Synthesis and properties of poly(amic acid)s and polyimides based on 2,2′,6,6′‐biphenyltetracarboxylic dianhydride

Poly(amic acid)s (PAAs) having the high solution stability and transmittance at 365 nm for photosensitive polyimides have been developed. PAAs with a twisted conformation in the main chains were prepared from 2,2′,6,6′‐biphenyltetracarboxylic dianhydride (2,2′,6,6′‐BPDA) and aromatic diamines. Imidization of PAAs was achieved by chemical treatment using trifluoroacetic anhydride. Among them, the PAA derived from 2,2′,6,6′‐BPDA and 4,4′‐(1,3‐phenylenedioxy)dianiline was converted to the polyimide by thermal treatment. The heating at 300 °C under nitrogen did not complete thermal imidization of PAAs having glass‐transition temperatures (T_g)s higher than 300 °C to the corresponding PIs. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 6385–6393, 2006     

聚酰胺酸贮存稳定性

在不同溶剂中合成了一系列均苯二酐（PMDA）、联苯四酸二酐（BPDA）、二苯硫醚二酐（TDPA）、三苯二醚二酐（HQDPA）型和二苯醚二酐（ODPA）型聚酰胺酸（PAA）,由PMDA和二氨基二苯甲烷（MDA）或3,3′－二甲基－4,4′－二氨基二苯甲烷（DMMDA）在N－甲基吡咯烷酮（NMP）中合成的PAA在室温下呈凝胶态,而其它PAA在室温下均为透明溶液,考察了贮存湿温度、凝胶态、添加分子筛等条件对PAA贮存稳定性的影响,发现PAA凝胶的贮存稳定性优于PAA溶液,在PAA溶液中加入4A分子筛时,有利于其它贮存期的延长。     

Synthesis and imidization of poly(amic methyl ester)s

The synthesis and characterization of a series of poly(amic methyl ester)s from five aromatic dianhydrides and a diamine, 4,4′-oxydianiline (ODA), are described. These poly(amic ester)s are obtained by the low-temperature polycondensation from dianhydrides derived diesterdiacyl chlorides and ODA in DMAc solution with the inherent viscosities in the 0.5–0.9 dL/g range. These precursors are readily soluble in aprotic solvents. A detailed thermal study of the imidization process is presented, based on dynamic and isothermal TGA measurements, FTIR spectroscopy, and dynamic mechanical analysis. © 1997 John Wiley & Sons, Inc.     

Synthesis, characterization and hydrolytic stability of poly (amic acid) ammonium salt

A series of new poly (amic acid) ammonium salt (PAAS) precursors were prepared by incorporating different amounts of triethylamine (TEA) into terpolymer polyamic acid (PAA), which was synthesized by pyromellitic dianhydride (PMDA), 4,4’-oxydianiline (ODA) and p-phenylenediamine (PDA) in dimethylacetamide (DMAc). Then, the PAAS films were made by casting their solutions onto glass plates followed by the evaporation of the solvent. The chemical structure of PAAS films was confirmed by ¹H NMR and FTIR spectroscopy. Mechanical properties, intrinsic viscosities and solubility of PAAS precursors were examined, respectively. It was found that the intrinsic viscosity of PAA solution obviously decreased with storage time during 30 days, while no distinct changes were observed in the intrinsic viscosity of the PAAS (the mole ratio of TEA/repeating unit of PAA = 2/1) solution after 90 days. The results suggested that hydrolytic stability of the PAAS films was significantly improved as compared with that of PAA film due to the polyelectrolyte structure of PAAS. Moreover, the thermal and mechanical properties of polyimide (PI) films prepared from PAAS precursors were also investigated, respectively.     

Preparation of poly(bis(trialkylammonium) 4,4′-oxydiphenylenepyromellitamate) films: A useful polyimide precursor film

A poly[bis(trialkylammonium) 4,4′-oxydiphenylenepyromellitamate] film not containing residual solvents was prepared first as a polyimide precursor film. The preparative method is composed of three process steps involving (1) polymerization of pyromellitic dianhydride with 4,4′-oxydianiline in a mixed solvent of tetrahydrofuran/methanol, (2) addition of a mixture of methanol/trialkylamine to the resulting poly(4,4′-oxydiphenylenepyromellitamic acid) solution, and (3) casting onto glass plates and drying. The salt formation between the poly(amic acid) and trialkylamines was confirmed first by spectroscopic methods. The dried salt film is thermally cured to produce the polyimide film with a reduced coefficient of thermal expansion (CTE). © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35 : 2493–2499, 1997     

聚酰胺酸结构及其亚胺化的红外光谱分析

利用变温透射红外光谱方法,通过跟踪聚酰胺酸（PAA）的亚胺化过程,对由均苯四酸二酐和4,4′-二氨基二苯醚合成的聚酰胺酸及经过加热亚胺化后生成的聚酰亚胺(PI)的红外吸收光谱进行分析,对聚酰胺酸和聚酰亚胺的红外谱峰进行合理的归属,发现聚酰胺酸在亚胺化过程中有-COO-和-NH+2存在,-COO-中羰基的对称与反对称伸缩振动分别位于1607和1406 cm-1,NH+2的伸缩振动则有3200、3133、2938、2880、2820和2610 cm-1等多个精细谱带。 并根据对-COO-和-NH+2谱峰的归属,提出聚酰胺酸生成聚酰亚胺的机理为聚酰胺酸中COOH的H+转移到聚酰胺酸中的NH上,形成NH+2,然后脱水环化生成聚酰亚胺。     

Rodlike/flexible polyimide composite films prepared from soluble poly(amic diethyl ester) precursors: Miscibility,structure, and properties

Homogeneous precursor/precursor solutions with various compositions were obtained with appreciably high solid contents in N-methyl-2-pyrrolidone from soluble poly(amic diethyl ester) precursors of rodlike poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA) and flexible poly(4,4′-oxydiphenylene biphenyltetracarboximide) (BPDA-ODA), which are hydrolytically more stable as well as more soluble than the corresponding poly(amic acid)s being equilibrated with the constituent monomers. Both optical microscopic and light scattering measurements showed that the dried precursor blend films and resultant polyimide composite films were optically transparent, regardless of compositions and process conditions. The composite films showed a single T_g behavior. However, for the composite of 30 wt % BPDA-PDA dispersed in the matrix of 70 wt % BPDA-ODA, a smectic crystalline-like aggregation of the BPDA-PDA component was detected on wide-angle x-ray diffraction patterns, indicative of microscopic phase separation between the two components. This phase separation was not detected on the optical microscopy, light scattering, and dynamic mechanical thermal analysis because of their resolution limits: Optical microscopy has a resolution of submicrometers, whereas dynamic mechanical thermal analysis and light scattering have a resolution of ca. 50 Å. Therefore, it is speculated that in the composite films BPDA-PDA and BPDA-ODA polyimide molecules have demixed on the scale of a few nanometers. The mean long periodicity, which was estimated from the small-angle x-ray scattering pattern, varied from 134 to 170 Å as the content of BPDA-ODA component increased. In addition, mechanical properties of the composite films were characterized. ©1995 John Wiley & Sons, Inc.     

A positive-working photosensitive alkaline-developable polyimide with a highly dimensional stability and low dielectric constant based on poly(amic acid) as a polyimide precursor and diazonaphthoquinone as a photosensitive compound

A positive-working photosensitive polyimide precursor based on fluorinated poly(amic acid) (FPAA) and 2,3,4-tris(1-oxo-2-diazonaphthoquinon-4-ylsulfonyloxy)benzophenone (D4SB) as a photosensitive compound has been developed. FPAA was prepared by ring-opening polyaddition of dianhydrides, pyromellitic dianhydride and biphenyltetracarboxylic dianhydride, with diamine, 2,2′-bis(trifluoromethyl)benzidine, in methanol. The FPAA film showed excellent transparency to UV light and good solubility in a wide range of organic solvents. The dissolution behavior of FPAA containing 30 wt % D4SB after exposure was studied, and it was found that the difference of dissolution rate between exposed and unexposed parts was enough to get high contrast due to the photochemical reaction of D4SB in the polymer film. The photosensitive fluorinated polyimide (FPI) precursor containing 30 wt % D4SB showed a sensitivity of 80 mJ cm⁻² and a contrast of 7.8 with 365 nm light when it was developed with 0.3% aqueous tetramethyl ammonium hydroxide solution at room temperature. The FPI film cured up to 360°C had a low coefficient of thermal expansion of 10.3 ppm °C⁻¹ and a low dielectric constant of 3.04. © 1998 John Wiley & Sons, Inc. J. Polym. Sci. A Polym. Chem. 36: 2261–2267, 1998     

Synthesis,characterization, and investigation of structure‐thermal cycloimidization relationship of novel poly(amide amic acid)s to poly(amide imide)s by thermogravimetric analysis

Novel diamic acids (DAAs) and poly(amide amic acid)s (PAAs) were prepared and their thermal cycloimidization to the corresponding imide form was investigated by thermogravimetric analysis under isothermal conditions at four different temperatures, that is, at 175, 200, 225, and 260 °C for 75 min. A general equation, 18NW/R_MW, where, the numerical 18 corresponds to the molecular weight of water, N is the number of water molecules, which would be eliminated per repeat unit of the PAA upon cycloimidization, W is the weight of PAA taken for TGA, and R is the molecular weight of the repeat unit of PAA, has been derived for the calculation of theoretical amount of weight loss of PAA upon complete cycloimidization. The degree of cycloimidization (DCI%) of PAAs to poly(amide imide)s (PAI) has been calculated from their isothermal TGA curves. The variation in DCI on temperature, time, and the structures of diamine and acid chloride, especially, with respect to meta‐ and para‐linkages and the presence of electron withdrawing groups has been discussed. Cycloimidization occurs at faster rate in the initial stages of about 20 min, curing and then proceeds in a gradual manner and reaches almost a plateau within an hour. The DCI was more at higher temperatures, and the final values were 22?60% at 175 °C, 34?78% at 200 °C, 50?96% at 225 °C, and 85?99% at 260 °C after 75 min of heating, depending on the nature of diamine and acid chloride in the PAA. The DCI of PAAs with meta‐linkages in either of diamine or diacid chloride was somewhat lower than those having para‐linkages. The DCI of PAAs containing electron withdrawing group like sulfone in the diamine is somewhat higher compared with those of others. The final DCI (%) values obtained from FT‐IR spectra and isothermal TGA curves were very close to each other. Further, the thermal and thermooxidative stabilities of the PAIs were discussed. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 2937–2947, 2007     

Synthesis and characterization of photo‐crosslinkable poly(amic acid ester)s with 2‐hydroxy‐4‐oxo‐hept‐5‐enyl side chain

Photosensitive poly(amic acid ester)s (PAEs) with 2‐hydroxy‐4‐oxo‐hept‐5‐enyl side group were simply synthesized from a non‐photosensitive polyamic acid (PAA), which was prepared from cyclobutane‐1,2,3,4‐tetracarboxylic dianhydride (CBDA) and 4,4′‐diaminodiphenyl ether (DDE) in N‐methyl‐2‐pyrrolidinone (NMP). 1‐oxiranyl‐pent‐3‐en‐2‐one was added to the poly(amic acid) solution to give the photosensitive PAEs by a ring opening esterification of the poly(amic acid). The esterification reaction was conducted with changing a reaction time and amounts of 1‐oxiranyl‐pent‐3‐en‐2‐one. The degree of esterification (DOE) increased with increasing esterification reaction time and amounts of 1‐oxiranyl‐pent‐3‐en‐2‐one. A photo‐lithography evaluation for the PAE‐D4 with the highest DOE was conducted in the presence of 1‐[4‐(phenylthio)phenyl]‐2‐(O‐benzoyloxime)‐1,2‐octanedione (PPBO) as a photoinitiator at a wavelength of 365 nm using a high‐pressure mercury lamp. The normalized film thicknesses for PAE‐D3 were measured with various post‐exposure baking (PEB) temperatures, which showed that the optimum PEB temperature was 120°C. The resolution of the resulting polyimide film cured at 250°C for 60 min was 25 µm. The initial decomposition temperature of the polyimide film was around 354°C and there was no weight loss at the temperature of 250–350°C. Copyright © 2009 John Wiley & Sons, Ltd.     

Alkaline-developable positive-type photosensitive polyimide with high mechanical strength and high resolution based on chain extendable poly(amic acid), thermally degradable cross-linker and photoacid generator

A positive-type photosensitive polyimide ( PSPI ) based on a chain extendable poly(amic acid) ( PAA ), a thermally degradable cross-linker 1,3,5-tris[(2-vinyloxy)ethoxy]benzene ( TVEB ), and a photoacid generator (PAG) (5-propylsulfonyloxyimino-5H-thiophene-2-ylidene)-(2-methylphenyl)acetonitrile ( PTMA ) has been developed. The chain extendable PAA was prepared from 3,3′,4,4′-biphenyltetracarboxylic dianhydride ( BPDA ) and 4,4′-oxydianiline ( ODA ) and end-capped with di-tert-butyl dicarbonate ( DIBOC ) in N-methyl-2-pyrrolidone (NMP), which has a controlled molecular weight for developing in a 2.38 wt% tetramethyl ammonium hydroxide aqueous solution ( TMAH _aq ) and undergoes a chain extending reaction during curing stage. The photosensitive resist solution was formulated with the polymerization solution (30 wt% in NMP), TVEB (15 wt% for the polymer), and PAG (4.5 wt% for the polymer). The PSPI showed a sensitivity of 47 mJ cm⁻² and a contrast of 5.8 when exposed to 365-nm light, followed by postexposure baking at 90 °C for 10 min and development with the 2.38 wt% TMAH _aq at room temperature. A fine-positive image with 3-μm line-and-space patterns was obtained on a 3-μm thick film exposed to UV light at 365 nm in the contact-printed mode. After thermal curing at 350 °C for 1 hr, the resulting PSPI features excellent mechanical strength and elongation.     

Micro construction of poly(epsilon-caprolactone)/poly(L-lactic acid) blend film by solution casting under microwave irradiation

The micro construction of poly(epsilon-caprolactone) (PCL) and poly(L-lactic acid) (PLLA) blend films fabricated by solution casting under microwave irradiation was investigated by selective enzymatic degradation and scanning electron microscopy (SEM). The results were totally different from the blends obtained by conventional methods. The blend was more homogeneous and the PCL continuous phase more compact as no spherulites and tiny zone separation were observed from the film surface and no PCL network was observed inside the film, and the degradation of a PCL plank by Pseudomonas lipase was significantly retarded. The distributed PLLA micro spheres were enlarged and amorphous. The thermal behavior of the blend by microwave heating revealed that PCL and PLLA underwent a melting process, which induced the variations of the PCL phase and PLLA spheres. The weight loss caused by degradation of the PCL/PLLA blend obtained by conventional methods (B50c) is greater than that of the blend obtained by microwave methods (B50m), which reflects the change in morphology from a loose PCL network (B50c) to a dense PCL plank (B50m).     

Isomeric compositions in amide acids and poly(amic acid)s derived from 1-(trifluoromethyl)-2,3,5,6-benzenetetracarboxylic dianhydride

Two different poly(amic acid)s were synthesized by the polycondensations of 1-(trifluoromethyl)-2,3,5,6-benzenetetracarboxylic dianhydride (CF3DAN) with p-phenylene diamine and benzidine. In addition, an amide acid model compound was prepared from CF3DAN and aniline. Isomeric units in the poly(amic acid)s as well as the amide acid were investigated by ¹H and ¹³C-nuclear magnetic resonance (NMR) spectroscopies. Spectroscopic results indicate that the major isomeric component was a CF3-meta-isomeric unit centered on the aromatic carbon substituted with the trifluoromethyl group. In particular, the amide acid compound was determined to be composed of 80 mol % CF3-meta-isomer and 20 mol % H-meta-isomer. Therefore, for the poly(amic acid)s, the minor isomeric component is speculated to be a H-meta-isomeric unit rather than a para-isomeric unit. The result might result mainly from the strong electron-withdrawable and bulky trifluoromethyl substituent in the CF3DAN monomer. The strong electron withdrawability might significantly enhance the reactivities of the adjacent carbons in the monomer to the nucleophilic attack of the amino nitrogen in the aniline and diamines, and consequently overcome the role of the bulkyness, ultimately leading to the amide acid and poly(amic acid)s rich with the CF3-meta-isomeric unit. In addition, a portion of the imide form was detected in the dried AN-CF3DAM-AN amide acid. Thus, the formation of imide linkage might be involved in a small portion for the dried poly(amic acid)s. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 1755–1765, 1998     

The synthesis of a precursor of polybenzimidazole (PBI) and blends with polyamic acid (PAA)

The precursor of polybenzimidazole (PBI), poly(3,3′-diamino-4,4′-benzidine isophthalamide) (PDABI), was synthesized from poly(3,3′-dinitro-4,4′-benzidine isophthalamide) (PDNBI) by reduction. With increasing temperature, the NH₂ moiety which was protected by SnCl₅^?1 could cyclize and form PBI. Blends with polyamic acid (LaRC-TPI) were prepared. Clear blend films were prepared at up to 400°C. The IR spectra displayed shifts in the NH stretching band, thereby providing evidence for specific interactions related to the miscibility of their cured blends. © 1993 John Wiley & Sons, Inc.     

Osmotic deswelling of weakly charged poly(acrylic acid) solutions and gels

The osmotic pressure of weakly charged aqueous poly(acrylic acid) (PAA) solutions and the swelling pressure PAA gels were studied by osmotic deswelling at different degrees of ionization (α). In solution, the osmotic pressure was found to scale linearly with concentration, whereas the scaling power of the swelling pressure of gels was higher (1.66). The effect of the ionization degree on the osmotic coefficient in PAA solutions was in agreement with the theory of Borue and Erukhimovich [Macromolecules, 21 , 3240 (1988)]. Ionization increases the swelling capacity of the PAA gels until a plateau is reached at about 35% neutralization. The concentration at equilibrium swelling scales as C_e ～ α^?0.6. The contribution of the network to the gel swelling pressure is evaluated by subtracting the osmotic pressure of the polymer solution at the same concentration and degree of ionization. In swollen gels the extended network opposes swelling. As the gel is osmotically deswelled, a state of zero network pressure exists at a certain concentration, below which the network elasticity favors swelling. The crossover concentration shifts to lower values as the degrees of ionization increases. © 1995 John Wiley & Sons, Inc.     

Degradation of poly(lactic acid) into repolymerizable oligomer using montmorillonite K10 for chemical recycling

The degradation of poly(L-lactic acid) (PLLA) into a repolymerizable oligomer was carried out using a clay catalyst, montmorillonite K10 (MK10), with the objective of developing a chemical recycling process. PLLA having an Mw of 120,000 was degraded by MK10 in toluene at 100 degrees C for 6 h to produce the corresponding linear-type oligomers having a molecular weight of a few hundreds in a yield of greater than 90%. The oligomer was readily polymerized by a conventional chemical catalyst to give a high-molecular-weight PLLA. No isomerization of L-lactic acid occurred during the degradation process using MK10. The MK10 could be repeatedly used at least five times without any significant decrease in its activity. The degradation of PLLA was accelerated by the addition of a small amount of ethanol in toluene using anhydrous MK10 to produce oligomers with ethyl ester end groups.     

苯胺链段为侧基的聚酰胺酸的合成及性质

采用三元共聚法制备了苯胺齐聚物为侧链的接枝型聚酰胺酸. 通过红外光谱、核磁共振谱及高效凝胶渗透色谱等技术对聚合物结构进行了表征. 该材料亚胺化后具有十分优异的热稳定性. 紫外-可见光谱和电化学测试结果表明, 该聚合物具有独特的光谱性质和可逆的电化学活性. 聚酰胺酸/ITO电致变色电极具有颜色变化明显, 响应速度较快, 着色效率高等优点, 是一种综合性能较好的电致变色聚合物材料.     

Synthesis and properties of polyimides derived from 1,7-bis(4-aminophenoxy)naphthalene and aromatic tetracarboxylic dianhydrides

The novel diamine, 1,7-bis(4-aminophenoxy)naphthalene (1,7-BAPON), was synthesized and used to prepared polyimides. 1,7-BAPON was synthesized through the nucleophilic displacement of 1,7-dihydroxynaphthalene with p-fluoronitrobenzene in the presence of K₂CO₃ followed by catalytic-reduction. Polyimides were prepared from 1,7-BAPON and various aromatic tetracarboxylic dianhydrides by the usual two-step procedure that included ring-opening polyaddition to give poly(amic acid)s, followed by cyclodehydration to polyimides. The poly(amic acid)s had inherent viscosities of 0.74-2.48 dL/g. Most of the polyimides formed tough, creasible films. These polyimides had glass transition temperatures between 247–278°C and their 10% weight loss temperatures were recorded in the range of 515–575°C in nitrogen atmosphere. © 1995 John Wiley & Sons, Inc.     

硫醚双酐聚酰胺酸的合成及其热稳定性

合成了硫醚二酐和4-硝基-4'-[N,N-二(2-氨乙基)氨基]偶氮苯(二胺单体)及对应的硫醚聚酰胺酸,并对其结构进行表征.由于该发色团分子的一端有可以进一步聚合的氨基,它与硫醚酐所形成的聚酰胺酸在普通有机溶剂中具有良好的可溶性,NLO发色团和聚酰亚胺骨架的分解温度t_d分别为362℃和491℃,显现出了特殊的热稳定性.目前,这些聚合物在高敏感非线性光学材料方面显示着广泛的应用前景.