Effect of substituents on the curing of liquid crystalline epoxy resin

The synthesis of an aromatic ester based liquid crystalline epoxy resin (LCE) with a substituent in the mesogenic central group is described. Chlorine and methyl groups were introduced as substituents. The curing behaviors of three epoxy resins were investigated using diaminodiphenyl ester as the curing agent. The curing rate and heat of curing of LCE were measured with dynamic and isothermal DSC. The chlorine substituent accelerated the curing of LCE, while the methyl substituent decelerated the curing of LCE. The heat of curing of substituted LCE was diminished compared to LCE with no substituent. Glass transition temperature and elastic modulus of LCE decreased with increasing the size of the substituent. Three liquid crystalline epoxy resins based on aromatic ester mesogenic groups formed a liquid crystalline phase after curing, and the liquid crystalline phase was stable up to the decomposition temperature. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 911–917, 1998     

Flame retardant and toughening behaviors of bio‐based DOPO‐containing curing agent in epoxy thermoset

Based on bio‐based furfural, a phosphorus‐containing curing agent (FPD) was successfully synthesized, via the addition reaction between 9,10‐dihydro‐9‐oxa‐10 phosphaphenanthrene‐10‐oxide (DOPO) and furfural‐derived Schiff base. Then, as co‐curing agent, FPD was used to prepare flame retardant epoxy thermosets (EP) cured by 4, 4′‐diaminodiphenyl methane. The incorporated FPD improved the flame retardancy and toughness of epoxy thermoset, simultaneously. When 5 wt% FPD was added into EP, the FPD/EP achieved 35.7% limited oxygen index (LOI) value and passed UL94 V‐0 rating, meanwhile. In FPD/EP thermoset, the incorporated FPD reduced the thermal decomposition rate, increased the charring capacity, and inhibited the combustion intensity of epoxy thermoset. Through gas‐phase and condensed‐phase actions in weakening fuel supply, suppressing volatile combustion, and enhancing charring barrier effect, FPD decreased the heat release of burning epoxy thermoset, significantly. For the outstanding effectiveness on both flame retardancy and toughness, the study on FPD provides a promising way to manufacture high‐performance epoxy thermoset.     

Diglycidyl ether of bisphenol‐A epoxy resin modified using poly(ether ether ketone) with pendent tert‐butyl groups

Bisphenol‐A‐based difunctional epoxy resin was modified with poly(ether ether ketone) with pendent tert‐butyl groups (PEEKT). PEEKT was synthesized by the nucleophilic substitution reaction of 4,4′‐difluoro benzophenone with tert‐butyl hydroquinone in N‐methyl‐2‐pyrrolidone. Blends with various amounts of PEEKT were prepared by melt‐mixing. All the blends were homogeneous in the uncured state. The glass transition temperature of the binary epoxy/PEEKT blends was predicted using several equations. Reaction‐induced phase separation was found to occur upon curing with a diamine 4,4′‐diaminodiphenyl sulfone. The phase morphology of the blends was studied using scanning electron microscopy. From the micrographs, it was found that PEEKT‐rich phase was dispersed in a continuous epoxy matrix. The domain size increased with the amount of PEEKT in the blends. The increase in domain size was due to the coalescence of the domains after phase separation. Dynamic mechanical analysis of the blends gave two peaks corresponding to epoxy‐rich phase and thermoplastic‐rich phase. The tensile strength and modulus of the blends remained close to that of the unmodified resin, while the flexural properties decreased with the addition of PEEKT to epoxy resin. The fracture toughness of the epoxy resin increased with the addition of PEEKT. Investigation of the fracture surfaces revealed evidences for local plastic deformation of the matrix, crack pinning, crack path deflection, and ductile tearing of PEEKT‐rich phase. Thermogravimetric analysis revealed that the initial decomposition temperature of the blends were close to that of the unmodified resin. Finally, the properties of the blends were compared with other modified PEEK/epoxy blends. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 2481–2496, 2007     

不同温度下环氧树脂代木搪塑模具的固化过程

采用流变学的方法研究了环氧树脂代木搪塑模具在不同温度下的固化过程。 为了找到合适的测试条件,首先研究了应变和振荡频率对环氧树脂代木搪塑模具的测试结果的影响。 环氧树脂代木搪塑模具固化过程中,体系交联程度逐渐变大;在不同的固化阶段,固化程度的变化快慢不同,先缓慢增加,然后迅速增加,最后缓慢增加至平台值;储能模量和损耗模量的变化速度在不同阶段的变化与固化程度的变化相似,根据储能模量和损耗模量的最快增长速率与温度的关系得到体系的活化能约为27.2 kJ/mol;随着固化温度升高,环氧树脂代木搪塑模具固化完全所需的时间减少,同时环氧树脂的施工容留时间也相应地减少。     

Synthesis and Characterization of a Novel Curing Agent for Epoxy Resin Based on Phosphazene Derivatives

In this work, a novel amine-terminated curing agent for epoxy resin based on hexachlorocyclotriphosphazene (HCCP) was synthesized through two steps of nucleophilic substitution reactions by phenol and 4-aminophenol. Its chemical structure was characterized by ¹H-NMR, Fourier transform infrared spectroscopy (FTIR) and mass spectrometry (MS). This curing agent was liquid at room temperature which made it easy to disperse in the epoxy resin. The rheological test showed the viscosity of the pre-polymer fluid decreased as the proportion of the curing agent increased so it improved the process performance. The curing reaction was studied by differential scanning calorimeter (DSC). The novel curing agent had a wider range of curing temperature and relatively lower curing temperature in comparison with the widely-using curing agent 4,4′-Diaminodiphenylmethane (DDM). The wider range of curing temperature helped lower the heat accumulation which was an important factor in curing process.     

FTIR法研究环氧树脂固化反应动力学

用傅里叶红外光谱（ＦＴＩＲ）法研究了双酚Ｓ环氧树脂和甲溴双酚Ａ环氧树脂分别与二胺基二苯砜在恒温条件下的固化反应动力学,得出了各反应的表观活化能。     

Cure behavior and thermal stability of an epoxy: new bismaleimide blends for composite matrices

A new bismaleimide (BMI) resin was synthesized to formulate epoxy(tetraglycidyl diaminodiphenyl methane; TGDDM) – bismaleimide thermoset blends for composite matrix applications. 4,4′-diaminodiphenyl methane (DDM) was used as an amine curing agent for the TGDDM. A Fourier transform infrared (FTIR) spectroscopy was employed to characterize the new BMI resin. Cure behavior of the epoxy–BMI blends was studied using a differential scanning calorimeter (DSC). DSC thermograms of the thermoset blends indicated two exothermic peaks. The glass transition temperature of the thermoset blends decreased with BMI content. Thermogravimetric analysis (TGA) was carried out to investigate thermal degradation behavior of the cured epoxy–BMI thermoset blends. The new BMI resin reacted partially with the DDM and weak intercrosslinking polymer networks were formed during cure of the thermoset blends.     

Comparative studies on the curing kinetics and thermal stability of tetrafunctional epoxy resins using various amines as curing agents

The curing reactions of the epoxy resins tetraglycidyl diaminodiphenyl methane (TGDDM) and tetraglycidyl methylenebis (o-toluidine) (TGMBT) using diaminodiphenyl sulfone (DDS), diaminodiphenyl methane (DDM) and diethylenetriamine (DETA) as curing agents were studied kinetically by differential scanning calorimetry. The dynamic scans in the temperature range 20°–300°C were analyzed to estimate the activation energy and the order of reaction for the curing process using some empirical relations. The activation energy for the various epoxy systems is observed in the range 71.9–110.2 kJ·mol^–1. The cured epoxy resins were studied for kinetics of thermal degradation by thermogravimetry in a static air atmosphere at a heating rate of 10 deg·min^–1. The thermal degradation reactions were found to proceed in a single step having an activation energy in the range 27.6–51.4 kJ·mol^–1.

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Zusammenfassung Die Vernetzungsreaktionen der Epoxidharze Tetraglycidyl-diamino-diphenyl-methan (TGDDM) und Tetraglycidyl-methylen-bis(o-toluidin) (TGMBT) unter Verwendung von Diaminodiphenylsulfon (DDS), Diaminodiphenylmethan (DDM) und Diethylentriamin (DETA) als Vernetzungsmittel wurden kinetisch mittels DSC untersucht. Die dynamischen Scans im Temperaturbereich 20°–300°C wurden analysiert, um unter Anwendung einiger empirischer Gleichungen die Aktivierungsenergie und die Reaktionsordnung des Vernetzungsprozesses zu ermitteln. Die Aktivierungsenergie der einzelnen Epoxy-Systeme liegt im Bereich 71.9–110.2 kJ·mol^–1. An der ausgehärteten Harze wurde mittels TG in einer statischen Luftatmosphäre un deiner Aufheizgeschwindigkeit von 10 Grad/min die Kinetik des termischen Abbaues untersucht. Man fand, daß die thermiscehn Abbaureaktionen in einem Schritt ablaufen und ihre Aktivierungsenergie im Intervall 27.6–51.4 kJ·mol^–1 liegt.

     

Insights into phthalonitrile/epoxy blends modification system from non-competitive cure system based on alicyclic anhydride

A series of polymer blends were prepared from 1,3-bis(3,4-dicyanophenoxy)benzene (3BOCN) and epoxy resin with methyl tetrahydrophthalic anhydride as curing agent.The curing behavior and curing kinetics of the blends were studied by differential scanning calorimetry.The apparent activation energy of the blends with various contents of 3BOCN was higher than that of the blends without 3BOCN.A model experiment suggested that there is no obvious reaction between phthalonitrile and epoxy.The thermal and mechanical properties of the polymer blends were evaluated.The polymer blends exhibit high storage modulus and char yield compared with the neat epoxy.The polymer blends show ductile fracture morphology by scanning electron microscopy (SEM) images.     

Study of cure kinetics of epoxy/DDS/nanosized (SiO2/TiO2) system by dynamic differential scanning calorimetry

In this study the curing kinetics of epoxy based on the diglycidyl ether of bisphenol A (DGEBA), 4,4′‐diaminodiphenyl sulfone (DDS) as a hardener, and SiO₂/TiO₂ (70:30) as a nanofiller was investigated by nonisothermal differential scanning calorimetry (DSC). The effects of different weight contents of SiO₂/TiO₂ nanoparticles were studied using DSC in Dynamic Mode and the best value of the nanofiller was found to be 5 phr (parts per hundred). Dynamic measurements were used to obtain the total heat of reaction of the epoxy system as well as its activation energy (E_a) based on the isoconversional methods of Kissinger and Ozawa. The process revealed a dependence of the activation energy on conversion (α). The morphology of the cured system was investigated by scanning electron microscopy (SEM). It showed a strong cross‐linking between the resin and hardner and a relatively better dispersion of surface modified filler nanoparticles. Copyright © 2009 John Wiley & Sons, Ltd.     

Factors affecting H2O absorption of the epoxy tetraglycidyl-4,4′-diaminodiphenyl methane cured with diaminodiphenyl sulfone

It was found that the amount of water absorbed at room temperature in cured tetraglycidyl-4,4′-diaminodiphenyl methane/diaminodiphenyl sulfone epoxy resins increases as the curing time or temperature increases while the amount of tetrahydrofuran-soluble extractables and the room temperature density decreases. These data suggest that the free volume increases with the extent of cure and the resins become more accessible to water. While the driving force for water absorption is the electrostatic attraction between water and the functional groups in the epoxy, the results suggest that equilibrium H₂O absorption is determined primarily by unoccupied volume of the epoxy resin.     

酸酐固化环氧树脂/蒙脱土复合材料的等温固化动力学

用等温差示扫描量热法(DSC)研究了酸酐固化环氧树脂/蒙脱土复合材料的等温固化过程，考察了未处理的蒙脱土(MMT)和有机蒙脱土(OMMT)对环氧树脂固化动力学的影响. 实验表明， 环氧树脂的固化过程包含自催化机理，加入蒙脱土没有改变固化反应机理. 用Kamal方程对该体系的固化过程进行拟合，得到反应级数m、n，反应速率常数k1、k2，总反应级数(m + n)在2.4～3.0之间. MMT的加入使环氧树脂体系的k1、k2有所降低，而OMMT的加入对体系的k1、k2影响较为复杂，加入蒙脱土对环氧树脂固化体系的活化能影响较小.     

Curing Kinetics Modeling of Epoxy Modified by Fully Vulcanized Elastomer Nanoparticles Using Rheometry Method

In this study, the curing kinetics of epoxy nanocomposites containing ultra-fine full-vulcanized acrylonitrile butadiene rubber nanoparticles (UFNBRP) at different concentrations of 0, 0.5, 1 and 1.5 wt.% was investigated. In addition, the effect of curing temperatures was studied based on the rheological method under isothermal conditions. The epoxy resin/UFNBRP nanocomposites were characterized via Fourier transform infrared spectroscopy (FTIR). FTIR analysis exhibited the successful preparation of epoxy resin/UFNBRP, due to the existence of the UFNBRP characteristic peaks in the final product spectrum. The morphological structure of the epoxy resin/UFNBRP nanocomposites was investigated by both field emission scanning electron microscopy (FESEM) and transmission electron microscopy (TEM) studies. The FESEM and TEM studies showed UFNBRP had a spherical structure and was well dispersed in epoxy resin. The chemorheological analysis showed that due to the interactions between UFNBRP and epoxy resin, by increasing UFNBRP concentration at a constant temperature (65, 70 and 75 °C), the curing rate decreases at the gel point. Furthermore, both the curing kinetics modeling and chemorheological analysis demonstrated that the incorporation of 0.5% UFNBRP in epoxy resin matrix reduces the activation energy. The curing kinetic of epoxy resin/UFNBRP nanocomposite was best fitted with the Sestak–Berggren autocatalytic model.     

电子束作用下双酚A型环氧树脂体系的固化特征

当前 ,先进树脂基复合材料基本上都是采用加热固化成型的 ,由于其工艺周期长 ,造成复合材料的制造成本较高 ,同时 ,热固化采用的固化剂和有机溶剂往往会对操作人员及环境造成危害 .为顺应复合材料低成本化和无公害化的发展趋势 ,树脂基复合材料的电子束辐射固化技术逐渐发展起来 .复合材料的电子束固化技术是在 2 0世纪 80年代初 ,由法国Ａｅｒｏｐａｔｉｃｌｅ的研究人员首先进行的[1] .近年来 ,美国、日本、加拿大及欧洲的许多国家都在积极从事于研究和利用此项技术 ,并且已经取得了可观的成果[2 ] .我国在这方面的研究工作也开始起步 .作…     

A flame‐retardant phosphate and cyclotriphosphazene‐containing epoxy resin: Synthesis and properties

A novel flame‐retardant epoxy resin, (4‐diethoxyphosphoryloxyphenoxy)(4‐glycidoxyphenoxy)cyclotriphosphazene (PPCTP), was prepared by the reaction of epichlorohydrin with (4‐diethoxyphosphoryloxyphenoxy)(4‐hydroxyphenoxy)cyclotriphosphazene and was characterized by Fourier transform infrared, ³¹P NMR, and ¹H NMR analyses. The epoxy resin was further cured with diamine curing agents, 4,4′‐diaminodiphenylmethane (DDM), 4,4′‐diaminodiphenylsulfone (DDS), dicyanodiamide (DICY), and 3,4′‐oxydianiline (ODA), to obtain the corresponding epoxy polymers. The curing reactions of the PPCTP resin with the diamines were studied by differential scanning calorimetry. The reactivities of the four curing agents toward PPCTP were in the following order: DDM > ODA > DICY > DDS. In addition, the thermal properties of the cured epoxy polymers were studied by thermogravimetric analysis, and the flame retardancies were estimated by measurement of the limiting oxygen index (LOI). Compared to a corresponding Epon 828‐based epoxy polymer, the PPCTP‐based epoxy polymers showed lower weight‐loss temperatures, higher char yields, and higher LOI values, indicating that the epoxy resin prepared could be useful as a flame retardant. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 972–981, 2000     

The curing kinetics and mechanical properties of epoxy resin composites reinforced by PEEK microparticles

In this paper, a polyether-ether-ketone (PEEK)/epoxy composite was prepared by using PEEK microparticles as the reinforcement. The nonisothermal differential scanning calorimetry (DSC) test was used to evaluate the curing reaction of PEEK/epoxy resin system. The curing kinetics of this system were examined utilizing nonisothermal kinetic analyses (Kissinger and Ozawa), isoconversional methods (Flynn-Wall-Ozawa and Kissinger-Akahira-Sunose) and an autocatalytic reaction model. During these analyses, the kinetic parameters and models were obtained, the curing behavior of PEEK/epoxy resin system under dynamic conditions was predicted. The results show that isoconversional methods can adequately interpret the curing behavior of PEEK/epoxy resin system and that the theoretical DSC curves calculated by the autocatalytic reaction model are in good agreement with experimental data. Furthermore, the tensile elongation at break, tensile strength, flexural strength, compression strength and compression modulus increased by 81.6%, 33.66%, 36.53%, 10.98% and 15.14%, respectively, when PEEK microparticles were added in epoxy resin composites.     

Facile,one‐pot synthesis of aromatic diamine‐based benzoxazines and their advantages over diamines as epoxy hardeners

Three aromatic diamine‐based benzoxazines were successfully prepared by a facile, clean, one‐pot procedure from 1,4‐phenylenediamine ( 1 ), 4,4′‐diaminodiphenyl ether ( 2 ), and 4,4′‐diaminodiphenyl methane ( 3 ), respectively. Their structures were confirmed by NMR spectra and single crystal diffractogram. The effect of the reactivity of diamines on the purity of the resultant benzoxazines was discussed. The resultant benzoxazines were applied as hardeners for cresol novolac epoxy (CNE). The processing window, the latent curing characteristic, and the miscibility of benzoxazine/CNE systems were discussed. Compared with diamines ( 1 and 3 ), ( 1 and 3 )‐based benzoxazines show latent curing characteristic as epoxy hardeners, and wide processing windows can be obtained. Compared with diamine ( 2 ) which is immiscible with CNE in the molten state, ( 2 )‐based benzoxazine shows good miscibility with CNE. Dynamic mechanical analysis shows the T_gs of the benzoxazine/CNE thermosets are as high as 242–243 °C. Thermogravimetric analysis shows the outstanding thermal stability of the resultant thermosets. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 2430–2437, 2010     

电子束辐射固化环氧树脂的反应过程分析

对双酚A型环氧树脂的电子束辐射固化反应过程进行了分析.考察了引发剂、稀释剂对树脂体系辐射反应的影响,以环氧丙烷作为模型化合物,研究了环氧丙烷-碘盐体系的电子束辐射反应机理,证实了在电子束辐射下,碘盐分解产生质子酸,引发环氧树脂阳离子开环聚合的反应过程.观测环氧树脂辐射固化区域发现,电子束穿过样品时发生强烈的散射,在辐射方向以及周围一定区域内引发固化反应,固化反应从活性中心开始向体系内部层层扩展,整个固化区域由很多的层状结构组成.     

活性酯固化邻甲酚环氧树脂反应机理的研究

采用交叉反应研究在促进剂2-甲基咪唑存在下活性酯固化邻甲酚环氧树脂的反 应机理，用傅立叶转换红外（FTIR）原位测量技术，NMR，气-质联用（GC-MS）等 手段研究了模型化合物的反应动力学，并提出了其反应机理。结果表明，在促进剂 2-甲基咪唑存在下活性酯固化邻甲酚环氧树脂的反应是通过分子内机理进行的。