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烟酸对酸性硫酸盐体系铜电沉积的影响 总被引:2,自引:0,他引:2
对溶液A: 0.8 mol•L-1硫酸铜,0.6 mol•L-1硫酸,5.0×10-5 mol•L-1氯离子,1.0×10-4 mol•L-1聚乙二醇的溶液,溶液B:在溶液A中加入2.0×10-2 mol•L-1烟酸,pH为0.5,运用循环伏安和计时安培法研究玻碳电极上铜的电沉积行为.结果表明,铜的电沉积过程经历了晶核形成过程,其电结晶按瞬时成核和三维生长方式进行.烟酸的加入对铜的电沉积具有阻化作用,但不改变铜的电结晶机理.沉积层的X射线衍射表明Cu为面心立方结构,在烟酸存在下沉积层出现(220)高择优取向,这可能是烟酸在Cu(220)晶面上发生强烈吸附作用的结果. 相似文献
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采用循环伏安和计时安培法研究了羟基乙叉二膦酸(HEDPA)镀铜液中铜在玻碳电极上电结晶的初期行为。结果表明:羟基乙叉二膦酸(HEDPA)镀铜体系中,铜的电沉积过程经历了晶核形成过程;当溶液中不含CO32-时,其电结晶按连续三维成核方式进行,而CO32-的加入,使得铜电结晶按瞬时三维成核方式进行;成核数密度都随着电位的提高而增加。这可能是CO32- -以第二配体形式进入HEDPA和Cu2+构成的络合结构,从而形成更稳定的络合物吸附在电极表面所致。 相似文献
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采用扫描电镜、X射线衍射仪、原子吸收光度计和电子探针等仪器,研究了含有铋离子的酸性硫酸铜电解液中阴极铜沉积的电结晶生长形态、结晶的晶面取向以及铜沉积层的化学组成.研究结果表明:65℃时,在通常的电流密度i=200A·mol/L-2下电解,铋不会在阴极沉积;铋离子对铜沉积层的晶面取向(220)基本不影响,电解液中存在高浓度铋离子时对(220)晶面生长起促进作用,对其它晶面生长起较强的抑制作用;铋离子影响铜沉积的电结晶生长形态和铜沉积层的晶胞尺寸. 相似文献
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添加剂3-巯基-1-丙烷磺酸钠对铜电沉积影响的研究 总被引:1,自引:0,他引:1
采用循环伏安(CV)、线性电位扫描(LSV)、计时安培(CA)和交流阻抗(AC impedance)电化学方法结合扫描电镜(SEM)研究了不同浓度的3-巯基-1-丙烷磺酸钠(MPS)对CuSO4-H2SO4体系中铜在玻碳电极(GCE)上的电沉积过程的影响. CV, LSV和AC impedance实验结果一致表明 MPS阻化铜的电沉积, 并且随着MPS浓度的增加, 其阻化作用增强. 但是MPS对Cu的电结晶过程表现为促进作用, CA与SEM研究结果一致表明, MPS不改变Cu的电结晶成核机理, 仍然按瞬时成核和三维生长方式进行, 并且成核数目随着MPS浓度的增大而增加. 相似文献
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在弱酸性柠檬酸盐体系铜锡合金镀液中,采用线性扫描伏安(LSV)、循环伏安(CV)和计时安培实验方法,运用Scharifker-Hills(SH)理论模型和Heerman-Tarallo(HT)理论模型分析拟合实验结果,研究铜锡合金在铜电极上的电沉积过程与电结晶机理.结果表明,铜锡合金在铜电极表面实现共沉积并遵循扩散控制下三维瞬时成核的电结晶过程.电位阶跃从-0.80 V负移至-0.85 V(vs SCE),HT理论分析得到铜锡合金的成核与生长的动力学参数分别为成核速率常数(A)值从20.19 s-1增加至177.67 s-1,成核活性位点密度数(N0)从6.10×105cm-2提高至1.42×106cm-2,扩散系数(D)为(6.13±0.62)×10-6cm2s-1. 相似文献
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Mechanism of copper electrocrystallization on highly oriented pyrolytic graphite electrode from a solution of 1 mmol/L CuSO4 and 1.0 mol/L H2SO4 has been studied using cyclic voltammogram and chronoamperometry. The results show that in copper electrodeposition the charge-transfer step is fast and the rate of growth is controlled by the rate of mass transfer of copper ions to the growing centers. Reduction of Cu(Ⅱ) ions did not undergo underpotential deposition. The initial deposition kinetics of Cu electrocrystallization corresponds to a model including progressive nucleation and diffusion controlled growth. Copper nanocrystals with size of 75.6 nm and relative standard deviation of 9% can be obtained by modulation potential electrodeposition. 相似文献
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用线性电位扫描、循环伏安和计时安培电化学方法研究了聚乙二醇(PEG)和Cl-同时存在时, 酸性镀铜溶液中Cu在玻碳电极(GCE)上的电结晶过程. 研究表明, PEG-Cl-作用下Cu 的电结晶按瞬时成核和三维生长方式进行. PEG-Cl-使电极表面的活性点急剧减少, 并降低了Cu2+的扩散系数, 阻化了Cu的电沉积和成核过程. PEG-Cl-作用时, Cl-离子仍然表现出较强的促进作用, 随Cl-浓度的增大, Cu2+的扩散系数、Cu的沉积速度和成核速度都有所提高. 适宜的PEG, Cl-浓度使成核数密度增大. 相似文献
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高择优取向Cu电沉积层的XRD研究 总被引:16,自引:1,他引:15
采用电化学和XRD方法在CuSO4 +H2 SO4 电解液中获得Cu电沉积层并研究其结构 .结果表明 ,在 4 .0A/dm2 和 15 .0A/dm2 电流密度下可分别获得 (2 2 0 )和 (111)晶面高择优取向Cu镀层 ;Cu镀层晶面织构度随厚度提高而增大 ,获得 (111)晶面高择优Cu镀层的厚度约是 (2 2 0 )晶面的 7倍 ,说明Cu(2 2 0 )晶面比 (111)晶面是更易保留的晶面 ,且低电流密度下铜的电结晶更容易受电沉积条件控制 ;较高的沉积电流密度有利于晶核的形成 ;Cu镀层存在晶格畸变和晶胞参数的涨大 相似文献
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The process of copper electrocrystallization on the Ag(111) face was studied in acidic perchlorate-sulfate electrolytes. Enhanced
rate of charge transfer in the course of nucleation and growth of epitaxial copper crystallites was observed in the solutions
with additives of sulfate ion as a result of local electrostatic effects under specific adsorption of anions. Copper nucleation
parameters were estimated in the framework of the diffusion models and atomistic theory of electrochemical nucleation. 相似文献
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The electrodeposition of copper on a polycrystalline gold electrode and on Au(hkl) single crystals was investigated in a deep eutectic solvent (DES). The DES employed consisted of a mixture of choline chloride and urea (1:2). The Au(hkl)/DES interface was studied using cyclic voltammetry in the capacitive region. The blank voltammograms showed characteristic features, not previously reported, that demonstrate the surface sensitivity of this solvent. Copper electrodeposition was then studied and it was found that this takes place through the formation of an underpotential deposition (UPD) adlayer, demonstrating the surface sensitivity of this process. Voltammetric profiles showed similarities with those obtained in aqueous solutions containing chloride, suggesting that the copper UPD in this DES is strongly influenced by the presence of chloride. 相似文献
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In this paper we report the transfer of micro-scale patterns by electrodeposition on to substrates without requiring them to be coated with a photoresist mask. This approach makes uses of a patterned tool which is placed in close proximity to the substrate in an electrochemical reactor. With an appropriate choice of electrochemical parameters, electrodeposition can be confined to regions corresponding to the exposed regions of the tool. Experiments indicate that the electrodeposition of copper features on to conductive substrates is possible using this approach. Copper lines of 100 μm width have been successfully replicated, but with some increase in dimension due to current spreading. This effect can be minimised by reducing the inter-electrode gap and employing an electrolyte with a low conductivity. It is also demonstrated that the tool can be used to pattern multiple substrates. 相似文献
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刘久苗 《中国无机分析化学》2014,4(2):32-35
建立了用于混合铜矿石中自由氧化铜测定的方法。试样用含亚硫酸钠(6g/L)的硫酸(10%)溶液浸取2h,选择性溶解铜氧化物,过滤并煮沸滤液,用去离子水稀释后电解。溶液中的铜离子电积至阴极铂网上。用火焰原子吸收光谱法检测残余于电解后液中的铜离子;同时用硝酸(1+1)溶解铂网上的铜,并用火焰原子吸收光谱法检测与阴极铜共电积的杂质元素含量,用铂阴极差重加上电积后液残余铜含量并减去共电积的杂质元素含量可计算出氧化铜矿中酸溶铜含量。与碘量法相比,不用肉眼观察颜色变化确定终点,人为误差小,结果稳定、准确。通过对加拿大氧化铜矿标准物质AMIS0050进行测定(n=12),方法准确度可靠。并选取15批次的氧化铜矿检测,与经典碘量法比对,结果令人满意。 相似文献
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Te,CdTe,HgCdTe的电沉积及其成核机理 总被引:2,自引:0,他引:2
应用自装微机联用恒电位系统研究了在玻璃碳或铁电极上Te、CdTe、HgCdTe的电沉积及其电结晶成核机理。结果表明,在酸性溶液中,HTeO_2~+的阴极还原符合4电子还原机理,其电结晶生长表现为由HTeO_2~+扩散控制的三维瞬时成核机理;CdTe沉积层的形成是亚碲酸还原的延续,其电结晶成核机理因电位阶跃值、沉积温度及溶液pH值的改变而由HTeO_2~+扩散控制的三维瞬时成核转变为二维瞬时成核机理;对HgCdTe,其电沉积过程的动力学步骤可设想为: Hg~(2+)+2e—→Hg,HTeO_2~++3H~++4e—→Te+2H_2O xHg+Te—→Hg_2Te,Hg_2Te+(1—x)Cd~(2+)+2(1—x)e—→Hg_2Cd_(1-2)Te 相关的结晶生长除受各种实验因素影响外,还与CdTe的成核过程有关。在本文实验条件下,大体遵循二维瞬时成核机理。 相似文献