Interaction between an interface crack and subinterface microcracks in metal/piezoelectric bimaterials

The J-integral analysis is presented for the interaction problem between a semi-infinite interface crack and subinterface matrix microcracks in dissimilar anisotropic materials. After deriving the fundamental solutions for an interface crack subjected to different loads and the fundamental solutions for an edge dislocation beneath the interface, the interaction problem is deduced to a system of singular integral equations with the aid of a superimposing technique. The integral equations are then solved numerically and a conservation law among three values of the J-integral is presented, which are induced from the interface crack tip, the microcracks and the remote field, respectively. The conservation law not only provides a necessary condition to confirm the numerical results derived, but also reveals that the microcrack shielding effect in such materials could be considered as a redistribution of the remote J-integral. It is this redistribution that does lead to the phenomenological shielding effect.     

A conducting arc crack between a circular piezoelectric inclusion and an unbounded matrix

The present paper investigates the problem of a conducting arc crack between a circular piezoelectric inclusion and an unbounded piezoelectric matrix. The original boundary value problem is reduced to a standard Riemann–Hilbert problem of vector form by means of analytical continuation. Explicit solutions for the stress singularities δ=−(1/2)±iε are obtained, closed form solutions for the field potentials are then derived through adopting a decoupling procedure. In addition, explicit expressions for the field component distributions in the whole field and along the circular interface are also obtained. Different from the interface insulating crack, stresses, strains, electric displacements and electric fields at the crack tips all exhibit oscillatory singularities. We also define a complex electro-elastic field concentration vector to characterize the singular fields near the crack tips and derive a simple expression for the energy release rate, which is always positive, in terms of the field concentration vector. The condition for the disappearance of the index ε is also discussed. When the index ε is zero, we obtain conventionally defined electro-elastic intensity factors. The examples demonstrate the physical behavior and the correctness of the obtained solution.     

A technique for studying interaction between a screw dislocation dipole or a concentrated load and a mode III crack crossing an interface

A method of potentially wide application is developed for deriving analytical expressions of the elastic interaction between a screw dislocation dipole or a concentrated force and a crack cutting perpendicularly across the interface of a bimaterial. The cross line composed of the interface and the crack is mapped into a line, and then the complex potentials are educed. The Muskhelishvili method is extended by creating a Plemelj function that matches the singularity of the real crack tips, and eliminates the pseudo tips’ singularity induced by the conformal mapping. The stress field is obtained after solving the Riemann–Hilbert boundary value problem. Based on the stress field expressions, crack tip stress intensity factors, dislocation dipole image forces and image torque are formulated. Numerical curves show that both the translation and rotation must be considered in the static equilibrium of the dipole system. The crack tip stress intensity factor induced by the dipole may rise or drop and the crack may attract or reject the dipole. These trends depend not only on the crack length, but also on the dipole location, the length and the angle of the dipole span. Generally, the horizontal image force exerted at the center of the dislocation dipole is much smaller than the vertical one. Whether the dipole subjected to clockwise torque or anticlockwise torque is determined by whether the Burgers vector of the crack-nearby dislocation of the dipole is positive or negative. A concentrated load induces no singularity to crack tip stress fields as the load is located at the crack line. However, as the concentrated force is not located on the crack line but approaches the crack tip, the nearby crack tip stress intensity factor K_IIIu increases steeply to infinity.     

Opening and contact zones of an interface crack in a piezoelectric bimaterial under combined compressive-shear loading

A plane problem for a tunnel electrically permeable interface crack between two semi-infinite piezoelectric spaces is studied. A remote mechanical and electrical loading is applied. Elastic displacements and potential jumps as well as stresses and electrical displacement along the interface are presented using a sectionally holomorphic vector function. It is assumed that the interface crack includes zones of crack opening and frictionless contact. The problem is reduced to a combined Dirichlet–Riemann boundary value problem which is solved analytically. From the obtained solution, simple analytical expressions are derived for all mechanical and electrical characteristics at the interface. A quite simple transcendental equation, which determines the point of separation of open and close sections of the crack, is found. For the analysis of the obtained results, the main attention is devoted to the case of compressive-shear loading. The analytical analysis and numerical results show that, even if the applied normal stress is compressive, a certain crack opening zone exists for all considered loading values provided the shear field is present. It is found that the shear stress intensity factor at the closed crack tip and the energy release rates at the both crack tips depend very slightly on the magnitude of compressive loading.     

Contact Zone Approach for a Moving Interface Crack in a Piezoelectric Bimaterial under Thermoelectromechanical Loading

An interface crack of a finite length moving with a constant subsonic speed v along an interface of two semi-infinite piezoelectric spaces is considered. It is assumed that the bimaterial compound is loaded by a remote mixed mode mechanical loading and a thermoelectrical field and that a frictionless contact zone arises at the leading crack tip. Electrically permeable and electrically insulated cases of the open part of the crack are involved into the consideration. By introducing a moving coordinate system at the crack tip the problem is reduced to a combined Dirichlet–Riemann boundary value problem which is solved exactly. For both cases of the electrical conditions the transcendental equations are obtained for the determination of the real contact zone length, and moreover, the associated closed form asymptotic formulas are found for small values of this parameter. Variations of the contact zone length and the stress intensity factor with respect to the crack speed and the loading have been investigated both for electrically permeable and electrically insulated cases.     

An electrically conducting interface crack with a contact zone in a piezoelectric bimaterial

A plane problem for an electrically conducting interface crack in a piezoelectric bimaterial is studied. The bimaterial is polarized in the direction orthogonal to the crack faces and loaded by remote tension and shear forces and an electrical field parallel to the crack faces. All fields are assumed to be independent of the coordinate co-directed with the crack front. Using special presentations of electromechanical quantities via sectionally-analytic functions, a combined Dirichlet–Riemann and Hilbert boundary value problem is formulated and solved analytically. Explicit analytical expressions for the characteristic mechanical and electrical parameters are derived. Also, a contact zone solution is obtained as a particular case. For the determination of the contact zone length, a simple transcendental equation is derived. Stress and electric field intensity factors and, also, the contact zone length are found for various material combinations and different loadings. A significant influence of the electric field on the contact zone length, stress and electric field intensity factors is observed. Electrically permeable conditions in the crack region are considered as well and matching of different crack models has been performed.     

Electroelastic Analysis of an Internal Interface Crack in a Half-Plane Consisting of Two Bonded Dissimilar Piezoelectric Quarter-Planes

The problem of an interface crack in a half-plane consisting of two bonded dissimilar piezoelectric quarters is considered under antiplane shear and inplane electric loading. The problem is solved under the electrically permeable assumption for a crack. The integral transform technique is employed to reduce the problem to triple integral equations, which is further converted to a hypersingular integral equation for the crack sliding displacement. By solving the resulting equation analytically, the electroelastic field along the interface and the energy release rate are obtained in explicit form, respectively. Several examples are given to illustrate the influence of the material properties and the crack position on the energy release rate.     

The effect of an elastic triangular inclusion on a crack

IntroductionWiththedevelopmentofparticleandfiberreinforcedcomposites,theinclusion_crackinteractionproblemisbecominganimportantfieldbeingstudied .Andasamodel,itisalsousedtostudytheeffectsofmaterialdefectsonthestrengthandfractureofengineeringstructure.TheinterationbetweencircularinclusionandcrackwasstudiedinRefs.[1 -6 ] ;InRefs.[7-1 2 ] ,theinterationbetweenlineinclusionandcrackswasdiscussed ;TheinterationbetweenellipticalinclusionandcrackwasstudiedinRefs.[1 3,1 4] .However,withthedevelopmento…     

Dynamic stress intensity factors of two collinear mode-III cracks perpendicular to and on the two sides of a bi-FGM weak-discontinuous interface

The mechanical model was established for the anti-plane dynamic fracture problem for two collinear cracks on the two sides of and perpendicular to a weak-discontinuous interface between two materials with smoothly graded elastic properties, as opposed to a sharp interface with discontinuously changing elastic properties. The problem was reduced as a system of Cauchy singular integral equations of the first kind by Laplace and Fourier integral transforms. The integral equations were solved by Erdogan's collocation method and the dynamic stress intensity factors in the time domain were obtained through Laplace numerical inversion proposed by Miller and Guy. The influences of geometrical and physical parameters on the dynamic stress intensity factors were illustrated and discussed, based on which some conclusions were drawn: (a) to increase the thickness of the FGM strip on either side of the interface will be beneficial to reducing the DSIF of a crack perpendicular to a bi-FGM interface and embedded at the center of one of the FGM strips; (b) To increase the rigidity of the FGM strip where the crack is located will increase the DSIF. However, when the material in one side of the interface is more rigid, the DSIF of the interface-perpendicular embedded crack in the other side will be reduced; (c) To decrease the weak-discontinuity of a bi-FGM interface will not necessarily reduce the stress intensity factor of a crack perpendicular to it, which is different from the case of interfacial crack; (d) For two collinear cracks with equal half-length, when the distance between the two inner tips is less than about three times of the half-length, the interaction of them is intensified, however, when the distance is greater than this the interaction becomes weak.     

Full field analysis of an anti-plane interface crack subjected to dynamic body forces

In this study, the transient full field response of an interface crack between two different media subjected to dynamic body force at one material is investigated. For time t < 0, the bimaterial medium is stress free and at rest. At t = 0, a concentrated anti-plane dynamic point loading is applied at the medium as shown in Fig. 1. The total wave field is due to the effect of this point loading and the scattering of the incident waves by the interface crack. An alternative methodology that is different from the conventional superposition method is used to construct the reflected, refracted and diffracted wave fields. A useful fundamental solution is proposed in this study and the full field solution is determined by superposition of the fundamental solution in the Laplace transform domain. The proposed fundamental problem is the problem of applying an exponentially distributed traction (in the Laplace transform domain) on the interfacial crack faces. The Cagniard–de Hoop method of Laplace inversion is used to obtain the transient solution in time domain. Exact transient closed form solutions for stresses and stress intensity factors are obtained. Numerical results for the time history of stresses and stress intensity factors during the transient process are discussed in detail.     

ANALYSIS OF A SCREW DISLOCATION INSIDE A CIRCULAR INCLUSION WITH INTERFACIAL CRACKS IN PIEZOELECTRIC COMPOSITES

IntroductionPiezoelectric materials have potentials for use in many modern devices and compositestructures. The presence of various defects, such as inclusions, holes, dislocations andcracks, can greatly influence their characteristics and coupled behavio…     

Dislocation approach to study interaction of adhesively bonded weak zones

The problem of interaction between crack-like interface defects subjected to a remote tensile stresses in an elastic bi-plane is considered using a model of an adhesively bonded asymmetric weak zone. In this model, the opening displacements are prescribed by a basis function which contains free parameters and automatically accounts for the asymmetry and the “true” stress–strain field behavior near the tips. The corresponding adhesive forces which can be very different by physical origin, are determined a posteriori. The limiting situations: transformation of one of the defects to the nucleus of a cohesive crack or the rupture of an obstacle between the weak zones are analytically described.     

On a moving interface crack with a contact zone in a piezoelectric bimaterial

An inplane problem for a crack moving with constant subsonic speed along the interface of two piezoelectric materials is considered. A mechanically frictionless and electrically permeable contact zone is assumed at the right crack tip whilst for the open part of the crack both electrically permeable and electrically insulated conditions are considered. In the first case a moving concentrated loading is prescribed at the crack faces and in the second case an additional electrical charge at the crack faces is prescribed as well. The main attention is devoted to electrically permeable crack faces. Introducing a moving coordinate system at the leading crack tip the corresponding inhomogeneous combined Dirichlet–Riemann problem is formulated and solved exactly for this case. All electromechanical characteristics at the interface are presented in a closed form for arbitrary contact zone lengths, and further, the transcendental equation for the determination of the real contact zone length is derived. As a particular case of the obtained solution a semi-infinite crack with a contact zone is considered. The numerical analysis performed for a certain piezoelectric bimaterial showed an essential increase of the contact zone length and the associated stress intensity factor especially for the near-critical speed region. Similar investigations have been performed for an electrically insulated crack and the same behavior of the above mentioned parameters is observed.     

Interaction of general plane P wave and cylindrical inclusion partially debonded from its viscoelastic matrix

The interaction of a general plane P wave and an elastic cylindrical inclusion of infinite length partially debonded from its surrounding viscoelastic matrix of infinite extension is investigated. The debonded region is modeled as an arc-shaped interface crack between inclusion and matrix with non-contacting faces. With wave functions expansion and singular integral equation technique, the interaction problem is reduced to a set of simultaneous singular integral equations of crack dislocation density function. By analysis of the fundamental solution of the singular integral equation, it is found that dynamic stress field at the crack tip is oscillatory singular, which is related to the frequency of incident wave. The singular integral equations are solved numerically, and the crack open displacement and dynamic stress intensity factor are evaluated for various incident angles and frequencies. The project supported by the National Natural Science Foundation of China (19872002) and Climbing Foundation of Northern Jiaotong University     

Limited permeable crack moving along the interface of a piezoelectric bi-material

A plane problem for a crack moving with a subsonic speed along the interface of two piezoelectric semi-infinite spaces is considered. The crack is assumed to be free from mechanical loading. The limited permeable electric condition with an account of electric traction is adopted at its faces. A uniformly distributed mixed mode mechanical loading and an electric flux are prescribed at infinity. The problem is reduced to the Riemann–Hilbert problem by means of introducing a moving coordinate system and assuming that the electric flux is uniformly distributed along the crack region. An exact solution of this problem is proposed. It permits to find in closed form all necessary electromechanical characteristics at the interface and to formulate the equation for the determination of the electric flux. Analysis of this equation confirms the correctness of the assumption concerning the uniform distribution of the electric flux in the crack region. The values of the electric flux are determined by solving the obtained equation. Thereafter, the stress and electric intensity factors as well as their asymptotic fields at the crack tip are also found. The particular case of a crack moving in a homogeneous piezoelectric material is considered. The values of the electric flux and the fracture parameters are found exactly in a simple form for this case. Also, a numerical analysis is performed for a crack propagating with a subsonic speed between PZT4 and PZT5 materials and for a crack moving in PZT4 material. The electric flux in the crack region, stress and electric intensity factors, crack opening and the energy release rate (ERR) are found as functions of the crack speed, loading and electric permeability of the crack medium. The influence of the electric traction on the crack faces upon the mentioned parameters is demonstrated.     

Some basic problems in anisotropic bimaterials with a viscoelastic interface

This research is devoted to the study of anisotropic bimaterials with Kelvin-type viscoelastic interface under antiplane deformations. First we derive the Green’s function for a bimaterial with a Kelvin-type viscoelastic interface subjected to an antiplane force and a screw dislocation by means of the complex variable method. Explicit expressions are derived for the time-dependent stress field induced by the antiplane force and screw dislocation. Also presented is the time-dependent image force acting on the screw dislocation due to its interaction with the Kelvin-type viscoelastic interface. Second we investigate a rectangular inclusion with uniform antiplane eigenstrains embedded in one of the two bonded anisotropic half-planes by virtue of the derived Green’s function for a line force. The explicit expressions for the time-dependent stress field induced by the rectangular inclusion are obtained in terms of the simple logarithmic and exponential integral functions. It is observed that in general the stresses exhibit the logarithmic singularity at the four corners of the rectangular inclusion. Our results also show that when one side of the rectangular inclusion lies on the viscoelastic interface, the interfacial tractions are still regular at the two corners of the inclusion which are located on the interface. Last we address a finite Griffith crack normal to the viscoelastic interface by means of the obtained Green’s function for a screw dislocation. The crack problem is formulated in terms of a resulting singular integral equation which is solved numerically. The time-dependent stress intensity factors at the two crack tips are obtained and some interesting features are discussed.     

The collinear crack problem for an orthotropic functionally graded coating–substrate structure

A theoretical treatment of antiplane crack problem of two collinear cracks on the two sides of and perpendicular to the interface between a functionally graded orthotropic strip bonded to an orthotropic homogeneous substrate is put forward. Various internal cracks and crack terminating at the interface and crack crossing the interface configurations are investigated, respectively. The problem is formulated in terms of a singular integral equation with the crack face displacement as the unknown variable. The asymptotic stress field near the tip of a crack crossing the interface is examined, and it is shown that, unlike the corresponding stress field in piecewise homogeneous materials, in this case, the “kink” in material property at the interface does not introduce any singularity. Numerical calculations are carried out, and the influences of the orthotropy and nonhomogeneous parameters and crack interactions on the mode III stress intensity factors are investigated.     

On stress analysis for a penny-shaped crack interacting with inclusions and voids

An analytical approach to calculate the stress of an arbitrary located penny-shaped crack interacting with inclusions and voids is presented. First, the interaction between a penny-shaped crack and two spherical inclusions is analyzed by considering the three-dimensional problem of an infinite solid, composed of an elastic matrix, a penny-shaped crack and two spherical inclusions, under tension. Based on Eshelby’s equivalent inclusion method, superposition theory of elasticity and an approximation according to the Saint–Venant principle, the interaction between the crack and the inclusions is systematically analyzed. The stress intensity factor for the crack is evaluated to investigate the effect of the existence of inclusions and the crack–inclusions interaction on the crack propagation. To validate the current framework, the present predictions are compared with a noninteracting solution, an interacting solution for one spherical inclusion, and other theoretical approximations. Finally, the proposed analytical approach is extended to study the interaction of a crack with two voids and the interaction of a crack with an inclusion and a void.     

High frequency scattering due to a pair of time-harmonic antiplane forces on the faces of a finite interface crack between dissimilar anisotropic materials

The high-frequency elastodynamic problem involving the excitation of an interface crack of finite width lying between two dissimilar anisotropic elastic half-planes has been analyzed. The crack surface is excited by a pair of time-harmonic antiplane line sources situated at the middle of the cracked surface. The problem has first been reduced to one with the interface crack lying between two dissimilar isotropic elastic half-planes by a transformation of relevant co-ordinates and parameters. The problem has then been formulated as an extended Wiener–Hopf equation (cf. Noble, 1958) and the asymptotic solution for high-frequency has been derived. The expression for the stress intensity factor at the crack tips has been derived and the numerical results for different pairs of materials have been presented graphically.     

Uniformly moving screw dislocation interacting with interface cracks in anisotropic bimaterials

This paper attempts to investigate the problem for the interaction between a uniformly subsonic moving screw dislocation and interface cracks in two dissimilar anisotropic materials. Using Riemann–Schwarz’s symmetry principle integrated with the analysis singularity of complex functions, we present the general elastic solutions of this problem and the closed form solutions for interface containing one and two cracks. The expressions of stress intensity factors at the crack tips and image force acting on moving dislocation are derived explicitly. The results show that the stress intensity factors at the crack tips decrease with increasing velocity of dislocation, and larger dislocation velocity leads to the equilibrium position of dislocation leaving from crack tips. The presented solutions contain previously known results as the special cases.