High performance IGZO/TiO2 thin film transistors using Y2O3 buffer layers on polycarbonate substrate

In this work, we fabricate IGZO TFT devices on flexible substrate at room temperature. The IGZO/TiO₂ TFT has small subthreshold swing of 0.16 V/dec, but suffers large gate leakage and negative threshold voltage. However, the TiO₂ TFT with Y₂O₃ buffer layers shows improved characteristics including a low threshold voltage of 0.55 V, a small sub-threshold swing of 0.175 V/decade and high field-effect mobility of 43 cm²/Vs. Such good performance can be attributed to the enhanced capacitance density and lowered gate leakage owing to the integration of large band gap Y₂O₃ and low-temperature higher-κ TiO₂.     

Flexible InGaZnO thin film transistors using stacked Y2O3/TiO2/Y2O3 gate dielectrics grown at room temperature

In this Letter, we report a low operation voltage and high mobility flexible InGaZnO thin‐film transistor (TFT) using room‐temperature processed Y₂O₃/TiO₂/Y₂O₃ gate dielectric. The flexible IGZO TFT showed a low threshold voltage of 0.75 V, a small sub‐threshold swing of 137 mV/decade, a good field effect mobility of 32.7 cm²/V s, and a large I_on/I_off ratio of 1.7 × 10⁶. The low operation voltage, small sub‐threshold swing and high mobility could be ascribed to the combination of high‐κ TiO₂ and large band gap Y₂O₃, which provide the potential to meet the requirements of low‐temperature and low‐power portable electronics.

     

Improved performance of InGaZnO thin-film transistors with Ta2O5/Al2O3 stack deposited using pulsed laser deposition

Ta₂O₅/Al₂O₃ stacked thin film was fabricated as the gate dielectric for low-voltage-driven amorphous indium–gallium–zinc-oxide (IGZO) thin film transistors (TFTs). The Ta₂O₅/Al₂O₃ stacked thin film exhibits a combination of the advantages of Al₂O₃ and Ta₂O₅. The IGZO TFT with Ta₂O₅/Al₂O₃ stack exhibits good performance with large saturation mobility of 26.66 cm² V⁻¹ s⁻¹, high on/off current ratio of 8 × 10⁷, and an ultra-small subthreshold swing (SS) of 78 mV/decade. Such small SS value is even comparable with that of submicrometer single-crystalline Si MOSFET.     

SiOx interlayer to enhance the performance of InGaZnO-TFT with AlOx gate insulator

We have fabricated indium–gallium–zinc (IGZO) thin film transistor (TFT) using SiO_x interlayer modified aluminum oxide (AlO_x) film as the gate insulator and investigated their electrical characteristics and bias voltage stress. Compared with IGZO-TFT with AlO_x insulator, IGZO-TFT with AlO_x/SiO_x insulator shows superior performance and better bias stability. The saturation mobility increases from 5.6 cm²/V s to 7.8 cm²/V s, the threshold voltage downshifts from 9.5 V to 3.3 V, and the contact resistance reduces from 132 Ωcm to 91 Ωcm. The performance improvement is attributed to the following reasons: (1) the introduction of SiO_x interlayer improves the insulator surface properties and leads to the high quality IGZO film and low trap density of IGZO/insulator interface. (2) The better interface between the channel and S/D electrodes is favorable to reduce the contact resistance of IGZO-TFT.     

Room temperature fabrication Oxide TFT with Y2O3 as a gate oxide and Mo contact

In this investigation, an operating voltage as low as 5 V has been achieved for Oxide TFT with Y₂O₃ as a gate oxide and a-IGZO as an active layer. The OTFT has been fabricated at room temperature using RF sputter. The mobility and threshold voltages are 11.3 cm²/V s and 3.4 V for the device with W/L = 0.8, respectively. The annealing at 400 °C in N₂ containing 5% H₂ ambient has been utilized to improve the electrical performance of TFT. The on-off current which is determined by gate dielectric has been observed to be 10⁴. It has also been observed that the dielectric properties of gate oxide deteriorate on annealing. The dielectric constant of Y₂O₃ is observed in the range between 5.1 and 5.4 measured on various devices.     

Extraction of density-of-states in amorphous InGaZnO thin-film transistors from temperature stress studies

The instability of amorphous InGaZnO (a-IGZO) thin-film transistors (TFTs) with different active layer thicknesses under temperature stress has been investigated through using the density-of-states (DOS). Interestingly, the a-IGZO TFT with 22 nm active layer thickness showed a better stability than the others, which was observed from the decrease of interfacial and semiconductor bulk trap densities. The DOS was calculated based on the experimentally-obtained activation energy (E_A), which can explain the experimental observations. We developed the high-performance Al₂O₃ TFT with 22 nm IGZO channel layer (a high mobility of 7.4 cm²/V, a small threshold voltage of 2.8 V, a high I_on/I_off 1.8 × 10⁷, and a small SS of 0.16 V/dec), which can be used as driving devices in the next-generation flat panel displays.     

Optimization of transmittance and resistance of indium gallium zinc oxide/Ag/indium gallium zinc oxide multilayer electrodes for photovoltaic devices

We report on the optimization of the optical and electrical properties of IGZO/Ag/IGZO multilayer films as a function of IGZO thickness. The transmission window slightly widened and shifted toward lower energies with increasing IGZO thickness. The IGZO(39 nm)/Ag(19 nm)/IGZO(39 nm) showed transmittance 88.7% at 520 nm. The optical transmittance spectra were examined by finite-difference time-domain (FDTD) simulations. The carrier concentration decreased from 1.73 × 10²² to 4.99 × 10²¹ cm⁻³ with increasing the IGZO thickness, while the charge mobility insignificantly changed from 19.07 to 19.62 cm²/V. The samples had sheet resistances of 4.17–4.39 Ω/sq with increasing IGZO thickness, while the resistivity increased from 1.89 × 10⁻⁵ to 6.43 × 10⁻⁵ Ω cm. The 39 nm-thick IGZO multilayer sample had a smooth surface with a root mean square roughness of 0.63 nm. The IGZO(39 nm)/Ag(19 nm)/IGZO(39 nm) multilayer showed a Haacke's FOM of 49.94 × 10⁻³ Ω⁻¹.     

High-performance amorphous indium gallium zinc oxide thin-film transistors with sol-gel processed gate dielectric and channel layer fabricated using microwave irradiation

In this study, we fabricated high-performance a-IGZO TFTs by forming Al₂O₃ and a-IGZO thin films for gate insulator and active channel layer, respectively, using a sol-gel process. MWI for low thermal budget process was used to condensate Al₂O₃ and a-IGZO films, which was compared with the CTA. It is found that the MWI is superior process to the conventional method in terms of precursor and solvent decomposition and has proven to be more effective for eliminating residual organic contaminants. In addition, the MWI-treated Al₂O₃ and IGZO films have smoother surfaces, higher visible light transmittance, lower carbon contamination and impurities than the CTA-treated films. We have demonstrated that a-IGZO TFTs with sol-gel solution-processed Al₂O₃ gate insulator and a-IGZO channel layer can achieve a field effect mobility of 69.2 cm²/V·s, a subthreshold swing of 86.2 mV/decade and a large on/off current ratio of 1.48 × 10⁸, by the MWI process even at temperatures below 200 °C. In addition, the MWI-treated a-IGZO TFTs have excellent resistance to electron trapping and good stability to positive and negative gate-bias stress. Therefore, the sol-gel processed a-IGZO TFTs with Al₂O₃ gate oxide and the MWI treatment with a low thermal budget are promising for emerging transparent flat panel displays applications.     

Low-voltage-drive and high output current ZnO thin-film transistors with sputtering SiO2 as gate insulator

Low-voltage-drive ZnO thin-film transistors (TFTs) with room-temperature radio frequency magnetron sputtering SiO₂ as the gate insulator were fabricated successfully on the glass substrate. The ZnO-TFT operates in the enhancement mode with a threshold voltage of 4.2 V, a field effect mobility of 11.2 cm²/V s, an on/off ratio of 3.1 × 10⁶ and a subthreshold swing of 0.61 V/dec. The drain current can reach to 1 mA while the gate voltage is only of 12 V and drain voltage of 8 V. The C–V characteristics of a MOS capacitor with the structure of ITO/SiO₂/ZnO/Al was investigated. The carrier concentration N_D in the ZnO active layer was determined, the calculated N_D is 1.81 × 10¹⁶ cm⁻³, which is the typical value of undoped ZnO film used as the channel layer for ZnO-TFT devices. The experiment results show that SiO₂ film is a promising insulator for the low voltage and high drive capability oxide TFTs.     

Impacts of Ti on electrical properties of Ge metal–oxide–semiconductor capacitors with ultrathin high-k LaTiON gate dielectric

Ge Metal–Oxide–Semiconductor (MOS) capacitors with LaON gate dielectric incorporating different Ti contents are fabricated and their electrical properties are measured and compared. It is found that Ti incorporation can increase the dielectric permittivity, and the higher the Ti content, the larger is the permittivity. However, the interfacial and gate-leakage properties become poorer as the Ti content increases. Therefore, optimization of Ti content is important in order to obtain a good trade-off among the electrical properties of the device. For the studied range of the Ti/La₂O₃ ratio, a suitable Ti/La₂O₃ ratio of 14.7% results in a high relative permittivity of 24.6, low interface-state density of 3.1×10¹¹ eV⁻¹ cm⁻², and relatively low gate-leakage current density of 2.0×10⁻³ A cm⁻² at a gate voltage of 1 V.     

Room-temperature fabrication of ultra-thin ZrOx dielectric for high-performance InTiZnO thin-film transistors

In this letter, indium–titanium–zinc–oxide thin-film transistors with zirconium oxide (ZrO_x) gate dielectric were fabricated at room temperature. In the devices, an ultra-thin ZrO_x layer was formed as the gate dielectric by sol–gel process followed by ultraviolet (UV) irradiation. The devices can be operated under a voltage of 4 V. Enhancement mode operations with a high field-effect mobility of 48.9 cm²/V s, a threshold voltage of 1.4 V, a subthreshold swing of 0.2 V/decade, and an on/off current ratio of 10⁶ were realized. Our results demonstrate that UV-irradiated ZrO_x dielectric is a promising gate dielectric candidate for high-performance oxide devices.     

AlGaN/GaN HEMT based hydrogen sensor with platinum nanonetwork gate electrode

AlGaN/GaN high electron mobility transistor (HEMT) based hydrogen sensors incorporating platinum nanonetworks in the gate region were demonstrated. Pt nanonetworks with 2–3 nm diameter were synthesized by a simple and low-cost solution phase method, and applied to the gate electrode of transistor sensor. The HEMT with physically and electrically connected Pt nanonetwork gate showed good pinch-off and modulation of drain current characteristics. Compared to conventional Pt thin film AlGaN/GaN HEMT sensor, the Pt nanonetwork sensor has dramatically improved current response to hydrogen. Relative current change of Pt nanonetwork gated sensor in 500 ppm H₂ balanced with Air ambient was 3.3 × 10⁶% at V_GS of ?3.3 V, while 2.5 × 10²% at V_GS of ?2.9 V for Pt film. This results from large increase in channel conductance induced by huge catalytic surface area of nanostructured Pt networks.     

Characterization of Y2O3 gate dielectric on n-GaAs substrates

Physical and electrical properties of sputtered deposited Y₂O₃ films on NH₄OH treated n-GaAs substrate are investigated. The as-deposited films and interfacial layer formation have been analyzed by using X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectroscopy (SIMS). It is found that directly deposited Y₂O₃ on n-GaAs exhibits excellent electrical properties with low frequency dispersion (<5%), hysteresis voltage (0.24 V), and interface trap density (3 × 10¹² eV⁻¹ cm⁻²). The results show that the deposition of Y₂O₃ on n-GaAs can be an effective way to improve the interface quality by the suppression on native oxides formation, especially arsenic oxide which causes Fermi level pinning at high-k/GaAs interface. The Al/Y₂O₃/n-GaAs stack with an equivalent oxide thickness (EOT) of 2.1 nm shows a leakage current density of 3.6 × 10⁻⁶ A cm⁻² at a V_FB of 1 V. While the low-field leakage current conduction mechanism has been found to be dominated by the Schottky emission, Poole-Frenkel emission takes over at high electric fields. The energy band alignment of Y₂O₃ films on n-GaAs substrate is extracted from detailed XPS measurements. The valence and conduction band offsets at Y₂O₃/n-GaAs interfaces are found to be 2.14 and 2.21 eV, respectively.     

High‐mobility flexible thin‐film transistors with a low‐temperature zirconium‐doped indium oxide channel layer

Thin film transistors (TFTs) with zirconium‐doped indium oxide (ZrInO) channel layer were successfully fabricated on a flexible PEN substrate with process temperature of only 150 °C. The flexible ZrInO TFT exhibited excellent electrical performance with a saturation mobility of as high as 22.6 cm² V^–1 s^–1, a sub‐threshold swing of 0.39 V/decade and an on/off current ratio of 2.5 × 10⁷. The threshold voltage shifts were 1.89 V and ?1.56 V for the unpassivated flexible ZrInO TFT under positive and negative gate bias stress, respectively. In addition, the flexible ZrInO TFT was able to maintain the relatively stable performance at bending curvatures larger than 20 mm, but the off current increased apparently after bent at 10 mm. Detailed studies showed that Zr had an effect of suppress the free carrier generation without seriously distorting the In₂O₃ lattice. (© 2016 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Preparation of Y2O3:Eu thin films by excimer-laser-assisted metal organic deposition

Europium-doped yttrium oxide (Y₂O₃:Eu) thin films were successfully deposited on quartz and ITO/glass substrates by excimer-laser-assisted metal organic deposition (ELAMOD) at low temperatures. The effects of laser wavelength and thermal temperature on the films’ crystallinity and photoluminescence properties were investigated. Films irradiated by an ArF laser at 80 mJ/cm² and 400–500°C were highly crystallized compared with those prepared by thermal MOD. In contrast, when the film was irradiated by a KrF laser at 500°C, no crystalline Y₂O₃:Eu was formed. The Y₂O₃:Eu film irradiated by the ArF laser at 80 mJ/cm² and 500°C showed typical PL spectra of Eu³⁺ ions with cubic symmetry and a ⁵D₀→⁷F₂ transition at ∼612 nm. The PL intensity at 612 nm was much higher for the film prepared with ELAMOD than for that prepared by the thermal-assisted process, and the photoemission intensity of the film prepared with ELAMOD strongly depended on the substrate material.     

Effects of Y incorporation in TaON gate dielectric on electrical performance of GaAs metal–oxide–semiconductor capacitor

In this study, GaAs metal–oxide–semiconductor (MOS) capacitors using Y‐incorporated TaON as gate dielectric have been investigated. Experimental results show that the sample with a Y/(Y + Ta) atomic ratio of 27.6% exhibits the best device characteristics: high k value (22.9), low interfacestate density (9.0 × 10¹¹ cm^–2 eV^–1), small flatband voltage (1.05 V), small frequency dispersion and low gate leakage current (1.3 × 10^–5A/cm² at V_fb + 1 V). These merits should be attributed to the complementary properties of Y₂O₃ and Ta₂O₅:Y can effectively passivate the large amount of oxygen vacancies in Ta₂O₅, while the positively‐charged oxygen vacancies in Ta₂O₅ are capable of neutralizing the effects of the negative oxide charges in Y₂O₃. This work demonstrates that an appropriate doping of Y content in TaON gate dielectric can effectively improve the electrical performance for GaAs MOS devices.

Capacitance–voltage characteristic of the GaAs MOS capacitor with TaYON gate dielectric (Y content = 27.6%) proposed in this work with the cross sectional structure and dielectric surface morphology as insets.     

Effect of Y2O3 doping on the electrical transport properties of Sr2MnNiFe12O22 Y-type hexaferrite

Y₂O₃ doped Y-type composite hexa-ferrites Sr₂MnNiFe₁₂O₂₂ + xY₂O₃ (x = 0 wt%, 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%) were synthesized successfully using sol-gel auto combustion technique. X-ray diffraction analysis reveals Y-type hexagonal structure with few traces of secondary phases. The decrease in grain size as a function of Yttrium content is attributed to the fact that Yttrium acts as a grain inhibitor. The DC resistivity was observed to increase with increasing Yttrium-contents due to the unavailability of Fe³⁺ ions at octahedral sites. Activation energy showed that the samples with high resistivity have high value of activation energy and vice versa. Permittivity decreases with the increase of frequency following Maxwell Wagner Model. In addition, the doped samples exhibit very low dielectric constant and low loss tangent in frequency range 20 Hz–1 MHz. The sample x = 5 wt% exhibit the lowest value of dielectric constant. The variation in imaginary part of dielectric constant and loss tangent with frequency show normal dielectric behavior for all the samples. The frequency dependent ac conductivity increases with increase in frequency and decrease with Y₂O₃ doping. These characteristics may be suitable for their potential applications in electromagnetic attenuation materials and microwave devices. The conductivity mechanism so determined was hopping mechanism. The dc resistivity of the doped ferrites measured in our case is about 10¹⁰ Ω-cm that meets the requirement for fabrication of components by electroplating.     

High‐performance In–Zn–O thin‐film transistors with a soluble processed ZrO2 gate insulator

Spin‐coated zirconium oxide films were used as a gate dielectric for low‐voltage, high performance indium zinc oxide (IZO) thin‐film transistors (TFTs). The ZrO₂ films annealed at 400 °C showed a low gate leakage current density of 2 × 10^–8 A/cm² at an electric field of 2 MV/cm. This was attributed to the low impurity content and high crystalline quality. Therefore, the IZO TFTs with a soluble ZrO₂ gate insulator exhibited a high field effect mobility of 23.4 cm²/V s, excellent subthreshold gate swing of 70 mV/decade and a reasonable I_on/off ratio of ～10⁶. These TFTs operated at low voltages (～3.0 V) and showed high drain current drive capability, enabling oxide TFTs with a soluble processed high‐k dielectric for use in backplane electronics for low‐power mobile display applications. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Low-voltage cathodoluminescence property of Li-doped Gd2−xYxO3:Eu

Cathodoluminescent (CL) spectra of Li-doped Gd_2−xY_xO₃:Eu³⁺ solid-solution (0.0?x?0.8) were investigated at low voltages (300 V-1 kV). The CL intensity is maximum for the composition of x=0.2 and gradually reduces with increasing the amount of substituted Y content. In particular, small (∼100 nm) particles of Li-doped Gd_1.8Y_0.2O₃:Eu³⁺ are obtained by firing the citrate precursors at only 650°C for 18 h. Relative red-emission intensity at 300 V of this phosphor is close to 180% in comparison with that of commercial red phosphor Y₂O₃:Eu³⁺. An increase of firing temperature to 900°C results in 400-600 nm sized spherical particles. At low voltages (300-800 V), the CL emission of 100 nm sized particles is much stronger than that of 400-600 nm sized ones. In contrast, the larger particles exhibit the higher CL emission intensity at high voltages (1-10 kV). Taking into consideration small spherical morphology and effective CL emission, Li-doped Gd_1.8Y_0.2O₃:Eu³⁺ appears to be an efficient phosphor material for low voltage field emission display.     

H2S Solid oxide fuel cell based on a modified Barium cerate perovskite proton conductor

Urea combustion method was adopted to prepare precursor powder, MCeO₃ doped with Zr (M is alkaline earth element, such as barium, strontium, and calcium). The precursor powder has typically perovskite structure after being calcined at 873 K. In 773 K∼1,273 K, BaCe_0.425Zr_0.475Y_0.1O₃ has the highest conductivity above 10⁻² S cm⁻¹ and good chemical stability, while the phase transition may exist in H₂S atmosphere for the proton conductors. In the single fuel cell composed of MoS₂-BaCe_0.425Zr_0.475Y_0.1O_3-σ-Ag with BaCe_0.425Zr_0.475Y_0.1O_3-σ as electrolyte, the best performance is obtained. The open circuit voltage of fuel cell is all about 0.72 V, the max power density, 1.55 mW cm⁻². The performance drop is attributed to ohmic loss resulting from the separation of electrolyte and electrode, and improvement is required to bring out new anode materials compatible to the proton conductor, BaCe_0.425Zr_0.475Y_0.1O_3-σ, as electrolyte.