Characterization of Al/Si junctions on Si(100) wafers with chemical vapor deposition-based sulfur passivation

Chemical vapor deposition-based sulfur passivation using hydrogen sulfide is carried out on both n-type and p-type Si(100) wafers. Al contacts are fabricated on sulfur-passivated Si(100) wafers and the resultant Schottky barriers are characterized with current–voltage (I–V), capacitance–voltage (C–V) and activation-energy methods. Al/S-passivated n-type Si(100) junctions exhibit ohmic behavior with a barrier height of <0.078 eV by the I–V method and significantly lower than 0.08 eV by the activation-energy method. For Al/S-passivated p-type Si(100) junctions, the barrier height is ~0.77 eV by I–V and activation-energy methods and 1.14 eV by the C–V method. The discrepancy between C–V and other methods is explained by image force-induced barrier lowering and edge-leakage current. The I–V behavior of an Al/S-passivated p-type Si(100) junction remains largely unchanged after 300 °C annealing in air. It is also discovered that heating the S-passivated Si(100) wafer before Al deposition significantly improves the thermal stability of an Al/S-passivated n-type Si(100) junction to 500 °C.     

Point defect generation in pulsed impure solids

Abstract

The effect of beam incidence on dry etching damage in n- and p-type silicon has been studied with Schottky barriers fabricated on samples etched with 0.5 keV and 1.0 keV Ar. The electrical properties of Schottky barriers are extremely sensitive to surface damage, and it is found that there is a steep dependence of the effective Schottky barrier height on the angle of incidence. Evaluation of the current-voltage and capacitance-voltage characteristics of the diodes shows that the barrier modification peaks at an angle of incidence of about 45°.     

Tailoring of Schottky barrier heights in Si and GaAs using metal alloys for infrared detectors

The tailoring of Schottky barrier heights in semiconductors for IR detectors is still a difficult task. Various approaches to modify barrier heights have been reported in the literature. A comparatively easier technique for tailoring barrier heights in Si and GaAs by adjusting the alloy composition of suitable metal alloys is proposed in this paper. The experimental verification of this technique, using Pd-Al alloy Schottky contacts on p-type Si, is also reported.     

快速热退火对Co/Si0.85Geo.15肖特基结电学特性的影响

用离子束溅射技术分别在SiO2和单晶Si衬底上沉积了Si1-xGex和Co薄膜.在不同温度下,对Co/Si1-xGex肖特基结进行快速热退火处理(RTA),对处理后的样品进行了表面形貌和电学测量.发现退火温度升高,样品表面粗糙度变大,理想因子也变大,但对肖特基势垒高度(SBH)的影响很小.分析认为,随着退火温度的升高,...     

Modification of terminating species and band alignment at the interface between alumina films and metal single crystals

Thin epitaxial alumina films were grown on Cu(111), Cu–9 at.%Al(111), Ni(111) and NiAl(110) single crystals. The alumina films grew in such a manner that hexagonal or pseudo-hexagonal oxygen lattices were parallel to the surface of the substrates. Photoelectron spectra were obtained either with synchrotron or Al K-alpha radiation. We measured Al 2p spectra and determined the atomic species that terminated the interface between the alumina films and the substrates. The influence of Al in the substrates on the species that terminated the interface has been discussed based on thermodynamics. From valence band spectra, p-type Schottky barrier height (energy difference between the Fermi level of the metallic substrates and the valence band maximum of the alumina films, band offset) was determined. Differences in interface terminating species resulted in variations in p-type Schottky barrier height, or band alignment.     

Study of Ni/Si(1 0 0) solid-state reaction with Al addition

The characteristics of Ni/Si(1 0 0) solid-state reaction with Al addition (Ni/Al/Si(1 0 0), Ni/Al/Ni/Si(1 0 0) and Al/Ni/Si(1 0 0)) is studied. Ni and Al films were deposited on Si(1 0 0) substrate by ion beam sputtering. The solid-state reaction between metal films and Si was performed by rapid thermal annealing. The sheet resistance of the formed silicide film was measured by four-point probe method. The X-ray diffraction (XRD) was employed to detect the phases in the silicide film. The Auger electron spectroscopy was applied to reveal the element profiles in depth. The influence of Al addition on the Schottky barrier heights of the formed silicide/Si diodes was investigated by current-voltage measurements. The experimental results show that NiSi forms even with the addition of Al, although the formation temperature correspondingly changes. It is revealed that Ni silicidation is accompanied with Al diffusion in Ni film toward the film top surface and Al is the dominant diffusion species in Ni/Al system. However, no Ni_xAl_y phase is detected in the films and no significant Schottky barrier height modulation by the addition of Al is observed.     

Schottky barrier at the Al/Si(111) doped and double-doped interfaces: a local-density cluster study

Using the local-density approximation method we have investigated a cluster model of the Al/Si(111) interface. P atoms were placed in the fifth silicon double-atomic layer (DAL) counting from the interface. The second DAL was doped with either Ga or As. The Schottky barrier height was found to be 0.75 eV at the Al/Si(intrinsic) system and 0.73 eV at the Al/Si(P-doped) case. The additional doping of the near-interface layer by Ga increased the barrier to 0.90 eV while the As doping decreased it to 0.5 eV.     

Schottky contact barrier height enhancement on p-type silicon by wet chemical etching

A wet chemical etch preceding the usual cleaning process has been found to yield Schottky barriers of high values on p-type silicon. This procedure produces a passivated surface layer which has resulted in Al/0-Si Schottky diodes with barrier height of 0.75 eV and ideality factor of 1.15. Measurements have confirmed the presence of electrically active donor-like states in this surface layer. The origin of the donor states is explained in terms of the deactivation of the boron acceptor by the formation ofH ⁺ B ^– pairs.     

热退火处理对AuGeNi/n-AlGaInP欧姆接触性能的影响

本文在n-(Al0.27Ga0.73)0.5In0.5P表面通过电子束蒸发Ni/Au/Ge/Ni/Au叠层金属并优化退火工艺成功制备了具有较低接触电阻的欧姆接触,其比接触电阻率在445℃退火600 s时达到1.4×10–4 W·cm2.二次离子质谱仪测试表明,叠层金属Ni/Au/Ge/Ni/Au与n-AlGaInP界面发生固相反应,Ga,In原子由于热分解发生外扩散并在晶格中留下Ⅲ族空位.本文把欧姆接触形成的原因归结为Ge原子内扩散占据Ga空位和In空位作为施主提高N型掺杂浓度.优化退火工艺对低掺杂浓度n-(Al0.27Ga0.73)0.5In0.5P的欧姆接触性能有显著改善效果,但随着n-(Al0.27Ga0.73)0.5In0.5P掺杂浓度提高,比接触电阻率与退火工艺没有明显关系.本文为n面出光的AlGaInP薄膜发光二极管芯片的n电极制备提供了一种新的方法,有望大幅简化制备工艺,降低制造成本.     

Electrical characteristics of p-Si/TiO2/Al and p-Si/TiO2-Zr/Al Schottky devices

Electrical devices involve different types of diode in prospective electronics is of great importance. In this study, p-type Si surface was covered with thin film of TiO₂ dispersion in H₂O to construct p-Si/TiO₂/Al Schottky barrier diode (D1) and the other one with TiO₂ dispersion doped with zirconium to construct p-Si/TiO₂-Zr/Al diode (D2) by drop-casting method in the same conditions. Electrical properties of as-prepared diodes and effect of zirconium as a dopant were investigated. Current–voltage (I–V) characteristics of these devices were measured at ambient conditions. Some parameters including ideality factor (n), barrier height (Φ_B0), series resistance (Rs) and interface state density (Nss) were calculated from I–V behaviours of diodes. Structural comparisons were based on SEM and EDX measurements. Experimental results indicated that electrical parameters of p-Si/TiO₂/Al Schottky device were influenced by the zirconium dopant in TiO₂.     

The electrical characterization of Zn(Phen)q/p-type Si/Al diode with interfacial layer by current–voltage characteristics

The current–voltage characteristics of Zinc (II) [(8-hydroxyquinoline)(1,10-phenanthroline)] complex (Zn(phen)q)/p-type Si/Al diode with interfacial layer have been investigated. The barrier height and ideality factor of the diode were found to be 0.71 eV and 2.05. Zn(phen)q/p-type Si/Al diode shows a metal–insulator–semiconductor structure resulted from presence of series resistance and an interfacial layer. The n and φ_B values obtained the presence of interfacial layer are 1.02 and 0.70 eV, respectively. The effect of series resistance was evaluated using a method developed by Cheung. The R_s and n values were determined from the d ln(I)/dV plot and were found to be 30.43 kΩ and 2.16, respectively. The barrier height and R_s values were calculated from the H(I)–I plot and were found to be 0.70 eV and 30.99 kΩ. The density of the interface states of the Zn(phen)q/p-type Si/Al diode was calculated and was found to be an order of 10¹³ eV⁻¹ cm⁻².     

Tuning the Schottky barrier in the arsenene/graphene van der Waals heterostructures by electric field

Using density functional theory calculations, we investigate the electronic properties of arsenene/graphene van der Waals (vdW) heterostructures by applying external electric field perpendicular to the layers. It is demonstrated that weak vdW interactions dominate between arsenene and graphene with their intrinsic electronic properties preserved. We find that an n-type Schottky contact is formed at the arsenene/graphene interface with a Schottky barrier of 0.54 eV. Moreover, the vertical electric field can not only control the Schottky barrier height but also the Schottky contacts (n-type and p-type) and Ohmic contacts (n-type) at the interface. Tunable p-type doping in graphene is achieved under the negative electric field because electrons can transfer from the Dirac point of graphene to the conduction band of arsenene. The present study would open a new avenue for application of ultrathin arsenene/graphene heterostructures in future nano- and optoelectronics.     

The modulation of Schottky barrier height of NiSi/n-Si Schottky diodes by silicide as diffusion source technique

This paper reports that the Schottky barrier height modulation of NiSi/n-Si is experimentally investigated by adopting a novel silicide-as-diffusion-source technique, which avoids the damage to the NiSi/Si interface induced from the conventional dopant segregation method. In addition, the impact of post-BF₂ implantation after silicidation on the surface morphology of Ni silicides is also illustrated. The thermal stability of Ni silicides can be improved by silicide-as-diffusion-source technique. Besides, the electron Schottky barrier height is successfully modulated by 0.11~eV at a boron dose of 10¹⁵~cm^-2 in comparison with the non-implanted samples. The change of barrier height is not attributed to the phase change of silicide films but due to the boron pile-up at the interface of NiSi and Si substrate which causes the upward bending of conducting band. The results demonstrate the feasibility of novel silicide-as-diffusion-source technique for the fabrication of Schottky source/drain Si MOS devices.     

Interface effects on the quantum well states of Pb thin films

Using scanning tunneling spectroscopy, we have studied the interface effect on quantum well states of Pb thin films grown on various metal-terminated (Pb, Ag, and Au) n-type Si(111) surfaces and on two different p-type Si(111) surfaces. The dispersion relation E(k) of the electrons of the Pb film and the phase shift at the substrate interface were determined by applying the quantization rule to the measured energy positions of the quantum well states. Characteristic features in the phase shift versus energy curves were identified and were correlated to the directional conduction band of the silicon substrate and to the Schottky barrier formed between the metal film and the semiconductor. A model involving the band structure of the substrate, the Schottky barrier, and the effective thickness of the interface was introduced to qualitatively but comprehensively explain all the observed features of the phase shift at the substrate interface. Our physical understanding of the phase shift is critically important for using interface modification to control the quantum well states.     

Electrical peculiarities in Al/Si/Ge/…/Ge/Si and Al/SiGe/Si structures

The current–voltage (I–V) and capacitance–voltage (C–V) behaviour of different Si/Ge multilayers and SiGe single layers prepared on p-type Si substrates by magnetron sputtering and annealing, has been studied in the temperature range of 80–320 K by using Al Schottky contacts as test structures. Although a significant influence of the microstructure of the Si/Ge multilayers and SiGe layers was obtained on the electrical behaviour of the structures, the structures exhibited similar specific features.     

Chemical tuning of metal-semiconductor interfaces

We report a study of the Schottky barrier for Pb films grown on Si surfaces terminated by various metals (Ag, In, Au, and Pb) to explore the atomic-scale physics of the interface barrier and a means to control the barrier height. Electronic confinement by the Schottky barrier results in quantum well states in the Pb films, which are measured by angle-resolved photoemission. The barrier height is determined from the atomic-layer-resolved energy levels and the line widths. A calculation based on the known interface chemistry and the electronegativity yields predicted barrier heights in good agreement with the experiment.     

Selective high-resolution electrodeposition on semiconductor defect patterns

We report a new principle and technique that allows one to electrodeposit material patterns of arbitrary shape down to the submicrometer scale. We demonstrate that an electrochemical metal deposition reaction can be initiated selectively at surface defects created in a p-type Si(100) substrate by Si (++) focused ion beam bombardment. The key principle is that, for cathodic electrochemical polarization of p-type material in the dark, breakdown of the blocking Schottky barrier at the semiconductor/electrolyte interface occurs at significantly lower voltages at implanted locations than for an unimplanted surface. This difference in the threshold voltages is exploited to achieve selective electrochemical deposition.     

金属与半导体Ge欧姆接触制备、性质及其机理分析

金属与Ge材料接触时界面处存在着强烈的费米钉扎效应, 尤其与n型Ge形成的欧姆接触的比接触电阻率高, 是制约Si基Ge器件性能的关键因素之一. 本文对比了分别采用金属Al和Ni 与Si衬底上外延生长的p型Ge和n型Ge材料的接触特性. 发现在相同的较高掺杂条件下, NiGe与n型Ge可形成良好的欧姆接触, 其比接触电阻率 较 Al接触降低了一个数量级, 掺P浓度为2×10¹⁹ cm^-3时达到1.43×10^-5 Ω·cm². NiGe与p型Ge接触和Al接触的比接触电阻率相当, 掺B浓度为4.2×10¹⁸ cm^-3时达到1.68×10^-5 Ω·cm². NiGe与n型Ge接触和Al电极相比较, 在形成NiGe过程中, P杂质在界面处的偏析是其接触电阻率降低的主要原因. 采用NiGe作为Ge的接触电极在目前是合适的选择. 关键词： 金属与Ge接触性质 NiGe 比接触电阻率     

Analysis of thermionic emission from electrodeposited Ni–Si Schottky barriers

Ni–Si Schottky barriers are fabricated by electrodeposition using n on n+ Si substrates. I–V, C–V and low temperature I–V measurements are presented. A high-quality Schottky barrier with extremely low reverse leakage current is revealed. The results are shown to fit an inhomogeneous barrier model for thermionic emission over a Schottky barrier proposed by Werner and Guttler [J.H. Werner, H.H. Guttler, Barrier inhomogeneities at Schottky contacts, J. Appl. Phys. 69 (3) (1991) 1522–1533]. A mean value of 0.76 V and a standard deviation of 66 mV is obtained for the Schottky barrier height at room temperature with a linear bias dependence. X-ray diffraction and scanning electron microscopy measurements reveal a polycrystalline Ni film with grains that span from the Ni–Si interface to the top of the Ni layer. The variation in Ni orientation is suggested as a possible source of the spatial distribution of the Schottky barrier height.     

Electrical and structural properties of a stacked metal layer contact to n-InP

In this study, we found that the double metal contact structure in Pt/Al/n-InP diodes provides better rectification characteristics than conventional single-metal/n-InP Schottky diodes. The effective barrier height was measured to be 0.67 eV for a 400 °C-annealed Pt/Al/n-InP diode sample. The increase in the barrier height is attributed to the formation of Al₂O₃ at the metal/n-InP contact interface during thermal annealing. The formation of the phase Al₂O₃ phase was monitored by X-ray diffraction (XRD) analysis. The corresponding element profiles of Al and O were also confirmed at the metal/n-InP contact interface using secondary ion mass spectrum (SIMS) analysis. The lowering of the Schottky barrier height due to the inhomogeneity at the metal/n-InP junction is also discussed on the basis of the TE theory. The distribution of local effective Schottky barrier heights was explained by a model incorporating the existence of double Gaussian barrier heights, which represent the high barrier and low barrier of the full distribution in the temperature ranges of 83-198 and 198-300 K.