Polymeric arrayed waveguide grating using imprint method incorporating a flexible PDMS stamp

A polymeric arrayed waveguide grating (AWG) has been proposed and demonstrated by employing the nanoimprint method. A flexible PDMS (polydimethylsiloxane) stamp with the device patterns engraved was developed from a rigid master mold made of quartz glass, featuring uniform precision contact with and easy separation from polymer films. The device was fabricated by replicating the pattern on the stamp in a core polymer layer, with no etching process involved. For our device, the number of the output channels is eight and the center wavelength of each output channel is positioned from 1543.7 nm to 1548.3 nm with the spacing of 0.8 nm. The achieved channel crosstalk was about 10 dB and the 3 dB bandwidth approximately 0.8 nm.     

One-stage fabrication of sub-micron hydrophilic microchannels on PDMS

A sub-micron hydrophilic microchannel was fabricated on poly(dimethylsiloxane) (PDMS) in one step using vacuum ultraviolet light (VUV) lithography in vacuum. The topographies and properties of the irradiated PDMS surface were characterized and analyzed by atomic force microscopy (AFM), and the chemical composition changes on VUV-treated PDMS analyzed by X-ray photoelectron spectroscopy (XPS). The hydrophilic stability of irradiated PDMS surface was studied by static water contact angle. As demonstrated, the hydrophilicity on surface of PDMS microchannel can be kept for a longer term even three months after the treatment.     

二维光子晶体的软平板印刷技术制作研究

分析了软平板印刷技术制作二维光子晶体的特点和方法.利用绝缘PDMS模板,采用软平板印刷技术制造了三角晶系结构的二维聚合物光子晶体,采用同样的技术成功制成尺寸为150~500 nm,纵横比达1.25的高密度二维光子晶体.与其他制作技术相比,平板印刷技术具有大尺寸和易于制作的优点.结果表明,制作获得的微结构有很高的保真度.     

Fabrication of three-dimensional electrical patterns by swollen-off process: An evolution of the lift-off process

We present a novel process to fabricate three-dimensional (3D) metallic patterns from 3D printed polymeric structures utilizing different hygroscopic swelling behavior of two different polymeric materials. 3D patterns are printed with two different polymers as cube shape. The surface of the 3D printed polymeric structures is plated with nickel by an electroless plating method. The nickel patterns on the surface of the 3D printed cube shape structure are formed by removing sacrificial layers using the difference in the rate of hygroscopic swelling between two printing polymer materials. The hygroscopic behavior on the interfaced structure was modeled with COMSOL Multiphysics. The surface and electrical properties of the fabricated three-dimensional patterns were analyzed and characterized.     

Sub-microns period grating couplers fabricated by silicon mold

This paper describes a novel simple process suitable for fabrication of micro-periodic structure in optical waveguide. The mold was fabricated using electron beam lithography and fast atom beam etching. Sub-micron-scale patterns were transferred from silicon mold to polymer layer. Grating coupler was fabricated by the mold and normal optical mask. In the proposed method, no press which is needed for imprint lithography is required and the mold structure can be duplicated with high aspect ratio. Experimental coupling efficiency is about 25%. This technique can also be used to fabricate other nanometer-scale structures.     

Influence of un-cured PDMS chains in stamp using PDMS-based lithography

We present the compatibility of elastomeric stamp, poly(dimethylsiloxane) (PDMS), with inks for non-photolithography. This ink limitation is important in considering the lamination of hydrophilic solution on the patterned ink surface using an elastomeric stamp. We focus on an increase of the hydrophobicity of the patterned surface due to diffusion of low molecular weight (LMW) silicone polymer chains. This hydrophobicity increases inversely with the PDMS–ink interaction parameter (χ), which is correlated with the solubility parameter (δ). This study's results translate into proposed design factors for ink used in the patterned functional layer for PDMS-based lithography. Both the XPS and the contact angle measurement show that the hydrophobicity can be increased by LMW PDMS chains transfer from stamps, and this increase can cause the expansion of the free volume in PDMS pores through a swelling effect.     

Improvement of plasmonic field-matter interaction by subwavelength dielectric gratings

We experimentally and theoretically investigate that detection sensitivity in surface plasmon resonance (SPR) biosensors can be significantly enhanced by employing subwavelength dielectric gratings deposited on a gold film. The enhancement originates from an improvement of field-matter interaction: enhanced evanescent field intensity at the binding region and increased surface reaction area. Using a large-area SiO₂ grating array fabricated by nanoimprint lithography, experimental sensor performance measured by parylene film coating shows that the SPR substrates combined with a dielectric grating provide a notable sensitivity improvement compared to a conventional bare gold film. We also demonstrate that plasmon field can be more confined and enhanced at the dielectric gratings with a larger width. The proposed SPR structure could potentially be useful in a variety of plasmonic applications including high-sensitivity biosensors.     

Features of surface acoustic wave propagation in lithium niobate damaged by an electron beam

The propagation of surface acoustic waves (SAWs) in a thin-film aluminum waveguide of Δv/v type fabricated on a 128° Y-X LiNbO₃ plate by lift-off lithography and direct writing by a 20-keV electron beamis studied experimentally. The temperature dependence of the phase of the signal passed through an SAW delayline exhibits steps and hysteresis. The line consists of such a waveguide and two interdigital transducers with acenter frequency of 486 MHz and is exposed to a nitrogen flow. The vapors of water-containing analytes introduced into the nitrogen flow cause anomalous phase changes. These changes are of opposite sign and more thanone order of magnitude greater than the phase changes observed under similar conditions in specimens fabricated by optical lithography. It is concluded that these phenomena offer possibilities for designing SAW humidity sensors with a low threshold of sensitivity.     

磁性量子元胞自动机功能阵列的实验研究

采用电子束光刻、热蒸镀和剥离工艺在室温下制备了多组磁性量子元胞自动机器件功能阵列. 实验研究了曝光剂量和曝光时间对三个不同间距参数磁性量子元胞自动机阵列图案的影响, 发现100 pA电子束束流和0.38 μs曝光时间可获得理想的阵列图案. 对制备的反相器阵列结构进行了磁力显微测试, 结果显示了正确的逻辑功能, 成功实现了不同间距参数功能阵列的实验制备. 此外, 实验还发现纳磁体阵列制备中容易出现缺陷, 模拟结果表明丢失纳磁体缺陷导致了信号传递反相.     

Band diagram determination of MOS structures with different gate materials on 3C-SiC substrate

MOS capacitors were fabricated on 3C-SiC n-type substrate (001) with a 10-μm N-type epitaxial layer. An SiO₂ layer of the thickness t_OX ≈55 nm was deposited by PECVD. Circular Al, Ni, and Au gate contacts 0.7 mm in diameter were formed by ion beam sputtering and lift-off. Energy band diagrams of the MOS capacitors were determined using the photoelectric, electric, and optical measurement methods. Optical method (ellipsometry) was used to determine the gate and dielectric layer thicknesses and their optical indices: the refraction n and the extinction k coefficients. Electrical method of C = f(V_G) characteristic measurements allowed to determine the doping density ND and the flat band voltage VFB in the semiconductor. Most of the parameters which were necessary for the construction of the band diagrams and for determination of the basic physical properties of the structures (e.g. the effective contact potential difference ϕ_MS) were measured by several photoelectric methods and calculated using the measurement data. As a result, complete energy band diagrams have been determined for MOS capacitors with three different gate materials and they are demonstrated for two different gate voltages VG: for the flat-band in the semiconductor (V_G = V_FB) and for the flat-band in the dielectric (V_G = V_G0).     

Fabrication of PDMS microlens array by digital maskless grayscale lithography and replica molding technique

This paper presents a facile and effective method to fabricate microlens array in polydimethylsiloxane (PDMS). The microlens array model is fabricated in photoresist via digital maskless grayscale lithography technique and the replica molding technique is used to fabricate PDMS microlens array. A convex PDMS microlens array with rectangular aperture and concave PDMS microlens array with hexagonal aperture are fabricated. The morphological characteristics of the microlens arrays are measured by microscope and 3D profiler. The results indicate that the profiles of the PDMS microlens arrays are clear and distinct. This method provides a simple and low-cost approach to prepare large area, concave or convex with arbitrary shape microlens array, which has potential application in many optoelectronic devices.     

Novel fabrication technologies of planar nano-gap electrodes for single molecule evaluation

Present information technologies use semiconductor devices and magnetic/optical disc. However, they are all foreseen to face fundamental limitations within a decade. Therefore, superseding devices are required for the next paradigm of high performance information technologies. This paper describes prospects for single molecule devices suitable for future information processing technologies, which are expected as the most probable candidate to supersede the present semiconductor devices. The first milestone towards the realization of single molecule devices in future electronics requires quantitative evaluation of single molecule characteristics, which inevitably needs planar nano-gap electrodes between which single molecules are sandwiched, observed their structures and measured their electrical characteristics. Nano-meter electrode pattern fabrication was achieved by electron beam lithography and metal lift-off, while planarization process requires many new technologies including chemical–mechanical polishing (CMP) and wafer bonding. The detailed planarization processing technologies are described in this paper to realize nm-planar nano-scale electrodes.     

The fabrication of 3-D nanostructures by a low- voltage EBL

Three-dimensional (3-D) structures are used in many applications, including the fabrication of opto-electronic and bio-MEMS devices. Among the various fabrication techniques available for 3-D structures, nano imprint lithography (NIL) is preferred for producing nanoscale 3-D patterns because of its simplicity, relatively short processing time, and high manufacturing precision. For efficient replication in NIL, a precise 3-D stamp must be used as an imprinting tool. Hence, we attempted the fabrication of original 3-D master molds by low-voltage electron beam lithography (EBL). We then fabricated polydimethylsiloxane (PDMS) stamps from the original 3-D mold via replica molding with ultrasonic vibration.First, we experimentally analyzed the characteristics of low-voltage EBL in terms of various parameters such as resist thickness, acceleration voltage, aperture size, and baking temperature. From these e-beam exposure experiments, we found that the exposure depth and width were almost saturated at 3 kV or lesser, even when the electron dosage was increased. This allowed for the fabrication of various stepped 3-D nanostructures at a low voltage. In addition, by using line-dose EBL, V-groove patterns could be fabricated on a cured electron resist (ER) at a low voltage and low baking temperature. Finally, the depth variation could be controlled to within 10 nm through superposition exposure at 1 kV. From these results, we determined the optimum electron beam exposure conditions for the fabrication of various 3-D structures on ERs by low-voltage EBL. We then fabricated PDMS stamps via the replica molding process.     

Top contact organic field effect transistors fabricated using a photolithographic process

This paper proposes an effective method of fabricating top contact organic field effect transistors by using a pho-tolithographic process.The semiconductor layer is protected by a passivation layer.Through photolithographic and etching processes,parts of the passivation layer are etched off to form source/drain electrode patterns.Combined with conventional evaporation and lift-off techniques,organic field effect transistors with a top contact are fabricated suc-cessfully,whose properties are comparable to those prepared with the shadow mask method and one order of magnitude higher than the bottom contact devices fabricated by using a photolithographic process.     

磁性量子元胞自动机拐角结构的理论模拟和实验

磁性量子元胞自动机拐角结构是一种同时含有铁磁耦合和反铁磁耦合的电路. 理论模拟了外加时钟场作用下铸铁磁性材料拐角结构的信号传递. 采用微磁仿真给出了信号传递的磁化演化图, 结果证实了铸铁纳磁体能够实现含有两种冗长耦合结构的稳定转换. 实验制备了相应的拐角结构, 扫描电子显微图和磁力显微图结果显示了成功的电路图案和正确的两种耦合方式信号传递.     

Fabrication of multi-scale structures with multiple X-ray masks and synchrotron hard X-ray irradiations

Synchrotron hard X-ray irradiation can be utilized in lithography processes to manufacture precise structures. Due to the difficulty of precise X-ray mask fabrication in hard X-ray lithography, this X-ray process has been used mainly to fabricate precise microstructures. In this study, a technology is proposed for fabricating novel multi-scale patterns that include submicron-scale structures using hard X-rays. The required X-ray masks for submicron-sized patterning are fabricated by a simple UV lithography process and sidewall metal deposition. Above all, thanks to the high penetration capability of hard X-rays with sub-nanometer wavelengths, it is possible to employ multiple masks to fabricate a variety of patterns. By combining each sub-micron X-ray mask with typical micro-sized X-ray masks, a unique X-ray lithography is performed, and various multi-scale structures are fabricated. The usefulness of the proposed technology is demonstrated by the realization of these structures.     

Fabrication of optical devices in poly(dimethylsiloxane) by proton microbeam

Optical diffraction grating and micro Fresnel zone plate type structures were fabricated in relatively thin poly(dimethylsiloxane) (PDMS) layers using proton beam writing technique and the performance of these optical devices was tested. PDMS is a commonly used silicon-based organic polymer, optically clear, generally considered to be inert, non-toxic and biocompatible. PDMS has been used as a resist material for direct-write techniques only in very few cases. In this work, PDMS was used as a resist material; the structures were irradiated directly into the polymer. We were looking for a biocompatible, micropatternable polymer in which the chemical structure changes significantly due to proton beam exposure making the polymer capable of proton beam writing. We demonstrated that the change in the structure of the polymer is so significant that there is no need to perform any development processes. The proton irradiation causes refractive index change in the polymer, so diffraction gratings and other optical devices like Fresnel zone plates can be fabricated in this way. The observed high order diffraction patterns prove the high quality of the created optical devices.     

用于折射率传感的聚合物基狭缝波导的模拟与制备

设计了在极近红外波段(890 nm)的聚合物基狭缝波导微环折射率传感器.分析了波导高度、宽度及狭缝宽度对灵敏度的影响,以找到最佳的设计标准用于折射率传感.采用电子束光刻工艺制备了硅母版模,并用独特的氟化聚合物PFPE从硅母版模上成功制备了柔性软模具.采用紫外软压印工艺制备了聚合物基狭缝波导.波导的宽度和高度以及狭缝波导的宽度分别约为510 nm、830 nm和234 nm,聚合物狭缝波导残留层的厚度约为350 nm.制备的狭缝波导具有高的高宽比并与低成本批量生产工艺相兼容.     

Mechanics of plasma exposed spin-on-glass (SOG) and polydimethyl siloxane (PDMS) surfaces and their impact on bond strength

Silicone polymer (PDMS), widely used for micro-fluidic and biosensor applications, possesses an extremely dynamic surface after it is subjected to an oxygen plasma treatment process. The surface becomes extremely hydrophilic immediately after oxygen plasma exposure by developing silanol bond (SiOH), which promotes its adhesion to some other surfaces like, silicon, silicon dioxide, glass, etc. Such a surface, if left in ambient dry air, shows a gradual recovery of hydrophobicity. We have found an identical behavior to occur to surfaces coated with a thin continuous film of SOG (methyl silsesquioxane). The chemistry induced by oxygen plasma treatment of a spin-on-glass (SOG) coated surface provides a much higher density of surface silanol groups in comparison to precleaned glass, silicon or silicon dioxide substrates thus providing a higher bond strength with polydimethyl siloxane (PDMS). The bonding protocol developed by using the spin coated and cured SOG intermediate layer provides an universal regime of multi level wafer bonding of PDMS to a variety of substrates. The paper describes a contact angle based estimation of bond strength for SOG and PDMS surfaces exposed to various combinations of plasma parameters. We have found that the highest bond strength condition is achieved if the contact angle on the SOG surface is less than 10°.     

Improved Dielectric Breakdown Strength of Covalently-Bonded Interface Polymer–Particle Nanocomposites

Interfacial covalent bonding is an effective approach to increase the electrical resistance of a polymer–particle composite to charge flow and dielectric breakdown. A bifunctional tether reagent bonded to an inorganic oxide particle surface assists with particle dispersion within a thermosetting epoxy polymer matrix but then also reacts covalently with the polymer matrix. Bonding the particle surface to the polymer matrix resulted in a composite that maintained the pure polymer glass transition temperature, compared to modified or unmodified particle dispersions that lacked covalent bonding to the polymer matrix, which depressed the polymer glass transition to lower temperatures. The added interfacial control, directly bonding the particle to the polymer matrix, appears to prevent conductive percolation across particle surfaces that results in a reduced Maxwell–Wagner relaxation of the polymer–particle composite and a reduced sensitivity to a dielectric breakdown event. The inclusion of 5 vol% particles of higher permittivity produces a composite of enhanced dielectric constant and, with surface modification to permit surface cross-linking into the polymer, a polymer–particle composite with a Weibull E ₀ dielectric breakdown strength of 25% greater than that of the pure polymer resulted. The estimated energy density for the cross-linked interface composite was improved 260% compared to the polymer alone, 560% better than a polymer–particle composite synthesized using bare particles, and 80% better than a polymer–particle composite utilizing bare particles with a dispersant.