

The curing agents of epoxy resin, trimethylsilyl ethers of phenol novolak (TMSPN) and cresol novolak (TMSCN) were prepared by refluxing phenol novolak and cresol novolak respectively, with the mixture of hexamethyldisilazane and chlorotrimethylsilane in THF. The curing reaction of epoxy resin with these curing agents and the thermal properties of cured resins were examined. The Tg values of epoxy resins cured with TMSPN were a little higher than those cured with TMSCN. The maximum of Tg is 118°C for TMSPN-cured epoxy resin against 112°C for TMSPN-cured epoxy resin. The water absorption of hydrophobic epoxy resins cured with TMSPN was a little lower than those cured with TMSCN. The clear decrease of water absorption is attributed to the difficulty of the micro-void formation caused by the more tight primary structures of TMSPN. The water absorption at 25°C containing trimethylsilyl groups is about one-tenth of that of epoxy resins cured with conventional curing agents and even one-half of that of the epoxy resins cured with active esters. The low water absorption is attributed to the presence of trimethylsilyl groups, which are more hydrophobic than ester groups, and to the absence of hydroxyl groups of the cured resins. This revised version was published online in July 2006 with corrections to the Cover Date.     

咪唑固化不同类型环氧树脂的固化特征、固化动力学及其反应活性

以咪唑为固化剂,对缩水甘油醚型、缩水甘油酯型环氧树脂(简称链型环氧树脂)及脂环环氧树脂的固化特征、固化动力学及反应活性进行了研究.DSC实验结果表明,固化过程均分两阶段进行,链型环氧树脂固化反应表观活化能低于脂环环氧树脂.各树脂第一阶段的表观反应活化能均低于第二阶段活化能.当脂环环氧树脂中混入不同比例的链型环氧树脂后,固化反应速率均较脂环环氧树脂单独固化时快,当链型环氧树脂量大于50％时,更为明显.     

Synthesis and thermal characterization of phosphorus containing siliconized epoxy resins

Siliconized epoxy matrix resin was developed by reacting diglycidyl ethers of bisphenol A (DGEBA) type epoxy resin with hydroxyl terminated polydimethylsiloxane (silicone) modifier, using γ-aminopropyltriethoxysilane crosslinker and dibutyltindilaurate catalyst. The siliconized epoxy resin was cured with 4, 4-diaminodiphenylmethane (DDM), 1,6-hexanediamine (HDA), and bis (4-aminophenyl) phenylphosphate (BAPP). The BAPP cured epoxy and siliconized epoxy resins exhibit better flame-retardant behaviour than DDM and HDA cured resins. The thermal stability and flame-retardant property of the cured epoxy resins were studied by thermal gravimetric analysis (TGA) and limiting oxygen index (LOI). The glass transition temperatures (T_g) were measured by differential scanning calorimetry (DSC) and the surface morphology was studied by scanning electron microscopy (SEM). The heat deflection temperature (HDT) and moisture absorption studies were carried out as per standard testing procedure. The thermal stability and flame-retardant properties of the cured epoxy resins were improved by the incorporation of both silicone and phosphorus moieties. The synergistic effect of silicone and phosphorus enhanced the limiting oxygen index values, which was observed for siliconized epoxy resins cured with phosphorus containing diamine compound.     

MODIFICATION OF EPOXY RESIN WITH POLYSILOXANE BEARING PENDANT QUATERNARY AMMONIUM GROUPS

Polysiloxane bearing pendant quaternary ammonium groups (PSI) was used to modify the surface properties ofepoxy resins. In the cured resin, PSI formed the dispersed phase. Remarkable enrichment and gradient distribution ofpolysiloxane on the surface region of the epoxy resins were demonstrated by XPS analysis. The composition and propertiesof the surface of PSI-modified epoxy resin, which is in contact with the mold, are dependent on the material of the mold.Through the incorporation of PSI, epoxy resins with low surface energy and low friction coefficient were obtained.Polysiloxane with lower ionic group content shows a higher degree of enrichment on the resin surface and leads to a highercontact angle against water, while the polysiloxane having optimum compatibility with the epoxy resin shows a greater effectin reducing the static friction coefficient of the resin against glass.     

Morphology, flexural, and thermal properties of sepiolite modified epoxy resins with different curing agents

A bisphenol A-based epoxy resin was modified with 5 wt% organically modified sepiolite (Pangel B40) and thermally cured using two different curing agents: an aliphatic diamine (Jeffamine D230, D230) and a cycloaliphatic diamine (3DCM). The morphology of the cured materials was established by scanning and transmission electron microscopy analysis. The thermal stability, thermo-mechanical properties, and flexural behaviour of the sepiolite-modified matrices were evaluated and compared with the corresponding neat matrix. The initial thermal decomposition temperature did not change with the addition of sepiolite. The flexural modulus of the epoxy matrix slightly increases by the incorporation of the organophilic sepiolite. The flexural strength of the sepiolite modified resin cured with D230 increased by a 10% while the sepiolite modified resin cured with 3DCM resulted in a lower flexural strength compared with the unmodified resin. The reduced flexural strength was attributed to the stress concentrations caused by the sepiolite modifier, which rendered the resins more brittle.     

Preparation and structural determination of siloxane-modified sulfone-containing epoxy resins

Siloxane-modified sulfone-containing epoxy resins (ESBS) were prepared by polycondensation of PMPS and/or PDMS siloxane oligomers with EBS, the sulfone-containing epoxy resin. Structures were analyzed by IR, ¹H-, and ¹³C-NMR. The siloxane content in the copolymers was determined by ¹H-NMR with an integration technique. Epoxy equivalent weight (EEW) determination indicated that the oxirane ring of EBS was intact with this hot-melt procedure. The GPC measurement of these ESBS copolymers showed that molecular weight (MW) increased with increasing siloxane content in PMPS-modified copolymers. Evidence of siloxane incorporation in the copolymer was discussed. © 1996 John Wiley & Sons, Inc.