含氟苯乙炔苯胺封端聚酰亚胺的合成与性能研究

设计并合成了一种含氟苯乙炔苯胺封端剂4-苯乙炔基-3-三氟甲基苯胺(3FPA),使用3FPA与4,4′-(六氟异丙基)双邻苯二甲酸二酐(6FDA)和对苯二胺(p-PDA)制备了计算分子量为5000的聚酰亚胺树脂3FPA-PI-50,并对树脂溶液、树脂模塑粉和树脂模压件的制备与性能进行了研究,实验结果表明3FPA-PI-50树脂溶液具有良好的储存稳定性,成型后树脂具有优异的热性能和热氧化稳定性,后固化后树脂玻璃化转变温度为404℃,5%热失重温度大于530℃.此外树脂具有低的介电常数和吸水率.     

耐高温交联侧基苯乙炔封端酰亚胺预聚体

合成了含有苯乙炔基的二胺单体 3,5-二氨基-4'-苯乙炔苯甲酮(DPEB), 并与3,3',4,4'-联苯四酸二酐(s-BPDA)和1,4-双(4'-氨基苯氧基)-2-(苯基)苯(p-TPEQ)进行了缩聚反应, 以4-苯乙炔苯酐作为封端剂, 合成了交联侧基苯乙炔封端酰亚胺预聚体(n=4). DSC测试结果表明, 引入交联侧基后预聚体依然保持着较宽的加工窗口. 利用所合成的预聚体在370℃热压1 h制备了热固性薄膜. DMA测试结果表明, 引入交联侧基的预聚体树脂具有更高的玻璃化转变温度, 并且其储存模量在玻璃化转变后有很好的保持.     

苯乙炔基封端聚酰亚胺材料研究进展

在过去二十年中，芳香族聚酰亚胺材料得到越来越广泛的应用，其中苯乙炔基封端的聚酰亚胺材料因其优异的性能成为目前耐高温聚合物材料研究的热点。本文综述了苯乙炔基封端聚酰亚胺材料的研究现状与发展趋势，着重对材料的化学结构设计与制备方法、以及化学结构与性能之间的关系进行介绍。     

4-苯乙炔基苯胺封端聚酰亚胺树脂的合成与性能研究

使用4-苯乙炔基苯胺(4-PEA)作为反应性封端剂,和3,3′,4,4′-二苯醚四酸二酐(ODPA),3,3′,4,4′-联苯四酸二酐(BPDA),1,4-双(4′-氨基-2′-三氟甲基苯氧基)苯(BTPB)和3,4′-二氨基二苯醚(3,4-′ODA)反应合成了系列4-苯乙炔基苯基封端的聚酰亚胺低聚物,对低聚物的化学结构、热性能和熔体粘度以及固化后树脂的热性能等进行了研究.实验结果表明,低聚物均具有一定的结晶性,含有ODPA的聚酰亚胺低聚物较之含有BPDA的低聚物具有更低的熔体粘度,且出现最低熔体粘度的温度更低;固化后的树脂表现出良好的热性能,含有BPDA的树脂具有更高的玻璃化转变温度;系列低聚物中二胺单体的比例对于低聚物的熔体粘度和固化后树脂的热稳定性有一定影响.     

乙炔基封端聚酰亚胺增韧改性的相结构

以双酚A二醚二酐(BPADA)和3乙-炔苯胺(APA)为原料,通过两步法合成一种热固性可交联的聚酰亚胺预聚体.将此预聚体分别与不同结构的热塑性聚酰亚胺(PI)共混,对其进行增韧改性,通过调控热塑性聚酰亚胺的质量分数,引入结构相似且含有更多柔性基团的热塑性聚酰亚胺(如含有醚键和对称甲基结构的二酐),得到了热固/热塑性聚酰亚胺复合膜.利用差示扫描量热仪(DSC)及扫描电镜(SEM)对该体系的相分离结构和相容性进行研究,并讨论其机械性能和热性能.结果表明,相分离结构使体系的机械性能得到改善,同时也保持了原有的优异热性能.     

双酚F型聚酰亚胺的合成及其性能表征

以苯酚和甲醛为原料,合成了双酚F(BPF)和双酚F二酐(BPFDA),用BPFDA分别和间苯二胺(m-PDA)、4,4'-二氨基二苯醚(4,4'-ODA)、1,4-(4-氨基苯氧基)苯(TPEQ)反应,得到了3种双酚F型聚酰亚胺,分别对其结构、溶解性、热性能和力学性能进行了表征.结果表明:聚合物的比浓对数黏度为0.5～...     

用于树脂传递模塑成型的苯乙炔封端的酰亚胺预聚体制备

采用4-苯乙炔苯酐(4-PEPA)、1,3-二(3-氨基苯氧基-4′-苯酰基)苯(BABB)和4,4′-双(3-氨基苯氧基)二苯甲酮(APBP)合成了两种苯乙炔苯酐封端的聚酰亚胺预聚体PI-1和PI-2, 并对预聚体的熔体黏度、稳定性、固化后树脂的热稳定性能和机械性能等进行了研究. 结果表明, 制备的预聚体具有较高产率(>95%); 与其它PEPA封端的聚酰亚胺相比, 两种预聚物在较低温度(200 ℃)时均具有很低的熔体黏度(1 Pa·s)和良好的熔体黏度稳定性, 固化后玻璃化温度达到300 ℃以上, 可适用于树脂传递模塑(RTM)成型制备耐高温高性能树脂基复合材料, 且在成型工艺上有了很大改善; 固化后的树脂具有优异的热稳定性能和良好的机械性能.     

4-苯乙炔苯酐封端聚酰亚胺树脂的合成与性能研究

使用3,3′,4,4′-二苯醚四酸二酐(ODPA)、3,3′,4,4′-联苯四酸二酐(BPDA)、1,3-双(4-氨基苯氧基)苯(1,3,4-APB)、3,4′-二氨基二苯醚(3,4′-ODA)和反应性封端剂4-苯乙炔苯酐(4-PEPA)合成了设计分子量为5000的系列苯乙炔基封端的聚酰亚胺低聚物,并使用XRD、DSC、TGA、FT-IR、DMA和流变仪等对低聚物的化学结构、热性能和熔体性能,固化后树脂的热性能和力学性能进行了测试.研究结果表明基于ODPA的低聚物具有低的熔体粘度和良好的熔体粘度稳定性,固化后的树脂具有很高的热失重温度,较高的玻璃化转变温度以及良好的力学性能尤其是高的断裂伸长率(>10%);基于BPDA的低聚物具有一定的结晶性,其结晶熔融温度与苯乙炔基固化交联温度相近,影响了材料的成型工艺性能.     

苯乙炔封端的BTDA系列酰亚胺预聚体的研究

合成了具有苯侧基的二胺单体1,4-双(4'-氨基苯氧基)-2-(苯基)苯(p-TPEQ), 并与3,3',4,4'-苯酮四羧酸二酐(BTDA)进行缩聚反应, 分别以4-苯乙炔苯酐(PEPA)和4-苯乙炔-1,8-萘二甲酸酐(PENA)作为封端剂, 合成了两个系列的苯乙炔封端的酰亚胺预聚体. DSC测试结果表明, 此类预聚体具有比PETI-5更宽的加工窗口; 利用所合成的预聚体制成了具有较高热分解温度热固性交联PI薄膜. 结果表明, PI预聚体加工性能良好, 其交联后具有优异的力学和热学性能; 同时PEPA封端的预聚体树脂具有比PENA封端的树脂更为优异的综合性能.     

带有不同端炔保护基团的新型苯乙炔树枝状化合物的合成

以1,3,5-三溴苯为原料,通过Sonogashira反应,设计并合成了两种带有不同端炔保护基团的1,3,5-取代的苯乙炔树枝状化合物:1,3,5-三[3-(3-甲基-3-羟基-1-丁炔基)-5-(三异丙基硅乙炔基)苯基乙炔基]苯(B1)和1,3,5-三[3-(三甲基硅乙炔基)-5-(三异丙基硅乙炔基)苯基乙炔基]苯(B2),并对合成路线的选择进行了比较和讨论.用1H NMR,13C NMR,质谱,元素分析等表征手段确认了中间体及最终产物的结构.这两种苯乙炔树枝状化合物各自带有两类不同的周边端炔保护基团,可根据其脱保护条件的不同引入不同的周边功能基团.     

Colorless poly(ether-imide)s deriving from 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride(BPADA) and aromatic bis(ether amine)s bearing pendent trifluoromethyl groups

A series of poly(ether-imide)s (III) characterized by colorless, highly solubility was synthesized from 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride(BPADA) and various fluorinated aromatic diamines (I_a-h) in DMAc via polycondensation to form poly(amic acid) (II), followed by chemical (C) and thermal (H) imidization. These polymers had inherent viscosities ranging from 0.60 to 1.3 dL/g. These polyimides were highly soluble in a variety of organic solvent such as amide-type, ether-type and chlorinated solvents. Moreover, these poly(ether-imide) films were almost colorless, with an ultraviolet-visible absorption cutoff wavelength below 390 nm and low b* value (a yellowness index) of 4.6-18.0. The III series showed strength tensile of 72-101 MPa, elongation at break of 11-25%, initial modulus of 1.5-2.0 GPa. The glass transition temperature (T_g) of III_a-h were in the range of 202-267 °C, and the decomposition temperature above 493 °C and left 40-65% char yield at 800 °C in nitrogen. They had the lower dielectric constants of 3.39-3.72 (1 MHz) and moisture absorptions in the range of 0.11-0.40%.     

Novel organosoluble and colorless poly(ether imide)s based on 1,1-bis[4-(3,4-dicarboxyphenoxy)phenyl]cyclohexane dianhydride and trifluoromethyl-substituted aromatic bis(ether amine)s

A series of novel fluorinated poly(ether imide)s (IV) having inherent viscosities of 0.70-1.08 dL/g were prepared from 1,1-bis[4-(3,4-dicarboxyphenoxy)phenyl]cyclohexane dianhydride (I) and various trifluoromethyl (CF₃)-substituted aromatic bis(ether amine)s II_a-g by a standard two-step process with thermal and chemical imidization of poly(amic acid) precursors. These poly(ether imide)s showed excellent solubility in many organic solvents and could be solution-cast into transparent, flexible, and tough films. These films were essentially colorless, with an ultraviolet-visible absorption edge of 375-380 nm and a very low b^∗ value (a yellowness index) of 5.5-7.3. They also showed good thermal stability with glass-transition temperatures of 207-269 °C, 10% weight loss temperatures in excess of 474 °C, and char yields at 800 °C in nitrogen more than 62%. In comparison with analogous V series poly(ether imide)s without the -CF₃ substituents, the IV series polymers showed better solubility, lower color intensity, and lower dielectric constants.     

New poly(amide-imide) syntheses. V. Preparation and properties of poly(amide-imide)s based on the diimide—diacid condensed from 2,2-bis[4-(4-aminophenoxy)phenyl]propane and trimellitic anhydride

A dicarboxylic acid ( 1 ) bearing two pre-formed imide rings, was prepared from the condensation of 2,2-bis[4-(4-aminophenoxy)phenyl]propane and trimellitic anhydride. A new family of poly(amide-imide)s having inherent viscosities of 0.53–1.68 dL/g was prepared by the triphenyl phosphite activated polycondensation from the diimide—diacid I with various aromatic diamines in a medium consisting of N-methyl-2-pyrolidone (NMP), pyridine, and calcium chloride. Most of the resulting polymers showed an amorphous nature and were readily soluble in polar solvents such as NMP and N,N-dimethylacetamide. All the soluble poly(amide-imide)s afforded transparent, flexible, and tough films. The glass transition temperatures of these poly(amide-imide)s were in the range of 237–293°C and the 10% weight loss temperatures were above 508°C in nitrogen. © 1993 John Wiley & Sons, Inc.     

Preparation and characterization of colorless alternate poly(amide-imide)s based on trimellitic anhydride and 2,2-bis[4-(3-aminophenoxy)phenyl]sulfone

Alternate poly(amide-imide) [P(A-alt-I)] was synthesized from two aromatic diamines and trimellitic anhydride (TMA). When the diamine was 2,2-bis[4-(3-aminophenoxy)phenyl]sulfone (BAPS), the resulted P(A-alt-I) was found to be of light color. Specifically, when BAPS was located between two amide groups in the P(A-alt-I) chain, the P(A-alt-I) was almost colorless. A series of P(A-alt-I)s (Series III) containing BAPS was synthesized through direct polycondensation of an aromatic dicarboxylic acid prepared from various aromatic diamines and TMA, as well as BAPS. Polymers of Series III were much lighter in color than those of the isomeric series (BAPS was located between two imide group). The series of P(A-alt-I)s III had inherent viscosities ranging 0.69–1.35 dL/g and good solubility in various solvents. The tensile strengths, elongations to break, and initial moduli of the films were 72–107 MPa, 7–12% and 1.93–2.39 GPa, respectively, and most of the films had no yielding. Polymers of Series III had glass transition temperatures 210–272°C and 10% weight loss temperatures in nitrogen 518–545°C, indicating excellent thermal stability. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 2421–2428, 1999     

长链聚酰胺酸的热环化动力学

利用GPC、原位FTIR测定了长链聚酰胺酸PAA(由双酚A二酐与 4 ,4′ 二 (4 胺基苯氧基 )二苯酚制备 )的热环化过程 .结果表明 ,在升温热环化的初始阶段 ,聚合物环化的同时其分子链断裂成酐、胺端基分子链 ,相对数均分子量降低 ,薄膜渐脆 ;随着温度进一步的升高 ,酐、胺端基链又重新链合 ,相对数均分子量回升 ,薄膜重具韧性 ;恒温热环化存在两个明显的阶段 ,初期的快速阶段和后期的慢速阶段 ,表现出动力学中断的现象 .采用两步、一级动力学模型研究热环化并得出相关的动力学参数 (速率常数、活化能、指前因子等 ) .针对恒温热环化 ,建立动力学中断时亚胺化程度与温度的关联式 ,从构象转化与自由体积两个方面对动力学中断现象提出解释 ,并由实验数据得到了该关联式的相关参数     

Synthesis and characterization of organosoluble copolyimides based on 2,2‐Bis[4‐(4‐aminophenoxy)phenyl]propane, 2,2‐Bis[4‐(4‐aminophenoxy)phenyl]hexafluoropropane and a pair of commercial aromatic dianhydrides

Organosoluble homopolyimides (PIs) and copolyimides (CoPIs) were synthesized from 2,2‐bis[4‐(4‐aminophenoxy)phenyl]propane (BAPP) or 2,2‐bis[4‐(4‐aminophenoxy)phenyl]hexafluoropropane (6FBAPP) and six kinds of commercial aromatic dianhydrides (PMDA, II _a ; BTDA, II _b ; BPDA, II _c ; ODPA, II _d ; DSDA, II _e ; 6FDA, II _f ). Although BAPP and II _d∼f could prepare three kinds of soluble PIs ( III‐A _d∼f ), likewise 6FBAPP and II _c∼f could prepare four PIs ( III‐B _c∼f ), the insoluble PIs were synthesized from these two diamines and other dianhydrides. However, soluble CoPIs could be prepared by alternative copolycondensation from a pair of dianhydrides of soluble PIs and insoluble PIs in certain molar ratios (m₁/m₂). The ratios of m₁/m₂ of BAPP/PMDA series CoPIs ( IV _{m1(d–f)/m2a} ) ranged from 3–5, but ratios of 6FBAPP/PMDA series CoPIs ( V _{m1(c∼f)/m2a} ) decreased to 2–3. The m₁/m₂ of the BAPP/BTDA and 6FBAPP/BTDA series CoPIs were 2, while the BAPP/BPDA series were between 1–2. Composition, solubility, tensile properties and thermal properties of these CoPIs synthesized via a two‐stage thermal cyclodehydration were determined and were compared with their corresponding PIs. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 3954–3961, 2000     

Synthesis of a Novel Ligand Containing Phenyl Pyridine

In this article, we provide a new, efficient route to synthesize 2-[3-(3,4-bis(2-ethylhexyloxy)phenyl]phenyl pyridine ligand from readily available starting materials. The target compound was obtained by a condensation reaction and Suzuki coupling reaction. Structures of compounds were demonstrated by ¹H NMR, ¹³C NMR, and high-resolution mass spectrometry. The advantages of this synthetic route are simple operation, mild reaction conditions, and good yields.     

Preparation and properties of new soluble aromatic polyimides from 2,2′-bis(3,4-dicarboxyphenoxy)biphenyl dianhydride and aromatic diamines

A new aromatic tetracarboxylic dianhydride having a crank and twisted noncoplannar structure, 2,2′-bis(3,4-dicarboxyphenoxy)biphenyl dianhydride, was synthesized by the reaction of 4-nitrophthalonitrile with biphenyl-2,2′-diol, followed by hydrolysis and cyclodehydration. The biphenyl-2,2′-diyl-containing aromatic polyimides having inherent viscosities up to 0.66 dL/g were obtained by the conventional two-step procedure starting from the dianhydride monomer and various aromatic diamines. Most of the polyimides were readily soluble in amide-type solvents such as N,N-dimethylacetamide and N-methyl-2-pyrrolidone. The aromatic polyimides had glass transition temperatures in the range of 205–242°C, and began to lose weight around 415°C, with 10% weight loss being recorded at about 500°C in air. © 1998 John Wiley & Sons, Inc. J. Polym. Sci. A Polym. Chem. 36: 2021–2027, 1998     

Synthesis and characterization of norbornane-containing cardo polyamides

A new diamine, 2,2-bis[4-(4-aminophenoxy)phenyl]norbornane (BAPN), containing both ether and norbornane cardo groups, was synthesized in three steps started from norcamphor. A series of cardo polyamides were obtained by the direct polycondensation of BAPN and various aromatic dicarboxylic acids in N-methyl-2-pyrrolidinone (NMP) using triphenyl phosphite and pyridine as condensing agents. Polyamides had inherent viscosities in the range of 0.82–1.58 dL g⁻¹, and were readily soluble in polar aprotic solvents such as NMP, N,N-dimethylacetamide (DMAc) and N,N-dimethylformamide and dimethyl sulfoxide. These polymers were cast in DMAc solution into transparent, flexible, and tough films that were further characterized by X-ray and mechanical analysis. All the polymers were amorphous, and the polyamide films had a tensile strength range of 71–89 MPa, an elongation at break range of 5–9%, and a tensile modulus range of 2.0–2.3 GPa. Polyamides showed glass transition temperatures in the range of 256–296°C as measured by DSC and thermogravimetric analysis indicated no weight loss below 450°C in nitrogen and air atmosphere. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 2791–2794, 1999