Preparation and properties of polyimide/chopped carbon fiber composite foams

In this study, a series of reinforced polyimide (PI)/carbon fiber (CF) composite foams were fabricated through thermal foaming of polyester ammonium salt (PEAS) precursor powders. The PEAS precursor powders containing different contents of chopped CF were synthesized from benzophenone‐3,3′,4,4′‐tetracarboxylic dianhydride (BTDA) and 4,4′‐diaminodiphenyl ether (ODA). The effects of different CF loadings on foaming behavior of PEAS/CF composite precursor powders, final cellular morphology, and physical properties of PI composite foams were investigated. The results revealed that the chopped CF acted as nucleation agent in the foaming process. The dispersion of CF can be evaluated using digital microscope. It is interesting to find that the chopped CF were highly oriented along the direction of cell arrises. As a result, the mechanical properties of PI foams were significantly enhanced owing to the incorporation of chopped CF. Furthermore, the thermal stability of PI composite foams were also slightly improved owing to fine dispersion of CF. In addition, the PI/CF composite foam shows uniform cell size distribution and the best comprehensive physical properties as chopped CF loading at around 6 wt%. Copyright © 2016 John Wiley & Sons, Ltd.     

聚酰亚胺泡沫材料的制备与性能表征

采用3,3′,4,4′-二苯甲酮四甲酸二酐(酮酐,BTDA)和4,4′-二氨基二苯甲烷(MDA)为主要原料制备了一种聚酰亚胺泡沫材料.采用傅里叶变换红外光谱(FTIR)、核磁共振氢谱(1H-NMR)、扫描电镜(SEM)、导热系数测定仪、热失重分析(TGA)、差式扫描量热分析(DSC)及驻波管分别对前聚体粉末化学结构、泡沫泡孔结构、热性能及声学性能进行了表征.研究结果表明前聚体粉末以聚酰胺酯和铵盐两种形式存在,所得泡沫泡孔均匀,并且随前聚体干燥温度升高,泡孔尺寸变小.泡沫的导热系数λ为7.62×10-3W/(m.K),失重5wt%的分解温度Td5为540℃,玻璃化转变温度Tg为306℃,表明其具有优良的隔热耐热性.并且由声学测试可知在0～2000Hz频率范围内,吸声系数可达0.79,传声损失可达19.4dB,具有低频吸声、隔声性.     

The effect of crosslinked networks with poly(ethylene glycol) on sulfonated polyimide for polymer electrolyte membrane fuel cell

To investigate the effect of crosslinking by a hydrophilic group on a sulfonated polyimide electrolyte membrane, sulfonated polyimide end‐capped with maleic anhydride was synthesized using 1,4,5,8‐naphthalenetetracarboxylic dianhydride, 4,4′‐diaminobiphenyl, 2,2′‐disulfonic acid, 2‐bis [4‐(4‐aminophenoxy)phenyl] hexafluropropane and maleic anhydride. The sulfonated polyimides end‐capped with maleic anhydride were self‐crosslinked or crosslinked with poly(ethylene glycol) diacrylate. A series of the crosslinked sulfonated polyimides having various ratios of sulfonated polyimide and poly(ethylene glycol) diacrylate were prepared and compared with uncrosslinked and self‐crosslinked sulfonated polyimides. The synthesized sulfonated polyimide films were characterized for FTIR spectrum, thermal stability, ion exchange capacity, water uptake, hydrolytic stability, morphological structure, and proton conductivity. The formation of sulfonated polyimide was confirmed in FTIR spectrum. Thermal stability was good for all the sulfonated polyimides that exhibited a three‐step degradation pattern. Ion exchange capacity was the same for both the uncrosslinked and the self‐crosslinked sulfonated polyimides (1.30 mEq/g). When the crosslinked sulfonated polyimides with poly(ethylene glycol) were compared, the ion exchange capacity was decreased as 1.27 > 1.25 > 1.23 mEq/g and water uptake was increased as 23.8 < 24.0 < 24.3% with the increase in poly(ethylene glycol) diacrylate content. All the crosslinked sulfonated polyimides with poly(ethylene glycol) diacrylate were stable for over 200 h at 80 °C in deionized water. Morphological structure and mean intermolecular distance were obtained by WAXD. Proton conductivities were measured at 30, 50, 70, and 90 °C. The proton conductivity of the crosslinked sulfonated polyimides with poly(ethylene glycol) diacrylate increased with the increase in poly(ethylene glycol) diacrylate content despite the fact that the ion exchange capacity was decreased. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 1455–1464, 2005     

Preparation of poly(bis(trialkylammonium) 4,4′-oxydiphenylenepyromellitamate) films: A useful polyimide precursor film

A poly[bis(trialkylammonium) 4,4′-oxydiphenylenepyromellitamate] film not containing residual solvents was prepared first as a polyimide precursor film. The preparative method is composed of three process steps involving (1) polymerization of pyromellitic dianhydride with 4,4′-oxydianiline in a mixed solvent of tetrahydrofuran/methanol, (2) addition of a mixture of methanol/trialkylamine to the resulting poly(4,4′-oxydiphenylenepyromellitamic acid) solution, and (3) casting onto glass plates and drying. The salt formation between the poly(amic acid) and trialkylamines was confirmed first by spectroscopic methods. The dried salt film is thermally cured to produce the polyimide film with a reduced coefficient of thermal expansion (CTE). © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35 : 2493–2499, 1997     

Nanoindentation studies of polyimide thin films with various internal linkages in the diamine component

Polyimide thin films were synthesized from 3,3′,4,4′‐biphenyltetracarboxylic acid dianhydride (BPDA) and four different diamines (p‐phenylene diamine, 4,4′‐oxydiphenylene diamine, 4,4′‐biphenylene diamine, and 4,4′‐sulfonyldiphenylene diamine). The nanoindentation behavior of the resulting polyimides, namely, poly(p‐phenylene biphenyltetracarboximide) (BPDA‐PDA), poly(4,4′‐biphenylene biphenyltetracarboximide) (BPDA‐BZ), poly(4,4′‐oxydiphenylene biphenyltetracarboximide) (BPDA‐ODA), and poly(4,4′‐sulfonyldiphenylene biphenyltetracarboximide) (BPDA‐DDS), were investigated. Also, the morphological properties were characterized with a prism coupler and wide‐angle X‐ray diffraction and were correlated to the nanoindentation studies. The nanoindentation behavior and hardness varied quite significantly, depending on the changes in the chemical and morphological structures. The hardness of the polyimide thin films increased in the following order: BPDA‐DDS < BPDA‐ODA < BPDA‐BZ < BPDA‐PDA. For all the polyimide thin films, except that of BPDA‐BZ, the hardness decreased with an increase in the load. The birefringence, a measure of the molecular in‐plane orientation, increased in the following order: BPDA‐DDS < BPDA‐ODA < BPDA‐PDA < BPDA‐BZ. The X‐ray diffraction studies revealed that the crystallinity of the polyimide thin films varied with the changes in the chemical structure. The studies showed that the indentation response with an applied load and the hardness by nanoindentation for the BPDA‐based polyimides were closely related to the morphological structure. The nanoindentation and birefringence results revealed that the mechanical properties of the polyimide thin films were dependent on the crystallinity, which arose because of the chain order along the chain axis and the molecular packing order. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 861–870, 2004     

Role of the in‐plane orientation of polyimide films in graphitization

Poly(amide acid) labeled with perylenetetracarboxydiimide (PEDI) was prepared from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), p‐phenylenediamine (PDA), and diamino‐PEDI. Poly(amide acid) was then reacted with sodium hydride and various kinds of alkyl iodides for transformation into various poly(amide ester)s. The cast films were imidized while fixed on glass substrates to give BPDA/PDA polyimide films. The degree of in‐plane molecular orientation (f) of the polyimides and their precursors, poly(amide acid) and poly(amide ester)s, were determined via measurements of the visible dichroic absorption at an incidence angle for a rodlike dye (PEDI) bound to the main chain. All precursor films showed relatively low degrees of in‐plane orientation. After imidization of the precursors fixed on glasses, however, striking spontaneous in‐plane orientation behavior was observed. The f value for polyimide film from a poly(amide acid) precursor was as high as 0.7–0.8. The f value for polyimide film from a methyl ester precursor, however, was lowered to 0.4–0.5, but it increased with the increasing size of the alkyl groups. Good correlations of the in‐plane orientation of the polyimide films with the tensile modulus of the films and the in‐plane orientation of the graphitized films were observed. © 2001 John Wiley & Sons, Inc. J Polym Sci Part B: Polym Phys 39: 3011–3019, 2001     

Crosslinked polyamide based on main‐chain type polybenzoxazines derived from a primary amine‐functionalized benzoxazine monomer

Two types of main‐chain type polybenzoxazines with amide and benzoxazine groups as repeating units in the main chain, termed as poly(amide‐benzoxazine), have been synthesized. They have been prepared by polycondensation reaction of primary amine‐bifunctional benzoxazine with adipoyl and isophthaloyl dichloride using dimethylacetamide as solvent. Additionally, a model reaction is designed from the reaction of 3,3′‐(4,4′‐methylenebis(4,1‐phenylene))bis(3,4‐dihydro‐2H‐benzo[e][1,3]oxazin‐6‐amine) with benzoyl chloride. The structures of model compound and polyamides are confirmed by Fourier transform infrared (FTIR) and proton nuclear magnetic resonance (¹H NMR) spectroscopies. Differential scanning calorimetry and FTIR are also used to study crosslinking behavior of both the model compound and polymers. Thermal properties of the crosslinked polymers are also studied by thermogravimetric analysis. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2011     

Poly(ether‐imide) and related sepiolite nanocomposites: investigation of physical,thermal, and mechanical properties

Novel poly(ether‐imide) and sepiolite nanocomposites were synthesized based on a unique diamine monomer with the aim of improving physical and mechanical properties of final polyimide films. The diamine was polycondensed with 4,4′‐(hexafluoroisopropylidene) diphthalic anhydride to produce related poly(ether amic acid) prepolymer. Pure poly(ether‐imide) and nanocomposite films were prepared via thermal imidization process of poly(ether amic acid). Coexistence of ether, pyridine, and phenylene functional groups in the diamine chemical structure resulted in flexible polyimide films with significant thermal, physical, and mechanical properties. Thermal stability, glass‐transition temperature, dimensional stability, and tensile properties of polymer and nanocomposites were studied and compared. Morphology of nanocomposites was also investigated using scanning and transmission electron microscopic methods to study the distribution and dispersion behavior of sepiolite nanofibers in the polyimide matrix. By introduction of sepiolite nanoparticles, overall improvement of properties was observed in respect to pure polyimides. Copyright © 2015 John Wiley & Sons, Ltd.     

Poly(vinyltriethoxysilane) modified MWCNT/polyimide nanocomposites—Preparation,morphological, mechanical,and electrical properties

Multi‐walled carbon nanotube (MWCNT) modified by vinyltriethoxysilane (VTES) via free radical reaction has been prepared (poly (vinyltriethoxysilane) modified MWCNTs, PVTES‐MWCNT). Precursor of polyimide, polyamic acid has been synthesized by reacting 4,4′‐oxydianiline with 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride. PVTES‐MWCNT were then mixed with polyamic acid and heated to 300 °C to form CNT/polyimide composite. During the imidization processes, the silanes on CNT surface reacted with each other and may be connected together by covalent bond (Si? O? Si). The PVTES‐MWCNT was analyzed by Fourier transform infrared and X‐ray photoelectron spectroscopy. The PVTES‐MWCNT/polyimide composites were analyzed by CP/MAS solid state ²⁹Si nuclear magnetic resonance (NMR) spectroscopy. Morphological properties of the PVTES‐MWCNT/polyimide composites were investigated by scanning electron microscope and transmission electron microscope. Electrical conductivity increased dramatically comparing to the unmodified MWCNT/polyimide composites. Mechanical properties of nanocomposite were enhanced significantly by PVTES‐MWCNT. © 2007 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 803–816, 2008     

Synthesis and Properties of Hyperbranched Polyimides Combined with Silica

Summary: The novel hyperbranched polyimide - silica hybrid materials containing theoretically 16 wt% of an inorganic phase were prepared via a sol-gel process. An amine terminated polyimide precursor (hyperbranched polyamic acid) was prepared from commercially available monomers 4,4′,4″-triaminotriphenylmethane and 4,4′-oxydiphthalic anhydride in molar ratio 1:1. Tetramethoxysilane and/or 3-glycidoxypropyltrimethoxysilane (also used as a coupling agent) were used as silica precursors. During thermal exposition the polyimide precursor was transformed to hyperbranched polyimide and hydrolyzed alkoxy groups reacted mutually to form silica. The final products were self-standing films, whose structure was characterized by using IR and ¹³C and ²⁹Si solid state NMR spectroscopy. The influence of the amount of silica and/or coupling agent on their structure and thermal properties was described.     

Synthesis,Characterization and Comparison of Properties of Novel Fluorinated Polyimides Derived from Bisphenol–A‐di(phthaleic anhydride)

Four new poly(etherimide)s have been synthesized by reaction with commercially available bisphenol‐A‐(diphthaleic anhydride) (BPADA) with four different kinds of diamines, namely 4,4′‐bis(p‐aminophenoxy‐3,3″‐trifluoromethyl) terphenyl,4,4′‐bis(3″‐trifluoromethyl‐p‐aminobiphenyl ether)biphenyl,2,6‐bis(3′‐trifluoromethyl‐p‐aminobiphenyl ether)pyridine, 2,5‐bis(3′‐trifluoromethyl‐p‐aminobiphenylether)thiopene. The poly(etherimide)s are named as 1a, 1b, 1c and 1d, respectively. The synthesized polyimides show good solubility in various organic solvents. The polyimide films had low water absorption of 0.19–0.30% and low dielectric constant of 2.79–3.1 at 1 MHz. These polyimides showed very high thermal stability with decomposition temperature (5% wt loss) up to 522°C in nitrogen. Transparent thin films of these polyimides exhibited tensile strength up to 97 MPa, a modulus of elasticity up to 1.56 GPa and elongation at break up to 20%.     

Preparation and dielectric properties of polyimide/silica nanocomposite films prepared from sol–gel and blending process

Using poly(amic acid) (PAA) as a precursor followed by thermal imidization, the polyimide/silica nanocomposite films were prepared via an improved sol–gel process and a blending process, respectively. FT‐IR, TEM and TGA measurements were used to characterize the structure and properties of the obtained films. The results confirmed that the introduction of silica did not yield negative effects on the conversion of the PAA precursor to the polyimide. With the increase of silica content, the aggregation of silica appeared in the polyimide matrix, and the thermal stability decreased slightly for both kinds of films. The dielectric constant (ε) of both films increased slowly with the increase of the silica concentration. The dielectric constant of the obtained polyimide/silica nanocomposite films displayed good stability within a wide range of temperatures or frequency. Based on modeling relation between ε and silica content, the difference in dielectric properties for two kinds of nanocomposites are discussed. Copyright © 2007 John Wiley & Sons, Ltd.     

Preparation and characterization of a polyimide nanofoam through grafting of labile poly(propylene glycol) oligomer

Preparation of a polyimide nanofoam (PI‐F) for microelectronic applications was carried out using a polyimide precursor synthesized from poly[(amic acid)‐co‐(amic ester)] and grafted with a labile poly(propylene glycol) (PPG) oligomer. Polyimide precursor was synthesized by partial esterification of poly(amic acid) (PAA) derived from pyromellitic dianhydride (PMDA) and 4,4′‐oxydianiline (ODA). The precursor was then grafted with bromide‐terminated poly(propylene glycol) in the presence of K₂CO₃ in hexamethylphosphoramide and N‐methylpyrrolidone, imidized at 200°C in nitrogen and the product was subsequently decomposed in air at 300°C to eliminate the labile PPG oligomer to produce PMDA/ODA polyimide nanofoam. Nuclear magnetic resonance spectroscopy (¹H‐NMR) and Fourier transform infrared spectroscopy (FT‐IR) techniques were used to characterize the formation of polyimide precursor and extent of grafting of PPG with polyimide. The results of thermogravimetric analysis (TGA) showed three step decomposition of nanofoam with the removal of PPG at 350°C and decomposition of polyimide at around 600°C. The polyimide nanofoams were also characterized by small angle X‐ray scattering (SAXS), field‐emission scanning electron microscopy (FE‐SEM) and transmission electron microscopy (TEM). The morphology showed nanophase‐separated structures with uniformly distributed and non‐interconnected pores of 20–40 nm in size. Dynamic mechanical analysis (DMA) indicated higher storage modulus for the foamed structure compared to the pure PI with reduction in loss tangent for the former system. Copyright © 2004 John Wiley & Sons, Ltd.     

Synthesis and characterization of novel fluorinated aromatic polyimides derived from 1,1‐bis(4‐amino‐3,5‐dimethylphenyl)‐1‐(3,5‐ditrifluoromethylphenyl)‐2,2,2‐trifluoroethane and various aromatic dianhydrides

A novel fluorinated aromatic diamine, 1,1‐bis(4‐amino‐3,5‐dimethylphenyl)‐1‐(3,5‐ditrifluoromethylphenyl)‐2,2,2‐trifluoroethane (9FMA), was synthesized by the coupling reaction of 3′,5′‐ditrifluoromethyl‐2,2,2‐trifluoroacetophenone with 2,6‐dimethylaniline under the catalysis of 2,6‐dimethylaniline hydrochloride. A series of fluorinated aromatic polyimides were synthesized from 9FMA and various aromatic dianhydrides, including pyromellitic dianhydride, 3,3′4,4′‐biphenyl tetracarboxylic dianhydride, 4,4′‐oxydiphthalic anhydride, 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA), and 4,4′‐hexafluoroisopropylidene diphthalic anhydride, via a high‐temperature, one‐stage imidization process. The inherent viscosities of the polyimides ranged from 0.37 to 0.74 dL/g. All the polyimides were quickly soluble in many low‐boiling‐point organic solvents such as tetrahydrofuran, chloroform, and acetone as well as some polar organic solvents such as N‐methyl‐2‐pyrrolidinone, N,N′‐dimethylacetamide, and N,N′‐dimethylformamide. Freestanding fluorinated polyimide films could be prepared and exhibited good thermal stability with glass‐transition temperatures of 298–334 °C and outstanding mechanical properties with tensile strengths of 69–102 MPa and elongations at break of 3.3–9.9%. Moreover, the polyimide films possessed low dielectric constants of 2.70–3.09 and low moisture absorption (<0.58%). The films also exhibited good optical transparency with a cutoff wavelength of 303–351 nm. One polyimide (9FMA/BTDA) also exhibited an intrinsic negative photosensitivity, and a fine pattern could be obtained with a resolution of 5 μm after exposure at the i‐line (365‐nm) wavelength. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 2665–2674, 2006     

Crosslinked sulfonated polyimide networks as polymer electrolyte membranes in fuel cells

Sulfonated polyimides with tertiary nitrogen in the polymer backbone were synthesized with 1,4,5,8‐naphthalenetetracarboxylic dianhydride, 4,4′‐diaminobiphenyl 2,2′‐disulfonic acid, 2‐bis[4‐(4‐aminophenoxy)phenyl]hexafluoropropane, and diaminoacrydine hemisulfate. They were crosslinked with a series of dibromo alkanes to improve the hydrolytic stability. The crosslinked sulfonated polyimide films were characterized for their thermal stability, ion‐exchange capacity (IEC), water uptake, hydrolytic stability, and proton conductivity. All the sulfonated polyimides had good thermal stability and exhibited a three‐step degradation pattern. With an increase in the alkyl chain length of the crosslinker, IEC decreased as 1.23 > 1.16 > 1.06 > 1.01, and the water uptake decreased as 7.29 > 6.70 > 6.55 > 5.63. The order of the proton conductivity of the crosslinked sulfonated polyimides at 90 °C was as follows: polyimide crosslinked with dibromo butane (0.070) > polyimide crosslinked with dibromo hexane (0.055) > polyimide crosslinked with dibromo decane (0.054). The crosslinked polyimides showed higher hydrolytic stability than the uncrosslinked polyimides. Between the crosslinked polyimides, the hydrolytic stability decreased with an increase in the alkyl chain length of the crosslinker. The crosslinked and uncrosslinked sulfonated polyimides exhibited almost the same proton conductivities. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 2370–2379, 2005     

Polyimide containing internal acetylene units linked para to the aromatic ring

4,4′-Diaminodiphenylacetylene (p-intA) was reacted with 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and pyromellitic dianhydride (PMDA) in N-methyl-2-pyrrolidone (NMP) to give poly(amic acid) solution of moderate to high viscosity. Thermal imidization gave polyimide having acetylene units that are linked para to the aromatic connecting unit. Polyimide having acetylene units that are linked meta to the aromatic connecting unit also was prepared utilizing 3,3′-diaminodiphenylacetylene (m-intA) for comparison. The crosslinking behavior of the acetylene units was observed with DSC. Exotherm due to the crosslinking of the para-linked acetylene units appeared at ca. 340 to 380°C depending on the structure of polyimide, whereas meta-linked acetylene units appeared at lower temperature as 340–350°C. After thermal treatment at high temperature such as 350 or 400°C, the amount of the exotherm became smaller and finally disappeared on DSC, confirming the progress of crosslinking. Dynamic mechanical properties of the polyimide films show that glass transition temperature increased with higher heat treatment, also confirming the progress of crosslinking. Tensile properties of the polyimide films showed that rigid polyimide films consisting of p-intA with BPDA or PMDA have considerably higher modulus than those consisting of m-intA. Cold-drawing of the poly(amic acid) followed by imidization gave much higher modulus in the case of rigid polyimide. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35 : 2395–2402, 1997     

Synthesis and properties of novel triptycene‐based polyimides

Two new triptycene‐containing bis(ether amine)s, 1,4‐bis(4‐aminophenoxy)triptycene ( 4 ) and 1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)triptycene ( 6 ), were synthesized, respectively, from the nucleophilic chloro‐displacement reactions of p‐chloronitrobenzene and 2‐chloro‐5‐nitrobenzotrifluoride with 1,4‐dihydroxytriptycene in the presence of potassium carbonate, followed by palladium‐catalyzed hydrazine reduction of the dinitro intermediates. The bis(ether amine)s were polymerized with six commercially available aromatic tetracarboxylic dianhydrides to obtain two series of novel triptycene‐based polyimides 8a – f and 9a – f by using a conventional two‐step synthetic method via thermal and chemical imidizations. All the resulting polyimides exhibited high enough molecular weights to permit the casting of flexible and strong films with good mechanical properties. Incorporation of trifluoromethyl groups in the polyimide backbones improves their solubility and decreases their dielectric constants. The fluorinated polyimides 9d and 9f derived from diamine 6 with 4,4′‐oxydiphthalic anhydride and 2,2‐bis(3,4‐dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), respectively, could afford almost colorless thin films. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2011     

Dielectric properties of oxydianiline‐based polyimide thin films according to the water uptake

For polyimide thin films, the dielectric properties were investigated with the capacitance and optical methods. The dielectric constants of the 4,4′‐oxydianiline (ODA)‐based polyimide thin films varied from 2.49 to 3.10 and were in the following decreasing order: 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA)–ODA > 1,2,4,5‐benzenetetracarboxylic dianhydride (PMDA)–ODA > 4,4′‐hexafluoroisopropylidene diphthalic dianhydride (6FDA)–ODA. According to the absorption of water, the diffusion coefficients in the films varied from 4.8 × 10^?10 to 7.2 × 10^?10 cm²/s and were in the following increasing order: BPDA–ODA < PMDA–ODA < 6FDA–ODA. The dielectric constants and diffusion coefficients of the polyimides were affected by the morphological structures, including the molecular packing order. However, because of the water uptake, the changes in the dielectric constants in the polyimide thin films varied from 0.49 to 1.01 and were in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. Surprisingly, 6FDA–ODA with bulky hexafluoroisopropylidene groups showed less of a change in its dielectric constant than PMDA–ODA. The total water uptake for the polyimide thin films varied from 1.43 to 3.19 wt % and was in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. This means that the changes in the dielectric constants in the polyimide thin films were significantly related to the morphological structure and hydrophobicity of hexafluoroisopropylidene groups. Therefore, the morphological structure and chemical affinity in the polyimide thin films were important factors in controlling the dielectric properties. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 40: 2190–2198, 2002     

Crosslinked copolymer with low dielectric constant and dissipation factor based on poly(2,6‐Dimethylphenol‐co−2,6‐Diphenylphenol) and a crosslinker

The crosslinked poly(2,6‐dimethylphenol (95 mol %)‐co?2,6‐diphenylphenol (5 mol %)) (poly(2,6‐DMP₉₅‐co?2,6‐DPP₅)) was successfully developed as an insulating material separating conducting elements with a low dielectric constant and dissipation factor. The crosslinked poly(2,6‐DMP₉₅‐co?2,6‐DPP₅) was prepared by the oxidative coupling polymerization of 2,6‐DMP with 2,6‐DPP, followed by the reaction with 4,4′‐methylenebis[2,6‐bis(methoxymethyl)]phenol (MBMP) as a crosslinking agent. The crosslinked poly(2,6‐DMP₉₅‐co?2,6‐DPP₅) exhibited a good thermal stability and glass transition temperature. The dielectric constant and dissipation factor of the crosslinked poly(2,6‐DMP₉₅‐co?2,6‐DPP₅) were 2.6 and 0.004 at 10 GHz, respectively. Moreover, a flexible double layer copper clad laminate based on the crosslinked poly(2,6‐DMP₉₅‐co?2,6‐DPP₅) composite was successfully prepared, indicating a useful material for high‐speed and high‐frequency electrical applications. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 3218–3223     

Highly reflective and conductive double-surface-silvered polyimide films prepared from silver fluoride and BTDA/4,4'-ODA

This work focuses on surface silver metallization on a 3,3',4,4'-benzophenonetetracarboxylic dianhydride/4,4'-oxydianiline (BTDA/ODA)-based polyimide matrix via a direct ion-exchange self-metallization technique using a simple silver salt, silver fluoride, as the silver precursor. The method involves performing an ion-exchange reaction of damp-dry poly(amic acid) films in silver aqueous solution to form silver(I)-containing precursor films. Thermal treatment under tension converts the poly(amic acid) into polyimide and simultaneously reduces the silver(I) to silver(0), yielding silver layers with excellent reflectivity and conductivity on both film sides. However, significant property differences were exhibited on the upside and underside surfaces of the metallized films and this has been discussed in detail. The variation of surface properties and surface morphologies during the thermal curing cycle was also investigated. The mechanical and thermal properties of the metallized polyimide films are essentially similar to those of the host polyimide.