Engineering oxide resistive switching materials for memristive device application

Based on a unified physical model and first-principle calculations, a material-oriented methodology has been proposed to control the bipolar switching behavior of an oxide-based resistive random access memory (RRAM) cell. According to the material-oriented methodology, the oxide-based RRAM cell can be designed by material engineering to achieve the required device performance. In this article, a Gd-doped HfO₂ RRAM cell with excellent bipolar switching characteristics is developed to meet the requirements of memristive device application. The typical memristive characteristics of the Gd-doped HfO₂ RRAM cell are presented, and the mechanism is discussed.     

Light-induced negative differential resistance effect in a resistive switching memory device

The negative differential resistance (NDR) effect was observed in a Pt/BiFeO₃/TiO₂/BiFeO₃/Pt memory cell by using light-illumination as extra stimulation. Further, the coexistence appearances and gradually becomes obvious when the device is exposed to light-illumination, which display an excellent stability and reversibility of the coexistence of NDR and resistive switching (RS) at room temperature. Through analysis of the physical conduction mechanism, it is expected that a large number of photo-generated charge carriers are induced under light-illumination on the surface and interface of the heterojunction is responsible for the appearance of this coexistence phenomenon. Importantly, the NDR effect is strengthened by the competition transfer of charge carrier in the polarized electric field under light-illumination. This work shows that the coexistence of light-modulated NDR and RS can deeply explore the potential applications of light-controlled multifunctional devices.     

High-speed multibit operation of a dual vacancy-type oxide device with extended bi-polar resistive switching behaviors

We investigated the resistive switching behaviors of the metal–copper oxide–metal devices with the enhanced capability in terms of high speed and multi-bit operation. From the analysis of the normal and extended resistive switching behaviors, the voltage-induced resistive changes were modeled and the resistive switching polarity was explained. Also, we proposed and fabricated a dual vacancy-type device structure with an extended resistive switching behavior and demonstrated a high-speed implemental 2-bit multi-bit operation by controlling specifically switch-on voltage pulses.     

Dynamic resistive switching in a three-terminal device based on phase separated manganites

A three-terminal device based on electronic phase separated manganites is suggested to produce high performance resistive switching. Our Monte Carlo simulations reveal that the conductive filaments can be formed/annihilated by reshaping the ferromagnetic metal phase domains with two cross-oriented switching voltages. Besides, by controlling the high resistance state(HRS) to a stable state that just after the filament is ruptured, the resistive switching remains stable and reversible, while the switching voltage and the switching time can be greatly reduced.     

Bipolar tri-state resistive switching characteristics in Ti/CeO_x/Pt memory device

Highly repeatable multilevel bipolar resistive switching in Ti/Ce Ox/Pt nonvolatile memory device has been demonstrated. X-ray diffraction studies of Ce O2 films reveal the formation of weak polycrystalline structure. The observed good memory performance, including stable cycling endurance and long data retention times（〉10^4s） with an acceptable resistance ratio（～10^2）, enables the device for its applications in future non-volatile resistive random access memories（RRAMs）. Based on the unique distribution characteristics of oxygen vacancies in Ce Ox films, the possible mechanism of multilevel resistive switching in Ce Ox RRAM devices has been discussed. The conduction mechanism in low resistance state is found to be Ohmic due to conductive filamentary paths, while that in the high resistance state was identified as Ohmic for low applied voltages and a space-charge-limited conduction dominated by Schottky emission at high applied voltages.     

Self-learning ability realized with a resistive switching device based on a Ni-rich nickel oxide thin film

The resistive switching device based on a Ni-rich nickel oxide thin film exhibits an inherent learning ability of a neural network. The device has the short-term-memory and long-term-memory functions analogous to those of the human brain, depending on the history of its experience of voltage pulsing or sweeping. Neuroplasticity could be realized with the device, as the device can be switched from a high-resistance state to a low-resistance state due to the formation of stable filaments by a series of electrical pulses, resembling the changes such as the growth of new connections and the creation of new neurons in the brain in response to experience.     

Fabrication of printed memory device having zinc-oxide active nano-layer and investigation of resistive switching

An all printed resistive memory device, a 9-bit memristor, has been presented in this study consisting of 3 × 3 memristor crossbars deposited via electrohydrodynamic inkjet printing process at room conditions. Transparent zinc oxide active nano-layers, directly deposited by electrospray process, are sandwiched between the crossbars to complete the metal–insulator metal structure consisting of copper–zinc oxide–silver, where Cu and Ag are used as bottom and top electrodes respectively. The 9-bit memristor device has been characterized using current–voltage measurements to investigate the resistive switching phenomenon thereby confirming the memristive pinched hysteresis behavior signifying the read–write and memory characteristics. The memristor device showed a current bistability due to the existence of metal–oxide layer which gives rise to oxygen vacancies upon receiving the positive voltage hence breaking down into doped and un-doped regions and a charge transfer takes place. The maximum ON/OFF ratio of the current bi-stability for the fabricated memristor was as large as 1 × 10³, and the endurance of ON/OFF switchings was verified for 500 read–write cycles. The metal–insulator–metal structure has been characterized using X-ray diffraction, X-ray photoelectron spectroscopy and scanning electron microscope techniques.     

Characteristics of the bipolar resistive switching behavior in memory device with Au/ZnO/ITO structure

In this work, reproducible and stable bipolar resistive switching behavior without the requirement of forming process is observed in the memory device with Au/ZnO/ITO structure. It shows a high R_on/R_off ratio, where R_on and R_off are the resistance at low resistance state (LRS) and high resistance state (HRS), respectively. The dominated transport mechanisms for LRS and HRS are related to space charge limited current and Ohmic behavior, respectively. This bipolar resistive behavior is attributed to the formation and rupture of conducting filaments which are constructed with oxygen vacancies. The Au/ZnO/ITO device discussed in this work shows huge potential applications in the next generation nonvolatile memory field.     

Atomic crystals resistive switching memory

Facing the growing data storage and computing demands, a high accessing speed memory with low power and non volatile character is urgently needed. Resistive access random memory with 4F~2 cell size, switching in sub-nanosecond cycling endurances of over 10~(12) cycles, and information retention exceeding 10 years, is considered as promising nex generation non-volatile memory. However, the energy per bit is still too high to compete against static random acces memory and dynamic random access memory. The sneak leakage path and metal film sheet resistance issues hinder th further scaling down. The variation of resistance between different devices and even various cycles in the same device hold resistive access random memory back from commercialization. The emerging of atomic crystals, possessing fin interface without dangling bonds in low dimension, can provide atomic level solutions for the obsessional issues. Moreove the unique properties of atomic crystals also enable new type resistive switching memories, which provide a brand-new direction for the resistive access random memory.     

Improved resistive switching performance in Cu-cation migrated MoS2 based ReRAM device incorporated with tungsten nitride bottom electrode

The resistive switching characteristics of sputtered deposited molybdenum disulphide (MoS₂) thin film has been investigated in Cu/MoS₂/W₂N stack configuration for Resistive Random Access Memory (ReRAM) application. The benefits of incorporating tungsten nitride (W₂N) as a bottom electrode material were demonstrate by stability in operating voltages, good endurance (10³ cycles) and long non-volatile retention (10³?s) characteristics. Resistive switching properties in Cu/MoS₂/W₂N structure are induced by the formation/disruption of Cu conducting filaments in MoS₂ thin film. Ohmic law and space charge limited current (SCLC) are observed as dominant conduction mechanism in low resistance state (LRS) and high resistance state (HRS) respectively. This study suggests the application of MoS₂ thin films with W₂N bottom electrode for next generation non-volatile ReRAM application.     

Hafnia-based resistive switching devices for non-volatile memory applications and effects of gamma irradiation on device performance

Non-volatile memory (NVM) devices were fabricated as a Metal– Insulator–Metal (MIM) structures by sandwiching Hafnium dioxide (HfO₂) thin film in between two metal electrodes. The top and bottom metal electrodes were deposited by using the thermal evaporation, and the oxide layer was deposited by using the RF magnetron sputtering technique. The Resistive Random Access Memory (RRAM) device structures such as Ag/HfO₂/Au/Si were fabricated and I-V characteristics for the pristine and gamma-irradiated devices with a dose 24?kGy were measured. Further we have studied the thermal annealing effects, in the range of 100°–400°C in a tubular furnace for the HfO₂/Au/Si samples. The X-ray diffraction (XRD), Rutherford Backscattering Spectrometry (RBS), field emission-scanning electron microscopy (FESEM) analysis measurements were performed to determine the thickness, crystallinity and stoichiometry of these films. The electrical characteristics such as resistive switching, endurance, retention time and switching speed were measured by a semiconductor device analyser. The effects of gamma irradiation on the switching properties of these RRAM devices have been studied.     

Analysis and modeling of resistive switching mechanisms oriented to resistive random-access memory

With the progress of the semiconductor industry,the resistive random-access memory(RAM) has drawn increasing attention.The discovery of the memristor has brought much attention to this study.Research has focused on the resistive switching characteristics of different materials and the analysis of resistive switching mechanisms.We discuss the resistive switching mechanisms of different materials in this paper and analyze the differences of those mechanisms from the view point of circuitry to establish their respective circuit models.Finally,simulations are presented.We give the prospect of using different materials in resistive RAM on account of their resistive switching mechanisms,which are applied to explain their resistive switchings.     

Improved resistive switching phenomena observed in SiNx‐based resistive switching memory through oxygen doping process

The improvement of resistive switching (RS) phenomena of silicon‐nitride (SiN_x)‐based resistive random access memory (ReRAM) cells through oxygen doping process was investigated. As a result, compared to un‐doped SiN_x films, the oxygen doped SiN_x (SiN_x:O₂)‐based ReRAM cells show a lower current (～0.3 μA) level at a high resistance state and a smaller variation of operating voltage through the reduction of leakage current in the SiN_x:O₂ film by combining silicon dangling bonds and doped oxygen ions. Therefore, we believe that the oxygen doping process in SiN_x films can effectively improve the RS characteristics of SiN_x‐based ReRAM cells. (© 2014 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Flexible and degradable resistive switching memory fabricated with sodium alginate

Transient electronics has attracted interest as an emerging technology to solve electronic-waste problem,due to its physically vanishing ability in solution.Here in this work,we demonstrate a flexible and degradable transient resistive switching(RS) memory device with simple structure of Cu/sodium alginate(SA)/ITO.The device presents excellent RS characteristics as well as high flexibility,including low operating voltage(1.5 V) and multilevel RS behavior.No performance degradation occurs after bending the device 50 times.Moreover,our device can be absolutely dissolved in deionized water.The proposed SA-based transient memory device has great potential for the development of green and security memory devices.     

Thickness dependence of the resistive switching behavior of nonvolatile memory device structures based on undoped ZnO films

The resistive switching behavior of Al/ZnO/Al layered memory device structures was investigated in connection with varying ZnO layer thickness and related changes in crystallinity and concentration of oxygen-related defects. It was observed that, with increasing thickness, the crystallinity of the ZnO layer was improved and the concentration of oxygen-related defects within the layer increased. While the device showed unipolar switching characteristics, the current-voltage hysteresis was dependent on the thickness of the ZnO layer. In particular, the set voltage gradually increased with increasing layer thickness in the high resistive state whereas the reset voltage remained almost constant in the low resistive state. The observed operation characteristics of the device structures in relation to the crystallinity and oxygen-related defect concentration of the ZnO layer suggest that extended defects such as grain boundaries and dislocations play important roles in determining device performances.     

Electric pulse-induced resistive switching in ceramic interfaces

We show the existence of a reversible, complementary and polarity dependant electric pulse-induced resistance (EPIR) switching effects in Au/YBa₂Cu₃O_7-δ ceramic superconductor interfaces. Non-volatile high and low resistance states and transition regions between them are obtained as a function of the amplitude and polarity of the pulsing voltage. Relaxation processes of the resistivity after applying the pulses, not associated with heating effects, are also observed. We also report on the temperature sensitivity of these resistance hysteresis switching loops, where both the difference between high and low resistance states and the voltage needed to produce the switching decrease with increasing temperature. Our results are consistent with a mechanism for the EPIR effect based on oxygen electromigration.     

Interface resistive switching effects in bulk manganites

A physical mechanism driving the resistance switching in heterocontacts, formed by a metal counterelectrode and electrically conducting bulk perovskite manganites, is discussed. The nature of the inelastic, charge-hopping transport inside insulating and strongly inhomogeneous metal/manganite interfaces is studied theoretically. Comparison with measured current-voltage characteristics for a La_0.67Ca_0.33MnO₃/Ag heterostructure in a high-resistance state reveals the presence of one or more charge traps along a conduction path within the interface. In a low-resistance state the main charge-transferring events are direct tunneling ones. The analysis of electrical noise measurements for a La_0.82Ca_0.18MnO₃ single crystal in three different charge-transport regimes shows scattering centers with a broad, flat spectrum of excitation states, independent of manganite electrical and/or magnetic characteristics. All of these results are consistent with an oxygen-drift model for a bistable resistance state in perovskites.      

Optically-controlled resistive switching effectsof CdS nanowire memtransistor

Since it was proposed, memtransistors have been a leading candidate with powerful capabilities in the field of neural morphological networks. A memtransistor is an emerging structure combining the concepts of a memristor and a field-effect transistor with low-dimensional materials, so that both optical excitation and electrical stimuli can be used to modulate the memristive characteristics, which make it a promising multi-terminal hybrid device for synaptic structures. In this paper, a single CdS nanowire memtransistor has been constructed by the micromechanical exfoliation and alignment lithography methods. It is found that the CdS memtransistor has good non-volatile bipolar memristive characteristics, and the corresponding switching ratio is as high as 10⁶ in the dark. While under illumination, the behavior of the CdS memtransistor is similar to that of a transistor or a memristor depending on the incident wavelengths, and the memristive switching ratio varies in the range of 10 to 10⁵ with the increase of the incident wavelength in the visible light range. In addition, the optical power is also found to affect the memristive characteristics of the device. All of these can be attributed to the modulation of the potential barrier by abundant surface states of nanowires and the illumination influences on the carrier concentrations in nanowires.