高效率GaN基高压LED芯片的制备及COB封装

为提升GaN基高压LED芯片的出光性能,优化了芯片发光单元之间隔离沟槽的宽度.当隔离沟槽宽度为20μm时,芯片的电学性能和光学性能最优.当注入电流为20 mA时,正向电压为50.72 V,输出光功率为373.64 mW,电光转换效率为36.83％.采用镜面铝基板和陶瓷基板进行了4颗芯片串联形式的COB封装.镜面铝基板的热导率和反射率均高于陶瓷基板,可提升HV-LED器件在大注入电流和高温时的发光性能.当注入电流为20 mA且基板温度为20℃时,镜面铝基板封装的HV-LED器件的正向电压是198.9 V,发光效率达122.2 lm/W.     

中高温GaN插入层厚度对蓝光LED光电性能的影响

利用金属有机气相化学沉积(MOCVD)技术在蓝宝石图形衬底上生长GaN基蓝光LED,并系统研究了不同中高温GaN插入层厚度对其光电性能的影响。利用芯片测试仪和原子力显微镜(AFM)表征了GaN基蓝光LED外延片的光电性能以及表面形貌。当中高温GaN插入层厚度从60 nm增加至100 nm时,V形坑尺寸从70~110 nm增加至110~150 nm。当注入电流为20 mA时,LED芯片的光功率从21.9 mW增加至24.1mW;当注入电流为120 mA时,LED芯片的光功率从72.4 mW增加至82.4 mW。对V形坑尺寸调控LED光电性能的相关物理机制进行了分析,结果表明:增大V形坑尺寸有利于增加空穴注入面积和注入效率,进而提高LED器件的光功率。     

Si衬底功率型GaN基绿光LED性能

对本实验室在Si(111)衬底上MOCVD法生长的芯片尺寸为400 μm×600μm功率型绿光LED的光电性能进行研究.带有银反射镜的LED在20 mA的电流下正向工作电压为3.59 V,主波长518 nm,输出光功率为7.3 mW,90 mA下达到28.2 mW,发光功率效率为7.5%,光输出饱和电流高达600 mA.在200 mA电流下加速老化216 h,有银反射镜的LED光衰小于尤银反射镜的LED,把这一现象归结于Ag反射镜在提高出光效率的同时,降低了芯片奉身的温度.本器件有良好的发光效率,光衰和光输出饱和电流等综合特性表明,Si衬底GaN基绿光LED具有诱人的发展前景.     

转移基板材质对Si衬底GaN基LED芯片性能的影响

在Si衬底上生长了GaN基LED外延材料,分别转移到新的硅基板和铜基板上,制备了垂直结构蓝光LED芯片。研究了这两种基板GaN基LED芯片的光电性能。在切割成单个芯片之前,对大量尺寸为(300μm×300μm)的这两种芯片分别通高达1 A的大电流在测试台上加速老化1 h。结果显示,铜基板Si衬底GaN基LED芯片有更大的饱和电流,光输出效率更高,工作电压随驱动电流的变化不大,光输出在老化过程中衰减更小。铜基板芯片比硅基板芯片可靠性更高,在大功率半导体照明器件中前景诱人。     

GaN基高压直流发光二极管制备及其性能分析

GaN基高压直流发光二极管工艺制备, 采用蓝宝石图形衬底(PSS) 外延片制备正梯形芯粒结构的GaN基高压直流LED.相对其他结构器件, 该结构器件发光效率最高, 封装白光后, 在色温4500 K, 驱动电流20 mA时, 光效116.06 lm/W, 对应电压50 V. 测试其I-V曲线表明, 开启电压为36 V, 对应驱动电流为1.5 mA; 在电流15 mA至50 mA时, 光功率随驱动电流增加近似于线性增加, 在此区域光效随电流增加而降低的幅度比较缓慢, 表明GaN基高压直流LED适宜于采用大电流密度驱动, 而不会出现驱动电流密度增加导致量子效率明显下降(efficiency droop), 为从芯片层面研究解决量子效率下降难题提供了一种新思路.     

不同基板1W硅衬底蓝光LED老化性能研究

将硅(Si)衬底上外延生长的氮化镓(GaN)基LED薄膜,通过电镀的方法转移到铜支撑基板、铜铬支撑基板以及通过压焊的方法转移到新的硅支撑基板,获得了垂直结构蓝光LED器件,并对其老化特性进行了对比研究。研究结果表明,在三种基板中铜支撑基板的器件老化后光电特性最稳定。把这一现象归结于三种样品的应力状态以及基板热导率的不同,其中应力状态可能是影响器件可靠性的最主要因素。     

ITO表面粗化提高GaN基LED芯片出光效率

使用现有生产线上工艺成熟且成本低廉的技术实现ITO粗化以提高GaN基LED蓝光芯片的出光效率是产业界重要的研究课题。本文通过普通光刻技术和湿法腐蚀技术,实现ITO表面粗化,有效地提高了LED芯片的输出光功率。输入电流为20 mA时,ITO层制备密集分布的三角周期圆孔阵列后,芯片输出光功率提升11.4%,但正向电压升高0.178 V;微结构优化设计后,芯片输出光功率提升8.2%,正向电压仅升高0.044 V。小电流注入时,密集分布的三角周期圆孔阵列有利于获得较高的输出光功率。大电流注入时,这种结构将导致电流拥挤,芯片的电光转化效率衰减严重。经过优化设计后的微结构阵列器件,具有较高的电注入效率,因此芯片的出光效率较高且随输入电流的增加而衰减的趋势较慢,因此更适合大电流下工作。     

SiN钝化膜对Si衬底GaN基蓝光LED性能影响

利用等离子辅助化学气相沉积(PECVD)系统在垂直结构Si衬底GaN基蓝光LED芯片上生长了SiN钝化膜,并对长有钝化膜及未作钝化处理的LED在不同条件下进行了老化实验,首次研究了SiN钝化膜对垂直结构Si衬底GaN基蓝光LED可靠性的影响。实验发现:经过30mA、85℃、24h条件老化后,未作钝化处理的Si衬底GaN基蓝光LED的平均光衰为11.41%,而长有SiN钝化膜的LED平均光衰为6.06%,SiN钝化膜有效地改善了LED在各种老化条件下的光衰,另外,SiN钝化膜缓解了Si衬底GaN基蓝光LED老化过程中反向电压(Vr)的下降,但对老化后LED的抗静电击穿能力(ESD)没有明显的影响。     

注入电流对绿光高压LED光电特性的影响

设计并制备了12 V的GaN基绿光高压发光二极管(LED),并对其进行了变电流测试。研究了绿光高压LED的正向电压、峰值波长、光功率以及光效等重要参数随注入电流的变化关系,电流变化范围为3~50mA,测试温度为25℃。实验结果表明:电流对绿光高压LED的光电特性有很大影响。在驱动电流为20 mA时,对应电压为14 V。随着注入电流的增大,峰值波长蓝移了2 nm。随着电流的增大,光功率近似于线性增加。在注入电流从3 mA增大到20 mA的过程中,光效降低了约61%;在注入电流从20 mA增大到50 mA的过程中,光效降低了约39%。这说明高压LED在大电流驱动时,光效降低的幅度比较缓慢。上述结果对GaN基绿光高压LED的改进优化具有一定的参考价值。     

注入电流对绿光高压LED光电特性的影响

设计并制备了12 V 的GaN基绿光高压发光二极管（LED）,并对其进行了变电流测试。研究了绿光高压LED的正向电压、峰值波长、光功率以及光效等重要参数随注入电流的变化关系,电流变化范围为3~50 mA,测试温度为25 ℃。实验结果表明：电流对绿光高压LED的光电特性有很大影响。在驱动电流为20 mA时,对应电压为14 V。随着注入电流的增大,峰值波长蓝移了2 nm。随着电流的增大,光功率近似于线性增加。在注入电流从3 mA增大到20 mA的过程中,光效降低了约61%;在注入电流从20 mA增大到50 mA的过程中,光效降低了约39%。这说明高压LED在大电流驱动时,光效降低的幅度比较缓慢。上述结果对 GaN基绿光高压 LED 的改进优化具有一定的参考价值。     

晶圆键合和激光剥离工艺对GaN基垂直结构发光二极管芯片残余应力的影响

GaN基发光二极管(LED)中的残余应力状态对器件的性能和稳定性有很大影响. 通过使用三种不同的键合衬底(Al₂O₃衬底, CuW衬底和Si衬底)以及改变键合温度(290 ℃, 320 ℃, 350 ℃和380 ℃), 并且使用不同的激光能量密度(875, 945和1015 mJ·cm^-2) 进行激光剥离, 制备了不同应力状态的GaN基LED器件. 对不同条件下GaN LED进行弯曲度、Raman 散射谱测试. 实验结果表明, 垂直结构LED中的残余应力的状态是键合衬底和键合金属共同作用的结果, 而键合温度影响着垂直结构LED中的残余应力的大小. 激光剥离过程中, 一定能量密度下激光剥离工艺一般不会对芯片中的残余应力造成影响, 但是如果该工艺对GaN 层造成了微裂缝, 则会在一定程度上起到释放残余应力的作用. 使用Si衬底键合后, 外延蓝宝石衬底翘曲变大, 对应制备的GaN基垂直结构 LED中的残余应力为张应力, 并且随着键合温度的上升而变大; 而Al₂O₃和CuW衬底制备的LED中的残余应力为压应力, 但使用Al₂O₃衬底键合制备的LED中压应力随键合温度上升而一定程度变大, CuW 衬底制备的LED中压应力随键合温度上升而下降.     

Silver-induced activation for improving the electrical characteristics of GaN-based vertical light-emitting diodes

Silver (Ag) contacts are important reflectors for vertical-structure GaN-based light-emitting diodes (LEDs). The Ag contacts produce good electrical and optical properties at different annealing temperatures. Thus, in order to best optimize the reliability of LEDs, we introduced an Ag activation process before performing normal annealing treatments. In other words, after removing 200-nm-thick Ag layers on p-GaN that were annealed at 500 °C for 1 min, Ag films were deposited on the Ag-activated p-GaN, which were subsequently annealed at 300 °C for 1 min. The activated LEDs fabricated with the 300 °C-annealed Ag contacts reveal better electrical properties than the reference LEDs. For example, the activated LEDs give a forward voltage of 2.92 V at an injection current of 20 mA, whereas the reference LEDs with the 300- and 500 °C-annealed Ag contacts yield 3.02 and 2.98 V at 20 mA, respectively. The activated LEDs yield 4.9% and 17% higher output power (at 30 mW) than the reference LEDs with the Ag contacts annealed at 300 and 500 °C. The activation-induced electrical improvement is briefly described and discussed.     

GaN-based light-emitting diodes directly grown on sapphire substrate with holographically generated two-dimensional photonic crystal patterns

As an approach to enhance light extraction from GaN-based light-emitting diodes (LEDs), we inserted a submicron period photonic crystal (PC) pattern at the interface between GaN epilayer and sapphire substrate. A two-dimensional square-lattice pillar array of 600-nm period was produced directly onto the sapphire substrate by a combination of laser holography and inductively-coupled-plasma etching. A standard GaN LED heterostructure was grown on top of the nano-patterned substrate, which was then processed to conventional bottom-emitting LED chips. At the drive current of 20 mA, the PC-LED produced surface-normal output power about 40% higher than that of the reference LED (with no PC integrated). Temperature-dependent photoluminescence measurement indicated that the emission enhancement was solely a structural effect by the integrated PC pattern.     

ITO界面调制层对GZO电极LED器件性能的影响

采用磁控溅射制备GZO和具有ITO界面调控层的GZO(ITO/GZO)透明导电薄膜作为大功率LED的电流扩散层,对比研究界面调控层对LED器件性能的影响。研究结果表明,ITO/GZO薄膜的透过率在可见光区达80%以上,退火后的ITO/GZO薄膜有较低的电阻率(1.15×10^-3 Ω·cm)。ITO调控层的介入能够调制GZO表面粗糙度,有利于改善LED外量子效率,降低GZO/p-GaN界面的接触势垒,提高LED器件的光电性 能。通过ITO界面调控后,LED器件20 mA驱动电流下的工作电压从9.5 V降低为6.8 V,发光强度从245 mcd 升到297 mcd,提高了20%;驱动电流为35 mA时,其发光强度从340.5 mcd 升到511 mcd,提高了50%。     

Progress and prospects of GaN-based LEDs using nanostructures

Progress with GaN-based light emitting diodes(LEDs) that incorporate nanostructures is reviewed,especially the recent achievements in our research group.Nano-patterned sapphire substrates have been used to grow an Al N template layer for deep-ultraviolet(DUV) LEDs.One efficient surface nano-texturing technology,hemisphere-cones-hybrid nanostructures,was employed to enhance the extraction efficiency of In GaN flip-chip LEDs.Hexagonal nanopyramid GaN-based LEDs have been fabricated and show electrically driven color modification and phosphor-free white light emission because of the linearly increased quantum well width and indium incorporation from the shell to the core.Based on the nanostructures,we have also fabricated surface plasmon-enhanced nanoporous GaN-based green LEDs using AAO membrane as a mask.Benefitting from the strong lateral SP coupling as well as good electrical protection by a passivation layer,the EL intensity of an SP-enhanced nanoporous LED was significantly enhanced by 380%.Furthermore,nanostructures have been used for the growth of GaN LEDs on amorphous substrates,the fabrication of stretchable LEDs,and for increasing the3-d B modulation bandwidth for visible light communication.     

Improved light extraction efficiency of GaN-based LEDs with patterned sapphire substrate and patterned ITO

To improve the light extraction efficiency of GaN-based light-emitting diodes (LEDs), periodic semisphere patterns with 3.5 μm width, 1.2 μm height, and 0.8 μm spacing were formed on sapphire substrate by dry etching using BCl₃/Cl₂ gas chemistry. The indium tin oxide (ITO) transparent conductive layer was patterned by wet etching to reduce the total internal reflection existing along between p-GaN, ITO, and air. At 350 mA injection current, the high power LED by integrating patterned sapphire substrate with patterned ITO technology exhibited a 36.9% higher light output power than the conventional LEDs.     

GaN-based light-emitting diode with ZnO nanotexture layer prepared using hydrogen gas

ZnO films were deposited on indium tin oxide (ITO), which formed the transparent conductive layer (TCL) of a GaN-based light-emitting diode (LED), by ultrasonic spraying pyrolysis to increase the light output power. The ZnO nanotexture was formed by treating the as-deposited ZnO films with hydrogen. The root mean square (RMS) roughness increased from 4.47 to 7.89 nm before hydrogen treatment to 10.82-15.81 nm after hydrogen treatment for 20 min. Typical current-voltage (I-V) characteristics of the GaN-based LEDs with a ZnO nanotexture layer have a forward-bias voltage of 3.25 V at an injection current of 20 mA. The light output power of a GaN-based LED with a ZnO nanotexture layer improved to as much as about 27.5% at a forward current of 20 mA.     

Micro-light-emitting-diode array with dual functions of visible light communication and illumination

We demonstrate high-speed blue 4 × 4 micro-light-emitting-diode(LED) arrays with 14 light-emitting units(two light-emitting units are used as the positive and negative electrodes for power supply, respectively) comprising multiple quantum wells formed of Ga N epitaxial layers grown on a sapphire substrate, and experimentally test their applicability for being used as VLC transmitters and illuminations. The micro-LED arrays provide a maximum-3-d B frequency response of 60.5 MHz with a smooth frequency curve from 1 MHz to 500 MHz for an optical output power of 165 mW at an injection current of 30 mA, which, to our knowledge, is the highest response frequency ever reported for blue Ga N-based LEDs operating at that level of optical output power. The relationship between the frequency and size of the device single pixel diameter reveals the relationship between the response frequency and diffusion capacitance of the device.     

Si衬底GaN基LED的结温特性

结温是发光二极管的重要参数之一,它对器件的内量子效率、输出功率、可靠性及LED的其他一些性能有很大的影响。首次报道Si衬底GaN基LED的结温特性。利用正向压降法测量Si衬底上GaN基LED的结温,通过与蓝宝石衬底上GaNLED的结温比较,发现Si衬底GaNLED有更低的结温,原因归结为Si有更好的导热性。同时也表明:用Si作GaNLED的衬底在大功率LED方面具有更大的应用潜力。