cBN基台面结构pin紫外光电探测器建模与性能

采用Silvaco TCAD软件构建了立方氮化硼（cBN）基台面结构pin型光电探测器数值计算模型,采用控制变量法研究了n型、i型、p型cBN层材料掺杂浓度、厚度对探测器光电性能的影响,并利用器件物理相关理论对结果进行了分析与讨论。结果表明：p型cBN层掺杂浓度增大时,光电流、暗电流和内量子效率先增大后减小;i型层掺杂浓度增大时,暗电流减小;n型层掺杂浓度增大,光电流、内量子效率增加;光电流和内量子效率随着p层厚度的增大而减小,随着i层厚度的增加而增大;n层厚度越大,光电流越大。     

p型层结构与掺杂对GaInN发光二极管正向电压温度特性的影响

在温度变化时, 如果GaInN发光二极管能够保持相对稳定的工作电压对其实际应用具有重要意义. 本文通过金属有机化学气相沉积生长了一系列包含不同有源区结构、不同p型层结构以及不同掺杂浓度纵向分布的样品, 并对其在不同温度区间内正向电压随温度变化的斜率(dV/dT)进行了研究. 结果表明: 1)有源区中包括插入层设计、量子阱结构以及发光波长等因素的变化对正向电压随温度变化特性影响很小; 2)影响常温区间(300 K± 50 K)正向电压随温度变化斜率的最主要因素为p-AlGaN 电子阻挡层起始生长阶段的掺杂形貌, 具有p-AlGaN陡掺界面的样品电压变化斜率为-1.3 mV·K^-1, 与理论极限值 -1.2 mV·K^-1十分接近; 3) p-GaN主段层的掺Mg浓度对低温区间(<200 K)的正向电压随温度变化斜率有直接影响, 掺Mg浓度越低则dV/dT斜率越大. 以上现象归因于在不同温度区间, p-AlGaN 以及p-GaN 发生Mg受主冻结效应的程度主要取决于各自的掺杂浓度. 因此Mg掺杂浓度纵向分布不同的样品在不同的温度区间具有不同的串联电阻, 最终表现为差异很大的正向电压温度特性.     

单载流子光电探测器的高速及高饱和功率的研究

利用载流子漂移-扩散模型, 模拟并分析了InGaAs/InP单载流子光电探测器(Uni-traveling-carrier/UTC-PD) 在不同条件下的物理特性及其带宽和饱和特性, 结合器件实验结果分析了影响器件高速和高饱和性能的物理机理. 结论表明在吸收区采用浓度渐变掺杂和增加InP崖层(cliff layer), 可以显著提升器件饱和特性, 高入射功率下吸收区电场崩塌是器件饱和的直接因素, 直径大于20 μm的UTC探测器中RC常数仍是影响带宽的主要因素. 论文指出了优化器件结构、 提升器件性能的有效方法.     

堆叠栅介质对称双栅单Halo应变Si金属氧化物半导体场效应管二维模型

提出了一种堆叠栅介质对称双栅单Halo应变Si金属氧化物半导体场效应管(metal-oxide semiconductor field effect transistor,MOSFET)新器件结构.采用分区的抛物线电势近似法和通用边界条件求解二维泊松方程,建立了全耗尽条件下的表面势和阈值电压的解析模型.该结构的应变硅沟道有两个掺杂区域,和常规双栅器件(均匀掺杂沟道)比较,沟道表面势呈阶梯电势分布,能进一步提高载流子迁移率;探讨了漏源电压对短沟道效应的影响;分析得到阈值电压随缓冲层Ge组分的提高而降低,随堆叠栅介质高k层介电常数的增大而增大,随源端应变硅沟道掺杂浓度的升高而增大,并解释了其物理机理.分析结果表明:该新结构器件能够更好地减小阈值电压漂移,抑制短沟道效应,为纳米领域MOSFET器件设计提供了指导.     

高速高饱和单行载流子光探测器的设计与分析

设计了一种In P基的背入射台面结构的单行载流子光探测器.通过在吸收层中采取高斯型掺杂界面及引入合适厚度和掺杂浓度的崖层,使得光探测器同时具备了高速和高饱和电流特性.理论分析表明,在光敏面为14μm2、反向偏压为2 V条件下,该器件的3 d B带宽可达58 GHz,直流饱和电流高达158 m A.在大功率光注入条件下,详细分析了光探测器带宽降低和电流饱和现象,得出能带偏移和电场坍塌是其根本原因的结论.     

以弱p型为有源区的新型p-n结构GaN紫外探测器

提出了以弱p型（p^－-GaN）为有源区的p-n结构GaN紫外探测器.由于弱p型层的载流子浓度较低,很容易增加耗尽区的宽度,从而可以增加器件的量子效率.通过模拟计算,研究了金属与p^－-GaN层的肖特基接触势垒高度、p^－-GaN层厚度等参数对器件性能的影响.研究结果表明,降低金属与p^－-GaN层的接触势垒高度、适当减小p^－-GaN层厚度能够实现有源层方向单一的内建电场,从而提高器件的量子效率.要制备出 关键词： 弱p型GaN 紫外探测器 量子效率     

太赫兹辐射场下的石墨烯光生载流子和光子发射

通过半经典的玻尔兹曼平衡方程理论研究了太赫兹辐射场下的石墨烯光生载流子和光子发射.研究得到了太赫兹辐射场下石墨烯的光生载流子浓度和光子发生率的解析公式.研究发现,掺杂电子浓度越小,或者温度越低,光生载流子浓度越大;掺杂电子浓度越大,或者温度越低,石墨烯的光子发射率越大.通过改变门电压或温度,可以有效地调控石墨烯光生载流子浓度和光子发射概率.理论研究结果和解析表达式对发展以石墨烯为基础的新型太赫兹光电器件具有重要的参考价值.     

SOI部分耗尽SiGe HBT集电结空间电荷区模型

SOI上的薄膜异质SiGe晶体管通过采用"折叠"集电极,已成功实现SOI上CMOS与HBT的兼容.本文结合SOI薄膜上的纵向SiGe HBT结构模型,提出了包含纵向、横向欧姆电阻和耗尽电容的"部分耗尽 (partially depleted) 晶体管"集电区简化电路模型.基于器件物理及实际考虑,系统建立了外延集电层电场、电势、耗尽宽度模型,并根据该模型对不同器件结构参数进行分析.结果表明,空间电荷区表现为本征集电结耗尽与MOS电容耗尽,空间电荷区宽度随集电结掺杂浓度减小而增大,随集电结反偏电压提高而增大, 关键词： SOI SiGe HBT 集电区 空间电荷区模型     

Poly-Si1-xGex栅应变SiN型金属-氧化物-半导体场效应管栅耗尽模型研究

基于对Poly-Si_1-xGe_x栅功函数的分析,通过求解Poisson方程, 获得了Poly-Si_1-xGe_x栅应变Si N型金属-氧化物-半导体场效应器件 (NMOSFET)垂直电势与电场分布模型.在此基础上,建立了考虑栅耗尽的Poly-Si_1-xGe_x栅应变Si NMOSFET的阈值电压模型和栅耗尽宽度及其归一化模型,并利用该模型,对器件几何结构参数、 物理参数尤其是Ge组分对Poly-Si_1-xGe_x栅耗尽层宽度的影响, 以及栅耗尽层宽度对器件阈值电压的影响进行了模拟分析.结果表明:多晶耗尽随Ge组分和栅掺杂浓度的增加而减弱, 随衬底掺杂浓度的增加而增强;此外,多晶耗尽程度的增强使得器件阈值电压增大. 所得结论能够为应变Si器件的设计提供理论依据.     

聚合物掺杂有机小分子发光二极管的电致发光与杂质陷阱效应

在新型空穴传输聚合物聚TPD(PTPD)中掺杂电子传输有机小分子荧光染料Rubrene制成薄膜器件.考察了不同掺杂浓度以及不同薄膜厚度器件的电致发光性能,结果表明存在杂质陷阱效应.基于固体中双注入理论，假设杂质陷阱限制在分立能级上，通过求解泊松方程，得到了掺杂器件J-V特性解析模型.该模型的计算值与实验结果一致.     

Photoresponse study of visible blind GaN/AlGaN p-i-n ultraviolet photodetector

The spectral responsivity characteristics have been numerically studied for visible blind GaN/AlGaN p-i-n ultraviolet detector. The effects of the absorption layer and the n-layer thicknesses on the photoresponse have been investigated. It is shown that the absorption layer and n-layer thicknesses have notable impacts on the peak value of photoresponse and the rejection ratio of short-wavelength side, respectively. Finally, the effect of doping concentration of the absorption layer on photoresponse is discussed in detail. It is demonstrated that mobility degradation, Radiative and Auger recombinations are jointly responsible for the decrease of photoresponse with increasing doping concentration of the absorption layer.     

GaN基发光二极管外延中p型AlGaN电子阻挡层的优化生长

本文利用金属有机物化学气相沉积(MOCVD)方法系统地研究了p-AlGaN层掺杂机理及优化设计生长. 明确了生长温度、压力及TMAl的流量对AlGaN层Al组分的影响关系,并给出了各自不同的机理与作用. 研究发现,Al组分介于10%—30%之间能够很好地将电子限定在量子阱区域并保持高的材料晶体质量. 发展了一种新的生长技术来克服p-AlGaN层掺入效率低下和空穴注入不足的问题. 优化条件下生长的p型AlGaN电子阻挡层很大地提升了InGaN/GaN基LED的输出光功率. 关键词： 氮化镓基 LED Al组分 电子阻挡层     

Degraded model of radiation-induced acceptor defects for GaN-based high electron mobility transistors （HEMTs）

Using depletion approximation theory and introducing acceptor defects which can characterize radiation induced deep-level defects in AlGaN/GaN heterostructures, we set up a radiation damage model of AlGaN/GaN high electron mobility transistor (HEMT) to separately simulate the effects of several main radiation damage mechanisms and the complete radiation damage effect simultaneously considering the degradation in mobility. Our calculated results, consistent with the experimental results, indicate that thin AlGaN barrier layer, high Al content and high doping concentration are favourable for restraining the shifts of threshold voltage in the AlGaN/GaN HEMT; when the acceptor concentration induced is less than 10¹⁴cm^-3, the shifts in threshold voltage are not obvious; only when the acceptor concentration induced is higher than 10¹⁶cm^-3, will the shifts of threshold voltage remarkably increase; the increase of threshold voltage, resulting from radiation induced acceptor, mainly contributes to the degradation in drain saturation current of the current--voltage (I--V) characteristic, but has no effect on the transconductance in the saturation area.     

GaN/AlGaN双带红外探测及光子频率上转换研究

研究了GaN/AlGaN异质结构中的双带（中、远）红外探测及光子频率上转换特性.通过光致发光光谱确认GaN/AlGaN探测器结构中AlGaN本征层的Al组分,讨论了不同Al组分GaN/AlGaN异质结的导带带阶界面功函数差.在拟合单周期GaN/AlGaN探测器中红外和远红外波段响应谱的基础上,研究多周期GaN/AlGaN探测器与GaN/AlGaN发光二极管集成结构的中红外和远红外光子频率上转换效率与GaN发射层厚度、AlGaN本征层厚度、紫光光子出射效率、内量子效率、空间频率和发射层掺杂浓度间的关系,优化 关键词： 双带红外探测 光子频率上转换 响应谱 GaN/AlGaN     

A novel model of photo-carrier screening effect on the GaN-based p-i-n ultraviolet detector

The photo-carrier density in the depletion region of the GaN-based p-i-n ultraviolet(UV) detector is calculated by solving the photo-carrier continuity equation,and the photo-carrier screening electric field is calculated according to Poisson's equation.Using the numerical calculation method,a novel model of photo-carrier screening effect is presented.Then the influence of photo-carrier screening effect on the distribution of photo-carrier density in the depletion region of p-i-n detector is discussed.The i...     

Impact of dopants in GaN on the formation of two-dimensional electron gas in AlGaN/GaN heterostructure field-effect transistors

The two-dimensional electron gas distribution in AlGaN/GaN high electron mobility transistors is determined from the solution of the coupled Schr?dinger’s and Poisson’s equations. Considering the piezoelectric effect, the two-dimensional electron gas concentration is calculated to be as high as 7.7×10¹⁹ cm^-3. In order to obtain an understanding of how the two-dimensional electron gas distribution is influenced by dopants in GaN, we observed the two-dimensional electron gas concentration and occupation of sub-bands versus dopant concentration in the GaN layer of an AlGaN/GaN heterostructure. Our results show that the two-dimensional electron gas concentration is slightly increased at higher doping levels in GaN, while the quantum confinement in the AlGaN/GaN heterostructure is weakened with the increase of donor concentration in the GaN layer. Received: 26 May 2001 / Accepted: 23 July 2001 / Published online: 23 January 2002     

极化诱导实现AlGaN薄膜材料中的超高电子浓度(1020cm-3)掺杂

材料的载流子浓度和迁移率是影响器件性能的关键因素, 变温Hall测试结果证明杂质掺杂AlGaN中的载流子浓度和迁移率随温度 降低而减小.然而极化诱导掺杂的载流子浓度和迁移率不受温度变化的影响.以准绝缘 的GaN体材料作为衬底, 在组分分层渐变的AlGaN中实现的极化诱导掺杂浓度 仅仅在10¹⁷ cm^-3数量级甚至更低. 本研究采用载流子浓度为10¹⁶ cm^-3量级的非有意n型掺杂GaN模板为衬底, 用极化诱导掺杂技术在分子束外延生长的AlGaN薄膜材料中实现了高 达10²⁰ cm^-3 量级的超高电子浓度. 准绝缘的体材GaN半导体作衬底时, 只有表面自由电子作为极化掺杂源, 而非有意掺杂的GaN模板衬底除了提供表面自由电子外,还能为极化电场 提供更多的自由电子"源", 从而实现超高载流子浓度的n型掺杂.     

阶梯AlGaN外延新型Al_(0.25)Ga_(0.75)N/GaNHEMTs击穿特性分析

为了优化AlGaN/GaN HEMTs器件表面电场,提高击穿电压,本文首次提出了一种新型阶梯AlGaN/GaN HEMTs结构.新结构利用AlGaN/GaN异质结形成的2DEG浓度随外延AlGaN层厚度降低而减小的规律,通过减薄靠近栅边缘外延的AlGaN层,使沟道2DEG浓度分区,形成栅边缘低浓度2DEG区,低的2DEG使阶梯AlGaN交界出现新的电场峰,新电场峰的出现有效降低了栅边缘的高峰电场,优化了AlGaN/GaN HEMTs器件的表面电场分布,使器件击穿电压从传统结构的446 V,提高到新结构的640 V.为了获得与实际测试结果一致的击穿曲线,本文在GaN缓冲层中设定了一定浓度的受主型缺陷,通过仿真分析验证了国际上外延GaN缓冲层时掺入受主型离子的原因,并通过仿真分析获得了与实际测试结果一致的击穿曲线.     

Influence of dislocations in the GaN layer on the electrical properties of an AlGaN/GaN heterostructure

This paper reports on a comparative study of the spatial distributions of the electrical, optical, and structural properties in an AlGaN/GaN heterostructure. Edge dislocation density in the GaN template layer is shown to decrease in the regions of the wafer where the heterostructure sheet resistance increases and the GaN photoluminescence band-edge energy peak shifts to a high wavelength. This phenomenon is found to be attributed to the local compressive strain surrounding edge dislocation, which will generate a local piezoelectric polarization field in the GaN layer in the opposite direction to the piezoelectric polarization field in the AlGaN layer and thus help to increase the two-dimensional electron gas concentration.     

Different influences of Schottky metal on the strain and relative permittivity of barrier layer between AlN/GaN and AlGaN/GaN heterostructure Schottky diodes

Ni/Au Schottky contacts on AlN/GaN and AlGaN/GaN heterostructures are fabricated.Based on the measured current–voltage and capacitance-voltage curves,the polarization sheet charge density and relative permittivity are analyzed and calculated by self-consistently solving Schrdinger’s and Poisson’s equations.It is found that the values of relative permittivity and polarization sheet charge density of AlN/GaN diode are both much smaller than the ones of AlGaN/GaN diode,and also much lower than the theoretical values.Moreover,by fitting the measured forward I–V curves,the extracted dislocations existing in the barrier layer of the AlN/GaN diode are found to be much more than those of the AlGaN/GaN diode.As a result,the conclusion can be made that compared with AlGaN/GaN diode the Schottky metal has an enhanced influence on the strain of the extremely thinner AlN barrier layer,which is attributed to the more dislocations.