周期性多层膜合金化制取的NiTi形状记忆薄膜的相深度分布

用掠入射X射线衍射对磁控溅射制取的等原子比Ni/Ti周期性多层膜晶化热处理后的相深度分布进行了分析. Ni-Ti形状记忆薄膜在深度方向的相分布是不均匀的,表现为靠近外表面是Ti3Ni4沉淀相、马氏体相和少量奥氏体相的三相混合区,靠近基体是单一的马氏体相区,薄膜和基体发生了界面扩散与反应. 周期厚度对薄膜的相深度分布有一定影响.     

纳米多层膜“软"相结构参量对硬度的Hall-Petch表征

采用直流磁控溅射方法制备了不同调制比的Ni/Al纳米多层膜,利用X射线衍射技术和纳米压入连续刚度法分析了薄膜微结构及塑性变形的尺度依赖性.实验结果表明,尽管调制比有所不同,多层膜的硬度与“软"相的微结构特征参量随调制波长减小具有相似变化规律,说明多层膜的变形机制对“软"相的微结构约束存在敏感性.随着薄膜特征尺度的减小,为统一多层膜中晶界和膜界两种强化机制,提出一个与“软”相相关的表征参量r(r＝L_sub/d,L关键词： 纳米多层膜 塑性变形 调制波长 Hall-Petch关系     

多弧离子镀工艺对TiN/Ti与Cr/Cu界面及微结构的影响

用多弧离子镀技术在铜基上电镀Cr/Ni层进行不同工艺条件下多弧离子沉积TiN/Ti实验.借助X射线衍射(XRD)和扫描电子显微镜(SEM)研究了TiN/Ti与Cr/Cu接触界面形成、微结构及其组分与形貌.XRD分析显示,薄膜表面组分包含TiN,Ti₂N多晶相外,还包含一些Cr-Ti的金属间化合物等.显然,TiN,Ti₂N在表面上已形成.SEM观察指出,在90℃制备的表面膜具有不平整的类枝状结晶结构.随着温度升高至170℃,得到精细TiN/Ti覆盖层表面,XRD峰 关键词： 多弧离子镀 氮化钛 界面形成 微结构     

Ti-Si-N复合膜的界面相研究

为了揭示Ti_Si_N复合膜中Si₃N₄界面相的存在方式及其对薄膜力学 性能的影响 ，采用x射线衍射仪、高分辨透射电子显微镜、俄歇电子能谱仪和显微硬度仪对比研究了磁 控溅射Ti_Si_N复合膜和TiN/Si₃N₄多层膜的微结构和力学性能. 实 验结果表明 ，Ti_Si_N复合膜均形成了Si₃N₄界面相包裹TiN纳米晶粒的微结构. 其中低Si 含量的Ti_Si_N复合膜中Si₃N₄界面相的厚度小于1nm，且以晶体态 存在，薄膜 呈现高硬度. 而高Si含量的Ti_Si_N复合膜中的Si₃N₄界面相以非晶 态存在，薄 膜的硬度也相应降低. 显然，Ti_Si_N复合膜中Si₃N₄界面相以晶体 态形式存在 是薄膜获得高硬度的重要微结构特征，其强化机制可能与多层膜的超硬效应是相同的. 关键词： Ti－Si－N复合膜 界面相 微结构 超硬效应     

NiTi合金薄膜厚度对相变温度影响的X射线光电子能谱分析

采用X射线衍射和X射线光电子能谱实验手段对不同厚度的NiTi薄膜相变温度的变化进行了分析.结果表明在相同衬底温度和退火条件下,3?μm厚度的薄膜晶化温度高于18?μm厚度的薄膜.衬底温度越高,薄膜越易晶化,退火后薄膜奥氏体相转变温度As越低.薄膜的表面有TiO₂氧化层形成,氧化层阻止了Ni原子渗出;膜与基片的界面存在Ti₂O₃和NiO.由于表面和界面氧化层的存在,不同厚度的薄膜内层的厚度也不同,因而薄膜越薄,Ni原子的含量就越高.Ni原子的含量的不同会影响薄膜的相变温度. 关键词： NiTi合金薄膜 X射线衍射 相变 X射线光电子能谱     

Ti(Cr)缓冲层对用于垂直磁记录材料CoCrTa介质磁特性和微结构的影响

利用直流对靶磁控溅射技术在单晶Si衬底上制备了C/CoCrTa/X (X=Cr，Ti)介质材料.分别采用振动样品磁强计、X射线衍射仪、扫描探针显微镜对样品的磁性、微结构等进行了测试分析.研究发现，Ti缓冲层有利于样品中Co晶粒的易轴垂直于膜面生长.以Ti为缓冲层的样品，颗粒尺寸和表面粗糙度较小，而且磁畴明显，说明以Ti为缓冲层的薄膜样品更适宜做垂直磁记录. 关键词： CoCrTa 垂直磁记录 缓冲层 微结构     

反应溅射VN/SiO2纳米多层膜的微结构与力学性能

采用V和SiO₂靶通过反应溅射方法制备了一系列具有不同SiO₂和VN调制层厚的VN/SiO₂纳米多层膜. 利用X射线衍射、X射线能量色散谱、高分辨电子显微镜和微力学探针表征了多层膜的微结构和力学性能. 结果表明：在Ar，N₂混和气体中，射频反应溅射的SiO₂薄膜不会渗氮. 单层膜时以非晶态存在的SiO₂，当其厚度小于1nm时，在多层膜中因VN晶体层的模板效应被强制晶化，并与VN层形成共格外延生长. 相应地，多层膜的硬度得到明显提高，最高硬度达34GPa. 随SiO₂层厚度的进一步增加，SiO₂层逐渐转变为非晶态，破坏了与VN层的共格外延生长结构，多层膜硬度也随之降低. VN调制层的改变对多层膜的生长结构和力学性能也有影响，但并不明显. 关键词： 2纳米多层膜')" href="#">VN/SiO₂纳米多层膜 共格外延生长 非晶晶化 超硬效应     

磁控溅射制备Ni/Ti多层膜表面粗糙度

采用磁控溅射方法制备了周期数分别为10,30,50和75的Ni/Ti多层膜,利用X射线掠入射反射测量了多层膜表面和界面的状态,并用原子力显微镜测量了多层膜的表面粗糙度,研究了不同周期数的Ni/Ti多层膜表面粗糙度的变化规律。结果表明:Ni/Ti多层膜表面粗糙度随着膜层数增加而增加,当Ni/Ti多层膜的周期数从10变化到75时,其表面粗糙度由0.80 nm增大到1.69 nm。实验数据拟合表明:Ni/Ti多层膜表面粗糙度与周期数成3次方关系;但在周期数较小时,粗糙度与周期数成线性关系。     

纳米晶Ti薄膜的结构研究

用高密度、高电离度的电子迴旋共振等离子体溅射方法在室温基片上沉积出纳米晶Ti薄膜,基体为玻璃、NaCl单晶、纯Al等。对Ti薄膜的结构、形貌和成分进行X射线衍射(XRD),透射电子显微镜(TEM)和X射线光电子能谱(XPS)分析,表明所沉积的Ti薄膜是平均粒径d<10nm,晶粒大小均匀且具有比较稳定的fcc反常结构的纳米晶粒膜。我们还较系统地研究了各工作参数对Ti薄膜的晶体结构、晶粒尺寸、成膜速率以及对基体粘附力的影响,分析了成膜机理。 关键词：     

光纤基底TiNi形状记忆合金薄膜制备工艺

将TiNi基记忆合金薄膜与光纤相结合可制成智能化、集成化且成本经济的微机电系统和微传感器件.本文采用磁控溅射法在二氧化硅光纤基底上制备TiNi记忆合金薄膜,系统讨论了溅射工艺参数以及后续退火处理对薄膜质量的影响.采用自研制光纤镀膜掩膜装置在直径为125μm的光纤圆周表面上形成均匀薄膜.实验表明:在靶基距、背底真空度、Ar气流量和溅射时间一定的条件下,溅射功率存在最佳值;溅射压强较大时,薄膜沉积速率较低,但薄膜表面粗糙度较小.进行退火处理后,薄膜形成较良好的晶体结构,Ti_49.09Ni_50.91薄膜中马氏体B19′相和奥氏体B2相共存,但以B19′为主.根据本文研究结果,在玻璃光纤基底上制备高质量的TiNi基记忆合金薄膜是可实现的,本工作为下一步研制微机电系统和微型传感器做了基础准备.     

Electron density profile at the interface of SiO2/Si(0 0 1)

In this report we present grazing incidence X-ray reflectivity (GIXR) study of SiO₂/Si(0 0 1) system. We have analysed the X-ray reflectivity data using recursive formalism based on matrix method and distorted wave Born approximation (DWBA). From the analysis of the reflectivity data we could obtain the electron density profile (EDP) at the interface of the dielectric SiO₂ film and the Si(0 0 1) substrate. The EDP obtained from the matrix method follows the DWBA scheme only when two transition layers are considered at the interface of SiO₂/Si. The layer which is in proximity with the Si substrate has a higher electron density value than the Si and SiO₂ values and it appears as a maximum in the EDP. The layer which is in proximity with the dielectric SiO₂ layer has an electron density value lower than the SiO₂ value and it appears as a minimum in the EDP. When the thickness of the SiO₂ layer is increased the lower density layer diminishes and the higher density layer persists.     

Polarized neutron reflectivity and X-ray scattering measurements as tools to study properties of Pt/Co/Pt ultrathin layers irradiated by femtosecond laser pulses

ABSTRACT

We have used polarized neutron reflectivity, X-ray diffraction, X-ray reflectivity and magneto-optical Kerr effect in polar configuration to study the properties of ultrathin Pt/Co/Pt films. Structures consisting of a 5-nm thick Pt buffer, 3-nm thick Co layer and 5-nm thick Pt cover layer were deposited onto (0001)-oriented Al₂O₃ substrate by the molecular beam epitaxy (MBE) method. Irreversible modifications of film properties, resulting from its illumination by single femtosecond laser pulses, of duration of 40 fs and wavelength of 800 nm, were observed and analyzed. As prepared films exhibited magnetization in-plane, but after laser irradiation, the direction of magnetization was rotated to out-of-plane state. Formation of Co–Pt alloy phase caused by quasi-uniform film irradiation was demonstrated by the results of X-ray and neutron scattering measurements. Moreover, polarized neutron and X-ray reflectivity data showed that after illumination Co was distributed mostly in the area of nominal Co layer and Pt cover layer and its diffusion into the Pt buffer was less significant.     

Composition and corrosion resistance of coatings on the basis of nitrides of titanium and chromium

Ti-Cr-N coatings were deposited on a low-carbon steel St3 substrate by overlapping of Ti and Cr plasma flows in residual nitrogen atmosphere using ion bombardment. Auger electron spectroscopy and X-ray diffraction were used to analyze the element and phase composition of the deposited coatings. It was established that, under constant deposition conditions (the arc current, gas pressure, bias voltage), coatings possess the fcc structure of a (Ti,Cr)N solid solution with uniform distribution of elements along the depth. The growth of the substrate bias voltage leads to an increase of titanium concentration in the coating due to changes in the interaction processes (condensation and sputtering) of the deposited materials with the substrate. Corrosion tests of the coatings and steel St3 were performed in acid (1 M H₂SO₄) and salt (3% NaCl) media. It was found that the corrosion processes progress less intensely in salt solution than in acid medium.     

Surface chemical states of barium zirconate titanate thin films prepared by chemical solution deposition

Ba(Zr_0.05Ti_0.95)O₃ (BZT) thin films grown on Pt/Ti/SiO₂/Si(1 0 0) substrates were prepared by chemical solution deposition. The structural and surface morphology of BZT thin films has been studied by X-ray diffraction (XRD) and scanning electron microscope (SEM). The results showed that the random oriented BZT thin film grown on Pt/Ti/SiO₂/Si(1 0 0) substrate with a perovskite phase. The SEM surface image showed that the BZT thin film was crack-free. And the average grain size and thickness of the BZT film are 35 and 400 nm, respectively. Furthermore, the chemical states and chemical composition of the films were determined by X-ray photoelectron spectroscopy (XPS) near the surface. The XPS results show that Ba, Ti, and Zr exist mainly in the forms of BZT perovskite structure.     

XPS and SIMS characterisation of TiOxNy solar absorber films

Solar thermal collectors have been prepared with thin TiO_xN_y films deposited using ion beam assisted deposition, on Si and Cu substrates. The films are amorphous and x and y were controlled by altering the O₂/N₂ ratio in the gas source. After annealing at temperatures of 200 – 400 °C, films have been depth profiled using Secondary Ion Mass Spectrometry. Profiles reveal the degradation of the film, particularly for films on Cu substrates, by migration of the substrate atoms through the films, to the sample surface. In general, films with x<1 and y>1 show improved temperature stability, ultimately at the expense of a reduced transmission window. Contrary to previous suggestions in the literature, the degradation mechanism initially involves the formation of a nitrogen rich phase, rather than an oxide at the film surface. On copper substrates, the nature of the films and of this phase, formed by diffusion of the substrate atoms, have been investigated by X-ray photoelectron spectroscopy (XPS). These investigations reveal complex behaviour in the early stages of film failure, with the suggestion that the initial films, at least near the surface, are two phase, and the reaction layer mixes the TiO_xN_y with some Ti replacement by ions from the Cu substrate.     

Composition of the sputter deposited W-Ti thin films

Tungsten-titanium (W-Ti) thin film was deposited by dc Ar⁺ sputtering of W(70 at.%)-Ti(30 at.%) target. The thin film composition, determined by X-ray photoelectron spectroscopy (XPS) depth profiling, is W_(0.77±0.07)Ti_(0.08±0.03)O_(0.15±0.03). The presence of oxygen in the deposit is due to the rather poor vacuum conditions during the deposition, while significant deficiency of Ti, as compared to the sputtering target composition cannot be explained straightforwardly. Monte Carlo simulations of both, transport of sputtered particles from target to the substrate through the background gas (SRIM 2003 program) and thin film sputtering during the XPS depth profiling (program TRIDYN_FZR) are presented. The simulations show that the particle transport through the background gas is mainly responsible for the Ti depletion: the estimated composition of the thin film is W_0.61Ti_0.16O_0.23. Additional apparent Ti depletion occurs due to the preferential sputtering during the thin film composition analysis. The simulation of the sputtering process show that the surface concentration measured by XPS should be about W_0.74Ti_0.11O_0.15. The discrepancy between the estimated surface composition and the actual experimental result is in the range of the experimental error.     

添加Y改善离子镀氮化钛膜的结构与性能

评价了离子镀氮化钛(TiN)和Y改性氮化钛(Ti(Y)N)膜的结合强度和在酸性介质中的耐蚀性能;用X射线衍射,离子探针质谱分析(IMA),透射电子显微镜(TEM)研究它们的显微结构特征;结果表明,添加Y元素富集在Ti(Y)N与A₃钢基材界面区域,并形成厚度约为20nm的亚层,Y的界面改性导致Ti(Y)N膜的X射线衍射线形略有宽化和明显的TiN相(111)面的择优生长取向;这些显微结构特征的改善导致Ti(Y)N膜比TiN膜具有更高的界面结合强度和更好的耐蚀性能。 关键词：     

X-ray study of growing wetting films

X-ray scattering experiments of liquid films on top of solid substrates were performed. With a short pulse disturbance, caused by a temperature difference between the substrate and the vapour in the X-ray cell, the wetting film thickness is reduced. Afterwards the time dependence of the growing film is monitored by X-ray reflectivity measurements in the region of total external reflection. We have examined CCl₄- and CCl₃Br-films on top of silicon wafers and CCl₃Br on glass/gold and glass/silver substrates. The film thickness as function of time is explained by the Kolmogorov growth model. From the data we obtain rather long time constants and the dimensiond=2 of the growing process     

Evolution of the structural and optical properties of silver oxide films with different stoichiometries deposited by direct-current magnetron reactive sputtering

Nitrogen doping of silver oxide(AgxO) film is necessary for its application in transparent conductive film and diodes because intrinsic AgxO film is a p-type semiconductor with poor conductivity.In this work,a series of AgxO films is deposited on glass substrates by direct-current magnetron reactive sputtering at different flow ratios(FRs) of nitrogen to O2.Evolutions of the structure,the reflectivity,and the transmissivity of the film are studied by X-ray diffractometry and sphectrophotometry,respectively.The specular transmissivity and the specular reflectivity of the film decreasing with FR increasing can be attributed to the evolution of the phase structure of the film.The nitrogen does not play the role of an acceptor dopant in the film deposition.