Grain Boundary Migration in Metals: Recent Developments

Current research on grain boundary migration in metals is reviewed. For individual grain boundaries the dependence of grain boundary migration on misorientation and impurity content are addressed. Impurity drag theory, extended to include the interaction of adsorbed impurities in the boundary, reasonably accounts quantitatively for the observed concentration dependence of grain boundary mobility. For the first time an experimental study of triple junction motion is presented. The kinetics are quantitatively discussed in terms of a triple junction mobility. Their impact on the kinetics of microstructure evolution during grain growth is outlined.     

Grain boundary misorientation changes during grain growth in pure aluminium

A new method is described for data-logging large amounts of grain boundary misorientation information from channelling patterns in the scanning electron microscope (SEM). The method relies on producing specimens where the grain size is larger than the specimen thickness and where the grain boundary planes are perpendicular to the specimen plane (the so-called columnar structure). Results for grain growth in pure aluminium at 460 and 500°C are presented. There is an increase in the proportion of low angle boundaries at the expense of high angle boundaries during growth times of up to a few hours. The reasons are thought to be partly connected with lower low angle boundary mobility compared with high angle boundaries. However, the growth kinetics appear to be normal over the entire growth time range.     

Grain boundary curvature and grain growth kinetics with particle pinning

Second-phase particles are used extensively in design of polycrystalline materials to control the grain size. According to Zener’s theory, a distribution of particles creates a pinning pressure on a moving grain boundary. As a result, a limiting grain size is observed, but the effect of pinning on the detail of grain growth kinetics is less known. The influence of the particles on the microstructure occurs in multiple length scales, established by particle radius and the grain size. In this article, we use a meso-scale phase-field model that simulates grain growth in the presence of a uniform pinning pressure. The curvature of the grain boundary network is measured to determine the driving pressure of grain growth in 2D and 3D systems. It was observed that the grain growth continues, even under conditions where the average driving pressure is smaller than the pinning pressure. The limiting grain size is reached when the maximum of driving pressure distribution in the structure is equal to the pinning pressure. This results in a limiting grain size, larger than the one predicted by conventional models, and further analysis shows consistency with experimental observations. A physical model is proposed for the kinetics of grain growth using parameters based on the curvature analysis of the grain boundaries. This model can describe the simulated grain growth kinetics.     

The structural properties of Al doped ZnO films depending on the thickness and their effect on the electrical properties

In this study, the structural and electrical properties of AZO films with different film thickness deposited by r.f. magnetron sputtering were interpreted in relation with film growth process. The result shows that the grain size increases during film growth, which is accompanied by decrease of compressive stress, indicating the enhancement of crystallinity. The relationship between grain size and compressive stress follows the same tendency for the samples regardless of deposition temperature, which implies the strong dependencies between the grain size and the compressive stress. The XPS analysis shows that the defects such as chemisorbed oxygen and segregated Al₂O₃ cluster at grain boundary are reduced with increase of film thickness or deposition temperature, leading to increase of carrier concentration and mobility. The mobility increase is accompanied by grain size increase and compressive stress reduction, indicating the influences of grain boundary and crystallinity on the mobility.     

Coarsening in Sintering: Grain Shape Distribution,Grain Size Distribution,and Grain Growth Kinetics in Solid-Pore Systems

Sintering occurs when packed particles are heated to a temperature where there is sufficient atomic motion to grow bonds between the particles. The conditions that induce sintering depend on the material, its melting temperature, particle size, and a host of processing variables. It is common for sintering to produce a dimensional change, typically shrinkage, where the powder compact densifies, leading to significant strengthening. Microstructure coarsening is inherent to sintering, most evident as grain growth, but it is common for pore growth to occur as density increases. During coarsening, the grain structure converges to a self-similar character seen in both the grain shape distribution and grain size distribution. Coarsening behavior during sintering conforms to classic grain growth kinetics, modified to reflect the evolving microstructure. These modifications involve the grain boundary coverage due to pores, liquid films, or second phases and the altered grain boundary mobility due to these phases. The mass transport rates associated with each of these interfaces are different, with different temperature and composition dependencies. Hence, the coarsening rate during sintering is not constant, but changes with the evolving microstructure. Core aspects treated in this review include models for coarsening, grain shape, grain size distribution, and how pores, liquids, dispersoids, and other phases determine microstructure coarsening during sintering.     

Size-dependent grain-growth kinetics observed in nanocrystalline Fe

Measurements of grain growth in nanocrystalline Fe reveal a linear dependence of the grain size on annealing time, contradicting studies in coarser-grained materials, which find a parabolic (or power-law) dependence. When the grain size exceeds approximately 150 nm, a smooth transition from linear to nonlinear growth kinetics occurs, suggesting that the rate-controlling mechanism for grain growth depends on the grain size. The linear-stage growth rate agrees quantitatively with a model in which boundary migration is controlled by the redistribution of excess volume localized in the boundary cores.     

Grain boundary,triple junction and quadruple point mobility controlled normal grain growth

Reduction in stored free energy provides the thermodynamic driving force for grain and bubble growth in polycrystals and foams. Evolution of polycrystalline networks exhibit the additional complication that grain growth may be controlled by several kinetic mechanisms through which the decrease in network energy occurs. Polyhedral boundaries, triple junctions (TJs), and quadruple points (QPs) are the geometrically distinct elements of three dimensional networks that follow Plateau’s rules, provided that grain growth is limited by diffusion through, and motion of, cell boundaries. Shvindlerman and co-workers have long recognized the kinetic influences on polycrystalline grain growth of network TJs and QPs. Moreover, the emergence of interesting polycrystalline nanomaterials underscored that TJs can indeed influence grain growth kinetics. Currently there exist few detailed studies concerned either with network distributions of grain size, number of faces per grain, or with ‘grain trajectories’, when grain growth is limited by the motion of its TJs or QPs. By contrast there exist abundant studies of classical grain growth limited by boundary mobility. This study is focused on a topological/geometrical representation of polycrystals to obtain statistical predictions of the grain size and face number distributions, as well as growth ‘trajectories’ during steady-state grain growth. Three limits to grain growth are considered, with grain growth kinetics controlled by boundary, TJ, and QP mobilities.     

Grain growth and static recrystallization kinetics in Co–20Cr–15W–10Ni (L-605) cobalt-base superalloy

The grain size evolution of cold-rolled L-605 cobalt-base superalloy during ultra-rapid annealing is investigated in this paper. Cold-worked specimens undergo static recrystallization, leading to grain refinement or grain coarsening depending on the annealing time and temperature. The kinetics of grain growth is found to be independent of the initial deformation. The evolution of grain size can be simply described by a grain growth model for high temperatures and long annealing times, and the mobility of interfaces is estimated by modelling. Fast annealing treatment process is a very promising technique to customize grain size and enhance mechanical strength. In particular, the reduction of annealing time is an efficient method to produce a refined microstructure through static recrystallization.     

Effect of finite boundary junction mobility on the growth rate of grains in 3D polycrystals

With decreasing grain size, grain boundary junctions become increasingly important for microstructure evolution. We show that the effect of a limited mobility of triple junctions on the growth rate of polycrystals can be implemented in theories of three-dimensional (3D) grain growth. Respective analytical relations are derived on the basis of the average n-hedra approach introduced by Glicksman to describe the volume rate of change of 3D grains in a polycrystalline aggregate under the impact of a limited triple junction mobility. The theoretical predictions were compared to network-model computer simulations, and good agreement was obtained.     

Study of the motion of individual triple junctions in aluminum

The mobility of individual triple junctions in aluminum is studied. Triple junctions with 〈111〉, 〈100〉, and 〈110〉 tilt boundaries are studied. The data obtained show that, at low temperatures, the mobility of the system of grain boundaries with a triple junction is controlled by the mobility of the triple junction (the junction kinetics). At high temperatures, the system mobility is determined by the mobility of the grain boundaries (the boundary kinetics). There is a temperature at which the transition from the junction kinetics to the boundary kinetics occurs; this temperature is determined by the crystallographic parameters of the sample.     

Statistical analyses of deformation twinning in magnesium

To extract quantitative and meaningful relationships between material microstructure and deformation twinning in magnesium, we conduct a statistical analysis on large data sets generated by electron backscattering diffraction (EBSD). The analyses show that not all grains of similar orientation and grain size form twins, and twinning does not occur exclusively in grains with high twin Schmid factors or in the relatively large grains of the sample. The number of twins per twinned grain increases with grain area, but twin thickness and the fraction of grains with at least one visible twin are independent of grain area. On the other hand, an analysis of twin pairs joined at a boundary indicates that grain boundary misorientation angle strongly influences twin nucleation and growth. These results question the use of deterministic rules for twin nucleation and Hall–Petch laws for size effects on twinning. Instead, they encourage an examination of the defect structures of grain boundaries and their role in twin nucleation and growth.     

Grain Boundary Dynamics: A Novel Tool for Microstructure Control

The reaction of grain boundaries to a wide spectrum of forces is reviewed. Curvature, volume energy and mechanical forces are considered. The boundary mobility is strongly dependent on misorientation, which is attributed to both grain boundary structure and segregation. In magnetically anisotropic materials grain boundaries can be moved by magnetic forces. For the first time a directionality of boundary mobility is reported. Flat boundaries can also be moved by mechanical forces, which sheds new light on microstructure evolution during elevated temperature deformation. Curvature driven and mechanically moved boundaries can behave differently. A sharp transition between the small and large angle boundary regime is observed. It is shown that grain boundary triple junctions have a finite mobility and thus, may have a serious impact on grain growth in fine grained materials. The various dependencies can be utilized to influence grain boundary motion and thus, microstructure evolution during recrystallization and grain growth.     

Reduced Mobility of Triple Nodes and Lines on Grain Growth in Two and Three Dimensions

Vertex dynamics models in two and three dimensions are applied to study grain growth including a limited mobility of triple points (two dimensions) and triple lines (three dimensions). A recent experiment on a triple node is used to validate the proposed model. The reduced triple node/line mobility in the case of a polycrystalline sample is shown to influence both, the grain growth kinetics and the grain size distribution function.     

Texture weakening in pure magnesium during grain growth

The microstructure and texture evolution during annealing of rolled pure Mg, at temperatures ranging from 150 to 400°C, was characterised in the present study. A grain growth exponent of n?=?13 was observed and the activation energy for grain growth kinetics was found to be 95.6?kJ?mol^?1. Further, broadening of the normalised grain size distributions, indicating abnormal grain growth, was also observed at all temperatures of annealing. The sample had a dominant basal texture before annealing. However, after annealing up to a temperature of 300°C, the alleviation of basal texture was observed in the samples. On further annealing at a temperature of 400°C, a strong basal texture was developed in the samples. The mobility of high angle grain boundaries, which is proportional to correlated misorientation distribution, was observed to be responsible for texture strengthening of the material. The grain boundary mobility changes during grain growth led to the growth of either small or large grains. It was further observed that the growth of small grains caused the formation of basal fibre and large grains led to the weakening of basal texture.     

Kinetics of Grain Boundary Recovery in Deformed Polycrystals

Annealing kinetics are studied for nonequilibrium ensembles of dislocations occurring in grain boundaries during plastic deformation. Two types of dislocation ensembles are considered: 1) walls of sessile extrinsic grain boundary dislocations (EGBDs), which cause a change of the GB misorientation angle, and 2) arrays of glissile EGBDs having a Burgers vector tangential to the grain boundary plane. For both types similar exponential relationships are obtained for the relaxation of the average EGBD density, with approximately the same characteristic time proportional to the cube of grain size.     

Grain Growth in Polycrystalline Thin Films of Semiconductors

Grain growth in thin films is usually abnormal, leading not only to an increase in the average grain size, but also to an evolution in the shape of the grain size distribution and to an evolution in the distribution of grain orientations. The latter can be driven by surface, interface or strain energy minimization, depending on film and substrate properties and on deposition conditions, and can lead to different final textures depending on which energy dominates.In semiconductor films, as in other materials, grain growth stagnation coupled with texture-selective driving forces leads to secondary grain growth, the rate of which is higher in thinner films. Self ion-bombardment enhances the rate of pre-stagnation grain growth, and doping of Si with electron donor leads to enhanced pre-stagnation grain growth as well as surface-energy-driven secondary grain growth. The effects of ion-bombardment and dopants on grain growth in Si can be understood in terms of associated increases in point defect concentrations and the effects of point defects on grain boundary mobilities.     

钙钛矿薄膜气相制备的晶粒尺寸优化及高效光伏转换

钙钛矿薄膜的气相制备是一种极具潜力的工业化生产工艺,但薄膜的质量控制目前远落后于溶液制备法.本文通过建立PbI_2薄膜向钙钛矿薄膜完全转化过程中反应时间、晶粒尺寸与温度的关系,实现了薄膜的质量优化及大面积钙钛矿薄膜的制备,将薄膜的平均晶粒粒径从0.42μm优化到0.81μm.基于空间电荷限制电流模型对缺陷密度的研究显示,钙钛矿薄膜的缺陷密度由5.90×10~(16)cm~(–3)降低到2.66×10~(16)cm~(–3).光伏器件(FTO/TiO_2/C_(60)/MAPbI_3/spiro-OMeTAD/Au结构)测试显示,面积为0.045cm~2器件的平均光电转换效率从14.00%提升到17.42%,最佳光电转换效率达到17.80%,迟滞因子减小至4.04%.同时,基于180℃制备的1cm~2器件的光电转换效率达到13.17%.     

The Effect of Lattice Temperature on Abnormal Subgrain Growth Simulations using a Monte Carlo Technique

Abnormal subgrain growth occurs in single-phase materials when the structure contains special subgrains that have growth advantage compared to others in their vicinity by virtue of having unique boundary properties such as low energy and high mobility. Monte Carlo simulations of abnormal subgrain growth were carried out for a wide range of such abnormal growth conditions. For a given abnormal growth condition, the simulation results were found to be sensitive to the choice of the lattice temperature used. When the lattice temperature was too low, the growth kinetics and the shape of the abnormal grain was influenced by the lattice geometry. At higher lattice temperatures, the lattice effects were reduced but the simulation results were scattered around the theoretical prediction of the maximum stable size ratio of the abnormal subgrain to the matrix subgrain. Simulations in which the local lattice temperature was scaled according to the relative boundary energy appeared to reduce the scatter associated with constant lattice temperature simulations, but a discrepancy between theory and simulation was noticed, with the simulations predicting consistently lower values than theoretical. Further simulations with larger system sizes are required in order to better understand the mesoscale issues associated with abnormal subgrain growth.     

Triple Junction Mobility: A Molecular Dynamics Study

We present a molecular dynamics simulation study of the migration of individual grain boundary triple junctions. The simulation cell was designed to achieve steady state migration. Observations of the triple junction angle and grain boundary profiles confirm that steady state was achieved. The static, equilibrium grain boundary triple junction angles and the dynamic triple junction angles were measured as a function of grain size and grain boundary misorientation. In most cases, the static and dynamic triple junction angles are nearly identical, while substantial deviations were observed for low boundary misorientations. The intrinsic, steady-state triple junction mobilities were extracted from measurements of the rate of change of grain boundary area in simulations with and without triple junctions. The triple junction velocity is found to be inversely proportional to the grain size width. The normalized triple junction mobility exhibits strong variations with boundary misorientation, with strong minima at misorientations corresponding to orientations corresponding to low values of . The triple junctions create substantial drag on grain boundary migration at these low mobility misorientations.