Influence of electric field annealing on atom diffusion in Cu/Ta/Si stacks

In this letter, we present a quantitative analysis of the influences caused by an electric field annealing on interface atom diffusion in a Cu/Ta/Si stack at a range of temperatures 450～650 °C. The results indicate that the external electric field has a remarkably accelerated effect on Cu atom diffusion in the Ta layer and the failure of Ta as the diffusion barrier. The preexponent D ₀ and the activation energy Q for Cu atom diffusion in the Ta layer were both decreased with the application of an external electric field. The activation energy for electric field annealed stacks is 1.22 eV, which is lower than that for annealed stacks (1.58 eV). The accelerating effect is mainly attributed to the perturbation of the electric state of the defects in the interface and grain interior.     

Comparison between post-irradiation annealing and post-high electric field stress annealing of n-channel power VDMOSFETs

The behavior of the defects created in the gate oxide and at the Si/SiO₂ interface of n-channel power vertical double-diffused metal-oxide-semiconductor field-effect transistors (VDMOSFETs) by irradiation and positive high electric field stress have been investigated. Interface traps exhibit the same behavior after both types of stress, while there are significant differences in post-stress responses of the charge trapped in the oxide, consisting of fixed and switching component.     

Fe/Si多层膜的层间耦合与界面扩散

对以本征Si及重掺杂ｐ型和ｎ型Si作为中间层的Fe/Si多层膜的层间耦合进行研究，并通过退火，增大Fe，Si之间的扩散，分析界面扩散对层间耦合的影响. 实验结果表明，层状结构良好的制备态的多层膜，Fe，Si之间也存在一定程度的扩散，它是影响层间耦合的 主要因素，远远超过了半导体意义上的重掺杂，使不同种类的Si作为中间层的层间耦合基本 一致.进一步还发现，在一定范围内增大Fe，Si之间的扩散，即使多层膜的层状结构已经有了相当的退化，Fe/Si多层膜的反铁磁耦合强度基本保持不变. 关键词： Fe/Si多层膜 层间耦合 界面扩散     

XPS study of annealing induced effects on surface and interface electronic properties of Si/Ge nanostructures

The present study is focused on the influence of vacuum thermal treatment on surface/interface electronic properties of Si/Ge multilayer structures (MLS) characterized using X-ray photoelectron spectroscopy (XPS) technique. Desired [Si(5 nm)/Ge(5 nm)]_×10 MLS were prepared using electron beam evaporation technique under ultra high vacuum (UHV) conditions. The core-level XPS spectra of as-deposited as well as multilayer samples annealed at different temperatures such as 100 °C, 150 °C and 200 °C for 1 h show substantial reduction in Ge 2p peak integrated intensity, whereas peak intensity of Si 2p remains almost constant. The complete interdiffusion took place after annealing the sample at 200 °C for 5 h as confirmed from depth profiling of annealed MLS. The asymmetric behaviour in intensity patterns of Si and Ge with annealing was attributed to faster interdiffusion of Si into Ge layer. However, another set of experiments on these MLS annealed at 500 °C suggests that interdiffusion can also be studied by annealing the system at higher temperature for relatively shorter time duration.     

退火对钛/铜热等静压扩散连接界面的影响

钛/铜(Ti/Cu)作为ITER 第一壁Be/CuCrZr 热等静压连接中间过渡层,形成了多层中间金属相结构,容易在Ti/Cu 金属相之间产生裂纹等缺陷。采用CuCrZr 代替Be,经过与Be/CuCrZr 相同的热等静压工艺,制作了多个CuCrZr/Ti/Cu/CuCrZr 连接件,对Ti/Cu 连接接头进行深入分析。对连接件分别进行未退火、400℃和500℃ 退火处理,去应力退火后对接头强度和缺陷分布的影响进行了研究。研究结果表明,中间钛层的两侧都形成了三层Ti/Cu 扩散层,分别为Cu₄Ti、CuTi 和CuTi₂。纯铜侧的Cu₄Ti 厚度比CuCrZr 侧的厚,使得裂纹几乎全部分布于铜侧的Cu₄Ti 与CuTi 交界处,拉伸样品极易在此处发生脆性断裂。随着退火温度升高,裂纹的产生和扩展减少。     

Effect of interface layer on growth behavior of atomic-layer-deposited Ir thin film as novel Cu diffusion barrier

Growth and nucleation behavior of Ir films grown by atomic layer deposition (ALD) on different interfacial layers such as SiO₂, surface-treated TaN, and 3-nm-thick TaN were investigated. To grow Ir thin film by ALD, (1,5-cyclooctadiene) (ethylcyclopentadienyl) iridium (Ir(EtCp)(COD)) and oxygen were employed as the metalorganic precursor and reactant, respectively. To obtain optimal deposition conditions, the deposition temperature was varied from 240 to 420 °C and the number of deposition cycles was changed from 150 to 300. The Ir film grown on the 3-nm-thick TaN surface showed the smoothest and most uniform layer for all the deposition cycles, whereas poor nucleation and three-dimensional island-type growth of the Ir layer were observed on Si, SiO₂, and surface-treated TaN after fewer number of deposition cycles. The uniformity of the Ir film layer was maintained for all the different substrates up to 300 deposition cycles. Therefore we suggest that the growth behavior of the Ir layer on different interface layer is related to the chemical bonding pattern of the substrate film or interface layer, resulting in better understand the growth mechanism of Ir layer as a copper diffusion barrier. The ALD-grown Ir films show the preferential direction of (1 1 1) for all the reflections, which indicates the absence of IrO₂ in metallic Ir.     

Effects of laser field and electric field on impurity states in zinc-blende GaN/AlGaN quantum well

Based on the effective-mass approximation, the competition effects between the laser field and applied electric field on impurity states have been investigated variationally in the ZB GaN/AlGaN quantum well (QW). Numerical results show that for any laser field, the electric field makes the donor binding energy present asymmetric distribution with respect to the center of the QW. Moreover, when the laser field is weak, the electric field effects are obvious on the donor binding energy; however, the electric field effects are insensitive to the variation of donor binding energy in the ZB GaN/AlGaN QW with strong laser field.     

Failure behavior of ITO diffusion barrier between electroplating Cu and Si substrate annealed in a low vacuum

A structure of Cu/ITO(10 nm)/Si was first formed and then annealed at various temperatures for 5 min in a rapid thermal annealing furnace under 10⁻² Torr pressure. In Cu/ITO(10 nm)/Si structure, the ITO(10 nm) film was coated on Si substrate by sputtering process and the Cu film was deposited on ITO film by electroplating technique. The various Cu/ITO(10 nm)/Si samples were characterized by a four-point probe, a scanning electron microscope, an X-ray diffractometer, and a transmission electron microscope. The results showed that when the annealing temperature increases near 600 °C the interface between Cu and ITO becomes unstable, and the Cu₃Si particles begin to form; and when the annealing temperature increases to 650 °C, a good many of Cu₃Si particles about 1 μm in size form and the sheet resistance of Cu/ITO(10 nm)/Si structure largely increases.     

Tuning the Schottky barrier in the arsenene/graphene van der Waals heterostructures by electric field

Using density functional theory calculations, we investigate the electronic properties of arsenene/graphene van der Waals (vdW) heterostructures by applying external electric field perpendicular to the layers. It is demonstrated that weak vdW interactions dominate between arsenene and graphene with their intrinsic electronic properties preserved. We find that an n-type Schottky contact is formed at the arsenene/graphene interface with a Schottky barrier of 0.54 eV. Moreover, the vertical electric field can not only control the Schottky barrier height but also the Schottky contacts (n-type and p-type) and Ohmic contacts (n-type) at the interface. Tunable p-type doping in graphene is achieved under the negative electric field because electrons can transfer from the Dirac point of graphene to the conduction band of arsenene. The present study would open a new avenue for application of ultrathin arsenene/graphene heterostructures in future nano- and optoelectronics.     

Evolution of step-terrace structure at Si–SiO2 interface in SIMOX substrate during annealing

The step-terrace structures at the interface between the Si layer and the buried SiO₂ layer of a Separation by IMplanted OXygen substrate has been observed by using atomic force microscopy (AFM) after removing the SiO₂ and Si layers. The time evolution of the Si–SiO₂ interface roughness during high-temperature annealing was analyzed by the scaling analysis of AFM data. The correlation length exhibited a nice correspondence to the size of square domain structures. Decreasing in the index of the length scale indicates that the growth mechanism changes as the annealing proceeds.     

稀土La对bcc-Fe中Cu扩散行为影响的第一性原理研究

采用基于密度泛函理论的第一性原理,研究了稀土La对bcc-Fe中Cu析出行为的影响.计算了α-Fe中La原子和Cu原子与空位之间,以及La原子和Cu原子之间的点缺陷结合能;在此基础上,讨论了α-Fe中La对Cu扩散激活能的关系.结果表明:La原子与空位之间有较强的相互吸引作用,且对近邻Cu原子也有一定的束缚.此外,La的加入使Cu原子近邻的空位形成能显著升高,这表明La,Cu偏聚区形成空位较为困难.与此同时,由于La原子对近邻空位和Cu原子的吸引作用,使Cu原子向近邻空位跳跃的迁移能有所升高.迁移能与空位形成能变化的计算结果显示,La原子的加入能够使α-Fe中Cu的扩散激活能显著升高,从而延缓了铁素体区富铜相的偏聚和析出.     

Cu/SiO2/Si(111)体系中Cu和Si的扩散及界面反应

室温下利用磁控溅射在p型Si(111)衬底上沉积了Cu薄膜. 利用X射线衍射和卢瑟福背散射分别对未退火以及在不同温度点退火后样品的结构进行了表征. 在此基础上，研究了Cu/SiO₂/Si(111)体系的扩散和界面反应. 实验结果表明：当退火温度高于450℃时出现明显的扩散现象，并且随着温度的升高，体系扩散现象会更加显著. 当退火温度低于450℃时没有铜硅化合物生成，当温度达到500℃时才有铜硅化合物生成. 关键词： 薄膜 扩散 界面反应 硅化物     

Influence of X-irradiation on the solicon-silicon dioxide interface of MOS structures

Silicon MOS structures with an SiO₂−Si₃N₄ insulator were exposed to X-rays. Positive oxide charges arise and the continuous density of fast states increases at the Si−SiO₂ interface. In addition, a single energy state develops above the middle of the energy gap atE−E _v=600 meV. Annealing measurements in dry air and H₂ lead to the conclusion that the single energy level originates from a dissociated hydrogen bond in the silicon dioxide.     

氦对铜钨纳米多层膜界面稳定性的影响

采用射频磁控溅射方法,分别在纯Ar和Ar, He混合气氛下制备了多个不同调制周期的Cu/W纳米多层膜. 利用增强质子背散射(EPBS)、扫描电子显微镜(SEM)、X射线衍射(XRD)分别对Cu/W多层膜中He含量、 截面形貌和相结构进行了分析.结果表明:多层膜的界面稳定性是耐氦损伤的前提和保证. 在适当的调制周期下,纳米多层膜能有抑制氦泡成核及长大的能力.     

Structural and morphological characterisation of hybrid Cu/Si(0 0 1) structures

The structural and morphological properties of epitaxial Cu/Si(0 0 1) type of structures have been investigated by a combination of electron, X-ray and scanning probe imaging techniques. Auger electron spectroscopy measurements indicate the presence of Si in the Cu layer for Cu thicknesses up to 10 nm. In addition, X-ray scattering results show that there is a mosaic spread in the Cu(0 0 1) crystal which decreases as the Cu thickness increases, from 8° at 15 nm to 4.5° at 100 nm. This behaviour is corroborated by reflection high energy electron diffraction patterns of the Cu surface measured during growth, which exhibit a twinning in the diffraction spots for the 15 and 30 nm Cu films. Atomic force and scanning electron microscopy imaging of Cu(4 nm)/Co(7,17 nm)/Cu(100 nm)/Si(0 0 1) structures allow one to visualise and characterise the sample surface in real space; from these measurements, an average roughness amplitude of ∼0.5 nm and a correlation length of ∼50 nm are obtained. Our results provide a better understanding of an important system which has been widely used as a template for the growth of epitaxial ultrathin magnetic films.     

Mo/Si软X射线多层膜的界面粗糙度研究

 用磁控溅射法分别制备了以Mo膜层和Si膜层为顶层的Mo/Si多层膜系列, 利用小角X射线衍射确定了各多层膜的周期厚度。以不同周期数的Mo/Si多层膜的新鲜表面近似等同于同一多层膜的内界面,通过原子力显微镜研究了多层膜界面粗糙度随膜层数的变化规律。并在国家同步辐射实验室测量了各多层膜的软X射线反射率。研究表明：随着膜层数的增加,Mo膜层和Si膜层的界面粗糙度先减小后增加然后再减小,多层膜的峰值反射率先增加后减小。     

Effects of high-frequency and high-voltage pulsed electric field parameters on water chain formation

Separation methods utilizing high-frequency and high-voltage pulsed DC electric fields have been used extensively in the oil and petroleum industries, where the occurrence of water-in-oil dispersions is highly unwelcome because of physical constraints and the high maintenance costs required to treat these dispersions. This paper reports the results of studies of the effects of applied electric field parameters, including electric field strength, frequency, and duty ratio, on water chain formation in water-in-oil emulsions. The investigations were performed in a rectangular Perspex^® cell. The results of the studies show that dipole–dipole forces dominate the process of water chain formation. At low electric field strength, frequency, or duty ratio, dipole–dipole forces are negligible; therefore, the process of water chain formation and aqueous drop coalescence are inconspicuous. However, at high electric field strength, frequency, or duty ratio, significant dipole–dipole forces give rise to water chain formation and aqueous drop coalescence. At extremely high electric field strength, frequency, or duty ratio, aqueous drops are excessively polarized and disintegrate, inhibiting the processes of water chain formation and aqueous drop coalescence. The optimum electric field parameters for separation of water-in-oil dispersions are as follows: electric field strength, 3.80 kV cm⁻¹; frequency, 4.0 kHz; and duty ratio, 0.65.     

Effect of the annealing environment on the optical properties of ZnO/GaAs grown by MOCVD

The optical properties of ZnO grown on (1 0 0) GaAs substrate using metalorganic chemical vapor deposition are investigated by photoluminescence (PL) spectroscopy. Postgrowth annealing in nitrogen and oxygen was performed for different times and temperatures in order to incorporate As from the substrate into the ZnO thin films. The PL spectra of the samples annealed in different ambients reveal that the effect of As diffusion into the ZnO thin films is more pronounced when the annealing is performed in oxygen at 550 °C. The 11 K PL spectra show the appearance of a transition at ∼3.35 eV after annealing in oxygen at 550 °C for 1 h. A further increase in the annealing temperature leads to the disappearance of this line, while for annealing times longer than 2 h at 550 °C, it is no longer prominent. The increase in intensity of this new transition is also accompanied by the enhancement of radiative centers related to structural defects, such as the stacking fault-related transition at 3.31 eV and the Y-line. Temperature dependent PL illustrates the excitonic nature of the new transition at ∼3.35 eV, which is therefore assigned to (A⁰, X) transition, where the acceptor is possibly the 2V_Zn-As_Zn complex, with an activation energy E_A in the range of 160-240 meV. Furthermore, the enhancement of the radiative centers related to structural defects is regarded as evidence that As atoms tend to segregate in the vicinity of structural defects to relieve local strain.     

Effect of electric field on diffusion in disordered materials

The effect of electric field on diffusion of charge carriers in disordered materials is studied by Monte Carlo computer simulations and analytical calculations. It is shown how an electric field enhances the diffusion coefficient in the hopping transport mode. The enhancement essentially depends on the temperature and on the energy scale of the disorder potential. It is shown that in one‐dimensional hopping the diffusion coefficient depends linearly on the electric field, while for hopping in three dimensions the dependence is quadratic.