4,5-环氧环己烷1,2-二甲酸二缩水甘油酯的固化行为

本文用动态力学扭辨分析法,研究4,5-环氧环己烷1,2-二甲酸二缩水甘油酯与间苯二胺的热固化动态力学行为。结果表明:固化过程分两个阶段进行,低于100℃时,交联反应主要在缩水甘油酯链的环氧基上进行;100—130℃时为酯链环氧基反应趋近完全和酯环环氧基反应速率逐步增大的过渡区;130℃以上固化时,酯环环氧基才明显地参与固化交联反应。从Arrhenius关系曲线求得本固化体系凝胶点前表现反应活化能为13.2kcal/mol。     

芳基磺盐对不同类型环氧化合物的固化行为

通过 DSC法研究了 LEPB、双酚 A型环氧树脂 E-51和 TDE-85型环氧树脂与四种芳基碘钅翁盐的热固化行为及反应活化能。结果发现 ,双酚 A型环氧树脂固化反应的活化能较高 ,而 TDE-85的放热较集中。同时发现与酸酐固化剂相对照 ,本文中使用的 LEPB—固化剂体系的活化能 (78.66～ 1 0 2 .5k J· mol-1)普遍高于LEPB酸酐体系的活化能 (69.0 4～ 75.1 0 k J·mol-1)。     

亲水性形状记忆环氧树脂制备及表面浸润性调控

采用聚乙二醇(PEG)对间苯二甲胺(MXDA)固化的TDE-85环氧树脂体系进行改性,制备了亲水性形状记忆环氧树脂,结合微形貌构筑和热响应方式对树脂表面浸润性进行智能调控.结果表明,PEG的引入有效地增加了TDE-85环氧树脂的亲水性.PEG的最佳含量为20%(质量分数)时,树脂表面的接触角为54°,实现了环氧树脂从原始TDE-85/MXDA固化体系表面的疏水性(接触角为108°)到TDE-85/MXDA/PEG固化体系表面亲水性的转变;改性后树脂的玻璃化转变温度Tg为71℃,形状固定率和回复率分别为96.10%和99.97%,表明得到的树脂具有良好的形状记忆性能.进一步采用模板法在树脂表面构筑了微阵列结构,基于形状记忆效应,通过对表面微阵列形态的控制,实现了环氧树脂表面介于亲水性(接触角为51°)与超亲水性(接触角为0°)间的可逆浸润性智能调控.     

2,4,6-三(羟基苯甲基氨基)-均三嗪的合成及其与双酚A型环氧树脂的固化行为研究

合成了一种含三嗪环结构的环氧树脂固化剂2,4,6-三(羟基苯甲基氨基)-均三嗪(MFP).用动态DSC和原位红外光谱对MFP/DGEBA(双酚A型环氧树脂)体系的固化行为进行了研究.动态DSC研究表明,由于MFP分子结构中存在两种活泼氢(酚羟基氢和仲胺氢),固化反应存在明显的两个峰,相对应的表观活化能分别为70.5 kJ.mol-1和86.5 kJ.mol-1(Kissinger法),通过与另一相似化合物固化DGEBA的比较可知,在MFP固化DGEBA的过程中,酚羟基与环氧基反应相对较难.原位红外动力学结果很好地支持了上述结论.     

环氧/酸酐/DMPA体系固化动力学与溶解性研究

在环氧/酸酐固化体系中引入4-二甲氨基吡啶(DMPA)作为酯交换反应催化剂和固化反应促进剂,以制备具有动态交联网络的环氧树脂。用差示扫描量热仪(DSC)对环氧/酸酐/DMPA体系的固化行为进行了研究,考察了催化剂的含量和固化剂比例对环氧/酸酐/DMPA体系固化行为的影响和固化动力学。通过乙二醇溶解实验,研究交联网络中的可交换键。结果表明反应体系中有高温和低温两种固化机理发生反应,催化剂和固化剂含量较少时,固化反应温度高,固化反应中含较多环氧自聚反应,不利于酯交换反应,溶解效果差;反之,固化反应温度向低温移动,利于酯键的形成,样品的溶解速度就越快。当环氧/酸酐为1:1.5,催化剂用量为3%时,具有较好的溶解性能。     

环氧树脂与氰酸酯共聚反应研究

研究了催化剂对环氧树脂与氰酸酯树脂的共聚固化反应行为的影响,并初步探索氰酸酯／环氧固化的反应历程．研究表明,催化剂能明显地促进其固化反应,降低固化温度,缩短固化时间;氰酸酯与环氧共聚反应历程是首先氰酸酯三聚反应生成三嗪环结构,然后三嗪环开环与环氧共聚反应,最后是未能参与共聚反应的环氧官能团在唑啉结构和三嗪环的催化下发生聚醚化反应;在氰酸酯官能团欠量的条件下,固化树脂中主要是唑啉和聚醚结构,而三嗪环结构的含量很少．     

环氧树脂与氰酸酯共固化反应的研究

应用DSC、FT IR对乙酰丙酮过渡金属络合物催化促进的环氧树酯与氰酸酯共固化反应行为、历程以及固化物的结构特征进行了研究探讨 .结果表明 ,促进剂能够明显的降低固化反应温度 ,缩短固化反应时间 .反应历程首先是氰酸酯发生自聚反应形成二聚体或三聚体 (三嗪环 ) ,然后二聚体可进一步共聚形成三嗪环 ,此过程伴随着环氧基的聚醚反应 ,最后是三嗪环与剩余的环氧基反应形成唑烷酮 .在氰酸酯欠量的条件下 ,固化树脂中主要是唑烷酮和聚醚结构 ,三嗪环结构很少 ;在氰酸脂适量或过量条件下 ,固化树脂主要是三嗪环和唑烷酮结构 ,聚醚结构很少 .     

功能基化介晶高聚物增韧环氧树脂性能研究

在系统研究含介晶基团的高聚物ＬＣＥＵＰＰＧ增韧环氧树旨Ｅ－５１／双氧双胺固化体系固化反应活性、反应机制、动态力学行为及冲击性能的基础上,以扫描电镜（ＳＥＭ）为手段,对材料断裂面的形态结构进行了研究,并对体系的形态结构与动态力学行为、冲击性能之间的关系进行了探讨,结果表明,改性后材料断裂面的镁呈微观两相网络结构,明显不同于入性体系,正是由于两相网络结构的存在,导致了改性体系的冲击强度大幅度提高     

新型环氧丙烯酸树脂增韧剂的合成

用马来酸酐和聚乙二醇1000合成具有反应活性端基的聚乙二醇,用红外与核磁共振进行了表征,并用其对环氧丙烯酸树脂进行改性;研究反应温度、反应时间对反应及产物性能的影响;用红外对反应性聚乙二醇和环氧丙烯酸树脂的固化物进行分析.结果表明,反应性聚乙二醇参与了环氧丙烯酸树脂的固化反应,可在交联网络中构成不同长度的柔性链段,显著地提高了环氧丙烯酸树脂的冲击强度.     

热历史对已固化环氧树脂松弛行为的影响

<正> 环氧树脂是一种性能优良且应用广泛的高分子材料,近年来,人们对已固化环氧试样在玻璃化温度(T_g)以下贮存时,物理性能随时间而变化的物理老化现象进行了广泛的研究.Ophir等发现已固化环氧试样经淬火处理后,其T_g随贮存时间升高,认为是由于自由体积随贮存时间减小所致.Mijovic用不同的方法进行过类似的研究,发现淬火环氧试样的T_g随贮存时间降低,认为是由于试样中的内应力松弛所致.本文试图进一步搞     

2-乙基-4-甲基咪唑固化环氧树脂体系动力学模型

由2-乙基-4-甲基咪唑(2,4-EMI)固化双酚A二缩水甘油醚型环氧树脂(DGEBA)的等温差示扫描量热(DSC)实验结果发现固化反应分两阶段进行,催化聚合反应有一诱导期.由DSC测试结果求得催化聚合反应的速率常数.从反应机理出发,以诱导期为边界,建立两阶段的微观固化动力学模型.从扩散的角度在模型中引入临界固化度(αc)和扩散因子,进一步建立扩散控制固化动力学模型,对不同2,4-EMI含量和固化温度(Tc)的体系,计算得到αc.研究发现扩散因素对固化动力学影响较大,固化反应前期由化学动力学控制,后期由扩散因素控制;αc主要由体系的玻璃化转变决定,Tc越高,体系玻璃化转变时对应的固化度越大,cα越大.     

Morphology and water barrier properties of organosilane films: the effect of curing temperature

The morphology of silane films and the response of these films to water vapor are studied by neutron reflectivity, X-ray reflectivity, ellipsometry, and contact angle. The systems studied include bis-[3-(triethoxysilyl)propyl]tetrasulfide (bis-sulfur) and bis-[trimethoxysilylpropyl]amine (bis-amino), as well as mixtures of these two silanes. The effect of curing temperature on water-barrier properties is determined by comparing data for films cured at 180 degrees C with existing data for films cured at 80 degrees C. Higher curing temperature leads to an increase of the crosslink density as well as chemical modification for the sulfur-containing films. For bis-amino silane films, on the other hand, the effect on the water-barrier ability is negligible. Bis-amino silane is fully hydrolyzed and condensed at the curing temperature of 80 degrees C, so further increasing cure temperature does not affect the bulk structure of the film. For bis-sulfur and mixed films, however, higher curing temperature accelerates the hydrolysis and condensation, leading to denser films with better water-barrier performance.     

Comparative curing kinetics of 1,4-bis (4-diaminobenzene-1-oxygen) n-butane and 4,4′-bis-(diaminodiphenyl) methane with tetraglycidyl methylene dianiline systems

Aromatic amine curing agent with flexible unit in backbone, 1,4-bis (4-diaminobenzene-1-oxygen) n-butane (DDBE), was synthesized, and the structure was confirmed by FT-IR and ¹H NMR. The curing kinetics of tetraglycidyl methylene dianiline (TGDDM, or AG80) using DDBE and 4,4′-bis-(diaminodiphenyl) methane (DDM) as curing agents, respectively, were comparatively studied by non-isothermal DSC with a model-fitting Málek approach and a model-free advanced isoconversional method of Vyazovkin. The dynamic mechanical properties and thermal stabilities of the cured materials were investigated by DMTA and TG, respectively. The results showed that the activation energy of AG80/DDBE system was slightly higher than that of AG80/DDM system. ?esták-Berggren model can generally simulate well the reaction rates of these two systems. DMTA measurements showed that the storage modulus of cured AG80/DDBE is similar to that of cured AG80/DDM at the temperature below glass transition temperature (T _g) and lower than that of cured AG80/DDM at the temperature above glass transition temperature, while T _g of cured AG80/DDBE is lower than that of cured AG80/DDM. TG showed that the thermal stabilities of these two cured systems are similar.     

Enhanced properties of phthalonitrile resins under lower curing temperature via complex curing agent

High curing temperature has been restricting the application and development of phthalonitrile resin. A complex curing agent containing melamine (ME) and ZnCl₂ was developed to promote the curing reaction of resorcinol‐based phthalonitrile resin (DPPH). The thermal stability of ME can be significantly enhanced via adding ZnCl₂, which was due to the interaction between ZnCl₂ and amino group in ME. Moreover, the activities of pristine ZnCl₂ and ME were improved via mixing, especially, the curing temperature for DPPH can be effectively reduced. Even at a curing temperature of 300°C, the 5% weight loss temperature of the resulting resin cured with complex curing agent still exceeded 500°C, which was much higher than those with pristine curing agents. In addition, the good long‐term oxidation stability and relatively low water absorption can also be obtained in the resins cured with novel curing agent. This work affords a facile route for designing high‐performance curing agent to improve the curing process of phthalonitrile resin.     

Evolution of structure and properties of a liquid crystalline epoxy during curing

The evolution of structure, and thermal and dynamic mechanical properties of a liquid crystalline epoxy during curing has been studied with differential scanning calorimetry (DSC), polarized optical microscopy, x-ray scattering, and dynamic mechanical analysis. The liquid crystalline epoxy was the diglycidyl ether of 4,4′-dihydroxy-α-methylstilbene (DGEDHMS). Two curing agents were used in this study: a di-functional amine, the aniline adduct of DGEDHMS, and a tetra-functional sulfonamido amine, sulfanilamide. The effects of curing agent, cure time, and cure temperature have been investigated. Isothermal curing of the liquid crystalline epoxy with the di-functional amine and the tetra-functional sulfonamido amine causes an increase in the mesophase stability of the liquid crystalline epoxy resin. The curing also leads to various liquid crystalline textures, depending on the curing agent and cure temperature. These textures coarsen during the isothermal curing. Moreover, curing with both curing agents results in a layered structure with mesogenic units aligned perpendicular to the layer surfaces. The layer thickness decreases with cure temperature for the systems cured with the tetra-functional curing agent. The glass transition temperature of the cured networks rises with increasing cure temperature due to the increased crosslink density. The shear modulus of the cured networks shows a strong temperature dependence. However, it does not change appreciably with cure temperature. © 1997 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 35 : 2363–2378, 1997     

温度对丁腈羟聚氨酯固化反应及性能的影响

端羟基液体丁二烯-丙烯腈共聚物(简称丁腈羟,以HTBN表示)通常用甲苯二异氰酸酯作固化剂,N,N′-二羟丙基苯胺为链延伸剂经二步法固化成丁腈羟聚氨酯弹性体。本文报导丁腈羟-甲苯二异氰酸酯预聚体和N,N′-二羟丙基苯胺体系中同化温度对同化反应及固化弹性体性能的影响规律。     

Synthesis and characterization of a novel polytriazole resin with low‐temperature curing character

A novel low‐temperature curing polytriazole resin was prepared from a triazide and a tetraalkyne and characterized. The resin can be cured at 70°C. The glass transition temperature T_g and thermal decomposition temperature T_d5 of the cured resin with the molar ratio of azide to alkyne group [A]/[B] = 1.0:1.0 reached 324 and 355°C, respectively. The study on the curing kinetics of the resin shows that the apparent activation energy of the curing reaction is 93 kJ mol^?1. The flexural strength of the cured resin reached 137.6 MPa at room temperature and 102.6 MPa at 185°C. Copyright © 2007 John Wiley & Sons, Ltd.     

Influence of the Curing Temperature in the Mechanical and Thermal Properties of Nanosilica Filled Epoxy Resin Coating

0.5–3 wt% nanosilica was added to an epoxy resin based on diglycidyl ether of bisphenol A (DGEBA) and cured at 25, 40 or 60 °C using isophoronediamine (IPDA) as hardener. Aggregates of nanosilica were properly dispersed into the DGEBA-IPDA resin and agglomerates formation was avoided. Addition of nanosilica increased the storage modulus E′ and the area and height of the tan δ curve of DGEBA-IPDA resin cured at 25 °C, but no significant differences were found by curing at higher temperature. Gel time measurements and the results obtained by applying the Kamal model to isotherm DSC curing of DGEBA-IPDA-nanosilica revealed that nanosilica catalysed the curing reaction between DGEBA and IPDA, in less extent by increasing the curing temperature.     

E-beam curing of epoxy-based blends in order to produce high-performance composites

In this work, blends of a difunctional epoxy monomer and a thermoplastic toughening agent are E-beam irradiated at two different dose rates and two different total absorbed doses. The influence of the processing conditions on the thermal properties and on the morphology of the obtained matrices has been investigated. In particular, it is shown how the increase of the dose rate causes an increase of the temperature during irradiation, thus inducing a simultaneous thermal and radiation curing. On the contrary, at low-dose rate the system mainly undergoes to radiation curing, thus making the cured material very sensible to a post-irradiation thermal treatment with a significant improvement of the thermal properties.     

Modified epoxy coatings on mild steel: Tribology and surface energy

A commercial epoxy diglycidylether of bisphenol-A (DGEBA) was modified by adding fluorinated poly(aryl ether ketone) fluoropolymer and in turn metal micro powders (Ni, Al, Zn, and Ag) and coated on mild steel. Two curing agents were used; triethylenetetramine (a low temperature curing agent) and hexamethylenediamine (a high temperature curing agent) for understanding the curing temperature effect on the properties. Variations in tribological properties (dynamic friction and wear) and surface energies with varying amounts of metal powders and curing agents were evaluated. When cured at 30 °C, dynamic friction and wear decrease significantly due to phase separation reaction being favored between the fluoropolymer and the epoxy. However, when cured at 80 °C, friction and wear increase; this can be explained in terms of a crosslinking reaction favored at that temperature. There is a significant decrease in surface energies with the addition of modifiers.