Curing kinetics and thermal stability of diglycidyl ether of bisphenol

Curing kinetics of diglycidyl ether of bisphenol-A (DGEBA) in the presence of varying molar ratios of aromatic imide-amines and 4,4′-diaminodiphenylsulfone (DDS) were investigated by the dynamic differential scanning calorimetry. The imide-amines were prepared by reacting 1 mole of benzophenone 3,3′,4,4′-tetracarboxylic acid dianhydride (B) with 2.5 moles of 4,4′-diaminodiphenyl ether (E)/ or 4,4′-diaminodiphenyl methane (M)/ or 4,4′-diaminodiphenylsulfone (S) and designated as BE/ or BM/ or BS. The mixture of imide-amines and DDS at ratio of 0:1, 0.25:0.75, 0.5:0.5, 0.75:0.25 and 1:0 were used to investigate the curing behaviour of DGEBA. The multiple heating rate method (5, 10, 15 and 20°C min⁻¹) was used to study the curing kinetics of epoxy resins. The peak exotherm temperature was found to be dependent on the heating rate, structure of imide-amines as well as on the ratio of imide-amine: DDS used. A broad exotherm was observed in the temperature range of 180–230°C on curing with mixture of imide-amines and DDS. Curing of DGEBA with mixture of imide-amines and/or DDS resulted in a decrease in characteristic curing temperatures. Activation energy of curing reaction as determined in accordance to the Ozawa’s method was found to be dependent on the structure of amine. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere. The char yield was highest in case of resins cured using mixture of DDS: BS (0.25:0.75; EBS-3), DDS: BM (0.5: 0.5; EBM-2) and DDS: BE (0.5: 0.5; EBE-2).     

Curing and thermal behaviour of epoxy resin in the presence of a mixture of imide-amines

The curing behaviour of diglycidyl ether of bisphenol-A (DGEBA) was investigated by the dynamic differential scanning calorimetry using varying molar ratios of aromatic imide-amines and 4,4′-diaminodiphenylsulfone (DDS). The imide-amines were prepared by reacting 1 mole of naphthalene 1,4,5,8-tetracarboxylic dianhydride (N) and 4,4′-oxodiphthalic anhydride (O) with 2.5 moles of 4,4′-diaminodiphenyl ether (E) or 4,4′-diaminodiphenyl methane (M) or 4,4′-diaminodiphenylsulfone (S) and designated as NE/OE or NM/OM or NS/OS. The mixture of the imide-amines and DDS at ratio of 0:1, 0.25:0.75, 0.5:0.5, 0.75:0.25 and 1:0 were used to investigate the curing behaviour of DGEBA. A single exotherm was observed on curing with mixture of imide-amines and DDS. This clearly shows that the two amines act as co-curing agents. Curing temperatures were higher with imide-amines having sulfone linkage irrespective of anhydride. Curing of DGEBA with mixture of imide-amines and or DDS resulted in a decrease in characteristic curing temperatures. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere. The char yield was higher in case of resins cured imide-amines based on N and E. The activation energy of decomposition and integral procedural decomposition temperature were also calculated from the TG data.     

Studies on the curing kinetics of epoxy resins using mixture of nadic/or maleic anhydride and 4,4′-diaminodiphenyl sulfone

Curing kinetics of diglycidyl ether of bisphenol-A (DGEBA) in the presence of maleic anhydride (MA)/or nadic anhydride (NA) or mixture of MA/NA: 4,4′-diaminodiphenyl sulfone (DDS) in varying molar ratios were investigated using differential scanning calorimetry. Curing behaviour of DGEBA in the presence of varying amounts of DDS:MA/NA was evaluated by recording DSC scans at heating rates of 5, 10, 15 and 20°C min⁻¹. The peak exotherm temperature depends on the heating rate, structure of the anhydride as well as on the ratio of anhydride: DDS. Thermal stability of the isothermally cured resins was evaluated by thermogravimetry. The char yield was highest in case of resins cured using mixture of DDS:MA (0.75:0.25; sample EM-1) and DDS:NA (0.75:0.25, sample EN-1).     

Curing and thermal behaviour of DGEBA using mixture of biuret and 4,4′-diaminodiphenylsulfone

Curing behaviour of DGEBA was investigated in the presence of varying molar ratio of biuret and 4,4′-diaminodiphenylsulfone (DDS) by means of Differential scanning calorimetery. The multiple heating rate method (5, 10, 15 and 20 °C min⁻¹) was used to study the curing behaviour of epoxy resins. The peak exotherm temperature was found to be dependent on the heating rates, structure of biuret as well as on the ratios of biuret:DDS used. Ozawa method was used for calculating the activation energy of curing reaction. The thermal stability of the isothermally cured resins was evaluated by recording the thermogravimetric traces in nitrogen atmosphere. All the samples were stable up to 330 °C.     

A Well-Defined Cyclotriphosphazene-Based Epoxy Monomer and Its Application as A Novel Epoxy Resin: Synthesis,Curing Behaviors,and Flame Retardancy

Abstract

A novel cyclotriphosphazene-based epoxy monomer, hexa-[4-(glycidyloxycarbonyl) phenoxy]cyclotriphosphazene (HGCP), was synthesized via a four-step synthetic route, and fully characterized by ¹H, ¹³C, and ³¹P NMR spectroscopy, high-resolution mass spectrometry, and elemental analysis. Thermosetting systems based on HGCP with three curing agents, for example, 4,4′-diaminodiphenylsulfone (DDS), 4,4′-diaminodiphenylmethane (DDM), and dicyandiamide (DICY), were used for making a comparison of their thermal curing behaviors. The curing behaviors were measured by differential scanning calorimetry. Moreover, flame retardancy of HGCP thermosetting systems was estimated by Limiting Oxygen Index (LOI) and Vertical Burning Test (UL-94). The resulting HGCP thermosetting systems exhibited better flame retardancy than the common epoxy resins diglycidyl ether of bisphenol A (DGEBA) and the regular brominated bisphenol A epoxy resin (TBBA) cured by DDS, respectively. When HGCP was cured by DDS, its thermosetting system gave the most char residues, met the UL-94 V-0 classification, and had a limiting oxygen index value greater than 35.     

Organic/inorganic hybrid epoxy nanocomposites based on octa(aminophenyl)silsesquioxane

Octa(aminophenyl)silsesquioxane (OAPS) was used as the curing agent of diglycidyl ether of bisphenol-A (DGEBA) epoxy resin. A study on comparison of DGEBA/OAPS with DGEBA/4,4′-diaminodiphenyl sulfone (DDS) epoxy resins was achieved. Differential scanning calorimetry was used to investigate the curing reaction and its kinetics, and the glass transition of DGEBA/OAPS. Thermogravimetric analysis was used to investigate thermal decomposition of the two kinds of epoxy resins. The reactions between amino groups and epoxy groups were investigated using Fourier transform infrared spectroscopy. Scanning electron microscopy was used to observe morphology of the two epoxy resins. The results indicated that OAPS had very good compatibility with DGEBA in molecular level, and could form a transparent DGEBA/OAPS resin. The curing reaction of the DGEBA/OAPS prepolymer could occur under low temperatures compared with DGEBA/DDS. The DGEBA/OAPS resin didn’t exhibit glass transition, but the DGEBA/DDS did, which meant that the large cage structure of OAPS limited the motion of chains between the cross-linking points. Measurements of the contact angle indicated that the DGEBA/OAPS showed larger angles with water than the DGEBA/DDS resin. Thermogravimetric analysis indicated that the incorporation of OAPS into epoxy system resulted in low mass loss rate and high char yield, but its initial decomposition temperature seemed to be lowered.     

Flame‐retardant epoxy resins with high glass‐transition temperatures. II. Using a novel hexafunctional curing agent: 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane

We synthesized a novel phosphorus‐containing triamine [9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane (dopo‐ta)] from the nucleophilic addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and pararosaniline chloride, using triethylamine as an acid receiver. We confirmed the structure of dopo‐ta by IR, mass, and NMR spectra and elemental analysis. dopo‐ta served as a curing agent for diglycidyl ether of bisphenol A (DGEBA) and dicyclopentadiene epoxy (hp7200). Properties such as the glass‐transition temperature (T_g), thermal decomposition temperature, flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The T_g's of cured DGEBA/dopo‐ta and hp7200/dopo‐ta were 171 and 190 °C, respectively. This high T_g phenomenon is rarely seen in the literature after the introduction of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.80 wt % for DGEBA/dopo‐ta/diamino diphenylmethane (DDM) systems and 1.46 wt % for hp7200/dopo‐ta/DDM systems. The dielectric constants for DGEBA/dopo‐ta and hp7200/dopo‐ta were 2.91 and 2.82, respectively, implying that the dopo‐ta curing systems exhibited low dielectric properties. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5971–5986, 2005     

The non-halogen flame retardant epoxy resin based on a novel compound with phosphaphenanthrene and cyclotriphosphazene double functional groups

A novel flame retardant additive hexa-(phosphaphenanthrene -hydroxyl-methyl-phenoxyl)-cyclotriphosphazene (HAP-DOPO) with phosphazene and phosphaphenanthrene double functional groups has been synthesized from hexa-chloro-cyclotriphosphazene, 4-hydroxy-benzaldehyde and 9,10-dihydro-9-oxa-10- phosphaphenanthrene 10-oxide(DOPO). The structure of HAP-DOPO was characterized by Fourier transformed infrared (FT-IR) spectroscopy and ¹H nuclear magnetic resonance (¹H NMR) and ³¹P nuclear magnetic resonance (³¹P NMR). The additive HAP-DOPO was blended into diglycidyl ether of bisphenol-A (DGEBA) to prepare flame retardant epoxy resins. The flame retardant properties and thermal properties of the epoxy resins cured by 4, 4′-Diamino-diphenyl sulfone (DDS) were investigated from the differential scanning calorimeter (DSC), the thermogravimetric analysis (TGA), UL94 test, the limiting oxygen index (LOI) test and Cone calorimeter. Compared to traditional DOPO-DGEBA and ODOPB-DGEBA thermosets, the HAP-DOPO/DGEBA thermosets have higher T_gs at the same UL94 V-0 flammability rating for their higher crosslinking density and have higher char yield and lower pk-HRR at same 1.2 wt.% phosphorus content which confirm that HAP-DOPO has higher flame retardant efficiency on thermosets. The scanning electron microscopy (SEM) results shows that HAP-DOPO in DGEBA/DDS system obviously accelerate formation of the sealing, stronger and phosphorus-rich char layer to improve flame retardant properties of matrix during combustion.     

A Study on the Influence of the Temperature on the Formation of Cardanol‐Based Phenolic Resin

A kinetic study of the reaction of cardanol and maleic anhydride (MA) (mole ratios 1:0.25, 1:0.5, 1:0.75, 1:1) was carried out at five different temperatures ranging between 160 and 180°C with an interval of 5°C using paratoluene sulfonic acid (PTSA) as a catalyst. The acid values of the samples were checked at a regular time intervals to check the percentage of the completion of the reaction. The influence of the condensation temperature on the synthesized resins was studied using infrared spectroscopic analysis. The reaction between cardanol and MA was found to obey first‐order rate kinetics. The specific rate constant (k) calculated by regression analysis was found to obey the Arrhenius expression. The thermodynamic parameters such as activation energy (E_a), frequency factor (Z), entropy (∆S), enthalpy (∆H), and free energy (∆G) were calculated. It was found that the reaction was spontaneous and irreversible. The experimental results were explained by proposing a reaction mechanism and deriving the rate equation.     

High resolution solid‐state 13C‐NMR study of as‐cured and irradiated epoxy resins

This article presents the effects of strong ionizing radiations on the physico‐chemical modifications of aliphatic or aromatic amine‐cured epoxy resins based on diglycidyl ether of bisphenol A (DGEBA). Such epoxy resins have a considerable number of applications in the nuclear industrial field and are known to be very stable under moderate irradiation conditions. Using extensively high resolution solid‐state ¹³C‐NMR spectroscopy we show that the aliphatic amine‐cured resin (DGEBA‐TETA) appears much more sensitive to gamma rays than the aromatic amine‐cured one (DGEBA‐DDM). On the one hand, qualitative analyses of the high resolution solid‐state ¹³C‐NMR spectra of both epoxy resins, irradiated under similar conditions (8.5 MGy), reveal almost no change in the aromatic amine‐cured resin whereas new resonances are observed for the aliphatic amine‐cured resin. These new peaks were interpreted as the formation of new functional groups such as amides, acids and/or esters and to alkene groups probably formed in the aliphatic amine skeleton. On the other hand, molecular dynamics of these polymers are investigated by measuring the relaxation times, T_CH, T_1ρH and T_1C , before and after irradiation. The study of relaxation data shows the formation, under irradiation, of a more rigid network, especially for the aliphatic amine‐cured system and confirms that aromatic amine‐cured resin [DGEBA‐4,4′‐diaminodiphenylmethane(DDM)] is much less affected by ionizing radiations than the aliphatic amine‐cured resin [DGEBA‐triethylenetetramine(TETA)]. Moreover, it has been shown that the molecular modifications generated by irradiation on the powder of the aliphatic‐amine‐cured resin appear to be homogeneously distributed inside the polymers as no phase separations can be deduced from the above analyses. Copyright © 2001 John Wiley & Sons, Ltd.     

Synthesis and characterization of liquid‐crystalline epoxy and its blend with conventional epoxy

Terephthaloyl chloride was reacted with 4‐hydroxy benzoic acid to get terephthaloylbis(4‐oxybenzoic) acid, which was characterized and further reacted with epoxy resin [diglycidyl ether of bisphenol A (DGEBA)] to get a liquid‐crystalline epoxy resin (LCEP). This LCEP was characterized by Fourier transform infrared spectrometry, ¹H and ¹³C NMR spectroscopy, differential scanning calorimetry (DSC), and polarized optical microscopy (POM). LCEP was then blended in various compositions with DGEBA and cured with a room temperature curing hardener. The cured blends were characterized by DSC and dynamic mechanical analysis (DMA) for their thermal and viscoelastic properties. The cured blends exhibited higher storage moduli and lower glass‐transition temperatures (tan δ_max, from DMA) as compared with that of the pure DGEBA network. The formation of a smectic liquid‐crystalline phase was observed by POM during the curing of LCEP and DGEBA/LCEP blends. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 3375–3383, 2003     

Studies on the curing kinetics of epoxy resins using silicon containing amide-amines

Curing kinetics of diglycidyl ether of bisphenol-A (DGEBA) in the presence of novel silicon containing amide-amines were investigated by the dynamic differential scanning calorimetry. Silicon containing amide-amines were prepared by reacting 2.5 moles of 4,4'-diaminodiphenyl ether (E)/4,4'-diaminodiphenyl methane (M)/3,3'-diaminodiphenyl sulfone (mS)/bis(m-aminophenyl) methyl phosphine oxide (B) with one mole of bis(4-chlorobenzoyl) dimethyl silane. The multiple heating rate method (5, 10, 15 and 20°C min^-1) was used to study the curing kinetics of epoxy resins in the presence of stoichiometric amounts of amide-amines having molecular masses in the range of 660 to 760 g mol^-1. The peak exotherm temperature depends on the heating rate as well as on the structure of amide-amines. Activation energy of curing reaction as determined in accordance to the Ozawa's method was found to be dependent on the structure of amine. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere. The char yield was the highest in case of resins cured with amide-amines having both phosphorus and silicon atoms. This revised version was published online in July 2006 with corrections to the Cover Date.     

Synthesis and curing of amino‐containing benzoxazine as a novel hardener for diglycidyl ether of bisphenol‐A

Benzoxazines containing various additional functional groups have been extensively reported to improve the properties of polybenzoxazines. In this work, a novel amino‐containing benzoxazine (PDETDA‐NH₂) was conveniently synthesized from diethyltoluenediamine (DETDA), 2‐hydroxybenzaldehyde, and paraformaldehyde and was used as a hardener for diglycidyl ether of bisphenol‐A (DGEBA). The curing behaviors of PDETDA‐NH₂ and PDETDA‐NH₂/DGEBA systems were studied by DSC, FT‐IR, and ¹H NMR. When curing, PDETDA‐NH₂ was firstly polymerized to N,O‐acetal‐type polymer and then rearranged to Mannich‐type polymer at elevated temperature, while the addition reaction between amino and benzoxazine was discouraged because of the steric hindrance of alkyl substituents. During PDETDA‐NH₂/DGEBA curing, it was found that the reactions happened in the order of addition polymerization of amino and epoxide, ring‐opening polymerization of benzoxazine, etherification between phenolic hydroxyl of the polymerized benzoxazine, and epoxide. Compared with DETDA cured DGEBA, PDETDA‐NH₂ cured DGEBA showed higher modulus, higher char yield, and much lower water uptake.     

Curing properties of novel curing agent based on phenyl bisthiourea for an epoxy resin system

Phenyl bisthioureas: 4,4′-(bisthiourea)diphenylmethane (DTM), 4,4′-(bisthiourea)diphenyl ether (DTE), and 4,4′-(bisthiourea)diphenyl sulfone (DTS) were synthesized and used as curing agents for the epoxy resin diglydicyl ether bisphenol A (DGEBA). Synthesized phenyl bisthioureas were characterized using FT-IR and ¹H-NMR analysis. For comparison studies the epoxy system was also cured using the conventional aromatic amine 4,4′-diaminodiphenyl ether (DDE). Curing kinetics of epoxy/amine system was studied by dynamic and isothermal differential scanning calorimeter (DSC). Curing kinetic was evaluated based on model-free kinetics (MFK) and ASTM E 698 model, and the activation energy was compared with DDE. Curing system of phenyl bisthiourea link (DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS) shows two exothermic peaks, while that of the conventional aromatic amines showed only a single peak. The initial exothermic peak is due to the primary nitrogen of the thiourea group, and the exotherm at higher temperature is due to the presence of thiourea groups. Glass transition temperature (T _g) of DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS cured resins were lowered by 323 K when compared to the widely used diaminodiphenyl ether (DDE) cured resin. Oxidation induction temperature measurement performed on DSC suggests that the DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS system cured resins has better oxidative stability when compared to cured DGEBA/DDE resin system.     

A 13C NMR study of the methylol derivatives of 2,4′‐ and 4,4′‐dihydroxydiphenylmethanes found in resol phenol–formaldehyde resins

A total of 13 of the 16 possible methylol derivatives of 2,4′‐ and 4,4′‐dihydroxydiphenylmethane have been synthesized, isolated, and identified. These compounds are found as intermediates in the cure process of resol phenol–formaldehyde (PF) resins. Analysis of the ¹³C NMR spectra (in acetone‐d₆) of these compounds provided a way to evaluate the seven methylolphenol ring types (methylol derivatives of 2‐hydroxyphenyl and 4‐hydroxyphenyl rings) found in typical resol PF resins using the ipso carbon region from 150 to 160 ppm. A simple diagnostic test was developed using the chemical shift values of the methylol methylene carbon atoms to identify the presence of intermediates containing either a 2‐hydroxyphenyl or a 4‐hydroxyphenyl ring. Using these data it is now possible to analyze the major components in extracted prepreg PF resins. Copyright © 2002 John Wiley & Sons, Ltd.     

A flame‐retardant phosphate and cyclotriphosphazene‐containing epoxy resin: Synthesis and properties

A novel flame‐retardant epoxy resin, (4‐diethoxyphosphoryloxyphenoxy)(4‐glycidoxyphenoxy)cyclotriphosphazene (PPCTP), was prepared by the reaction of epichlorohydrin with (4‐diethoxyphosphoryloxyphenoxy)(4‐hydroxyphenoxy)cyclotriphosphazene and was characterized by Fourier transform infrared, ³¹P NMR, and ¹H NMR analyses. The epoxy resin was further cured with diamine curing agents, 4,4′‐diaminodiphenylmethane (DDM), 4,4′‐diaminodiphenylsulfone (DDS), dicyanodiamide (DICY), and 3,4′‐oxydianiline (ODA), to obtain the corresponding epoxy polymers. The curing reactions of the PPCTP resin with the diamines were studied by differential scanning calorimetry. The reactivities of the four curing agents toward PPCTP were in the following order: DDM > ODA > DICY > DDS. In addition, the thermal properties of the cured epoxy polymers were studied by thermogravimetric analysis, and the flame retardancies were estimated by measurement of the limiting oxygen index (LOI). Compared to a corresponding Epon 828‐based epoxy polymer, the PPCTP‐based epoxy polymers showed lower weight‐loss temperatures, higher char yields, and higher LOI values, indicating that the epoxy resin prepared could be useful as a flame retardant. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 972–981, 2000     

Nonaqueous synthesis of nanosilica in epoxy resin matrix and thermal properties of their cured nanocomposites

Nonaqueous synthesis of nanosilica in diglycidyl ether of bisphenol‐A epoxy (DGEBA) resin has been successfully achieved in this study by reacting tetraethoxysilane (TEOS) directly with DGEBA epoxy matrix, at 80 °C for 4 h under the catalysis of boron trifluoride monoethylamine (BF₃MEA). BF₃MEA was proved to be an effective catalyst for the formation of nanosilica in DGEBA epoxy under thermal heating process. FTIR and ²⁹Si NMR spectra have been used to characterize the structures of nanosilica obtained from this direct thermal synthetic process. The morphology of the nanosilica synthesized in epoxy matrix has also been analyzed by TEM and SEM studies. The effects of both the concentration of BF₃MEA catalyst and amount of TEOS on the diameters of nanosilica in the DGEBA epoxy resin have been discussed in this study. From the DSC analysis, it was found that the nanosilica containing epoxy exhibited the same curing profile as pure epoxy resin, during the curing reaction with 4,4′‐diaminodiphenysulfone (DDS). The thermal‐cured epoxy–nanosilica composites from 40% of TEOS exhibited high glass transition temperature of 221 °C, which was almost 50 °C higher than that of pure DGEBA–DDS–BF₃MEA‐cured resin network. Almost 60 °C increase in thermal degradation temperature has been observed during the TGA of the DDS‐cured epoxy–nanosilica composites containing 40% of TEOS. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 757–768, 2006     

Preparation and properties of modified bismaleimide resins by novel bismaleimide containing 1,3,4‐oxadiazole

Bismaleimide (BMI) resin is a high‐performance thermosetting polymer, but its inherent brittleness hinder a broader range of application. Therefore, it has aroused wide concern to improve the toughness of BMI resins without scarification of their thermal stability. This paper reported some studies on modified BMI resins based on diallyl bisphenol A, novel BMI monomers, e.g. 2‐[3‐(4‐maleimidophenoxy)phenyl]‐5‐(4‐maleimidophenyl)‐1,3,4‐oxadiazole (m‐Mioxd) or 2‐[4‐(4‐maleimidophenoxy)phenyl]‐5‐(4‐maleimidophenyl)‐1,3,4‐ oxadiazole (p‐Mioxd) in different proportions (0.87:1, 1:1, 1.2:1; mol/mol). The curing mechanism and kinetics of the copolymerized systems were investigated by differential scanning calorimetry and Fourier transform infrared spectroscopy. Thermogravimetric analysis was applied to study the thermal properties of the cured resins, and the results indicated that the modified resins had excellent thermal stability with high residual weight percentage at 700°C (>50%), temperatures for 5% weight loss around 400°C. Besides, N,N′‐4,4′‐bismaleimidodiphenylmethylene and O,O′‐diallyl bisphenol A resin blends were modified by m‐Mioxd and p‐Mioxd, respectively. We investigated the effects of mole concentration of m‐Mioxd or p‐Mioxd on the curing process, mechanical properties, fracture toughness, and heat resistance of the modified resins. The results revealed that the introduction of m‐Mioxd and p‐Mioxd could improve the impact property of the modified BMI resins. When their proportion was 0.07, the impact strength increased 123.8% and 108.3%, respectively. The novel chain‐extended BMIs could reduce the crosslink density of cured resins and improve the brittleness effectively. Copyright © 2015 John Wiley & Sons, Ltd.     

Efficient Synthesis of Novel 3‐Phenyl‐5‐thioxo‐3,4,5,6‐tetrahydroimidazo[4,5‐c]pyrazole‐2(1H)‐carbothioamide Derivatives Using a CeO2–MgO Catalyst and Evaluation of Antimicrobial Activity

Imidazo[4,5‐c ]pyrazole derivatives ( 3a–f , 4a–f , and 5a–f ) were efficiently synthesized by one‐pot three‐component reactions using CeO₂–MgO as the catalyst. The synthesized compounds were characterized by IR, ¹H NMR, ¹³C NMR, and mass spectroscopic analyses. The in vitro antimicrobial activity of the synthesized compounds against various bacterial and fungal strains was screened. Compound 3b was highly active [minimum inhibitory concentration (MIC): 0.5 μg/mL] against Gram‐positive Staphylococcus aureus , and compounds 3b , 3f , 4d , and 4e were highly active (MIC: 0.5, 2, 2, and 0.5 μg/mL, respectively) against Gram‐negative Pseudomonas aeruginosa and Klebsiella pneumoniae , relative to standard ciprofloxacin in the antibacterial activity screening. Compounds 3b and 4f were highly active (MIC: 4 and 0.5 μg/mL, respectively) against Aspergillus fumigatus and Microsporum audouinii in the antifungal activity screening compared with the clotrimazole standard.     

Using diethylphosphites as thermally latent curing agents for epoxy compounds

Diethylphosphite (DEP) and its derivative exhibited thermally latent properties for epoxy curing reactions through the formation of phosphonic acid as an active species from a reaction of ethanol elimination, which was observed with ¹H NMR and pyrolysis gas chromatography/mass spectrometry measurements. The thermally latent properties and curing reaction kinetics of the curing reaction of DEPs with diglycidyl ether of bisphenol A were studied with differential scanning calorimetry. The cured epoxy resins possessed a phosphorous element coming from the DEP derivatives, exhibiting improved flame retardancy. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 432–440, 2003