Sputtering of highly oriented pyrolytic graphite with 30 keV Argon ions

The influence of the incidence angle of 30 keV Ar⁺ ions, ion fluence and target temperature on the sputtering yield and surface microgeometry of highly oriented pyrolytic graphite (UPV-1T) samples was experimentally studied. It was found that at fluences more than 5 × 10¹⁹ ion cm^?2 the sputtering yield at room temperature in the range of the ion incidence angle from 0° to 80° is twice as small as the corresponding experimental data for both polycrystalline graphite and glassy carbon. The analysis of ion-induced relief permits us to suppose the topographical suppression mechanism of highly oriented pyrolytic graphite sputtering.     

Sputtering of A 3 B 5 materials (GaP, GaAs, GaSb, InP, and InSb) by 2-to 14-keV N 2 + ions

Investigations of the general characteristics and distinctive features of sputtering of A ³ B ⁵ materials (GaP, GaAs, GaSb, InP and InSb) under bombardment with N ₂ ⁺ ions have been carried out. From the experimental data, dependences of the sputtering yield of these materials on the incidence angle and ion energy have been obtained and the surface relief patterns produced by target etching have been studied. It has been shown that the dependence on energy of the sputtering yield for GaP, GaAs, and InP can be adequately described by the Haffa-Switkovski formula for binary materials and Yudin’s approximation for elemental targets. Sputtering of GaSb and InSb proceeds in the surface layer recrystallization mode, and the sputtering yield agrees with calculations based on Onderlinden’s model. From a comparison of the experimental and calculated dependences, the surface bonding energies have been determined.     

物理溅射的Monte Carlo模拟

模拟载能离子在固体传输及原子碰撞级联过程的Monte Carlo程序TCIS,已用于考察物理溅射问题。溅射过程中,低能原子碰撞是很重要的。因此,本文详细研究了二体碰撞计算中时间积分τ的数值大小及其对溅射计算的影响。对TCIS模拟溅射物理模型、输入参数作了介绍,并给出某些模拟研究结果。模拟程序可提供溅射的原子水平的信息,这对于开展有关机理的研究是很有用的。     

Artifacts in the sputtering of inorganics by C60

In the present study, the basic issues in C₆₀ⁿ⁺ sputtering are studied using silicon, gold and platinum samples. Sputtering yields are measured for energies in the range of 5-30 keV, by sputtering micrometre sized craters on the surface of flat clean samples and measuring their volumes using atomic force microscopy (AFM). Net deposition of carbon occurs for all three materials at 5 keV, and is not specific to silicon which forms a carbide. The threshold energy for net sputtering is dependent on the sputtering yield and the stopping power of the substrate. Away from the threshold, the sputtering yields agree well with Sigmund and Claussen's thermal spike model after allowance for the sputtering of the deposited carbon atoms. AFM images show the formation of unusual surface topography around the transition region between sputtering and deposition. Analysis of the bottom of a crater using imaging SIMS shows a significant enhancement of carbon clusters as well as various silicon-carbon groups, indicating the importance of carbon deposition and implantation in a gradual mixed layer formed from sputtering. The thickness of this interface layer is shown to be approximately 5 nm.     

Laser-induced sputtering of ZnO,TiO2, CdSe and GaP near threshold laser fluence

Sputtering of ZnO, TiO₂, CdSe and GaP induced by 10 ns laser pulses from a tunable dye laser has been investigated. It is shown that all of these materials exhibit the following characteristics: (1) non-linear dependence of sputtering yield on the excitation laser fluence, (2) existence of the threshold laser fluence, (3) dependence of the threshold laser fluence on laser wavelength, and (4) non-Maxwellian velocity distribution of sputtered particles. These results indicate that the laser-induced sputtering near threshold fluences is not a thermal effect but an effect of dense electron-hole plasma.     

Sputtering of AlxGa1−x As semiconductor targets by Ar+ ions with energies of 2–14 keV

Investigations of the sputtering of Al_xGa_1−x As semiconductor solid solutions by Ar⁺ ions with energies of 2–14 keV are performed. The dependence of the sputtering yield on the energy and angle of incidence of the ions are determined and the character of the surface relief formed during the sputtering is investigated. A comparison with theory shows that the best agreement between theory and experiment is achieved when the Haff-Switkowski formula is used together with Yudin’s stopping cross section. It is shown that the surface binding energies obtained differ from the atomization energies by an amount approximately equal to the amorphization energy. Zh. Tekh. Fiz. 67, 113–117 (June 1997)     

BaF2晶体的取向和入射束的剂量对溅射的影响

２７ｋｅＶ Ａｒ^＋离子束沿法向分别入射在ＢａＦ₂单晶（１１１），（１００）和（１１０）的晶面上，用捕获器方法和Ｒｕｔｈｅｒｆｏｒｄ背散射分析法测定了Ｂａ原子的溅射角分布和溅射产额。结果发现不同取向的晶体表面，它们的溅射产额有明显差异。当用剂量为５×１０¹⁷ｉｏｎ／ｃｍ²的Ａｒ^＋离子分别轰击这三种晶面时，其溅射产额的顺序Ｙ_１００＞ｙ_１１１＞ｙ_１１０．对已被上述剂量辐照过的晶面再作相同剂量轰击时，测得的溅射产额明显增大。这些结果被认为是由于在离子辐照过程中表面晶格受损逐步增大所致。 关键词：     

Thermal desorption spectroscopy of he from Ni at and below saturation

Trapping of helium after implantation at energies of 8 to 150 keV and fluences up to 10¹⁹ He-ions/cm² in nickel at room temperature is studied by measuring the thermal desorption spectra during linear heating up to 1000°C. At several annealing stages the trapped helium is measured by means of the nuclear reaction ³He(d, α)H and the target surface is observed by laser scattering and with the scanning electron microscope.

The thermal desorption spectra depend strongly on the implantation fluence but only slightly on the implantation energy, indicating a similar trapping of He in the lattice for the implantation energies used here, The temperature at which desorption starts decreases with increasing fluence. Above the critical fluence for blistering an additional low temperature (150°C) desorption maximum is found.

The desorption peak at 150°C can be approximated theoretically with a single jump desorption process of first order and a Gaussian distribution of activation energies around 1 eV. The measurements indicate that at higher temperatures (>300°C) helium desorption is partly due to the opening of helium bubbles at the target surface.     

Step edge sputtering yield at grazing incidence ion bombardment

The surface morphology of Pt(111) was investigated by scanning tunneling microscopy after 5 keV Ar+ ion bombardment at grazing incidence in dependence of the ion fluence and in the temperature range between 625 and 720 K. The average erosion rate was found to be strongly dependent on the ion fluence and the substrate temperature during bombardment. This dependence is traced back to the variation of step concentration with temperature and fluence. We develop a simple model allowing us to determine separately the constant sputtering yields for terraces and for impact area stripes in front of ascending steps. The experimentally determined yield of these stripes--the step-edge sputtering yield--is in excellent agreement with our molecular dynamics simulations performed for the experimental situation.     

Experiments on the sputtering of neutral Cu2 dimers from Cu by Ar+ ions (60–300 eV)

A planar polycrystalline copper target was bombarded normally by Ar⁺ ions with energies ranging from 60 to 300 eV. in the source of a mass spectrometer. The neutral particles sputtered normally from the target were post-ionized and analyzed in the mass spectrometer. A thermionically sustained, magnetically confined low pressure arc plasma was used to supply the bombarding ions, and for post-ionization of the neutral sputtered species. It was found that the relative yields of the sputtered neutral post-ionized Cu₂ dimers are linearly proportional to S², where S is the total sputtering yield for Ar⁺ -Cu. The results support the recombination model for the formation of neutral dimers in sputtering.     

Catastrophic sputtering of sulfur by helium

The sputtering yield of sulfur by 30-300 keV ⁴He+ at 20°C was found to be of the order of 10⁴-10⁶ sulfur atoms per incident ⁴He, dependent on the energy and total implanted fluence, and independent of the ion flux onto the target. This effect may be explained by a weakening of the van der Vaals binding between the S₈ rings due to Coulomb repulsion in the homogeneously charged volume, after a sufficient charge has accumulated in the highly insolating sample. Sulfur emission continues even for some time after the beam is switched off, and emission of sulfur atoms is also observed from non-irradiated areas adjacent to the irradiated spot, even from the rear side of 2-mm thick sulfur targets.     

Model calculation of ion collection in the presence of sputtering

This paper presents a zero order approximation of ion collection during sputtering. Neglecting diffusion, range shortening and knock-on effects and assuming a constant sputtering yield general analytical results are developed which allow a comparison with experimental data. The accumulation of implantation profiles and the build-up of surface concentrations and collected quantities are described in detail for Gaussian range distributions. A thorough discussion of available experimental results indicates that the model is suitable for a variety of projectile-target combinations, in particular for medium mass noble gas atoms collected in high melting point targets. Application to sputtering experiments presents further evidence of a strong fluence dependence of the silicon sputtering yield. Some comments are devoted to recently reported analytical and numerical treatments of ion collection during sputtering.     

Ar离子辐照非晶态合金表面发泡和针孔形成研究

150keV和195keVAr离子室温下辐照非晶态合金(Co₉₄Fe₄Cr₂)₇₈Si₈B₁₄,表表面发泡和溅射腐蚀是两种主要的表面损伤过程.针孔出现较表面发泡要晚,它的密度随剂量增加迅速地增加,并且在一定的辐照剂量时趋向饱和,这时,一种多孔粗糙的表面损伤结构形成.针孔的形成影响了表面发泡,导致了发泡密度随剂量增加急剧地减小.用溅射和气泡破裂解释了针孔形成和在高剂量时趋向饱和的原因.     

Sputtering yield of chromium by argon and xenon ions with energies from 50 to 500 eV

A radioactive tracer technique is described for the quantitative measurement of the sputtering yield of a target material electroplated on a copper substrate. Sputtering yields of chromium by argon and xenon ions with energies from 50 to 500 eV are reported. The ion beams, having a current density ranging from 0.01 to 0.1 mA/cm² at an operating pressure of 2×10^–5 Torr, were produced by a low-energy ion gun. The sputtered atoms were collected on an aluminum foil surrounding the target. ⁵¹Cr was used as the tracer isotope. The results indicate that the radioactive tracer technique is sensitive enough in measuring the extremely small amount of sputtered material at low ion currents and low ion energies.     

离子轰击引起的表面形貌对Ag的溅射产额的影响

用捕获膜技术和卢瑟福背散射(RBS)谱仪测定Ag靶在27keV Ar⁺离子轰击下的溅射原子角分布,从而确定不同剂量下Ag的溅射产额,并对其靶点表面形貌进行扫描电子显微镜(SEM)观察。结果发现,所有的角分布都呈over-cosine形状,但其溅射产额却随着表面形貌不同而不同。根据溅射产额Y与轰击离子入射角φ变化关系,讨论不同轰击剂量下溅射产额的差别,肯定了表面形貌是影响溅射产额的一个重要因素,并由此提出“表观产额”的新概念。 关键词：     

Implications in the use of sputtering for layer removal: the system Au on Si

Au films deposited on Si substrates have been sputtered by 20 and 100 keV Ar bombardment, respectively. Bombardment-induced intermixing of Au and Si was observed at film thicknesses considerably larger than the projectile range. Due to radiation-enhanced diffusion, the partial sputtering yield of Au from Si-Au alloys decreases with increasing fluence. Complete removal of Au from Si is impossible if Ar ions are used for sputtering.     

Radiation effects and pulsed laser deposition of titanium by Nd:Yag laser

A study of Ti laser irradiation and thin film deposition produced by an Nd:Yag pulsed laser is presented. The laser pulse, 9?ns width, has a power density of the order of 10¹⁰?W/cm². The titanium etching rate is of the order of 1?µg/pulse, it increases with the laser fluence and shows a threshold value at about 30?J/cm² laser fluence. The angular distribution of ejected atoms (neutrals and ions) is peaked along the normal of the target surface. At high fluence, the fractional ionization of the plasma produced by the laser is of the order of 10%. Time-of-flight measurements demonstrate that the titanium ions, at high laser fluence, may reach kinetic energies of about 1?keV. Obtained results can be employed to produce energetic titanium ions, to produce coverage of thin films of titanium and to realize high adherent titanium-substrate interfaces. The obtained results can be employed to produce energetic titanium ions, to produce a coverage of thin titanium films on polymers, and to realize highly adherent titanium–substrate interfaces.     

On the theory of laser sputtering through pairing of holes in compound semiconductors

A simple kinetic model is used to explain the observed dependence of the sputtering quantum yield on the laser fluence. The mechanism of sputtering presented here involves pairing of two holes against their repulsive Coulomb barrier, which depends on the concentration of photoexcited charge carriers through Debye screening. A threshold laser fluence is obtained at a concentration of photoexcited charge carriers that suppresses the barrier sufficiently to allow the pairing of holes at the surface bonds. The bonds are broken and atoms are ejected from the surface. The temperature dependence of the threshold laser fluence is discussed. Results agree qualitatively with experiments and existing theories.On leave of absence from: Institute of Solid State Physics, Bulgarian Academy of Sciences, 72 Lenin Boulevard, BG-1784 Sofia, Bulgaria     

Analyses of surface coloration on TiO2 film irradiated with excimer laser

TiO₂ film of around 850 nm in thickness was deposited on a soda-lime glass by PVD sputtering and irradiated using one pulse of krypton-fluorine (KrF) excimer laser (wavelength of 248 nm and pulse duration of 25 ns) with varying fluence. The color of the irradiated area became darker with increasing laser fluence. Irradiated surfaces were characterized using optical microscopy, scanning electron microscopy, Raman spectroscopy and atomic force microscopy. Surface undergoes thermal annealing at low laser fluence of 400 and 590 mJ/cm². Microcracks at medium laser fluence of 1000 mJ/cm² are attributed to surface melting and solidification. Hydrodynamic ablation is proposed to explain the formation of micropores and networks at higher laser fluence of 1100 and 1200 mJ/cm². The darkening effect is explained in terms of trapping of light in the surface defects formed rather than anatase to rutile phase transformation as reported by others. Controlled darkening of TiO₂ film might be used for adjustable filters.     

Laser-assisted growth of gold nanoparticles: Shaping and optical characterization

We demonstrate that supported gold nanoparticles with a given well-defined shape can be produced by laser-assisted growth. For this purpose, gold nanoparticles with average radii ranging from 1.5 to 13 nm, i.e., coverage between 0.45 × 10¹⁶ and 5.6 × 10¹⁶ atoms/cm², were prepared at room temperature by self-assembly of atoms deposited on quartz and sapphire substrates. For analysis of the samples, the optical spectra of the particles were measured with p-polarized light and photon energies in the range of 1.3 to 3.1 eV. Irradiating the particles during growth with laser light of different wavelengths to stimulate surface plasmon excitation made it possible to stabilize mean axial ratios between 0.19 and 0.98. The influence of the laser fluence on the shape of the nanoparticles was also investigated and shows that the position of the surface plasmon resonance shifts to higher energies as the fluence rises. Optimum growth conditions to shape gold nanoparticles with axial ratios close to unity (spheres) with a relatively low laser fluence of 60 ± 5 mJ/cm² have also been found. The results of our experiments show that laser-assisted growth is a powerfultechnique to control the shape of nanoparticles.