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采用由脉冲负偏压调节的等离子体增强化学气相沉积方法,以硅烷为源气体,在玻璃基片上沉积得到了多孔二氧化硅薄膜。将反应过程中加在沉积区域的脉冲偏压固定在-350V,当占空比从0.162增大到0.864时,薄膜样品的形貌、成份和结构均不相同。扫描电镜照片表明,组成多孔氧化硅薄膜的颗粒在占空比增大时变得细腻,并且薄膜整体变得多孔且蓬松。拉曼光谱和红外光谱结果显示,薄膜样品中的非晶硅和Si-H键在较高的占空比下减弱甚至消失。占空比升高时氧化硅桥键所占比例持续增加。     

多孔氧化硅薄膜阴极射线谱的研究

采用近常压下等离子体增强化学气相沉积的方法制备得到多孔氧化硅薄膜,并在沉积区域加载偏压对薄膜形貌和性质进行调制。扫描电镜显示偏压条件下沉积的薄膜更加蓬松多孔,常温下阴极射线谱表明:增大偏压的占空比,CL谱中发光峰的位置并不改变,但谱线强度增大。发光峰的位置说明薄膜中的主要成分是Si-O-Si基团,且该种基团以非桥键的形式存在,薄膜中还存在少量的Si-H键,这与红外光谱测试结果一致。X射线衍射结果表明薄膜中的SiO2是非晶态的。     

介质阻挡放电等离子体沉积多孔硅纳米颗粒膜的光发射及红外光谱

用介质阻挡放电(DBD)等离子体增强化学气相沉积(PECVD)的方法,以硅烷为源气体,在沉积区域加载脉冲负偏压进行调节,在玻璃基片上沉积得到具有荧光特征的多孔硅纳米颗粒膜。沉积过程的发射光谱结果表明,在412 nm处出现S iH*(A2Δ→X2Π0-0)特征峰,证明放电沉积过程中存在不同程度的硅烷裂解。将脉冲负偏压固定在-300 V,当占空比从0.162增大到0.864时,薄膜的红外光谱显示S i—O—S i在1 070cm-1伸缩振动吸收峰与800 cm-1的弯曲振动峰都有所增强,而930 cm-1的S i—H弯曲振动减弱。说明随着占空比的增加,S i—O—S i键的结合越来越明显。     

射频、直流磁控溅射和多弧离子镀沉积类金刚石薄膜的拉曼光谱分析

用射频、直流磁控溅射和多弧离子镀制备一系列类金刚石(DLC)薄膜样品,并测量了样品的拉曼光谱.通过数据分析发现三种沉积方式中多弧离子镀沉积得到的薄膜含有更高的sp3含量.采用多弧离子镀设备,在不同的溅射负偏压下沉积了一系列的DLC薄膜样品,对样品进行拉曼光谱测试,通过对比分析发现随着沉积负偏压的提高,薄膜内sp3的含量不断提高.表明可以通过提高多弧离子镀的负偏压来提高DLC薄膜的质量.     

锗/多孔硅和锗/氧化硅薄膜光致发光的比较研究

采用磁控溅射技术,以锗为溅射靶,在多孔硅上沉积锗薄膜,沉积时间分别为4,8和12 min,及以锗-二氧化硅复合靶为溅射靶,在n型硅衬底上沉积了含纳米锗颗粒的氧化硅薄膜,锗与总靶的面积比分别为5%,15%,30%.各样品在氮气氛中分别经过300,600及900℃退火30 min.对锗/多孔硅和锗/氧化硅薄膜进行了光致发光谱的对比研究,用红外吸收谱分析了锗/多孔硅的薄膜结构.实验结果显示,锗/多孔硅薄膜的发光峰位于517 nm附近,沉积时间对发光峰的强度有显著影响,锗层越厚峰强越弱.锗/氧化硅薄膜的发光峰位于580 nm附近,锗与总靶的面积比对发光峰的强度影响较大,锗/氧化硅薄膜中的锗含量越高峰强越弱.不同的退火温度对样品的发光峰强及峰位均没有明显影响.可以认为锗/多孔硅的发光峰是由多孔硅与孔间隙中的锗纳米晶粒两者界面的锗相关缺陷引起的,而锗/氧化硅的发光峰来自于二氧化硅的发光中心.     

脉冲偏压电弧离子镀TiO2薄膜的力学与光学性能

用脉冲偏压电弧离子镀技术在玻璃基片上制备均匀透明的TiO₂薄膜.利用X射线衍射仪、原子力显微镜、扫描电子显微镜、紫外-可见透射光谱仪和纳米压痕仪等手段,对不同脉冲负偏压下合成薄膜的相结构、微观结构、表面形貌、力学和光学性能进行表征.结果表明，沉积态薄膜为非晶态.脉冲负偏压对薄膜性能有明显的影响.随偏压的增加，薄膜厚度、硬度和弹性模量均先增大后减小，前者峰值出现在100—200 V负偏压范围，后两者则在250—350V范围.300 V负偏压时薄膜硬度最高，薄膜达到原子级表面光滑度，均方 关键词： 2薄膜')" href="#">TiO₂薄膜 脉冲偏压电弧离子镀 硬度 折射率     

衬底温度对氧化锌薄膜的光谱学特性影响研究

采用脉冲激光沉积技术,在不同沉积温度下制备了氧化锌薄膜。对衬底温度为400和700℃的薄膜进行了结构和光谱学性能表征。结果表明:沉积温度为400和700℃时,氧化锌薄膜均为C轴取向生长;但是表面晶粒生长模式由岛状生长转为柱状晶生长,柱状晶的出现导致了氧化锌薄膜拉曼光谱信号的增强、谱线的展宽、以及拉曼禁戒模式的出现;氧化锌UV峰由3.29 eV红移到3.27 eV,这可能是由于沉积温度为700℃时,氧化锌颗粒尺寸显著增大造成的。     

非晶氧化硅薄膜带尾发光特性

采用等离子体增强化学气相沉积技术,通过改变CO2流量制备了不同氧含量的非晶氧化硅薄膜。利用紫外可见吸收谱、傅里叶红外吸收谱和稳态/瞬态光致发光谱等技术研究了薄膜的微观结构和光学特性。实验结果表明,随着氧含量的增加,薄膜的带隙增大,光致发光强度增加、峰值朝高能方向移动、光谱半峰全宽展宽。时间分辨光谱显示薄膜发光峰值处的衰减时间随氧含量的增加从6.2ns单调增加到21ns,而同一样品的发光寿命随发射波长能量增加而减小。综合分析光学吸收、发射及发光衰减特性表明,薄膜的发光机制主要归结为非晶材料带尾态之间的辐射复合。     

电子回旋共振-射频双等离子体沉积氧化硅薄膜过程中的射频偏压效应

本文利用六甲基乙硅氧烷(HMDSO)和氧气(O2)为反应气体,利用微波电子回旋共振-射频双等离子体化学气相沉积法沉积氧化硅薄膜,并利用发射光谱对等离子体特性进行原位诊断.研究表明,RF偏压对氧化硅薄膜沉积速率和薄膜中的化学键结构产生有意义的影响.小的直流自偏压会略微提高沉积速率;但随着直流自偏压的增加,离子轰击效应及刻蚀作用加强,薄膜的沉积速率下降.在13.56MHz和400kHz两个不同射频频率条件下所沉积的薄膜中,O和Si的比例基本相同,均超过2∶1;但400kHz射频偏压下薄膜中的碳成分比例比13.56MHz条件下的要高得多.这可以归因为高的射频偏压的应用不仅可增强离子轰击效应,而且与体等离子体相互作用,使高活性的氧原子增多;而低频偏压的作用主要是增强离子轰击效应.     

尖端集电效应在薄膜沉积中的应用

本文利用尖端集电原理,在射频平衡磁控溅射过程中通过施加衬底偏压沉积了Cu2O薄膜。然后用原子力显微镜和掠入射X射线衍射仪对薄膜样品的形貌和结构进行表征。研究结果表明,不管施加的是正偏压还是负偏压,所制备Cu2O薄膜的形貌和结构相差不大,均呈现出疏松多孔和(111)择优取向的特点。进一步地,从尖端集电的角度对平衡磁控溅射沉积过程中的偏压效应进行了合理解释。     

Influence of substrate bias voltage on the microstructure of nc-SiOx:H film

Amorphous silicon oxide containing nanocrystalline silicon grain(nc-SiO_x:H) films are prepared by a plasmaenhanced chemical vapor deposition technique at different negative substrate bias voltages.The influence of the bias voltage applied to the substrate on the microstructure is investigated.The analysis of x-ray diffraction spectra evidences the in situ growth of nanocrystalline Si.The grain size can be well controlled by varying the substrate bias voltage,and the largest size is obtained at 60 V.Fourier transform infrared spectra studies on the microstructure evolutions of the nc-SiO_x:H films suggest that the absorption peak intensities,which are related to the defect densities,can be well controlled.It can be attributed to the fact that the negative bias voltage provides a useful way to change the energies of the particles in the deposition process,which can provide sufficient driving force for the diffusion and movement for the species on the growing surface and effectively passivate the dangling bonds.Also the larger grain size and lower band gap,which will result in better photosensitivity,can also be obtained with a moderate substrate bias voltage of 60 V.     

铜上采用过渡层沉积类金刚石薄膜的研究

将等离子增强非平衡磁控溅射物理气相沉积(PEUMS-PVD)和电子回旋共振-微波等离子体增强化学气相沉积(MW-ECRPECVD)技术相结合，通过制备不同的过渡层，在铜基上成功地制备了类金刚石膜.拉曼光谱分析表明，所制备的碳膜具有典型的类金刚石结构特征.检测结果表明，随着沉积偏压的增大，D峰和G峰均向高波数漂移，I_D/I_G值增大，表面粗糙度减小，而平均硬度和弹性模量呈先增大后减小的趋势. 关键词： 铜基体 类金刚石膜 过渡层 拉曼光谱     

Studies of diamond-like carbon （DLC） films deposited on stainless steel substrate with Si/SiC intermediate layers

In this work, diamond-like carbon （DLC） films were deposited on stainless steel substrates with Si/SiC intermediate layers by combining plasma enhanced sputtering physical vapour deposition （PEUMS-PVD） and microwave electron cyclotron resonance plasma enhanced chemical vapour deposition （MW-ECRPECVD） techniques. The influence of substrate negative self-bias voltage and Si target power on the structure and nano-mechanical behaviour of the DLC films were investigated by Raman spectroscopy, nano-indentation, and the film structural morphology by atomic force microscopy （AFM）. With the increase of deposition bias voltage, the G band shifted to higher wave-number and the integrated intensity ratio ID/IG increased. We considered these as evidences for the development of graphitization in the films. As the substrate negative self-bias voltage increased, particle bombardment function was enhanced and the sp^3-bond carbon density reducing, resulted in the peak values of hardness （H） and elastic modulus （E）. Silicon addition promoted the formation of sp^3 bonding and reduced the hardness. The incorporated Si atoms substituted sp^2- bond carbon atoms in ring structures, which promoted the formation of sp^3-bond. The structural transition from C-C to C-Si bonds resulted in relaxation of the residual stress which led to the decrease of internal stress and hardness. The results of AFM indicated that the films was dense and homogeneous, the roughness of the films was decreased due to the increase of substrate negative self-bias voltage and the Si target power.     

A magnetron sputtering technique to prepare a-C:H films: Effect of substrate bias

Amorphous hydrogenated carbon (a-C:H) films were deposited by magnetron sputtering with a mixture gas of Ar and CH₄. The a-C:H films deposited by this method have relatively low internal stress (<1 GPa) compared to some films deposited by conventional deposition process. The effects of substrate bias voltage on microstructure, surface morphology and mechanical properties of the films were investigated by various techniques. It has been found that the polymer-like structure is dominated at low bias voltage (−100 V), while the diamond-like structure with the highest hardness and internal stress is the main feature of the a-C:H films deposited under high bias voltage (−300 V). With increasing the bias voltage further, the feature of diamond-like structure decreases associating with the increase of graphitization. The frictional test shows that the friction coefficient and wear rate of the a-C:H films are depended strongly on structure and mechanical properties, which were ultimately influenced by the deposition method and bias voltage.     

线性微波化学气相沉积制备SiNx薄膜的微结构及光学性能研究

利用自主研发的线性微波化学气相沉积系统在不同微波功率、微波占空比、基片温度、特气比例条件下制备了SiN_x薄膜. 通过扫描电子显微镜、椭圆偏振仪等表征测量技术, 研究了不同工艺参数对SiN_x薄膜表面形貌、元素配比、折射率、沉积速度的影响, 并探讨了薄膜元素配比、折射率、沉积速度间的关系. 结果表明: 利用线性微波沉积技术, 不同工艺参数下制备的SiN_x薄膜组成元素分布均匀, 同时具有平整的表面状态; 特气比例和微波占空比是影响薄膜折射率的最主要因素, 薄膜折射率在1.92–2.33之间连续可调; 微波功率、微波占空比、沉积温度、特气比例都对SiN_x 薄膜沉积速度影响较大, 制备的SiN_x薄膜最大沉积速度为135 nm·min^-1.     

椭偏法表征四面体非晶碳薄膜的化学键结构

采用自主研制的双弯曲磁过滤阴极真空电弧(FCVA)技术,在不同衬底负偏压下制备了四面体非晶碳(ta-C)薄膜。通过分光光度计和椭偏(SE)联用技术精确测量了薄膜厚度,重点采用椭偏法对不同偏压下制备的ta-C薄膜sp3 C键和sp2 C键结构进行了拟合表征,并与X射线光电子能谱(XPS)和拉曼光谱的实验结果相对比,分析了非晶碳结构的椭偏拟合新方法可靠性。结果表明,在-100V偏压时薄膜厚度最小,为33.9nm;随着偏压的增加,薄膜中的sp2 C含量增加,sp3 C含量减小,光学带隙下降。对比结果发现,椭偏法作为一种无损、简易、快速的表征方法,可用于ta-C薄膜中sp2 C键和sp3 C键含量的准确测定,且在采用玻璃碳代表纯sp2 C的光学常数及拟合波长选取250～1700nm时的椭偏拟合条件下,拟合数值最佳。     

Influence of substrate bias voltage on structure and properties of the CrAlN films deposited by unbalanced magnetron sputtering

The CrAlN films were deposited on silicon and stainless steel substrates by unbalanced magnetron sputtering system. The influence of substrate bias on deposition rate, composition, structure, morphology and properties of the CrAlN films was investigated. The results showed that, with the increase of the substrate bias voltage, the deposition rate decreased accompanied by a change of the preferred orientation of the CrAlN film from (2 2 0) to (2 0 0). The grain size and the average surface roughness of the CrAlN films declined as the bias voltage increases above −100 V. The morphology of the films changed from obviously columnar to dense glass-like structure with the increase of the bias voltage from −50 to −250 V. Meanwhile, the films deposited at moderate bias voltage had better mechanical and tribological properties, while the films deposited at higher bias voltage showed better corrosion resistance. It was found that the corrosion resistance improvement was not only attributed to the low pinhole density of the film, but also to chemical composition of films.