功能梯度材料开裂三点弯曲试件的裂纹端应力强度因子

本文利用能量释放率法计算功能梯度材料开裂三点弯曲试件的裂纹端应力强度因子。在给定力作用下算出裂纹长度为“a”和“a △a”时的二组解，解中包括集中力作用处的位移。从二组解中的相应位移改变值便可以决定出能量释放率。再从能量释放率可以算出裂纹端应力强度因子。本文用有限元方法计算开裂三点弯曲试件的位移。正因为利用了能量释放率法，即利用一种间接法来求裂纹端应力强度因子，从而可用常规有限元来解决问题。     

冲击载荷下扩展裂纹尖端动态能量释放率分布的焦散线分析

借助高速摄影捕捉裂纹瞬态扩展过程，利用动态焦散线研究了含有裂纹的三点弯曲梁在冲击载荷作用下扩展裂纹尖端的动态能量释放率分布规律；综合分析了裂纹扩展时间、长度、速度，以及扩展裂纹尖端动态应力强度因子与它的变化关系，表明了动态能量释放率在裂纹扩展过程中的驱动作用。     

界面裂纹非对称扩展模型

提出了一种新的复合材料结构中层间脱层裂纹扩展模型，该模型能够揭示裂纹扩展对裂纹左右尖端能量释放率的相对大小及界面材料性能的依赖性，能够比较真实地揭示复合材料结构层间脱层裂纹扩展复杂性的特点．     

动态载荷下功能梯度复合材料的圆币形裂纹问题

研究了动态载荷下功能梯度材料中的圆币形裂纹问题．假设材料为横观各向同性,并且含有多个垂直于厚度方向的裂纹,材料参数沿轴向（与裂纹面垂直的方向）为变化的,沿该方向将材料划分为许多单层,各单层材料参数为常数,利用Hankel变换祛,在Laplace域内推导出了控制问题的对偶积分方程组．利用Laplace数值反演,得出了裂纹尖端的动态应力强度因子和能量释放率．研究了含两个裂纹的功能梯度接头结构,分析了材料非均匀性参数对应力强度因子和能量释放率的影响．     

各向异性压电材料平面裂纹的耦合场分析

用Stroh方法分析了各向异性压电材料电导通型裂纹问题的耦合场。结果表明,裂纹面上的切向电场强度和法向电位移均为常数,在裂纹尖端有由弹性场的耦事作用产生的奇异电导通裂纹模型中的静电场对裂纹尖端扩展的能量释放率不作贡献。     

最大能量释放率断裂准则在Ⅱ-Ⅲ和Ⅰ-Ⅱ-Ⅲ复合型断裂中的应用

MG准则的物理概念是非常明确的,它认为,裂纹扩展将引起裂纹体的势能释放,当释放的能量与形成新裂纹面所需要的能量相当时,就导致裂纹失稳扩展,并沿着能量释放率最大的方向开裂。本文将根据Irwin关于能量释放率G与应力强度因子K之间的关系的理论, ...     

Z—pins增强陶瓷基复合材料单搭接接头的裂纹尖端能量释放率

对典型Z-pins增强陶瓷基复合材料单搭接接头的裂纹尖端能量释放率进行了数值模拟,重点研究Z-pins在不同直径和间距下裂纹尖端能量释放率随裂纹扩展的变化规律.研究发现能够形成桥联的Z-pins具有一定抑制开裂的能力,形成桥联后,Z-pins的直径对于裂纹尖端能量释放率的影响较大,而Z-pins的间距对于裂纹尖端能量释放率也有影响,但当间距小到某一限度时,再减小间距裂纹尖端能量释放率基本保持不变.     

界面断裂韧性的实验研究

本文以铝材与浇注的环氧树脂之间的界面裂纹为研究对象，用三点弯曲和四点弯曲的试验方法，并结合有限元法的数值分析，对双材料界面裂纹的扩展判据，即裂纹扩展的临界能量释放率ＧＣ与相位角ψ↑＾的关系曲线，进行了初步验证。结果表明这一判据基本上是可取的。但是，应该注意界面裂纹的韧性与多种因素有关，实际应用ＧＣ－ψ↑＾曲线时，必须严格区分不同因素。     

涂层式裂纹监测系统中基体裂纹穿越行为研究

建立了智能涂层的两相模型与三相模型,基于能量准则分别用这两种模型研究了基体裂纹达到涂层界面后的穿越/偏转行为. 用有限元法分析了相对裂纹扩展长度、弹性错配参数及界面层厚度对偏转裂纹与穿越裂纹能量释放率之比的影响,结果表明当基体裂纹到达驱动层与基体界面时,能量释放率之比不仅与基体和驱动层之间的弹性错配相关,而且当驱动层较薄时对驱动层与传感层之间的弹性错配亦有较强的依赖性. 此外,随着驱动层厚度的增加,能量释放率之比对驱动层与传感层之间的弹性错配的依赖性逐渐降低. 通过与实验结果相比,建立的模型能够较好的解释基体裂纹在界面的扩展行为,可用于智能涂层裂纹传感器的优化设计.      

各向异性双材料界面裂纹扩展裂尖场

应用界面断裂力学理论和Stroh方法,研究了广义平面变形下动态裂纹沿着各向异性双材料界面扩展时的裂尖奇异应力及动态应力强度因子.双材料界面的动态裂尖区域特性主要由两个实矩阵W和D确定,且裂尖奇异应力和动态应力强度因子可以由包含这两个矩阵的柯西奇异积分方程确定,同时给出了动态应力强度因子和能量释放率的显示表达式.算例得出当裂纹以小速度扩展时,裂尖振荡因子ε与静态时几乎相同,当界面裂纹扩展速度接近瑞利波速时,ε趋于无穷大;同时得出应力强度因子及能量释放率随裂纹扩展速度的变化关系.     

黏弹性功能梯度材料裂纹问题的有限元方法

针对组分材料体积含量任意分布的黏弹性功能梯度材料裂纹问题建立有限元分析途径. 通过Laplace变换,将黏弹性问题转化到象空间中求解,基于反映材料非均匀的梯度单元和裂纹尖端奇异特性的奇异单元计算象空间中的位移、应力和应变场,应用虚拟裂纹闭合方法得到应变能释放率,分别由应力和应变能释放率确定应力强度因子. 给出这些断裂参量在物理空间和象空间之间的对应关系,由数值逆变换求出其在物理空间的相应值. 文中分析两端均匀受拉的黏弹性边裂纹板条,首先针对松弛模量表示为空间函数和时间函数乘积的特殊梯度材料进行计算,结合对应原理验证方法的有效性. 然后分析组分材料体积含量具有任意梯度分布的情形,由Mori-Tanaka方法预测象空间中的等效松弛模量. 计算结果表明,蠕变加载条件下,应变能释放率随时间增加,其增大程度与黏弹性组分材料体积含量相关. 由于梯度材料的非均匀黏弹性性质,产生应力重新分布,导致应力强度因子随时间变化,其变化范围与组分材料的体积含量分布方式有关.     

FRACTURE ANALYSIS OF A FUNCTIONALLY GRADED STRIP UNDER PLANE DEFORMATION

In this paper the plane elasticity problem for a functionally graded strip containing a crack is considered. It is assumed that the reciprocal of the shear modulus is a linear function of the thickness-coordinate, while the Possion's ratio keeps constant. By utilizing the Fourier transformation technique and the transfer matrix method, the mixed boundary problem is reduced to a system of singular integral equations that are solved numerically. The influences of the geometric parameters and the graded parameter on the stress intensity factors and the strain energy release rate are investigated. The numerical results show that the graded parameters, the thickness of the strip and the crack size have significant effects on the stress intensity factors and the strain energy release rate.     

Dynamic fracture behaviors of cracks in a functionally graded magneto-electro-elastic plate

In this paper the dynamic anti-plane problem for a functionally graded magneto-electro-elastic plate containing an internal or an edge crack parallel to the graded direction is investigated. The crack is assumed to be magneto-electrically impermeable. Integral transforms and dislocation density functions are employed to reduce the problem to Cauchy singular integral equations. Field intensity factors and energy release rate are derived, analyzed and partially calculated numerically. The effects of material graded index, loading combination parameter (including size and direction) and geometry criterion of the plate on the dynamic energy release rate are shown graphically. Numerical results indicate that increasing the graded index can all retard the crack extension, and that both the applied magnetic field loadings and electric field loadings play a dominant role in the dynamic fracture behaviors of crack tips.     

平行于功能梯度材料夹层的币型裂纹起裂条件

分析了功能梯度材料中币型裂纹的扩展问题．裂纹平行于无限域中功能梯度材料夹层,受有与裂纹面成任意角度的拉应力．假定功能梯度材料夹层与两个半无限域均匀介质完全粘合,其弹性模量沿厚度方向变化．采用基于层状材料广义Kelvin基本解的边界元方法分析裂纹问题,给出了均布正应力和剪应力作用下裂纹的应力强度因子、将应力强度因子耦合于应变能密度断裂判据,讨论了裂纹体在拉伸应力作用下的起裂条件．     

Periodic cracks in a functionally graded piezoelectric layer bonded to a piezoelectric half-plane

Studied is the problem of a periodic array of cracks in a functionally graded piezoelectric strip bonded to a homogeneous piezoelectric material. The properties of the functionally graded piezoelectric strip, such as elastic modulus, piezoelectric constant and dielectric constant, are assumed in exponential forms and vary along the crack direction. The crack surface condition is assumed to be electrically impermeable or permeable. Integral transform and dislocation density functions are employed to reduce the problem to the solution of a system of singular integral equations. The effects of the periodic crack spacing, material constants and the geometry parameters on the stress intensity factor, the energy release ratio and the energy density factor are studied.     

Crack-tip stress fields in functionally graded materials with linearly varying properties

Crack-tip stress fields for a stationary crack along or inclined to the direction of property gradation in functionally graded materials (FGMs) are obtained through an asymptotic analysis coupled with Westergaard’s stress function approach. The elastic modulus of the FGM is assumed to vary linearly along the gradation direction. The first six terms for a crack along the direction of property variation and first four terms for a crack inclined to the direction of property variation in the expansion of the stress field are derived to explicitly bring out the influence of nonhomogeneity on the structure of the stress field. Using these stress fields, contours of constant maximum shear stress and constant out of plane displacement are generated and the effect of inclination of property gradation direction on these contours is discussed. The strain energy density criterion is applied to obtain critical conditions for crack initiation and the effect of property gradation is discussed. It is shown that the materials with varying properties can offer more resistance to crack propagation and will suppress crack growth in some situations.     

Angle cracks in two bonded functionally graded piezoelectric material under anti-plane shear

Consider two bonded functionally graded piezoelectric material (FGPM) with finite height. Each material contains an arbitrary oriented crack. The material properties are assumed in exponential forms in the direction normal to the interface. The crack surface condition is assumed to be electrically impermeable or permeable. Using the Fourier transform technique, the problem can be reduced to a system of singular integral equations, which are then solved numerically by applying the Gauss-Chebyshev integration formula to obtain the stress intensity factors at the crack tips. Numerical calculations are carried out to obtain the energy density factor S and the energy release rate G. In impermeable case, the energy release rate has been shown to be negative as the electric loads are applied. The positive definite characteristic of the energy density factor makes it possible for predicting the fracture behavior of the cracked structure. The influences of the non-homogeneous parameters and crack orientation on the energy density factors at the crack tips are discussed in detail. The results show that the energy density factor at the crack tip will be increased when the crack tip is located within the softer material.     

Elliptical crack normal to functionally graded interface of bonded solids

This paper presents an analysis of an elliptical crack that is perpendicular to a functionally graded interfacial zone between two fully bonded solids. The functionally graded interfacial zone is treated as a non-homogeneous solid layer with its elastic modulus varying in the thickness direction. A generalized Kelvin solution based boundary element method is employed for the calculation of the stress intensity factors associated with the three-dimensional crack problem. The elliptical crack surface is subject to either uniform normal traction or uniform shear traction. The stress intensity factors are examined by taking into account the effects of the non-homogeneity parameter and thickness of the functionally graded interfacial zone, as well as the crack distance to the zone. The SIF values are further incorporated into the S-criterion for prediction of crack growth. The paper presents the most possible direction and location of the elliptical crack growth under an inclined tensile (or compressive) load. The paper further presents results of the critical external loads that would cause the elliptical crack to grow at the most possible location and along the most possible direction. The paper also examines the effects of external load direction and material and geometrical parameters on the critical loads.     

含非完整界面的功能梯度压电材料Ⅲ型裂纹问题

本文研究了含非完整界面的功能梯度压电复合材料的Ⅲ型裂纹问题．此裂纹垂直于非完整界面,采用弹簧型力电耦合界面模型模拟非完整界面．界面两侧材料的性质,如弹性模量、压电常数和介电常数均假定呈指数函数形式且沿着裂纹方向变化．运用积分变换法将裂纹面条件转换为奇异积分方程,并使用Gauss-Chebyshev方法对其进行数值求解．根据算例结果讨论了一些退化问题并分析了裂纹尖端强度因子与材料的非均匀系数和非完整界面参数的关系．     

Thermal response of a partially insulated interface crack in a graded coating-substrate structure under thermo-mechanical disturbance: Energy release and density

Consider the thermal fracture problem of a functionally graded coating-substrate structure of finite thickness with a partially insulated interface crack subjected to thermal-mechanical supply. A new model is proposed that the heat conduction through the crack region occurs and the temperature drop across the crack surfaces is the result of the thermal resistance. For the first time, real fundamental solutions are derived for the fracture analysis of functionally graded materials. The complicated mixed boundary problems of equations of heat conduction and elasticity are converted analytically into singular integral equations, which are solved numerically. The asymptotic expressions with higher order terms for the singular integral kernels are considered to improve the accuracy and efficiency of the numerical integration. Explicit expressions of various failure modes including stress intensity factors, energy release rate and strain energy density, are provided. Numerical results are presented to illustrate the effects of non-homogeneity parameters and the dimensionless thermal resistance on the temperature distribution along the crack surfaces and extended crack line, the thermal stress intensity factors and minimum strain energy density.