High‐performance In–Zn–O thin‐film transistors with a soluble processed ZrO2 gate insulator

Spin‐coated zirconium oxide films were used as a gate dielectric for low‐voltage, high performance indium zinc oxide (IZO) thin‐film transistors (TFTs). The ZrO₂ films annealed at 400 °C showed a low gate leakage current density of 2 × 10^–8 A/cm² at an electric field of 2 MV/cm. This was attributed to the low impurity content and high crystalline quality. Therefore, the IZO TFTs with a soluble ZrO₂ gate insulator exhibited a high field effect mobility of 23.4 cm²/V s, excellent subthreshold gate swing of 70 mV/decade and a reasonable I_on/off ratio of ～10⁶. These TFTs operated at low voltages (～3.0 V) and showed high drain current drive capability, enabling oxide TFTs with a soluble processed high‐k dielectric for use in backplane electronics for low‐power mobile display applications. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

High performance Zn–Sn–O thin film transistors with Cu source/drain electrode

Zn–Sn–O (ZTO) thin film transistors (TFTs) were fabricated with a Cu source/drain electrode. Although a reasonably high mobility (μ_FE) of 13.2 cm²/Vs was obtained for the ZTO TFTs, the subthreshold gate swing (SS) and threshold voltage (V_th) of 1.1 V/decade and 9.1 V, respectively, were inferior. However, ZTO TFTs with Ta film inserted as a diffusion barrier, exhibited improved SS and V_th values of 0.48 V/decade and 3.0 V, respectively as well as a high μ_FE value of 18.7 cm²/Vs. The improvement in the Ta‐inserted device was attributed to the suppression of Cu lateral diffusion into the ZTO channel region. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

退火温度对溶胶-凝胶法制备锌锡氧化物薄膜晶体管的影响

采用溶胶-凝胶法制备了非晶锌锡氧化物(ZTO)薄膜晶体管(TFT),通过热重-差热分析(TG-DTA)对ZTO胶体中的化学反应进行了分析,研究了不同退火温度对ZTO TFTs性能的影响。结果表明:当退火温度在300~500℃范围内时,薄膜为非晶态结构,薄膜表面致密、平整。当退火温度达到400℃时,薄膜在可见光范围内具有高透过率(>85%)。随着退火温度的升高,器件阈值电压明显降低,由15.85 V降至3.76 V,载流子迁移率由0.004 cm²·V^-1·s^-1提高到5.16 cm²·V^-1·s^-1,开关电流比达到10⁵。退火温度的升高明显改善了ZTO TFT的电学性能。     

Effect of antimony doping on the low‐temperature performance of solution‐processed indium oxide thin film transistors

The effects of antimony (Sb) doping on solution‐processed indium oxide (InO_x) thin film transistors (TFTs) were examined. The Sb‐doped InSbO TFT exhibited a high mobility, low gate swing, threshold voltage, and high I_ON/OFF ratio of 4.6 cm²/V s, 0.29 V/decade, 1.9 V, and 3 × 10⁷, respectively. The gate bias and photobias stability of the InSbO TFTs were also improved by Sb doping compared to those of InO_x TFTs. This improvement was attributed to the reduction of oxygen‐related defects and/or the existence of the lone‐pair s‐electron of Sb³⁺ in amorphous InSbO films. (© 2014 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Investigation of the electrical properties and stability of HfInZnO thin-film transistors

In this study, amorphous HfInZnO (a-HIZO) thin films and related thin-film transistors (TFTs) were fabricated using the RF-sputtering method. The effects of the sputtering power (50–200 W) on the structural, surface, electrical, and optical properties of the a-HIZO films and the performance and NBIS stability of the a-HIZO TFTs were investigated. The films’ N_e increased and resistivity decreased as the sputtering power increased. The 100 W deposited a-HIZO film exhibited good optical and electrical properties compared with other sputtering powers. Optimization of the 100 W deposited a-HIZO TFT demonstrated good device performance, including a desirable μ_FE of 19.5 cm²/Vs, low SS of 0.32 V/decade, low V_th of 0.8 V, and high I_on/I_off of 10⁷, respectively. The 100 W deposited a-HIZO TFT with Al₂O₃ PVL also exhibited the best stability, with small V_th shifts of -2.2 V during NBIS testing. These high-performance a-HIZO thin films and TFTs with Al₂O₃ PVL have practical applications in thin-film electronics.     

The effect of post-metal annealing on the electrical performance and stability of two-step-annealed solution-processed In2O3 thin film transistors

In this work, solution-processed indium oxide (In₂O₃) thin film transistors (TFTs) were fabricated by a two-step annealing method. The influence of post-metal annealing (PMA) temperatures on the electrical performance and stability is studied. With the increase of PMA temperatures, the on-state current and off-state current (I_on/I_off) ratio is improved and the sub-threshold swing (SS) decreased. Moreover, the stability of In₂O₃ TFTs is also improved. In all, In₂O₃ TFT with post-metal annealing temperature of 350°С exhibits the best performance (a threshold voltage of 4.75 V, a mobility of 13.8 cm²/V, an I_on/I_off ratio of 1.8 × 10⁶, and a SS of 0.76 V/decade). Meanwhile, the stability under temperature stress (TBS) and positive bias stress (PBS) also show a good improvement. It shows that the PMA treatment can effectively suppress the interface trap and bulk trap and result in an obviously improvement of the In₂O₃ TFTs performance.     

Oxygen plasma and high pressure H<Subscript>2</Subscript>O vapor heat treatments used to fabricate polycrystalline silicon thin film transistors

Oxygen plasma and high pressure H₂O vapor heat treatment were applied to fabrication of n-channel polycrystalline silicon thin film transistors (poly-Si TFTs). 13.56 MHz-oxygen-plasma treatment at 250 °C, 100 W for 5 min effectively reduced defect states of 25-nm-thick silicon films crystallized by 30 ns-pulsed XeCl excimer laser irradiation. 1.3×10⁶-Pa-H₂O vapor heat treatment at 260 °C for 3 h was carried out in order to improve electrical properties of SiO_x gate insulators and SiO_x/Si interfaces. A carrier mobility of 470 cm²/V s and a low threshold voltage of 1.8 V were achieved for TFTs fabricated with crystallization at 285 mJ/cm². Received: 18 November 2002 / Accepted: 25 November 2002 / Published online: 11 April 2003 RID="*" ID="*"Corresponding author. Fax: +81-42/388-7109, E-mail: tsamesim@cc.tuat.ac.jp     

Influence of the active layer thickness on the electrical properties of ZnO thin film transistors fabricated by radio frequency magnetron sputtering

We report on the electrical properties of bottom-gate ZnO thin film transistors (TFTs) with different active layer thicknesses. The ZnO active layer films with thickness varied from 20 to 100 nm were deposited by radio frequency (rf) magnetron sputtering on SiO₂/p-Si substrate and annealed at a high temperature of 950 °C. The transistor with 40 nm thick ZnO exhibited the best performance, with a field effect mobility of 27.5 cm²/V s, a threshold voltage of −2.4 V and an on/off ratio of 7×10³.     

Top-gate amorphous IGZO thin-film transistors with a SiO buffer layer inserted between active channel layer and gate insulator

In this paper, top-gate thin-film transistors (TFTs) using amorphous In-Ga-Zn-O as the n-channel active layer and SiO₂ as gate insulator were fabricated by radio frequency magnetron sputtering at room temperature. In this device, a SiO layer was used to be a buffer layer between active layer and gate insulator for preventing the damage of the InGaZnO surface by the process of sputtering SiO₂ with relatively high sputtering power. The thickness of buffer layers was studied and optimized for enhancing the TFTs performances. Contrasting to the TFTs without buffer layer, the optimized thickness of 10 nm SiO buffer layer improved the top-gate TFTs performances greatly: mobility increases 30%, reached 1.29 cm²/V s, the I_on/I_off ratio increases 3 orders, and the trap density at the interface of channel/insulator decreases about 1 order, indicated that the improvement of semiconductor/dielectric interface by buffering the sputtering power.     

Improvement of electrical characteristics of InGaZnO thin film transistors by using HMDSO/O2 plasma deposited SiOCH buffer layer

In this work, we present the performance improved InGaZnO thin film transistors by inserting low temperature processed 10 nm thick SiOCH buffer layers between SiN_x insulator and InGaZnO channel layer. The influences of oxygen flow rate during the deposition of SiOCH buffer layer have been intensively investigated. Basing on the analysis of hall effect measurement and Fourier transform infrared spectrum, the SiOCH buffer layer can effectively increase the carrier concentration of the channel layer by the hydrogen doping due to re-sputtering and diffusion effect. The InGaZnO thin film transistor with buffer layer exhibits an enhanced performance with mobility of 13.09 cm²/vs, threshold voltage of −0.55 V and I_on/I_off over 10⁶.     

基于氧化铟锡的无结低电压薄膜晶体管

在室温下制备了基于氧化铟锡(ITO)的底栅结构无结薄膜晶体管. 源漏电极和沟道层都是同样的ITO薄膜材料,没有形成传统的源极结和漏极结, 因而极大的简化了制备流程,降低了工艺成本.使用具有大电容的双电荷层SiO₂作为栅介质, 发现当ITO沟道层的厚度降到约20 nm时, 器件的栅极电压可以很好的调控源漏电流. 这些无结薄膜晶体管具有良好的器件性能: 低工作电压(1.5 V), 小亚阈值摆幅(0.13 V/dec)、 高迁移率(21.56 cm²/V·s)和大开关电流比(1.3× 10⁶). 这些器件即使直接在大气环境中放置4个月, 器件性能也没有明显恶化:亚阈值摆幅保持为0.13 V/dec,迁移率略微下降至18.99 cm²/V·s,开关电流比依然大于10⁶.这种工作电压低、工艺简单、 性能稳定的无结低电压薄膜晶体管非常有希望应用于低能耗便携式电子产品以及新型传感器领域.     

Effects of ZnO coating on the performance of TiO2 nanostructured thin films for dye-sensitized solar cells

ZnO-coated TiO₂ (ZTO) thin films were deposited on ITO substrates by a sol–gel method for application as the work electrode for dye-sensitized solar cells (DSSCs). The I–V curve and the incident photon-to-current conversion efficiency (IPCE) value of DSSCs for ZTO thin films were studied and compared with single TiO₂ films. The results show that the short-circuit photocurrent (J _sc) and open-circuit voltage (V _oc) values increased from 3.7 mA/cm² and 0.68 V for the DSSCs with a single TiO₂ film to 4.5 mA/cm² and 0.72 V, respectively, for the DSSCs with a ZTO thin film. It indicated that the DSSCs with a ZTO thin film contributed to provide an inherent energy barrier that suppressed charge recombination significantly. In addition, the higher IPCE value in the ZTO thin film is attributed to the better charge separation by a fast electron transfer process using two semiconductors with different conduction band edges and energy positions.     

Characterization of Zn<Subscript>2</Subscript>SnO<Subscript>4</Subscript> Thin Films Prepared by RF Magnetron Sputtering

Zn₂SnO₄ (ZTO) is a stable semiconductor in ZnO–SnO₂ system and important transparent conducting oxide (TCO) predominantly used in optoelectronic devices. ZTO thin films were prepared by RF magnetron sputtering using Zn₂SnO₄ ceramic target in this paper. The effects of annealing temperatures and oxygen contents on characterization of ZTO thin films were studied. The results show that ZTO thin films prepared by RF magnetron sputtering are amorphous with an optical band gap of 3.22 eV. After annealing at 650°C in Ar atmosphere for 40 min, ZTO films possess a spinel structure with an optical band gap of 3.62 eV. The atomic force microscope (AFM) data of morphology reveals that the surface roughness of films is about 2 nm. The results of energy dispersive spectrometer (EDS) show that the concentration ratio of Zn to Sn is in the range from 1.44 to 1.57. The results of Hall-effect-measurement system reveal that the resistivity of films varies from 102 to 10–1 Ωcm, carrier concentration is about 10¹⁷ cm^–3, and mobility ranges from 10⁰ to 10¹ cm² v^–1 s^–1.     

High-performance amorphous indium gallium zinc oxide thin-film transistors with sol-gel processed gate dielectric and channel layer fabricated using microwave irradiation

In this study, we fabricated high-performance a-IGZO TFTs by forming Al₂O₃ and a-IGZO thin films for gate insulator and active channel layer, respectively, using a sol-gel process. MWI for low thermal budget process was used to condensate Al₂O₃ and a-IGZO films, which was compared with the CTA. It is found that the MWI is superior process to the conventional method in terms of precursor and solvent decomposition and has proven to be more effective for eliminating residual organic contaminants. In addition, the MWI-treated Al₂O₃ and IGZO films have smoother surfaces, higher visible light transmittance, lower carbon contamination and impurities than the CTA-treated films. We have demonstrated that a-IGZO TFTs with sol-gel solution-processed Al₂O₃ gate insulator and a-IGZO channel layer can achieve a field effect mobility of 69.2 cm²/V·s, a subthreshold swing of 86.2 mV/decade and a large on/off current ratio of 1.48 × 10⁸, by the MWI process even at temperatures below 200 °C. In addition, the MWI-treated a-IGZO TFTs have excellent resistance to electron trapping and good stability to positive and negative gate-bias stress. Therefore, the sol-gel processed a-IGZO TFTs with Al₂O₃ gate oxide and the MWI treatment with a low thermal budget are promising for emerging transparent flat panel displays applications.     

Gadolinium scandate as an alternative gate dielectric in field effect transistors on conventional and strained silicon

Long channel n-type metal oxide semiconductor field effect transistors on thin conventional and strained silicon on insulator substrates have been prepared by integrating gadolinium scandate as high-κ gate dielectric in a gate last process. The GdScO₃ films were deposited by electron beam evaporation and subsequently annealed in oxygen atmosphere. Electrical characterization of readily processed devices reveals well behaved output and transfer characteristics with high I _on/I _off ratios of 10⁶–10⁸, and steep inverse subthreshold slopes down to 66 mV/dec. Carrier mobilities of 155 cm²/Vs for the conventional and 366 cm²/Vs for the strained silicon substrates were determined.     

Effect of Ge doping on the electrical properties of amorphous Zn–Sn–O thin films

We report the effect of germanium doping on the active layer of amorphous Zinc–Tin-Oxide (a-ZTO) thin film transistor (TFT). Amorphous thin film samples were prepared by RF magnetron sputtering using single targets composed of Zn₂Ge_0.05Sn_0.95O₄ and Zn₂SnO₄ with variable oxygen contents in the sputtering gases. In comparison with undoped, Ge-doped a-ZTO films exhibited five order of magnitude lower carrier density with a significantly higher Hall-mobility, which might be due to suppressed oxygen vacancies in the a-ZTO lattice since the Ge substituent for the Sn site has relatively higher oxygen affinity. Thus, the bulk and interface trap densities of Ge-doped a-ZTO film were decreased one order of magnitude to 7.047 × 10¹⁸ eV⁻¹cm⁻³ and 3.52 × 10¹¹ eV⁻¹cm⁻², respectively. A bottom-gate TFT with the Ge-doped a-ZTO active layer showed considerably improved performance with a reduced SS, positively shifted V_th, and two orders of magnitude increased I_on/I_off ratio, attributable to the doped Ge ions.     

Thin film transistors based on TiO2 fabricated by using radio-frequency magnetron sputtering

This study demonstrates that nanocrystalline TiO₂ thin films were deposited on ITO/glass substrate by radio-frequency magnetron sputtering. Field-emission scanning electron microscope (FE-SEM) and atomic force microscopic (AFM) images showed the morphology of TiO₂ channel layer with grain size and root-mean-square (RMS) roughness of 15 and 5.39 nm, respectively. TiO₂ thin-film transistors (TFTs) with sputter-SiO₂ gate dielectric layer were also fabricated. It was found that the devices exhibited enhancement mode characteristics with the threshold voltage of 7.5 V. With 8-μm gate length, it was also found that the I_on/off ratio and off-state current were around 1.45×10² and 10 nA, respectively.     

Highly stable hafnium–tin–zinc oxide thin film transistors with stacked bilayer active layers

Hf–Sn–Zn–O (HTZO) thin films were prepared on SiO₂/SiN_x substrates at room temperature by the direct current (DC) magnetron sputtering of Hf-doped Sn–Zn–O targets. The characteristics of films with different amounts of Hf were analyzed. Amorphous HTZO films were obtained by increasing the Hf content, while polycrystalline films have not shown with Hf doping. With the proper Hf concentration in the HTZO films (∼2.0 atomic % Hf/(Hf + Sn + Zn + O)), HTZO films demonstrated good performance as an oxide semiconductor channel material in thin film transistors (TFTs) with a field effect mobility (μ_FE) of 10.9 cm²V⁻¹ s⁻¹, an on/off current ratio of 10⁹, and a subthreshold voltage swing of 0.71 V/decade.     

Extraction of density-of-states in amorphous InGaZnO thin-film transistors from temperature stress studies

The instability of amorphous InGaZnO (a-IGZO) thin-film transistors (TFTs) with different active layer thicknesses under temperature stress has been investigated through using the density-of-states (DOS). Interestingly, the a-IGZO TFT with 22 nm active layer thickness showed a better stability than the others, which was observed from the decrease of interfacial and semiconductor bulk trap densities. The DOS was calculated based on the experimentally-obtained activation energy (E_A), which can explain the experimental observations. We developed the high-performance Al₂O₃ TFT with 22 nm IGZO channel layer (a high mobility of 7.4 cm²/V, a small threshold voltage of 2.8 V, a high I_on/I_off 1.8 × 10⁷, and a small SS of 0.16 V/dec), which can be used as driving devices in the next-generation flat panel displays.     

Phase evolution and effect of pre-heating temperature on the characteristics of PZT thin films grown by using a triol sol--gel route

Lead zirconate titanate (PZT) films were fabricated on Pt(111)/Ti/SiO₂/Si(100) using the triol sol--gel method. The effect of the pre-heating temperature on the phase transformations, microstructures, electrical properties and ferroelectric properties of the PZT thin films was investigated. Randomly-oriented PZT thin films pre-heated at 400°C for 10?min and annealed at 600°C for 30?min showed well-defined ferroelectric hysteresis loops with a remanent polarization of 26.57?µC?cm^?2 and a coercive field of 115.42?kV?cm^?1. The dielectric constant and dielectric loss of the PZT films were 621 and 0.0395, respectively. The microstructures of the thin films are dense, crack-free and homogeneous with fine grains about 15–20?nm in size.