小型平板CPL蒸发器耦合计算及优化设计研究

本文建立了小型平板CPL蒸发器毛细多孔芯内汽液两相流动与传热的模型以及金属外壁和工质区的导热模型,并进行耦合求解.分析了金属侧壁效应对蒸发器性能的影响,提出小型平板CPL存在着侧壁效应传热极限.数值结果表明,工质蒸发发生在多孔芯加热表面附近,蒸发器采用单一金属外壁时由于侧壁效应导致系统传热极限低,而上壁采用导热系数大,侧壁及下壁采用导热系数小的新型结构能够明显的提高系统的传热能力,同时使加热表面的温度维持在较低的水平.     

CPL蒸发器多孔芯传热传质特性的新数学模型

毛细循环泵(CPL),由于具有高热传输性能,目前已经成为大功率载荷的电子芯片排热系统的一个重要发展方向,尤其是在航空航天飞行器上。选择一种具有较大相变潜热的工质,例如甲醇, CPL可以传输相当大的热流。本文对CPL蒸发器多孔芯流动和传热的数值模拟提出了一个新的发展方向,就是在计算中加入非饱和模型数值计算。文中阐述了加入非饱和计算的三层模型对真实模拟蒸发器多孔芯流动和传热问题的重要性,并给出了应用新的三层模型所得到的初步计算结果。     

复合结构毛细蒸发器传热特性研究

研制了复合结构毛细蒸发器环路热管,实验研究了环路热管的启动性能与运行特性,通过与单一结构毛细蒸发器环路热管对比,表明复合结构毛细蒸发器环路热管传热功率密度得到了提高,热阻明显降低.但在低功率下启动时,复合结构毛细蒸发器环路热管的温度波动现象加剧.     

环路热管技术的研究热点和发展趋势

综述了环路热管技术近20年的主要理论和实验研究内容,分析了当前的研究热点,包括环路热管启动特性研究,以温度滞后和温度波动现象为代表的暂态特性研究,新型毛细芯的研制和毛细结构的优化,蒸发器内的强化传热和可视化研究,以及高级环路热管、混合冷却环路、多蒸发器混合环路热管、低温环路热管等新型环路热管技术。     

Coefficient de transfert, à l'interface de vaporisation,d'une boucle fluide diphasique à pompage thermocapillaire

Heat transfer coefficient at vaporisation interface of a two phase capillary loop. In this article, we present the results of heat transfer coefficient measurements at the vaporisation interface of a capillary pumped two-phase loop for two different types of evaporators and various powers. High contact between the evaporator wall and the porous wick, which induces capillary pumping, prevents vapor from escaping and being forced back into the wick and inhibits the device starting up. First, the surface state of the evaporator wall, then the minimum distance between wall and porous wick necessary to optimize operating conditions have been established.     

两相毛细泵环蒸发器性能的实验研究

本文对两根毛细泵环反向式蒸发器的传热性能进行了实验研究．研究了不同槽道结构尺寸及不同毛细材料组合对蒸发器传热性能的影响，并研究了蒸发器入口液体不同的过冷度等因素对蒸发器传热性能的影响。     

CPL蒸发器毛细芯中流动与传热的场协同分析

本文从场协同的角度分析工质在蒸发器毛细芯中的流动与传热情况,针对不同的蒸发器肋片结构参数、毛细多孔芯厚度以及不同的热流密度进行了数值分析。结果表明,利用场协同原理,可以解释不同的蒸发器结构参数和热负荷对蒸发器传热效果的影响,从而为优化蒸发器结构,提高CPL效能提供理论依据。     

小型平板CPL蒸发器预热驱动过程研究

分析了小型平板CPL蒸发器毛细多孔芯上下表面温差对启动的影响,建立了蒸发器满液启动的数学模型.结果表明,对不同的金属外壁,多孔芯上下表面平均温差存在一个最大值,铜壁时,温差较小,侧壁效应明显;采用不锈钢壁及上壁铜、侧壁下壁不锈钢时,温差大,侧壁效应小;采用不锈钢外壁时蒸发器加热面的温度过高.上壁采用导热系数大、侧壁下壁为导热系数小的金属对小型平板CPL蒸发器的正常启动以及降低加热表面温度非常有利.     

微小化毛细泵吸环路(miniature CPL)应用于笔记本计算机传热之研究

本文针对目前笔记本计算机CPU在小空间内的高发热量趋势,提出采用毛细泵吸环路（CPL）取代传统热管,实现小空间内的更高效传热。传统大型CPL环路的研究与应用已经相当完备,但当尺寸缩小时会有许多新的问题产生。本文通过实验观察及理论分析,望能发展出适用未来电子产品高发热需求的微小化CPL环路。     

新型平板式CPL的性能实验

本文介绍了由本实验室自主研发设计的平板式CPL(Capillary Pumped Loop)系统的组成与结构,以及在该系统上进行的大量的工作性能实验研究,实验结果表明本系统在热负荷低于450 W时具有良好的工作性能;系统储液器的设点温度会直接影响系统的工作温度,系统具有一定的控温能力;当系统的工作温度出现较大程度的波动时,系统的工作能力趋向极限.     

Performance Analysis of a New Water-based Microcooling System

In the electronic industry, dissipating the heat load becomes a critical factor for highly developed designs. These require higher power transfer in a more compact size. In the current study, a new microcooling system was developed and tested. It utilizes the enhancement in heat transfer characteristics associated with implementing a vortex promoter in the evaporator segment of a water-based heat pipe. The test evaporator was a cavity of 4-mm diameter and 23-mm length in an electrically heated aluminum block. A helical coil (of various diameters, namely 500, 300, and 250 μm) was introduced to the evaporator segment to act as a vortex promoter. Configurations of a new microcooling system based on a modified heat pipe technology were built and tested. The presented system proves to work efficiently in situations where a closed-loop thermosyphon encounters film boiling limitation. The most efficient configuration has a flow modifier diameter about one-tenth of the evaporator chamber gap, while the diameter of the return line was three-quarters of the evaporator gap. This configuration shows a stable operation characteristic and possesses high thermal efficiency. The maximum heat flux obtained by such a configuration was 305 W/cm² when it runs at 103°C saturated temperature and 0.01°C/W thermal resistance. A uniform temperature distribution along the system was noticed.     

照明用大功率LED回路热管散热器的研究

分析了照明用大功率LED封装的散热特性,提出了一种用于大功率LED系统散热的回路热管;研究了热负荷、倾角、加热方式等对热管的起动性、均温性、热阻等的影响。试验结果表明,所设计的热管散热器的热阻在0.19K/W~3.1K/W之间,蒸发器的均温性被控制在1.5℃以内,满足大功率LED封装的均温性要求,在热负荷为100W时,蒸发器的温度被控制在100℃以下,满足大功率LED结点温度的控制要求。     

孔隙率和渗透率对LHP主芯性能影响研究

毛细多孔芯的结构参数对环路热管(LHP)主芯中的流动和传热有着重要影响.通过发展一个综合考虑了热传导、对流和蒸发多种传热效应的模型,以及利用数值模拟易于独立改变参数的特点,研究了孔隙率和渗透率这对参数组合对LHP主芯内部流场和性能的影响.模拟结果在一定范围内是合理的,且对于LHP实验研究和工程应用具有一定的参考意义.     

CO_2两相回路启动过程阶段蒸发和干烧现象分析

采用并联蒸发器作为传热元件,并联冷凝器作为散热部件,建立了包括热量收集、传递与排散的机械泵驱动两相回路集成试验系统,并对该系统的热启动进行实验研究.实验结果表明:(1)在冷工况、低热流密度的情况下,采用长程毛细管结构的蒸发器对分布式小热源进行集热时,会出现阶段性形核沸腾蒸发,并且上游过热液体形核沸腾后会导致下游出现干烧现象.(2)对于该系统,并联蒸发器相同热量同时启动是相对较好的启动方式.     

Thermal Resistance Measurement across a Wick Structure Using a Novel Thermosyphon Test Chamber

A novel system is developed for measuring the thermal resistance across thin layers of sintered copper wicks of varying porosity. Wicks to be tested are integrated into a passive vertical thermosyphon system, and the resistance is measured for a series of input power levels. The wicks are sintered to a thermally conducting pedestal above a pool of deionized water and heated from below. The apparent thermal resistance across the wick (from the pedestal/wick interface to the vapor space) under the evaporative operating conditions encountered in heat pipes is measured using thermocouples. The apparent thermal resistance across the wick is measured to be as low as 0.01°C/W, corresponding to an evaporative heat transfer coefficient of greater than 128,000 W/m²K.     

工质对平板型LHP运行特性影响的实验研究

本文研制了一套以不锈钢丝网为毛细芯的平板式蒸发器、风冷管翅式冷凝器的环路热管,并着重研究其以甲醇和丙酮为工质时运行特性的差异。实验结果表明,小型平板式LHP具有良好的启动特性和适应变热负荷能力,在相同的工况条件下,以丙酮为工质的LHP温度波动较小,系统启动较快且蒸发器壁面温度较低,但其极限热负荷能力低于甲醇。     

补偿腔支路对环路热管传热性能影响的实验研究

在环路热管系统工作中,存在因补偿腔温度过高而造成的蒸发器烧干现象。在常规环路热管系统中设计了补偿腔支路,以带走热源向补偿腔传递的径向热量,并对设计的环路热管系统进行实验测试,分析补偿腔支路对环路热管传热特性的影响。实验结果表明:补偿腔支路开启后,在热流密度14 W/cm²时,系统稳定启动所需时间从4 min减少到3 min,表明系统稳定启动所需时间减小,有利于快速启动;在热流密度18 W/cm²下,对应的壁面温度从88.2℃降至85.4℃,系统热阻从0.56 K/W减小到了0.49 K/W,表明系统所能承受的最大热流密度更大,系统热阻也更低,因此系统的传热性能更好。     

The sorption heat pipe—a new device for thermal control and active cooling

The sorption heat pipe (SHP) is a new heat transfer device, which can be used as a sorption cooler or as a heat pipe. The SHP has a sorbent bed (adsorber/desorber and evaporator) at one end and a condenser+evaporator at the other end. This device is insensitive to some “g” acceleration and could be suggested for space and ground application. The most crucial feature of this device is that in different cases it can be used, for example, as a loop heat pipe, because they have the same evaporator and condenser, or as a SHP. The SHP can be used also as a cryogenic cooler. The SHP is convenient for cryogenic fluid storage, when the system does not work at low pressure and room temperature, and for use in the active cryogenic thermal control systems of spacecraft in orbit (cold plates for infrared observation of the Earth or space), or as an efficient electronic component cooling device.     

Recent Advances in Loop Heat Pipes with Flat Evaporator

The focus of this review is to present the current advances in Loop Heat Pipes (LHP) with flat evaporators, which address the current challenges to the wide implementation of the technology. A recent advance in LHP is the design of flat-shaped evaporators, which is better suited to the geometry of discretely mounted electronics components (microprocessors) and therefore negate the need for an additional transfer surface (saddle) between component and evaporator. However, various challenges exist in the implementation of flat-evaporator, including (1) deformation of the evaporator due to high internal pressure and uneven stress distribution in the non-circular casing; (2) heat leak from evaporator heating zone and sidewall into the compensation chamber; (3) poor performance at start-up; (4) reverse flow through the wick; or (5) difficulties in sealing, and hence frequent leakage. This paper presents and reviews state-of-the-art LHP technologies; this includes an (a) review of novel manufacturing methods; (b) LHP evaporator designs; (c) working fluids; and (d) construction materials. The work presents solutions that are used to develop or improve the LHP construction, overall thermal performance, heat transfer distance, start-up time (especially at low heat loads), manufacturing cost, weight, possibilities of miniaturization and how they affect the solution on the above-presented problems and challenges in flat shape LHP development to take advantage in the passive cooling systems for electronic devices in multiple applications.