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基于感应耦合等离子体(ICP)技术设计了一套用于在硅基片上制作形成超浅结的等离子体浸没注入(PIII)系统。该ICP PIII系统工作腔室为圆柱形,采用射频功率源,注入偏压源为一脉冲直流电压源,系统与Langmiur探针相连。探针诊断结果表明,该系统的等离子体离子密度达到1017m-3,离子密度径向均匀性达到3.53%。硼和磷的超低能注入试验的二次离子质谱测试结果表明：掺杂离子注入深度在10nm左右,最浅的注入深度为8.6nm(在注入离子密度为1018cm-3时);注入离子剂量达到了1015cm-2以上;掺杂离子浓度峰值在表面以下;注入陡峭度达到了2.5nm/decade。     

轴承滚珠等离子体浸没离子注入过程的数值模拟

 利用轴对称PIC模型对轴承滚珠等离子体浸没离子注入（PIII）过程进行了数值模拟，对归一化电势的扩展情况进行了研究。在滚珠批量处理过程中，为了避免相邻滚珠周围鞘层的相互重叠对注入均匀性造成不良影响，对滚珠在靶台上摆放的最小距离进行了数值计算，计算结果表明：在电压为－40kV, 氮等离子体密度为4.8×10⁹ cm^-3，脉冲宽度为10μs时，滚珠摆放的最小距离应大于34.18cm。分析了滚珠圆周方向注入剂量的分布情况，针对静止滚珠改性处理后剂量分布很不均匀的问题，通过旋转靶台使滚珠注入均匀性明显得到改善。利用朗谬尔探针测量了滚珠周围鞘层扩展的情况测量，模拟结果和实验测量结果相吻合，最大相对误差小于8.4 %。     

等离子体浸没离子注入过程中离子质谱测量

用一个取样离子源－Ｅ×Ｂ质谱系统测定了等离子体浸没离子注入中氮等离子体的质谱，测量出的氮等离子体的离子比率作为计算机模拟ＴＡＭＩＸ程序的输入参数，以预测原子的浓度－深度分布曲线，氮注入的Ｔｉ６Ａｌ４Ｖ样品用扫描俄歇微探针（ＳＡＭ）分析，获得了原子浓度－深度分布的试验数据，理论预测和用俄歇分析的结果比较，显示出很好的一致性．     

Plasma immersion ion implantation for silicon processing

Plasma Immersion Ion Implantation (PIII) is a technology which is currently widely investigated as an alternative to conventional beam line implantation for ultrashallow doping beyond the 0.15 μm technology. However, there are several other application areas in modern semiconductor processing. In this paper a detailed discussion of the PIII process for semiconductors and of actual as well as future applications is given. Besides the well known advantages of PIII — fast process, implantation of the whole surface, low cost of ownership — several peculiarities — like spread of the implantation energy due to finite rise time or collisions, no mass separation, high secondary electron emission — must be mentioned. However, they can be overcome by adjusting the system and the process parameters. Considering the applications, ultrashallow junction formation by PIII is an established industrial process, whereas SIMOX and Smart‐Cut by oxygen and hydrogen implantation are current topics between research and introduction into industry. Further applications of PIII, of which some already are research topics and some are only investigated by conventional ion implantation, include seeding for metal deposition, gettering of metal impurities, etch stop layers and helium implantation for localized lifetime control.     

Realization of conformal doping on multicrystalline silicon solar cells and black silicon solar cells by plasma immersion ion implantation

Emitted multi-crystalline silicon and black silicon solar cells are conformal doped by ion implantation using the plasma immersion ion implantation （PⅢ） technique. The non-uniformity of emitter doping is lower than 5 %. The secondary ion mass spectrometer profile indicates that the PⅢ technique obtained 100-rim shallow emitter and the emitter depth could be impelled by furnace annealing to 220 nm and 330 nm at 850 ℃ with one and two hours, respectively. Furnace annealing at 850 ℃ could effectively electrically activate the dopants in the silicon. The efficiency of the black silicon solar cell is 14.84% higher than that of the mc-silicon solar cell due to more incident light being absorbed.     

脉冲偏压上升沿特性对等离子体浸没离子注入鞘层扩展动力学的影响

等离子体浸没离子注入(PIII)是用于材料表面改性的一种廉价高效、非视线的技术.采用等离子体粒子模型，通过假设电子密度服从Boltzmann分布，求解Poisson方程和Newton方程，跟踪离子在等离子体鞘层中的运动形态及特性并进行统计分析，研究了不同上升速率和形状的6种波形上升沿对鞘层时空演化、离子注入能量和剂量的影响.结果表明，在PIII过程中，脉冲上升沿影响了等离子体鞘层的扩展，且不同波形诱导的鞘层厚度间存在最大差值.电场强度在鞘层的外边缘区域存在陡降区，离子的运动为非匀加速过程.可以通过调整脉冲 关键词： 等离子体浸没离子注入 鞘层 粒子模型 上升沿     

等离子体浸没离子注入非导电聚合物的适应性及栅网诱导效应的研究

本文建立了绝缘材料等离子体浸没离子注入过程的动力学Particle-in-cell(PIC)模型, 将二次电子发射系数直接与离子注入即时能量建立关联, 研究了非导电聚合物厚度、介电常数和二次电子发射系数对表面偏压电位的影响规律以及栅网诱导效应. 研究结果表明: 非导电聚合物较厚时, 表面自偏压难以实现全方位离子注入, 栅网诱导可以间接为非导电聚合物提供偏压, 并抑制二次电子发射, 为厚大非导电聚合物表面等离子体浸没离子注入提供了有效途径.     

介质靶表面的充电效应对等离子体浸没离子注入过程中鞘层特性的影响

针对等离子体浸没离子注入技术在绝缘体表面制备硅薄膜工艺，采用一维脉冲鞘层模型描述介质靶表面的充电效应对鞘层厚度、注入剂量及靶表面电位等物理量的影响.数值模拟结果表明：随着等离子体密度的增高，表面的充电效应将导致鞘层厚度变薄、表面电位下降以及注入剂量增加，而介质的厚度对鞘层特性的影响则相对较小. 关键词： 等离子体浸没离子注入 脉冲鞘层 绝缘介质 充电效应     

Formation of diamond-like carbon (DLC) film on the NiTi alloys via plasma immersion ion implantation and deposition (PIIID) for improving corrosion resistance

NiTi alloys are potentially useful in biomedical application due to their unique superelasticity and shape memory effect. However, the materials are vulnerable to surface corrosion and the most serious issue is out-diffusion of toxic Ni ions from the substrate into body tissues and fluids. In this paper, Diamond-like carbon (DLC) film is fabricated on the NiTi alloys using plasma immersion ion implantation and deposition (PIIID) at room temperature to improve their corrosion resistance and block the out-diffusion of the Ni ions. The results show that the DLC films cannot only improve the corrosion resistance of the NiTi substrate, but also effectively suppress the Ni ions release from the substrate. The reason that the corrosion resistance of the coated samples is markedly improved due to the DLC films formation is systematically investigated.     

增强辉光放电等离子体离子注入的三维PIC／MC模拟

采用三维粒子模拟／蒙特卡洛模型自洽地模拟了增强辉光放电等离子体离子注入过程中离子产生和注入,获得了放电空间的离子总数、电势分布、等离子体密度分布和离子入射剂量等信息．模拟结果表明,5μs时鞘层达到稳定扩展,15μs时离子的产生与注入达到平衡,证实了增强辉光放电等离子体离子注入能在一定条件下实现白持的辉光放电．注入过程中,在点状阳极正下方存在一个高密度的等离子体区域,证实了电子聚焦效应．除靶台边缘外,离子的注入速率稳定且入射剂量均匀．脉冲负偏压提高时注入速率增加但入射剂量的均匀性变差．     

Fluid simulation of the pulsed bias effect on inductively coupled nitrogen discharges for low-voltage plasma immersion ion implantation

Planar radio frequency inductively coupled plasmas(ICP) are employed for low-voltage ion implantation processes,with capacitive pulse biasing of the substrate for modulation of the ion energy. In this work, a two-dimensional(2D) selfconsistent fluid model has been employed to investigate the influence of the pulsed bias power on the nitrogen plasmas for various bias voltages and pulse frequencies. The results indicate that the plasma density as well as the inductive power density increase significantly when the bias voltage varies from 0 V to-4000 V, due to the heating of the capacitive field caused by the bias power. The N+fraction increases rapidly to a maximum at the beginning of the power-on time, and then it decreases and reaches the steady state at the end of the glow period. Moreover, it increases with the bias voltage during the power-on time, whereas the N_2~+ fraction exhibits a reverse behavior. When the pulse frequency increases to 25 kHz and40 kHz, the plasma steady state cannot be obtained, and a rapid decrease of the ion density at the substrate surface at the beginning of the glow period is observed.