氧离子注入纳米金刚石薄膜的微结构和电化学性能研究

在纳米金刚石薄膜中注入剂量为1012cm-2的氧离子,并进行700,800,900和1000?C的真空退火处理,系统研究薄膜的微结构和电化学性能结果表明,氧离子注入未退火(O120)和氧离子注入1000?C退火(O121000)电极的电势窗口分别为4.60 V和3.61 V,远大于其他电极的电势窗口,并且这两个样品的电极传质效率较高,说明氧离子注入和高温退火有利于提高电极的传质效率.红外光谱测试表明,样品O120和O121000的表面没有碳氢基团终止层,而其他样品均含有氢终止层,说明氧离子注入和高温退火破坏了薄膜表面含碳氢基团的氢终止层,提高了薄膜的电化学性能Raman光谱测试结果表明,金刚石含量较高、内应力较小和非晶石墨相无序化程度较大的样品具有较好的电化学性能;并且薄膜晶界处的非晶碳的团簇数量或者尺寸减小,样品的电化学性能提高.     

氧离子注入微晶金刚石薄膜的微结构与光电性能研究

本文系统研究了氧离子注入剂量和退火温度对含有Si-V发光中 心的微晶金刚石薄膜的微结构和光电性能的影响. 结果表明, 氧离子注入并在较高温度退火有利于提高薄膜中Si-V中心的发光强度. 当氧离子注入剂量从10¹⁴ cm^-2增加到10¹⁵ cm^-2时, 薄膜中Si-V发光强度增强. Hall效应测试结果表明退火后薄膜的面电阻率降低. 不同温度退火时, 氧离子注入薄膜的Si-V发光强度较强时, 薄膜的面电阻率增加, 说明Si-V发光中心不利于提高薄膜的导电性能. Raman光谱测试结果表明, 薄膜中缺陷数量的增多会增强Si-V的发光强度, 而降低薄膜的导电性能. 关键词： 金刚石薄膜 氧离子注入 电学性能 Si-V缺陷     

The effect of boron ion implantation and annealing on the microstructure and electrical characteristics of the diamond films

Diamond films were doped by boron ion-implantation with the energy of 120 keV. The implantation dose ranged from 10¹⁴ to 10¹⁷ cm⁻². After the implantation, the diamond films were annealed at different temperatures (600–750°C) for different times (2–15 min). Scanning Electronic Microscope, Raman and Secondary Ion Mass-spectrum were used to investigate the effect of boron ion implantation and annealing on the microstructure of the diamond films. The electrical resistivities of the diamond films were also measured. It was found that the best dose of boron ion-implantation into the diamond film was around 10¹⁶ cm⁻². The appropriate annealing temperature and time was 700°C and 2–5 min, respectively. After implantation, the resistivities were reduced to 0.1 Ω cm (almost nine orders lower than the unimplanted diamond films). These results show that boron ion implantation can be an effective way to fabricate P-type diamond films.     

FORMATION OF A BURIED LAYER OF ALUMINIUM NITRIDE BY HIGH DOSE N2+ IMPLANTATION INTO ALUMINIUM

Aluminium films with various thickness between 700 nm and 1μm were deposited on Si (100) substrates, and 400 keV N₂⁺ ions with doses ranging from 4.3×10¹⁷ to 1.8×10¹⁸ N/cm² were implanted into the alu-minium films on silicon, Rutherford Backscattering (RBS) and channeling, secondary ion mass spectroscopy (SIMS), Fourier transform infrared spectra (FTIR), X-ray diffraction (XRD), transmission electron microscopy (TEM) and spreading resistance probes (SRP) were used to characterize the synthesized aluminium nitride. The experiments showed that when the implantation dose was higher than a critical dose N_c, a buried stoichiometric AlN layer with high resistance was formed, while no apparent AlN XRD peaks in the as-implanted samples were observed; however, there was a strong AlN(100) diffraction peak appearing after annealing at 500 ℃ for 1h. The computer program, Implantation of Reactive Ions into Silicon (IRIS), has been modified and used to simulate the formation of the buried AlN layer as N₂⁺ is implanted into aluminium. We find a good agreement between experimental measurements and IRIS simulation.     

砷化镓中质子注入之研究

本文中,我们研究了砷化镓中质子注入及退火恢复过程。实验用晶向<100>偏1—3°,掺Sn 5×10¹⁷-1×10¹⁸cm^-3的单晶,室温下质子注入,注入能量E约8×10⁴—2×10⁶eV,用A-B腐蚀剂对注入质子样品的解理面显结,测得质子注入高阻层的纵向深度x_j和径向扩展x_L与注入能量E的定量关系。然后,对注入质子样品,在150—800℃下退火5分钟,用双晶衍射仪研究了样品的应变恢复过程,在静电计上测量了高阻阻值随退火温度的变化。根据实验结果,讨论了砷化镓中质子注入的射程R_p,电子阻止本领S_n(E)和核阻止本领S_e(E),以及质子注入形成高阻和退火恢复的机理。 关键词：     

GROWTH MODEL OF TEXTURED DIAMOND (111) FILM IN CH4/O2/H2 ATMOSPHERE

Partially oriented and highly textured diamond films on Si( 111 ) substrates were achieved by hot-filament chemical vapor deposition(HFCVD). High nucleation density greater than 5×10⁸cm^-2 was realiged in 3 min by near-surface glow discharge. The os-grown films were characterized by scanning electron microscopy(SEM), X-ray diffraction(XRD) and Raman spectroscopy. It was found that by adding a small amount of oxygen to the mixture of CH₄/H₂, the appearance of facet(111) was well controlled, and the secondary nucleation on the facet(111) was suppressed greatly. Growth feature of homoepitaxy on diamond (111) surface was demonstrated to be in Stranski-Krastanov model by SEM.     

Structure and luminescence of a-plane GaN on r-plane sapphire substrate modified by Si implantation

We show the structural and optical properties of non-polar a-plane GaN epitaxial films modified by Si ion implantation. Upon gradually raising Si fluences from 5×10¹³ cm^-2 to 5×10¹⁵ cm^-2, the n-type dopant concentration gradually increases from 4.6×10¹⁸ cm^-2 to 4.5×10²⁰ cm^-2, while the generated vacancy density accordingly raises from 3.7×10¹³ cm^-2 to 3.8×10¹⁵ cm^-2. Moreover, despite that the implantation enhances structural disorder, the epitaxial structure of the implanted region is still well preserved which is confirmed by Rutherford backscattering channeling spectrometry measurements. The monotonical uniaxial lattice expansion along the a direction (out-of-plane direction) is observed as a function of fluences till 1×10¹⁵ cm^-2, which ceases at the overdose of 5×10¹⁵ cm^-2 due to the partial amorphization in the surface region. Upon raising irradiation dose, a yellow emission in the as-grown sample is gradually quenched, probably due to the irradiation-induced generation of non-radiative recombination centers.     

The effect of nitrogen ion implantation on tungsten surfaces

X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) were used to study the phase, composition and chemical states of elements at the tungsten surface. The measurement results indicate that nitrogen-containing phase of tungsten were formed by nitrogen ion implantation (energy 40 keV, implantation doses of 4×10¹⁷, 8×10¹⁷ and 1.6×10¹⁸ ions/cm²). The formation of the W_x(O,N) and WN in the surface layer occurred as a result of nitrogen ion irradiation. A decrease in concentration of W_x(O,N) is observed with increasing N⁺ while that WN increases. Due to residual oxygen in the chamber WO₃ still exists at the surface of the specimen.     

Field-induced insulator-metal-insulator transitions in low-energy H_2~+ ion-irradiated epitaxial La_(2/3)Ca_(1/3)MnO_3 thin films

Epitaxial La 2/3 Ca 1/3 MnO 3 thin films grown on LaAlO 3 (001) substrates were irradiated with low-energy 120-keV H 2 + ions over doses ranging from 10 12 ions/cm 2 to 10 17 ions/cm 2 . The irradiation suppresses the intrinsic insulator-metal (I-M) transition temperature and increases the resistance by reducing the crystallographic symmetry of the films. No irradiation-induced columnar defects were observed in any of the samples. The specific film irradiated at a critical dose around 8 × 10 15 ions/cm 2 is in a threshold state of the electric insulator where the I-M transition is absent. In an external field of 4 T or higher, the I-M transition is restored and thus an enormous magnetoresistance is observed, while a negative temperature coefficient resumes as the temperature is reduced further. Magnetic relaxation behavior is confirmed in this and other heavily irradiated samples. The results are interpreted in terms of the displacement of oxygen atoms provoked by ion irradiation and the resulting magnetic glassy state, which can be driven into a phase coexistence of metallic ferromagnetic droplets and the insulating glass matrix in a magnetic field.     

快重离子辐照对非晶态SiO2薄膜光致发光谱的影响

用湿氧化法在单晶硅表面生长了非晶态SiO2薄膜,再用高能Pb和Xe离子对薄膜进行辐照,最后用荧光光谱分析了辐照参数(剂量、电子能损值)与发光特性改变的相关性.研究发现,快重离子辐照能显著影响薄膜的发光特性,进一步分析显示,辐照导致了SiO2薄膜内O-Si-O缺陷、缺氧缺陷和非桥式氧空位缺陷的产生,且缺氧缺陷和非桥式氧空...     

Eu掺杂GaN薄膜的阴极荧光特性

通过MOCVD方法在蓝宝石衬底上生长GaN薄膜,利用离子注入方法将Eu³⁺离子注入到GaN基质中。X射线衍射结果表明：经过退火处理后,修复了部分离子注入所导致的晶格损伤。利用阴极荧光光谱可得到GaN∶Eu³⁺材料在623 nm处有很强的红光发射,该发射峰来源于Eu³⁺离子的内部4f能级跃迁。另外,Eu³⁺离子注入会在样品中引入电荷转移态,产生408 nm附近的发光。退火处理有助于获得更强的电荷转移态发光和Eu离子特征发光。GaN基质的黄光峰与Eu离子之间存在能量交换,将能量传递给Eu离子,促进Eu离子发光。     

Surface defects,stress evolution,and laser damage enhancement mechanism of fused silica under oxygen-enriched condition

Oxygen ions (O⁺) were implanted into fused silica at a fixed fluence of 1×10¹⁷ ions/cm² with different ion energies ranging from 10 keV to 60 keV. The surface roughness, optical properties, mechanical properties and laser damage performance of fused silica were investigated to understand the effect of oxygen ion implantation on laser damage resistance of fused silica. The ion implantation accompanied with sputtering effect can passivate the sub-/surface defects to reduce the surface roughness and improve the surface quality slightly. The implanted oxygen ions can combine with the structural defects (ODCs and E' centers) to reduce the defect densities and compensate the loss of oxygen in fused silica surface under laser irradiation. Furthermore, oxygen ion implantation can reduce the Si-O-Si bond angle and densify the surface structure, thus introducing compressive stress in the surface to strengthen the surface of fused silica. Therefore, the laser induced damage threshold of fused silica increases and the damage growth coefficient decreases when ion energy up to 30 keV. However, at higher ion energy, the sputtering effect is weakened and implantation becomes dominant, which leads to the surface roughness increase slightly. In addition, excessive energy aggravates the breaking of Si-O bonds. At the same time, the density of structural defects increases and the compressive stress decreases. These will degrade the laser laser-damage resistance of fused silica. The results indicate that oxygen ion implantation with appropriate ion energy is helpful to improve the damage resistance capability of fused silica components.     

Structure and properties of molybdenum implanted with high-flux carbon ion

High purity molybdenum was implanted by C ion in a metal vapour vacuum arc (MEVVA) implanter. The influence of implantation parameters was studied by varying ion fluence and ion current density. The samples were implanted by 45 keV C ion with fluences from 1×10¹⁵ to 1×10¹⁸ ions/cm², respectively. The as-implanted samples were investigated by scanning electron microscopy (SEM), X-ray diffraction (XRD), and nanoindenter. Different morphologies were observed on the surfaces of the as-implanted samples due to irradiation damage, and clearly related to implantation parameters. XRD spectra confirm formation of β-Mo₂C with ion fluences equal to or larger than 1×10¹⁶ ions/cm², and formation of -Mo₂C with ion fluence of 1×10¹⁸ ions/cm². The maximum nanohardness and maximum modulus of the as-implanted samples increased gradually with increasing ion fluence, and reached the corresponding maximum values with ion fluence of 1×10¹⁸ ions/cm². The experimental results suggest that the structure and properties of the as-implanted Mo samples exhibited strong dependence on implantation parameters.     

Photoemission from diamond and fullerene films for advancedaccelerator applications

The photoemission properties of thin diamond and fullerene films were investigated for advanced accelerator applications, using subpicosecond laser pulses at three different wavelengths (650, 325, and 217 nm). The quantum efficiency (QE) obtained at 217 nm with a boron-doped, p-type, (111) polycrystalline diamond film (2.6·10 ^-4) was only five times smaller than the QE obtained with a mirror polished copper sample (1.3·10^-3) but more than nine times larger than the QE obtained with a pure diamond film or with natural diamond monocrystals. Similar results were obtained for the two-photon electron yields at 325 mm. The electron yields obtained with pure fullerene films were small and comparable to the ones observed with the pure diamond samples. With 650 mn pulses, the damage threshold of the (110) Type IIa natural diamond monocrystal (9.38·10⁴ μJ cm^-2), defined here as the fluence leading to an onset of ion emission, was 25 times larger than the damage threshold for a copper sample (3.75·10³ μJ cm^-2). The damage threshold of the boron-doped sample at the same wavelength was two times larger than that of copper. Damage thresholds with 325 nm pulses were lower, and with 217 mn pulses ion emission was observed at all fluences probably attributed to ablation of surface hydrocarbon contaminants. Results show that high-quality high-boron concentration diamond films could be a good candidate for high-RF electron guns     

Defect versus nanocrystal luminescence emitted from room temperature and hot-implanted SiO2 layers

Silicon nanocrystals have been synthesized in SiO₂ matrix using Si ion implantation. Si ions were implanted into 300-nm-thick SiO₂ films grown on crystalline Si at energies of 30–55 keV, and with doses of 5×10¹⁵, 3×10¹⁶, and 1×10¹⁷ cm⁻². Implanted samples were subsequently annealed in an N₂ ambient at 500–1100°C during various periods. Photoluminescence spectra for the sample implanted with 1×10¹⁷ cm⁻² at 55 keV show that red luminescence (750 nm) related to Si-nanocrystals clearly increases with annealing temperature and time in intensity, and that weak orange luminescence (600 nm) is observed after annealing at low temperatures of 500°C and 800°C. The luminescence around 600 nm becomes very intense when a thin SiO₂ sample is implanted at a substrate temperature of 400°C with an energy of 30 keV and a low dose of 5×10¹⁵ cm⁻². It vanishes after annealing at 800°C for 30 min. We conclude that this luminescence observed around 600 nm is caused by some radiative defects formed in Si-implanted SiO₂.     

Fe+注入植物种子射程实验的Monte-Carlo仿真

研究表明,TRIM程序运算结果与实验测量离子注入种子的射程分布数据相差甚远.本文根据种子微结构的特点,综合考虑多种因素,设计种子微结构模型和运算程序,用Monte-Carlo仿真不同能量（110 keV,20 keV,200 keV）、不同注量（2×10¹⁶ ions·cm^-2,5×10¹⁶ ions·cm^-2,10¹⁷ ions·cm^-2,2×10¹⁷ ions·cm^-2）的Fe⁺注入花生、彩棉、小麦种子的射程分布,结果显示本设计程序仿真的结果与实验测量数据较为吻合.所获得的注入离子与种子微结构相互作用的随机抽样模拟运算方法,为离子注入与生命体相互作用的理论研究提供新的思路.     

铒离子注入绝缘体上Si的射程分布研究

利用离子注入掺杂技术设计、制作半导体集成器件时,了解离子注入半导体材料的射程分布和横向离散规律等是很重要的.用200—500 keV能量的铒(Er)离子注入SOI(silicon-on-insulator,绝缘体上的硅)样品中,利用卢瑟福背散射(RBS)技术研究了剂量为2×1015cm-2的Er离子注入SOI的平均投影射程Rp和射程离散△Rp,把测出的实验值和SRIM软件得到的理论计算值进行了比较,发现平均投影射程Rp的实验值跟理论计算值符合较好,射程离散△Rp的实验值和理论计算值差别大一些.     

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Based on diffuse and drift assumption, a 1-D fluid model of atmospheric pressure oxygen RF discharge was developed. The model includes continuity equations for electrons, positive and negative ions, and energy equation, and Poisson equation for eclectic potential. The finite difference method was adopted to solve the model by numerical simulation. The simulation results show that the electron density and electron temperature were 10¹²cm^-3 and 1.23eV, respectively, and the main negative ion was O^- . As the peak of voltage increased, the electron density and electron temperature increased, however, the ratio of O^-/n_e had a maximum value at 700V.     

大气压射频氧气放电特性的数值模拟研究

基于漂移扩散近似,对大气压下氧气射频放电产生的等离子体建立了一维流体模型,包括了电子、正离子和负离子的连续性方程、电子能量方程及泊松方程。采用有限差分法对所建立的模型进行了自洽的数值模拟,得到了相应的数值结果。通过对所得数值结果的分析,研究了大气压下氧气放电的基本特性。研究表明,大气压氧气放电中等离子体密度可达到10¹²cm^-3 ,电子温度约在1.23eV,放电中主要的负离子是O^-离子;随着电压峰值的增加,电子密度、电子温度都增加,但n_O-/n_e 的比率先增加到7.5%又后减小到5%,在电压峰值为700V 时达到最大。     

VIOLET LIGHT-EMISSION FROM Ge+-IMPLANTED SiO2 FILMS ON Si SUBSTRATE

Germanium ions were implanted into SiO₂ films which were thermally grown on crystalline Si at an energy of 60 keV and with doses of 1×10¹⁵ and 1×10¹⁶ cm^-2.Under an ultraviolet excitation of ～5.0 eV,the implanted f ilms annealed at various temperatures exhibit intense violet luminescence with a peak at 396 nm.It is ascribed to the T₁→S₀ transition in GeO,which was formed during implantation and annealing process.