Synthesis of hydroxyl‐terminated poly(ether ether ketone) with pendent tert‐butyl groups and its use as a toughener for epoxy resins

Hydroxyl‐terminated poly(ether ether ketone) with pendent tert‐butyl groups (PEEKTOH) was synthesized by the nucleophilic substitution reaction of 4,4′‐difluorobenzophenone with tert‐butyl hydroquinone with potassium carbonate as a catalyst and N‐methyl‐2‐pyrrolidone as a solvent. Diglycidyl ether of bisphenol A epoxy resin was toughened with PEEKTOHs having different molecular weights. The melt‐mixed binary blends were homogeneous and showed a single composition‐dependent glass‐transition temperature (T_g). Kelley–Bueche and Gordon–Taylor equations gave good correlation with the experimental T_g. Scanning electron microscopy studies of the cured blends revealed a two‐phase morphology. A sea‐island morphology in which the thermoplastic was dispersed in a continuous matrix of epoxy resin was observed. Phase separation occurred by a nucleation and growth mechanism. The dynamic mechanical spectrum of the blends gave two peaks corresponding to epoxy‐rich and thermoplastic‐rich phases. The T_g of the epoxy‐rich phase was lower than that of the unmodified epoxy resin, indicating the presence of dissolved PEEKTOH in the epoxy matrix. There was an increase in the tensile strength with the addition of PEEKTOH. The fracture toughness increased by 135% with the addition of high‐molecular‐weight PEEKTOH. The improvement in the fracture toughness was dependent on the molecular weight and concentration of the oligomers present in the blend. Fracture mechanisms such as crack path deflection, ductile tearing of the thermoplastic, and local plastic deformation of the matrix occurred in the blends. The thermal stability of the blends was not affected by blending with PEEKTOH. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 541–556, 2006     

Syntheses of conductive adhesives based on epoxy resin and polyanilines by using N‐tert‐butyl‐5‐methylisoxazolium perchlorate as a thermally latent curing reagent

Conductive composites consisted of epoxy resin and polyanilines (PANIs) doped with dodecylbenzenesulfonic acid ( 1 ), dodecylsulfonic acid (2), di(2‐ethylhexyl)sulfosuccinic acid (3), and HCl were synthesized by use of N‐tert‐butyl‐5‐methylisoxazolium perchlorate (5) under various reaction conditions. It was found that the composites with PANI doped with acid 2 (PANI‐2) prepared by curing with 10 mol % of reagent 5 at 80 °C for 12 h showed high electroconductivity along with the low conducting percolation threshold (3 wt % of PANI‐2). Furthermore, the composite with even ?10 wt % of PANI‐2 exhibited ?10^?1 S/cm of electroconductivity. The UV–vis and IR measurements indicated that the conductive emeraldine salt form of PANI‐2 in the composite was maintained after the curing reaction. The thermal stability was studied by TGA and DSC measurements, and then, the T_d10 and T_g of the composite with 5 and 10 wt % of PANI‐2 were found to be similar to those with the cured epoxy resin itself. In addition, the similar investigation with an oxetane resin instead of the epoxy resin was also carried out. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 718–726, 2006     

Exploitation of introducing of catalytic centers into layer galleries of layered silicates and related epoxy nanocomposites. I. Epoxy nanocomposites derived from montmorillonite modified with catalytic surfactant‐bearing carboxyl groups

Montmorillonite (MMT) was modified with the acidified cocamidopropyl betaine (CAB) and the resulting organo‐montmorillonite (O‐MMT) was dispersed in an epoxy/methyl tetrahydrophthalic anhydride system to form epoxy nanocomposites. The intercalation and exfoliation behavior of the epoxy nanocomposites were examined by X‐ray diffraction and transmission electron microscopy. The curing behavior and thermal property were investigated by in situ Fourier transform infrared spectroscopy and DSC, respectively. The results showed that MMT could be highly intercalated by acidified CAB, and O‐MMT could be easily dispersed in epoxy resin to form intercalated/exfoliated epoxy nanocomposites. When the O‐MMT loading was lower than 8 phr (relative to 100 phr resin), exfoliated nanocomposites were achieved. The glass‐transition temperatures (T_g's) of the exfoliated nanocomposite were 20 °C higher than that of the neat resin. At higher O‐MMT loading, partial exfoliation was achieved, and those samples possessed moderately higher T_g's as compared with the neat resin. O‐MMT showed an obviously catalytic nature toward the curing of epoxy resin. The curing rate of the epoxy compound increased with O‐MMT loading. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 1192–1198, 2004     

The temperature‐dependent ballistic performance and the ductile‐to‐brittle transition in polymer networks

The temperature dependence of the ballistic impact performance of a series of transparent polymer networks is evaluated. A systematic series of homogeneous epoxy/propylene‐oxide‐based thermosets, a nanoscale phase‐separated epoxy/dual amine thermoset, and two homogeneous, completely aliphatic materials synthesized via ring‐opening metathesis polymerization are examined. The Vogel temperature (T_o) and the Kauzmann temperature (T_K) are critical parameters for scaling the temperature‐dependent ballistic impact performance of each class of materials. The ductile‐to‐brittle transition temperature in a series of propylene‐oxide amine‐cured epoxies occurs at the material T_K, corresponding to a sharp drop in fracture toughness and ballistic impact performance. Two aliphatic, ring‐opening metathesis polymerized materials are found to exhibit no clear transition from purely ductile to purely brittle behavior, but the temperature dependence is still scaled to a single curve when normalized by T_o. The cooperatively rearranging region (CRR) or the volume of this region is related to the breadth of temperatures over which these materials exhibit purely ductile deformation both quasi‐statically and at higher rates. The temperature‐dependent performance is discussed in the context of the configurational entropy. The breadth of the ductility window is related to the size of the CRR, calculated from calorimetric measurements at the resin T_g. Published 2019. This article is a U.S. Government work and is in the public domainin the USA. J. Polym. Sci., Part B: Polym. Phys. 2019 , 57, 511–523     

Novel flame‐retardant thermosets: Phosphine oxide‐containing diglycidylether as curing agent of phenolic novolac resins

Phosphorus‐containing novolac–epoxy systems were prepared from novolac resins and isobutyl bis(glycidylpropylether) phosphine oxide (IHPOGly) as crosslinking agent. Their curing behavior was studied and the thermal, thermomechanical, and flame‐retardant properties of the cured materials were measured. The T_g and decomposition temperatures of the resulting thermosets are moderate and decrease when the phosphorous content increases. Whereas the phosphorous species decrease the thermal stability, at higher temperatures the degradation rates are lower than the degradation rate of the phosphorous‐free resin. V‐O materials were obtained when the resins were tested for ignition resistance with the UL‐94 test. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3516–3526, 2004     

Flame‐retardant epoxy resins with high glass‐transition temperatures. II. Using a novel hexafunctional curing agent: 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane

We synthesized a novel phosphorus‐containing triamine [9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane (dopo‐ta)] from the nucleophilic addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and pararosaniline chloride, using triethylamine as an acid receiver. We confirmed the structure of dopo‐ta by IR, mass, and NMR spectra and elemental analysis. dopo‐ta served as a curing agent for diglycidyl ether of bisphenol A (DGEBA) and dicyclopentadiene epoxy (hp7200). Properties such as the glass‐transition temperature (T_g), thermal decomposition temperature, flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The T_g's of cured DGEBA/dopo‐ta and hp7200/dopo‐ta were 171 and 190 °C, respectively. This high T_g phenomenon is rarely seen in the literature after the introduction of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.80 wt % for DGEBA/dopo‐ta/diamino diphenylmethane (DDM) systems and 1.46 wt % for hp7200/dopo‐ta/DDM systems. The dielectric constants for DGEBA/dopo‐ta and hp7200/dopo‐ta were 2.91 and 2.82, respectively, implying that the dopo‐ta curing systems exhibited low dielectric properties. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5971–5986, 2005     

High resolution solid‐state 13C‐NMR study of as‐cured and irradiated epoxy resins

This article presents the effects of strong ionizing radiations on the physico‐chemical modifications of aliphatic or aromatic amine‐cured epoxy resins based on diglycidyl ether of bisphenol A (DGEBA). Such epoxy resins have a considerable number of applications in the nuclear industrial field and are known to be very stable under moderate irradiation conditions. Using extensively high resolution solid‐state ¹³C‐NMR spectroscopy we show that the aliphatic amine‐cured resin (DGEBA‐TETA) appears much more sensitive to gamma rays than the aromatic amine‐cured one (DGEBA‐DDM). On the one hand, qualitative analyses of the high resolution solid‐state ¹³C‐NMR spectra of both epoxy resins, irradiated under similar conditions (8.5 MGy), reveal almost no change in the aromatic amine‐cured resin whereas new resonances are observed for the aliphatic amine‐cured resin. These new peaks were interpreted as the formation of new functional groups such as amides, acids and/or esters and to alkene groups probably formed in the aliphatic amine skeleton. On the other hand, molecular dynamics of these polymers are investigated by measuring the relaxation times, T_CH, T_1ρH and T_1C , before and after irradiation. The study of relaxation data shows the formation, under irradiation, of a more rigid network, especially for the aliphatic amine‐cured system and confirms that aromatic amine‐cured resin [DGEBA‐4,4′‐diaminodiphenylmethane(DDM)] is much less affected by ionizing radiations than the aliphatic amine‐cured resin [DGEBA‐triethylenetetramine(TETA)]. Moreover, it has been shown that the molecular modifications generated by irradiation on the powder of the aliphatic‐amine‐cured resin appear to be homogeneously distributed inside the polymers as no phase separations can be deduced from the above analyses. Copyright © 2001 John Wiley & Sons, Ltd.     

Styrene 4‐vinylbenzocyclobutene copolymer for microelectronic applications

Styrene and 4‐vinylbenzocyclobutene (vinyl‐BCB) random copolymers were prepared by free radical polymerization and studied for suitability as a dielectric material for microelectronic applications. The percentage of vinyl‐BCB in the copolymer was varied from 0 to 26 mol % to optimize the physical and mechanical properties of the cured copolymer as well as the cost. Copolymer in which 22 mol % of vinyl‐BCB was incorporated along with styrene produced a thermoset polymer which, after cure, did not show a T_g before decomposition at about 350 °C. The polymeric material has a very low dielectric constant, dissipation factor, and water uptake. The fracture toughness of the copolymer was improved with the addition of 20 wt % of a star‐shaped polystyrene‐block‐polybutadiene. Blends of the poly(styrene‐co‐vinyl‐BCB) with the thermoplastic elastomer provided material that maintained high T_g of the cured copolymer with only a slight decrease in thermal stability. The crosslinked styrenic polymer and toughened blends possess many properties that are desirable for high frequency‐high speed mobile communication applications. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 2799–2806, 2008     

Amine‐cured epoxy/clay nanocomposites. II. The effect of the nanoclay aspect ratio

The thermophysical and mechanical properties of a nanocomposite material composed of amine‐cured diglycidyl ether of bisphenol A (DGEBA) reinforced with organomontmorillonite clay are reported. The storage modulus at 100 °C, which was above the glass‐transition temperature (T_g), increased approximately 350% with the addition of 10 wt % (6.0 vol %) of clay. Below the T_g, the storage modulus at 30 °C increased 50% relative to the value of unfilled epoxy. It was determined that the T_g linearly increased as a function of clay volume percent. The tensile modulus of epoxy at room temperature increased approximately 50% with the addition of 10 wt % of clay. The reinforcing effect of the organoclay nanoplatelets is discussed with respect to the Tandon–Weng and Halpin–Tsai models. A pseudoinclusion model is proposed to describe the behavior of randomly oriented, uniformly dispersed platelets in nanocomposite materials. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 4391–4400, 2004     

Epoxy resin/poly(ϵ‐caprolactone) blends cured with 2,2‐bis[4‐(4‐aminophenoxy)phenyl]propane. I. Miscibility and crystallization kinetics

Crystalline thermosetting blends composed of 2,2′‐bis[4‐(4‐aminophenoxy)phenyl]propane (BAPP)‐cured epoxy resin (ER) and poly(?‐caprolactone) (PCL) were prepared via the in situ curing reaction of epoxy monomers in the presence of PCL, which started from initially homogeneous mixtures of diglycidyl ether of bisphenol A (DGEBA), BAPP, and PCL. The miscibility of the blends after and before the curing reaction was established with differential scanning calorimetry and dynamic mechanical analysis. Single and composition‐dependent glass‐transition temperatures (T_g's) were observed in the entire blend composition after and before the crosslinking reaction. The experimental T_g's were in good agreement with the prediction by the Fox and Gordon–Taylor equations. The curing reaction caused a considerable increase in the overall crystallization rate and dramatically influenced the mechanism of nucleation and the growth of the PCL crystals. The equilibrium melting point depression was observed for the blends. An analysis of the kinetic data according to the Hoffman–Lauritzen crystallization kinetic theory showed that with an increasing amorphous content, the surface energy of the extremity surfaces increased dramatically for DGEBA/PCL blends but decreased for ER/PCL blends. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 1085–1098, 2003     

Further Study of Sub‐Tg Heat Flow Transition of a Cured Epoxy Resin

To further study the sub‐T_g heat flow transition of a cured epoxy resin, cured samples with different thermal history were investigated using torsion pendulum analysis (TPA) and thermal mechanical analysis (TMA). The results indicate that sub‐T_g heat flow transition could be related to the molecular relaxation from 20°C to the α‐peak, and that frozen‐in extra free volume is necessary for the appearance of sub‐T_g heat flow transition.     

Calorimetric studies on an anhydride‐cured epoxy resin from diglycidyl ether of bisphenol‐A and diglycidyl ether of poly(propylene glycol). I. Onset of diffusion control during isothermal polymerization

Calorimetric studies on a series of anhydride‐cured epoxy resins, in which the epoxy oligomer is a mixture of diglycidyl ether of bisphenol‐A (DGEBA) and diglycidyl ether of poly(propylene glycol) (DGEPPG) in different mole ratios, were carried out. DGEPPG is a flexible epoxy oligomer that was used to tune glass transition temperature for the fully reacted epoxy resin. Conversion versus time curves for the systems with different DGEBA/DGEPPG mole ratios (not including the neat DGEPPG system) were found to overlap with each other in mass‐controlled reaction regime, indicating similar reactivities of epoxy groups in both epoxy oligomers. Onset of diffusion‐controlled reaction regime for different systems was estimated by fitting the conversion versus time data using a phenomenological kinetic equation, as well as from direct comparison of the conversion versus time curves. For the systems (i.e., 0, 10, and 30% DGEPPG) that vitrify during reaction, the crossover from mass‐controlled to diffusion‐controlled reaction occurs close to the onset of the vitrification, where T_g is about 25–30 K below the reaction temperature. For the system (i.e., 50% DGEPPG system) that does not vitrify during the reaction, such crossover still occurs when the T_g of the mixture reaches a value about 25 K below the reaction temperature. © 2008 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 46: 2155–2165, 2008     

Preparation and properties of biocomposites composed of bio‐based epoxy resin,tannic acid,and microfibrillated cellulose

As new bio‐based epoxy resin systems, glycerol polyglycidyl ether (GPE) and sorbitol polyglycidyl ether (SPE) were cured with tannic acid (TA) at various conditions. When the curing conditions were optimized for the improvement of thermal and mechanical properties, the most balanced properties were obtained for the GPE/TA and SPE/TA cured at 160 °C for 2–3 h at the epoxy/hydroxyl ratio of 1/1. The cured SPE/TA had a higher glass transition temperature (T_g) and tensile strength than the cured GPE/TA. Next, biocomposites of GPE/TA and SPE/TA with microfibrillated cellulose (MFC) were prepared by mixing aqueous solution of the epoxy/curing reagent with MFC, and subsequent drying and curing at the optimized condition. For both the GPE/TA/MFC and SPE/TA/MFC biocomposites, T_g and the storage modulus at rubbery plateau region increased with increasing MFC content over the studied range of 3–15 wt %. The tensile strength at 25 °C for GPE/TA/MFC biocomposite with MFC content 10 wt % was 76% higher than that of control GPE/TA, while the tensile modulus was little improved. On the other hand, the tensile strength and modulus of SPE/TA/MFC biocomposite with MFC content 10 wt % were 30 and 55% higher than those of control SPE/TA, respectively. © 2010 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 48: 425–433, 2010     

Phase behavior of ternary poly‐(2‐vinylpyridine)/poly‐(N‐vinyl‐2‐pyrrolidone)/bis‐(4‐hydroxyphenyl)methane blends

The phase behavior of ternary poly‐(2‐vinylpyridine) (P2VPy)/poly‐(N‐vinyl‐2‐pyrrolidone) (PVP)/bis‐(4‐hydroxyphenyl)methane (BHPM) blends was studied. Fourier transform infrared spectroscopic examinations demonstrated that BHPM interacts with P2VPy and PVP through hydrogen‐bonding interactions. The addition of a sufficiently large amount of BHPM transformed an opaque blend with two glass‐transition temperatures (T_g's) to a transparent single‐T_g blend. Scanning electron microscopic studies showed that the transparent single‐T_g blend is micro‐phase‐separated at a scale of about 30 nm. © 2001 John Wiley & Sons, Inc. J Polym Sci Part B: Polym Phys 39: 1815–1823, 2001     

Degradable and chemically recyclable epoxy resins containing acetal linkages: Synthesis,properties, and application for carbon fiber‐reinforced plastics

Four sorts of epoxy resins containing degradable acetal linkages were synthesized by the reaction of bisphenol A (BA) or cresol novolak (CN) resin with vinyl ethers containing a glycidyl group [4‐vinlyoxybutyl glycidyl ether (VBGE) and cyclohexane dimethanol vinyl glycidyl ether (CHDMVG)] and cured with known typical amine‐curing agents. The thermal and mechanical properties of the cured resins were investigated. Among the four cured epoxy resins, the CN‐CHDMVG resin (derived from CN and CHDMVE) exhibited relatively high glass transition temperature (T_g = ca. 110 °C). The treatment of these cured epoxy resins with aqueous HCl in tetrahydrofuran (THF) at room temperature for 12 h generated BA and CN as degradation main products in high yield. Carbon fiber‐reinforced plastics (CFRPs) were prepared by heating the laminated prepreg sheets with BA‐CHDMVG (derived from BA and CHDMVE) and CN‐CHDMVG, in which strands of carbon fibers are impregnated with the epoxy resins containing conventional curing agents and curing accelerators. The obtained CFRPs showed good appearance and underwent smooth breakdown with the aqueous acid treatment in THF at room temperature for 24 h to produce strands of carbon fiber without damaging their surface conditions and tensile strength. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2012     

Thermosets containing benzoxazole units: Liquid‐crystalline behavior and thermal conductivity

A series of liquid‐crystalline (LC) thermosetting monomers containing benzoxazole (BO) units were synthesized to evaluate the thermal conductivities (λ) of their cured resins. A BO‐containing bisnadiimide system showed LC behavior during the heating process. However, the thermal cure of the bisnadiimide provided a film without optical anisotropy; consequently, the cured film exhibited normal levels of thermal diffusivity (α) and thermal conductivity (λ). The disappearance of the optically anisotropic ordered structures during thermal curing is likely related to the temperature gaps between the cure reaction ranges and LC ranges (T_cure‐T_LC gap). In addition, epoxy resins consisting of bisepoxides and BO‐containing diamines were investigated because of their high flexibility in terms of molecular design that can be used to reduce the T_cure‐T_LC gap. The combination of a terephthalylidene‐type bisepoxide and BO‐containing diamine with a controlled flexible chain length resulted in the smallest T_cure‐T_LC gap among the epoxy resin systems examined herein. The cured epoxy resin film exhibited an appreciably increased λ value (0.257 W m^?1 K^?1) in the Z direction. This indicated the importance of the T_cure‐T_LC gap for enhancing the α and λ values of the cured films. This epoxy resin system was cured under a continuous DC electric field during polarizing optical microscopy. A prompt response with deformation of the LC domains was observed in harmony with temporal ON/OFF switching of the DC power supply. As expected, the cured film exhibited a significantly enhanced λ value (0.488 W m^?1 K^?1) in the Z direction.     

Effects of water on epoxy cure kinetics and glass transition temperature utilizing molecular dynamics simulations

Effects of water on epoxy cure kinetics are investigated. Experimental tests show that absorbed water in an uncured bisphenol‐F/diethyl‐toluene‐diamine epoxy system causes an increase in cure rate at low degrees of cure and a decrease in cure rate at high degrees of cure. Molecular simulations of the same epoxy system indicate that the initial increase in cure rate is due to an increase in molecular self‐diffusion of the epoxy molecules in the presence of water. Effects of water on the glass transition temperature (T_g) of the crosslinked thermoset are also studied. Both experiments and simulations show that water decreases T_g. Both types of results indicate that T_g effects are small below 1% water by weight, but that T_g depression occurs much quickly with increasing water content above 1%. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2017 , 55, 1150–1159     

Copolymer networks from carboxyl‐containing polyaryletherketone and diglycidyl ether of bisphenol‐A: Preparation and properties

This article presents a new type of epoxy‐toughening system, in which high‐T_g polyaryletherketone (PEK‐L) containing one carboxyl group per repeating unit was utilized to randomly copolymerize with epoxy resin (DGEBA) to form crosslinking network. Compared to the neat epoxy resin, the PEK‐L/DGEBA copolymers showed simultaneous enhancement in flexural strains at break by 282%, G_IC value by 193%, and flexural strength by 14%. The reason was attributed to the uniform three‐dimensional copolymer network interweaved by PEK‐L and DGEBA segments through strong covalent bonds. The copolymerization process were monitored and examined by FTIR spectra. The effect of copolymer composition on the thermal and mechanical properties as well as toughening mechanism were also investigated and discussed in detail. © 2010 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2010     

Influence of the network chain orientation on the fracture toughness of a mesogenic epoxy resin modified with CTBN

A biphenol‐type epoxy resin, which had a mesogenic group in the backbone moiety, was modified with carboxy‐terminated butadiene acrylonitrile copolymer (CTBN) as a reactive elastomer, and its fracture toughness was measured. With the addition of CTBN, the fracture toughness of the biphenol‐type epoxy resin significantly increased and became significantly higher than that of a bisphenol A‐type epoxy resin modified with CTBN. The network chain orientation in the cured biphenol‐type epoxy resin system was clearly observed during the fracture process with polarized microscopy Fourier transform infrared measurements, although such a phenomenon was not observed in the bisphenol A‐type epoxy resin system. The high toughness of the cured biphenol‐type system was clearly due to the consumption of the mechanical energy by a large deformation of the matrix resin due to the orientation of the network chains during the fracture process. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 1198–1209, 2003     

Synthesis of a novel DPPA‐containing benzoxazine to flame‐retard epoxy resin with maintained thermal properties

The flame‐retarded epoxy resin with improved thermal properties based on environmentally friendly flame retardants is vital for industrial application. Hereby, a novel reactive‐type halogen‐free flame retardant, 10‐(3‐(4‐hydroxy phenyl)‐3,4‐dihydro‐2H‐benzo[e] [1,3] oxazin‐4‐yl)‐5H‐phenophosphazinine 10‐oxide (DHA‐B) was synthesized via a two‐step reaction route. Its structure was characterized using ¹H, ¹³C, and ³¹P NMR and HRMS spectra. For 4,4′‐diaminodipheny ethane (DDM) and diglycidyl ether of bisphenol A (DGEBA)‐cured systems, the epoxy resin with only 2 wt% loading of DHA‐B passed V‐0 rating of UL‐94 test. Significantly, its glass transition temperature (T_g) and initial decomposition temperature (T_5%) were as high as 169.6°C and 359.6°C, respectively, which were even higher than those of the corresponding original epoxy resin. Besides, DHA‐B decreased the combustion intensity during combustion. The analysis of residues after combustion suggested that DHA‐B played an important role in the condensed phase.