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依据钨材料表面溅射的实验现象,建立钨材料表面粗糙模型,模拟了高能H+、He+粒子辐照下的钨材料表面的溅射行为过程,并与基于离子输运的双群模型计算得到的结果作了比较。结果表明,随着钨材料表面粗糙程度的增加,溅射率降低;对一定的粗糙表面,相同能量的不同入射粒子,质量越大粒子溅射率越高,这些结果为分析聚变装置中心等离子体杂质水平和评价偏滤器寿命等提供了一定的理论支撑。     

表面粗糙度对面向等离子体钨材料溅射的影响

依据钨材料表面溅射的实验现象,建立钨材料表面粗糙模型,模拟了高能H⁺、He⁺粒子辐照下的钨材料表面的溅射行为过程,并与基于离子输运的双群模型计算得到的结果作了比较。结果表明,随着钨材料表面粗糙程度的增加,溅射率降低;对一定的粗糙表面,相同能量的不同入射粒子,质量越大粒子溅射率越高,这些结果为分析聚变装置中心等离子体杂质水平和评价偏滤器寿命等提供了一定的理论支撑。     

Formation of Charged Particle Tracks in Solids

A criterion for formation of etchable tracks in solids is suggested using the well-known concepts of ionization and thermal spikes, diffusion process with useful and justified assumptions, and present or published experimental and theoretical investigations on the same subject. The suggested criterion is useful for a wide spectrum of researchers including development and applications of track recording materials, ions implantation, sputtering and other areas, which include interactions of charged particles with solids.     

On the use of response surface methodology to predict and interpret the preferred c-axis orientation of sputtered AlN thin films

This paper deals with experimental design applied to response surface methodology (RSM) in order to determine the influence of the discharge conditions on preferred c-axis orientation of sputtered AlN thin films. The thin films have been deposited by DC reactive magnetron sputtering on Si (1 0 0) substrates. The preferred orientation was evaluated using a conventional Bragg-Brentano X-ray diffractometer (θ-2θ) with the CuKα radiation. We have first determined the experimental domain for 3 parameters: sputtering pressure (2-6 mTorr), discharge current (312-438 mA) and nitrogen percentage (17-33%). For the setup of the experimental design we have used a three factors Doehlert matrix which allows the use of the statistical response surface methodology (RSM) in a spherical domain. A four dimensional surface response, which represents the (0 0 0 2) peak height as a function of sputtering pressure, discharge current and nitrogen percentage, was obtained. It has been found that the main interaction affecting the preferential c-axis orientation was the pressure-nitrogen percentage interaction. It has been proved that a Box-Cox transformation is a very useful method to interpret and discuss the experimental results and leads to predictions in good agreement with experiments.     

分子束外延GaN薄膜的X射线光电子能谱和俄歇电子能谱研究

用XPS和AES电子能谱的方法对等离子体辅助分子束外延(MBE)生长的GaN薄膜进行了表面分析和深度剖析.发现红外分子束外延(RFMBE)生长的富镓GaN薄膜实际表面存在O和C吸附层,C主要为物理吸附,而O在GaN表面形成局域化学键产生氧络合物覆盖层,并形成一定的深度分布.杂质O在GaN带隙中导带底形成杂质带同时引入深受主能级,使得带隙变窄室温光吸收谱向低能方向移动,光致发光谱出现宽带发光峰.从而影响GaN薄膜的电学和光学性质 关键词： GaN薄膜 X射线光电子能谱 俄歇电子能谱 表面分析     

Simulation of sputtering from ion-beam-roughened carbon surfaces

Effects of ion-induced surface roughness on sputtering of amorphous carbon under ion bombardment are studied by means of binary-collision computer simulation in a wide range of incidence angles. Most simulations refer to 1–10?keV Ar ion bombardment, and sinusoidal ripple morphology is assumed. It is shown that surface roughness is a key factor to achieve quantitative agreement with experiment. The simulation results are compared with the analytical estimates of the yield from sine-shaped and ridged surfaces based on continuum models of ion sputtering. Some deviations between the results are discussed.     

Anisotropic energy distribution of sputtered atoms induced by low energy heavy ion bombardment

The theory of anisotropic sputtering published in Phys. Rev. B 71(2), 026101 (2005) and Radiat. Effects Defects Solids 159(5), 301 (2004) has been modified and used to calculate the sputtering yield energy distributions for copper, tungsten, and aluminum targets bombarded by low-energy argon ion. As usual, the electronic stopping is ignored in the analysis. The present theory (modified Sigmund’s theory) has been shown to fit the corresponding experimental results of sputtering yield energy distributions well, except for the cases where the larger ion incident angle and larger sputtering emission angles were considered. The larger discrepancy between the present theory and the experimental result in the latter cases is probably due to the influence of direct recoil atoms on the energy spectrum. Compared with Falcone’s analytical theory, the present theory can reproduce much better experimental results of sputtering phenomena. The fact clearly demonstrates the intrinsic relation between the ion–energy dependence of the total sputtering yield and the sputtering yield energy distribution and suggests the great importance of momentum deposited on the target surface in the physical sputtering     

慢正电子束流技术在金属/合金微观缺陷研究中的应用

正电子湮没谱学技术是研究材料微观结构非常有效的一种核谱学分析方法, 主要用于获取材料内部微观结构的分布信息, 特别是微观缺陷结构及其特性等传统表征方法难以获取的微观结构信息. 近年来, 在慢正电子束流技术快速发展的基础上, 正电子湮没谱学技术在薄膜材料表面和界面微观结构的研究中得到了广泛应用. 特别是该技术对空位型缺陷的高灵敏表征能力, 使其在金属/合金材料表面微观缺陷的形成机理、缺陷结构特性及其演化行为等研究方面具有独特的优势. 针对材料内部微观缺陷的形成、演化机理以及缺陷特性的研究, 如缺陷的微观结构、化学环境、电子密度和动量分布等, 正电子湮没谱学测量方法和表征分析技术已经发展成熟. 而能量连续可调的低能正电子束流, 进一步实现了薄膜材料表面微观结构深度分布信息的实验表征. 本文综述了慢正电子束流技术应用研究的最新进展, 主要围绕北京慢正电子束流装置在金属/合金材料微观缺陷的研究中对微观缺陷特性的表征和表面微观缺陷演化行为的应用研究成果展开论述.     

The influence of surface diffusion on the results of surface analysis — a model calculation

The influence of surface diffusion on some results of surface-analytical methods using sputtering is investigated by computer simulation of the combined effect of sputtering and surface diffusion on a model “crystal” consisting of one monolayer of some species on top of a semiinfinite inert matrix. The computations show that surface diffusion is able to cause erroneous results under “typical” experimental conditions. Criteria are given to avoid such errors. A comparison with the results of an experiment on surface diffusion shows that heavy sputtering increases the surface diffusion coefficient by 2 to 3 orders of magnitude.     

Surface engineering with ion beams: from self-organized nanostructures to ultra-smooth surfaces

Low-energy ion-beam sputtering, i.e. the removal of atoms from a surface due to the impact of energetic ions or atoms, is an inherent part of numerous surface processing techniques. Besides the actual removal of material, this surface erosion process often results in a pronounced alteration of the surface topography. Under certain conditions, sputtering results in the formation of well-ordered patterns. This self-organized pattern formation is related to a surface instability between curvature-dependent sputtering that roughens the surface and smoothing by different surface relaxation mechanisms. If the evolution of surface topography is dominated by relaxation mechanisms, surface smoothing can occur. In this presentation the current status of self-organized pattern formation and surface smoothing by low-energy ion-beam erosion of Si and Ge is summarized. In detail it will be shown that a multitude of patterns as well as ultra-smooth surfaces can develop, particularly on Si surfaces. Additionally, the most important experimental parameters that control these processes are discussed. Finally, examples are given for the application of low-energy ion beams as a novel approach for passive optical device engineering for many advanced optical applications. PACS 81.16.Dn; 81.16.Rf; 81.65.Cf; 81.65.Ps; 68.35.Ct     

磁控溅射Al膜的AFM性能分析及其制备工艺研究

用原子力显微镜(AFM)对直流溅射和射频溅射制备铝膜的表面粗糙度及颗粒大小进行了分析比较.实验结果表明:溅射功率和溅射时间对铝膜表面粗糙度有影响,通过延长溅射时间或提高溅射功率可使膜的平均颗粒直径增大.     

Effect of temperature on the sputtering yield of copper

The effect of temperature on the sputtering yield of copper for low energy argon ion bombardment is investigated. Experimentally, a phase sensitive technique utilizing the spectroscopic emission of sputtered particles is discussed. Analytically, the Langberg model for the sputtering yield is expanded to include the effect of temperature. Atoms of the bombarded surface attain a steady state distribution in the number of their bonds. Changes in either the temperature or the bombardment parameters result in changes in the distribution leading to variations in the sputtering yield. (111) and (110) single crystal and poly crystalline copper surfaces are investigated. Reasonable agreement is obtained between experimental and analytic yield values. The (111) surface shows the largest decrease in yield with an increase in temperature.     

采用双层靶提高激光薄膜相互作用中加速质子的产额

 在激光等离子体相互作用实验中测量到的加速质子,来源于薄膜靶表面的碳氢沾染物。为了提供稳定充足的质子源,设计一种新的复合靶,在2.5 μm塑料溅射200 nm 金薄层形成双层靶,并在中等强度激光功率密度下开展研究,采用磁谱仪和CR-39探测器测量得到其能谱,结果表明：双层靶结构能够有效地增加质子的产额,并可能改善加速质子束的单能性。     

溅射气压对非晶Hg1-xCdx Te薄膜微观结构和化学组分的影响（英文）

采用射频磁控溅射制备了非晶态结构的Hg1-xCdxTe薄膜,并利用台阶仪、XRD、原子力显微镜、EDS等分析手段对薄膜生长速率、物相、表面形貌、组分比例进行了研究。实验结果表明,溅射气压对薄膜生长速率、微观结构、表面形貌和化学组分有直接影响。随着溅射气压增大,其生长速率逐渐降低。当溅射气压高于1.1 Pa时,薄膜XRD图谱上没有出现任何特征衍射峰,只是在2θ=23°附近出现衍射波包,具有明显的非晶态特征;当溅射气压小于1.1 Pa时,XRD谱表现为多晶结构。另外,随着溅射气压的增加,薄膜表面粗糙度逐渐减小,而且溅射气压对薄膜组成的化学计量比有明显影响,当溅射气压为1.1 Pa时,薄膜中Hg的组分比最低,而Cd组分比最高。     

Simulation of boron nitride sputtering process and its comparisonwith experimental data

In the paper, TRIM and TRIDYN simulation codes were used to simulate the sputtering processes of boron nitride (BN) films during bombardment of ions. The TRIM and TRIDYN codes are applicable to the simulation of sputtering processes of different target materials with amorphous and polycrystalline structure. The results of the simulations are compared with experimental data. The sputtering experiments of polycrystalline hexagonal BN (h-BN) and cubic BN (c-BN) films were performed in a Commonwealth Scientific Corporation (CSC) 38-cm ion beam source device. The comparison of calculated and experimental results indicated that a) the experimental sputtering yields of h-BN and c-BN films bombarded with Ar⁺ ions versus the angle of incidence are in reasonable agreement with the calculated results; b) the sputtering yields of h-BN and c-BN bombarded with Ar⁺ are nearly of the same values versus the angle of incidence-preferential sputtering of h-BN was not found; c) the calculated sputtering. Yields of BN as a function of Ar⁺ ion energy are very sensitive to values of the surface binding energy (SEE); and d) surface binding energy between 2 and 3 eV for BN appears to be reasonable for the simulation of sputtering process of h-BN and c-BN films     

溅射功率对Mo薄膜微结构和性能的影响

 实验采用直流磁控溅射沉积技术在不同溅射功率下制备Mo膜,研究了不同溅射功率下Mo膜的沉积速率、表面形貌及晶型结构,并对其晶粒尺寸和应力进行了研究。利用原子力显微镜观察样品的表面形貌发现随着溅射功率的增加,薄膜表面粗糙度逐渐增大。X射线衍射分析表明薄膜呈立方多晶结构,晶粒尺寸为14.1～17.9 nm;应力先随溅射功率的增大而增大,在40 W时达到最大值(2.383 GPa),后随溅射功率的增大有所减小。     

Self-sputtering and reflection

Selfsputtering and reflection are investigated with the Monte Carlo program TRIMSP. The results include particle and energy reflection coefficients, sputtering yields and sputtered energy versus incident angle and energy. Angular and energy distributions of reflected and sputtered particles are also given. Reflection and sputtering values are compared to show their contributions to selfsputtering. A comparison of calculated sputtering yields and sputtering efficiencies (sputtered and reflected energy) with experimental data is carried out. The systems investigated are mainly the bombardement of C, Ni, and W with self-ions at low energies. All global results are summarized in graphs, where scaling properties are utilized including the sputtering yield in a generalized form.     

直流磁控溅射制备AlN薄膜的结构和表面粗糙度

采用直流磁控反应溅射法,在Si(111)基底上成功制备了多晶六方相AlN薄膜.研究了溅射过程中溅射气压对薄膜结构和表面粗糙度的影响.结果表明:当溅射气压低于0.6 Pa时,薄膜为非晶态,在傅里叶变换红外光谱中,没有明显的吸收峰;当溅射气压不低于0.6 Pa时,薄膜的X射线衍射图中均出现了六方相的AlN(100)、(11...     

Model calculation of ion collection in the presence of sputtering

This paper presents a zero order approximation of ion collection during sputtering. Neglecting diffusion, range shortening and knock-on effects and assuming a constant sputtering yield general analytical results are developed which allow a comparison with experimental data. The accumulation of implantation profiles and the build-up of surface concentrations and collected quantities are described in detail for Gaussian range distributions. A thorough discussion of available experimental results indicates that the model is suitable for a variety of projectile-target combinations, in particular for medium mass noble gas atoms collected in high melting point targets. Application to sputtering experiments presents further evidence of a strong fluence dependence of the silicon sputtering yield. Some comments are devoted to recently reported analytical and numerical treatments of ion collection during sputtering.     

离子束溅射致Si(110)表面形貌随样品温度变化的演化

本文研究了离子能量为1.5keV、束流密度为20?A/cm2正入射Ar+离子束溅射致Si(110)表面形貌随样品温度变化的演化过程。在温度自室温上升至 800?C的过程中, Si(110) 的表面形貌由不规则的纳米点和纳米孔图案变为密集的量子点阵列，同时表面粗糙度也随温度上升不断增加。被通常采用的 Bradley-Harper 模型无法解释上述实验数据。 在考虑溅射过程中存在Ehrlich-Schwoebel 效应后, 进行了已连续动态模型为基础的理论模拟，模拟工作很好的重复了实验结果。