Preparation and properties of polyimides and polyamide-imides from diisocyanates

Polyimides of different structures were synthesized by reaction of 1,4-phenylene diisocyanate (PPDI) and 1,5-naphthalene diisocyanate (NDI) with pyromellitic dianhydride (PMDA) and 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA). Polyamide-imides were also prepared by reaction of PPDI and NDI with trimellitic anhydride. The optimized condition for polymerization reactions were obtained via the study of model compounds. All polymers and model compounds were characterized by conventional methods. Physical properties of polymers, including thermal behavior, thermal stability, solution viscosity, and solubility behavior, were also studied. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 2245–2250, 1999     

Unsaturated poly(ester-imide)s from hydroxy-terminated polybutadiene, dianhydride and diisocyanate

Hydroxy terminated polybutadiene has been used for the first time in the synthesis of poly(ester-imide)s [P(E-I)s]. Anhydride terminated polyester prepolymers were prepared by the reaction of two different polyols--polytetramethyleneoxide glycol (PTMG) of molecular weight 1000 and hydroxy terminated polybutadiene (HTPB) of molecular weight 2500--and different dianhydrides--pyromellitic dianhydride (PMDA), benzophenonetetracarboxylic dianhydride (BTDA) and 4,4^′-(hexafluoroiso-propylidene)diphthalic anhydride (HFDA). The prepolymers were then reacted with different diisocyanates--80:20 mixture of 2,4- and 2,6-tolylene diisocyanate (TDI), 1,6-hexamethylene diisocyanate (HDI), isophorone diisocyanate (IPDI) and 4,4^′-methylene bis(phenylisocyanate) (MDI) resulting in P(E-I)s. The P(E-I)s were characterised by FT-IR, FT-NMR, GPC, TGA, DSC and for static and dynamic mechanical properties. The polymers based on PTMG showed two distinct melting points and behave as thermoplastic elastomers. The thermal stability and mechanical properties of P(E-I)s based on HTPB were substantially higher than those based on PTMG.     

A novel type of Si-containing poly(urethane-imide)s: synthesis, characterization and electrical properties

A novel type of a Si-containing poly(urethane-imide) (PUI) was prepared by two different methods. In the first method, Si-containing polyurethane (PU) prepolymer having isocyanate end groups was prepared by the reaction of diphenylsilanediol (DSiD) and toluene diisocyanate (TDI). Subsequently the PU prepolymer was reacted with pyromellitic dianhydride (PMDA) or benzophenonetetracarboxylic dianhydride (BTDA) in N-methyl pyrolidone (NMP) to form Si-containing modified polyimide directly. In the second method, PU prepolymer was reacted with diaminodiphenylether (DDE) or diaminodiphenylsulfone (DDS) in order to prepare an amine telechelic PU prepolymer. Finally, the PU prepolymer having diamine end groups was reacted with PMDA or BTDA to form a Si-containing modified polyimide. Cast films prepared by second method were thermally treated at 160 °C to give a series of clear, transparent PUI films. Thermogravimetric analysis indicated that the thermal degradation of PUI starts at 265 °C which is higher than degradation temperature of conventional PU, confirming that the introduction of imide groups improved the thermal stability of PU.To characterize the modified polyimides and their films, TGA, FTIR, SEM and inherent viscosity analyses were carried out. The dielectrical properties were investigated by the frequency-capacitance method. Dielectric constant, dielectric breakdown strength, moisture uptake and solubility properties of the films were also investigated.     

Preparation and absorption spectrum studies of aromatic and alicyclic poly(amide acid) ammonium salts in water and DMF and in films

A series of ammonium salts of poly(amide acid)s (PAS) were prepared from various poly(amide acid)s (PAA) with tertiary amines. The solubility of poly(amide acid) ammonium salts prepared from PAA(PMDA/ODA) in water is related to the ion concentration of tertiary amines. In order to elucidate the influence of the chemical structures of poly(amide acid)s and poly(amide acid) ammonium salts on their absorption spectra, pyromellitic dianhydride (PMDA), 3,3′,4,4 ′-biphenyltetracarboxylic dianhydride (BPDA), and 3,3′,4,4 ′-benzophenonetetracarboxylic dianhydride (BTDA) were chosen to react with p-phenylenediamine (PDA) and (4,4′-diaminodicyclohexyl)methane (DCHM) to give three kinds of aromatic PAAs and three kinds of alicyclic PAAs. The corresponding PASs were prepared by the reaction of PAAs with triethanolamine (TEA). Their ultraviolet–visible (UV–vis) absorption spectra were investigated compared to those of model compounds. A transparent film without absorption above 320 nm was obtained for PAS(PMDA/DCHM). The difference in absorption spectra of PAS(PMDA/PDA) from that of PAS(PMDA/DCHM) can be related to the existence of intra- and intermolecular charge transfer (CT) for PAS(PMDA/PDA). The absorption spectra of PASs with PDA in films are red shifted compared to those of corresponding PAAs in films, while the absorption spectra of PASs in water are blue shifted compared to those of corresponding PAAs in DMF. No differences in the absorption spectra of PAAs and PASs were found in DMF/H₂O (9/1) mixed solvent. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 1329–1340, 1998     

Synthesis of poly(urethane‐imide) using aromatic secondary amine‐blocked polyurethane prepolymer

A set of poly(urethane‐imide)s were prepared using blocked Polyurethane (PU) prepolymer and pyromellitic dianhydride (PMDA). The PU prepolymer was prepared by the reaction of polyether glycol and 2,4‐tolylene diisocyanate, and end capped with N‐methyl aniline. The PU prepolymer was reacted with PMDA until the evolution of carbon dioxide ceased. The effect of tertiary amine catalysts, organo tin catalysts, solvents, and reaction temperature were studied and compared with the poly(urethane‐imide) prepared using phenol‐blocked PU prepolymer. N‐methyl aniline blocked PU prepolymer gave a higher molecular weight poly(urethane‐imide) at a lower reaction temperature in a shorter time. Amine catalysts were found to be more efficient than organo tin catalysts. The reaction was favorable in particular with N‐ethylmorpholine and diazabicyclo(2.2.2)octane (DABCO) as catalysts, and dimethylpropylene urea as a reaction medium. The poly(urethane‐imide)s were characterized by FTIR, GPC, TGA, and DSC analyses. The molecular weight decreased with an increase in reaction temperature. The thermal stability of the PU was found to increase by the introduction of imide component. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 4032–4037, 2000     

Fire-resistant polyimides and copolyimides based on 1-[(dialkoxyphosphinyl)methyl]-2,4- and -2,6-diaminobenzenes

Various phosphorus-containing polyimides were prepared by the reaction of 1-[(dialkoxyphosphinyl)methyl]-2,4- and -2,6-diaminobenzenes (1) with a tetracarboxylic dianhydride like pyromellitic dianhydride (PMDA) and benzophenone tetracarboxylic dianhydride (BTDA). In addition, copolyimides that contained approximately 3% phosphorus were prepared by the reaction of 1 and m-phenylenediamine (MPD) with the aforementioned tetracarboxylic dianhydrides. Elemental analysis, inherent viscosity, infrared (IR) spectroscopy, differential scanning calorimetry (DSC), and thermogravimetric analysis (TGA) studies were performed to characterize the polymers. Their thermal properties were compared with those of the corresponding common polyimides. It was shown that the molecular weight and thermal stability of the polymers were reduced as the concentration of the phosphorus moieties increased. The fire-resistance of the copolyimides was evaluated by determining their limiting oxygen index (LOI) value. Copolyimides that contained about 3% phosphorus showed an LOI value approximately 30% higher, than the value of the corresponding common polyimides. In addition, a model diamic acid and diimide was synthesized by the reaction of 1-[di(2-chloroethoxyphosphinyl)methyl]-2,4- and - 2,6-diaminobenzene (DCEPD) with phthalic anhydride and characterized by elemental analysis, IR, proton nuclear magnetic (¹H-NMR) spectroscopy, DSC, and TGA. The pyrolysis behavior of the model compounds was investigated by gas chromatography-mass spectrometry (GC-MS). A direct cleavage of the P? C bond and a possible rearrangement to diisocyanates occurred during their pyrolysis.     

Kinetic investigations of formation of polyimides containing arylene sulfone ether linkages by potentiometric titration and their characterization

In this work, thermal solution imidization kinetics of two high performance polyimides, prepared from the polycondensation of pyromellitic dianhydride (PMDA) and 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) with 4,4′-bis(3-aminophenoxy)diphenylsulfone (DAPDS) were investigated using nonaqueous titration technique with tetramethylammonium hydroxide. Most of the kinetic investigations, found in the literature, are based on the aromatic p-diamines.^1,2 In the present work, attention was focused on imidization kinetics with m-substituted aromatic diamines having electron donating ( O ) and electron withdrawing ( SO₂ ) groups in the same molecule. Kinetic parameters, namely the rate constants, activation energies, entropies and enthalpies of imidization reactions were determined and compared with the literature values. It is reported in literature³ that electron affinities of dianhydrides and ionization potentials of diamines, have strong influence on the reaction rate and activation energies of imidization. Activation energy (E_a) values were found to be 66 and 57 kJ/mol for DAPDS/PMDA and DAPDS/BTDA respectively, and order of reaction was found to be second order. Polyimides DAPDS/PMDA and DAPDS/BTDA, subjected to kinetic investigation, showed glass transition temperatures of 267°C and 241°C, both were found to be thermally stable up to 500°C. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35 : 2981–2990, 1997     

Crystalline polyimide particles generated via thermal imidization in a heterogeneous medium

Highly crystalline polyimide powders were prepared from diluted solutions of polyamic acid in N-methyl-2-pyrrolidone (NMP) which were cured at 200°C for 4 hr with a high heating rate. The chemical structures of the repetitive units were chosen to obtain rigid polymeric backbones precluding any solubility in polar aprotic solvents. Therefore the starting polyamic acids were produced by polycondensation from an equimolar ratio of the following pairs of monomers: pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (ODA); 3,3′,4,4′-biphenyl tetracarboxylic dianhydride and ODA; PMDA and p-phenylenediamine. After optimizing the reaction conditions, the resulting powders were first characterized by scanning electronic microscopy and granulometric analysis. Well-divided particles with a spherulitic shape and average particle size of 5 μm were observed. The X-ray diffraction patterns and the solid-state ¹³C nuclear magnetic resonance spectra together revealed a highly organized structure. The degree of imidization of the powder is nearly complete as demonstrated by Fourier transform infrared analysis and the inherent viscosity after dissolution in concentrated sulfuric acid is about 0.8 dl/g. © 1998 John Wiley & Sons, Ltd.     

Diisocyanate route as a convenient method for the preparation of novel optically active poly(amide-imide)s based on N-trimellitylimido-S-valine

A new class of optically active poly(amide-imide)s based on an α-amino acid was synthesized via direct polycondensation reaction of different diisocyanates with a chiral diacid monomer. The step-growth polymerization reactions of N-trimellitylimido-S-valine (TISV) (1) with 4,4′-methylene-bis(4-phenylisocyanate) (MDI) (2) was performed under microwave irradiation, as well as solution polymerization under graduate heating and reflux conditions. The optimized polymerization conditions for each method were performed with tolylene-2,4-diisocyanate (TDI) (3), hexamethylene diisocyanate (HDI) (4), and isophorone diisocyanate (IPDI) (5) to produce optically active poly(amide-imide)s via diisocyanate route. The resulting polymers have inherent viscosities in the range of 0.02-1.10 dL/g. Decomposition temperatures for 5% weight loss (T₅) occurred above 300 °C (by TGA) in nitrogen atmospheres. These polymers are optically active, thermally stable and soluble in amide-type solvents. Some structural characterization and physical properties of this new optically active poly(amide-imide)s are reported.     

Synthesis and characterization of novel polyimide from bis‐(3‐aminophenyl)‐4‐(trifluoromethyl)phenyl phosphine oxide

A novel diamine, bis‐(3‐aminophenyl)‐4‐(trifluoromethyl)phenyl phosphine oxide (mDA3FPPO), containing phosphine oxide and fluorine moieties was prepared via the Grignard reaction from an intermediate, 4‐(trifluoromethyl)phenyl diphenyl phosphine oxide, that was synthesized from diphenylphosphinic chloride and 4‐(trifluoromethyl)bromobenzene, followed by nitration and reduction. The monomer was characterized by Fourier transform infrared (FTIR), ¹H NMR, ³¹P NMR, ¹⁹F NMR spectroscopies; elemental analysis; melting point measurements; and titration and was used to prepare polyimides with a number of dianhydrides such as pyromellitic dianhydride (PMDA), 5,5′‐[2,2,2‐trifluoro‐1‐(trifluoromethyl)ethyliden]‐bis‐1,3‐isobenzofuranedione (6FDA), 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA), and 4,4′‐oxydiphthalic dianhydride (ODPA). Polyimides were synthesized via a conventional two‐step route; preparation of polyamic acids, followed by solution imidization, and the molecular weight were controlled to 20,000 g/mol. Resulting polyimides were characterized by FTIR, NMR, DSC, and intrinsic viscosity measurements. Refractive‐index, dielectric constant, and adhesive properties were also determined. The properties of polyimides were compared with those of polyimides prepared from 1,1‐bis‐(4‐aminophenyl)‐1‐phenyl‐2,2,2‐trifluoroethane (3FDAm) and bis‐(3‐aminophenyl) phenyl phosphine oxide (mDAPPO). The polyimides prepared from mDA3FPPO provided high glass‐transition temperatures (248–311 °C), good thermal stability, excellent solubility, low birefringence (0.0030–0.0036), low dielectric constants (2.9–3.1), and excellent adhesive properties with Cu foils (107 g/mm). © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 3335–3347, 2001     

Preparation and Pervaporation Performances of PEA‐based Polyurethaneurea and Polyurethaneimide Membranes to Benzene/Cyclohexane Mixture

Pervaporation is promising in the separation of benzene/cyclohexane mixture for the petrochemical industry. Two kinds of pervaporation membrane materials, including PEA‐based polyurethaneurea (PUU) and polyurethaneimide (PUI), were successfully synthesized from the same soft segment of poly(ethylene adipate)diol (PEA) and different hard segments via a two‐step method. The hard segment of PUU was prepared from toluene diisocyanate (TDI) and 4,4′‐diaminodiphenyl methane (MDA), while that of PUI was from 4,4′‐methylene‐bis(phenylisocyanate) (MDI) and pyromellitic dianhydride (PMDA). The structures and properties of PUU and PUI were characterized by means of FT‐IR, DSC and TGA. During the pervaporation experiment, the PUI membranes had a flux of 12.13 kg µm m^?2 h^?1 and separation factor of 8.25, while the PUU membranes had a flux of 26.35 kg µm m^?2 h^?1 and separation factor of 6.29 for 50 wt% benzene in the benzene/cyclohexane mixture at 40°C. The effects of the structures of hard segments on pervaporation performances were discussed. The investigation of the relationship in molecular structure and PV performances will be helpful for the choice and design of membrane materials in the separation of benzene/cyclohexane mixture.     

Synthesis and characterization of polymerizable bisphthalonitrile monomers

The reactions of 4-aminophthalonitrile (APN) with 3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BPTDA), and with 1,2,3,4-benzenetetracarboxylic dianhydride (PMDA) have been studied to optimize the conditions for the synthesis of monomeric thermosetting bisphthalonitrile compound. Suitable procedures for the synthesis of the two monomers are presented. Elemental analyses, IR spectra, dynamic thermogravimetric analyses, differential scanning calorimetry, ¹H-NMR, and mass spectral studies have been used to characterize these compounds. Preliminary observations show that these materials can be polymerized to give high-temperature-resistant materials.     

Synthesis of benzophenone tetracarboxylic dianhydride and pyromellitic dianhydride incorporated biscitraconimides and their thermal polymerization

Biscitraconimides incorporated with 3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BTDA) and pyromellitic dianhydride (PMDA) were synthesised. Their curing behavior as well as thermal stabilities were investigated. The intermediate amic acids were prepared by the reaction of 4-amino 4′-citraconamic acid diphenyl sulphone, 4-amino 4′-citraconamic acid diphenyl ether, and 12-amino 1-citraconamic acid dodecane with BTDA and PMDA, respectively. Six amic acids formed were then imidized by cyclocondensation with acetic anhydride. The imide monomers were obtained and these were cured at 225–240°C. The thermal stabilities of the polymers so formed were investigated and compared. © 1996 John Wiley & Sons, Inc.     

Preparation and Characterization of Epoxy/Inorganic Anti‐electrostatic Nanocomposites Using Submicrometer Al(OH)3 and Colloid Al2O3

New organic‐inorganic hybrid materials and their anti‐electrostatic hybrid membranes are prepared via sol‐gel process. The polycondensation of epoxy oligomers and AEAPS/Al₂O₃ complexes which are organically surface modified submicrometer aluminum trihydroxide inorganic fillers with an active aminoterminal silane coupling agent, N‐(2‐aminoethyl)‐3‐aminopropyltrimethoxysilane (AEAPS), are performed. AEAPS enhances the interfacial interactions between the inorganic fillers and epoxy polymers. Meanwhile, this coupling agent maintains well dispersion of fillers in these composites. To improve the mechanical strength and thermal stability, pyromellitic dianhydride (PMDA) is used as curing agent. These hybrid films prepared from this method have excellent physical properties, such as UV‐shielding, high transmission in visible resign (> 85%), high hardness (7～8H) , high adhesive force (7～8) and low relative surface resistance (9.71 × 10¹¹～1.26 × 10¹⁰ Ω/cm²) with anti‐electrostatic characters. For thermal resistance, the best Td value of epoxy/PMDA/AEAPS/Al₂O₃ is 378.6 °C which is 85.4 °C higher than that of neat epoxy resin. Physical properties of these materials are almost the same as those of the nanocomposites prepared from expensive colloid Al₂O₃. Evidences from TEM micrograph show that the inorganic additives are dispersed evenly in organic matrix with nanometer scale.     

Pretilt angle for BTDA,PMDA and CPDA series polyimides with various side chain lengths

Polyamic acid precursors were prepared by mixing dianhydride of 3,3',4,4'-benzophenone-tetracarboxylic dianhydride (BTDA), 1,2,3,4-benzene-tetracarboxylic dianhydride (pyrromellitic dianhydride PMDA), cis-1,2,3,4-cyclopentane-tetracarboxylic dianhydride (CPDA), the diamine (alkyl 3,5-diaminobenzoate) with side chain, and 4,4'-oxydianiline (ODA) without side chain. Copolyimide films with various side chain lengths were prepared by thermal imidization of polyamic acid precursors. The roughness of rubbed polyimide surface increased with increase in the side chain length. The pretilt angle for the BTDA and PMDA series polyimide (PI) increased exponentially with increase in side chain length. Various pretilt angles were obtained on the synthesized polyimides. In the case of CPDA series PI, the pretilt angle was nearly constant at 0 until the alkyl side chain length reached 12 (C12) and then increased markedly at C18. Models of pretilt angle generation were tested.     

Preparation and properties of poly(urethane-imide)s derived from amine-blocked-polyurethane prepolymer and pyromellitic dianhydride

Poly(urethane-imide)s were prepared using amine-blocked-polyurethane (PU) prepolymer and pyromellitic dianhydride. The PU prepolymers were prepared by the reaction of different diols (polypropyleneoxy glycol, polytetramethyleneoxy glycol, polycaprolactonediol and hydroxyl terminated polybutadiene) and different diisocyanates (2,4-tolylene diisocyanate, 1,4-phenelene diisocyanate, 1,6-hexamethylene diisocyanate, isophorone diisocyanate and 4,4^′-methylenebis(cyclohexyl)isocyanate) and end capped with N-methylaniline. The polymerization was faster with aromatic isocyanates than with aliphatic isocyanates. The effect of imide content on the thermal and mechanical properties was studied. The poly(urethane-imide)s were characterized by FTIR, GPC, TGA and for dynamic and static mechanical properties. Weight average molecular weight (M_w) of the polymers did not vary significantly with change in -NCO/-OH ratio where as number average molecular weight (M_n) increased with increasing -NCO/-OH ratio, correspondingly, the dispersity (PD) decreased. Polymers with higher hard segment content exhibited higher glass transition temperature. The thermal stability of the PU was found to increase significantly by the introduction of imide component.     

Polyamide-imides

A novel preparation of polyamide-imides from diphenylmethane diisocyanate and trimellitic anhydride in N-methylpyrrolidone is described. Partial substitution of trimellitic anhydride with either maleopimaric acid, terephthalic acid, or by various di-anhydrides permitted a correlation of structure with solution stability and thermal properties. Heat resistance improved with increasing imide content of the polyamide-imide. Almost all solutions advanced in viscosity on storage at room temperature. The least stable solutions were those that deviated the most from 50–50 amide-imide. However, the viscosity changes depended somewhat on the type of modifying ingredient. For example, polyamide-imides modified by substitution of 10% PMDA (pyromellitic anhydride) or BPDA (benzophenone tetracarboxylic acid dianhydride) were less stable than those modified with 10% (cyclopentanetetracarboxylic acid dianhydride) CPDA or THFDA (tetrahydrofuran-2,3,4,5-tetracarboxylic acid dianhydride). The use of excess reagent and of monofunctional chain stopper was investigated as a means of controlling solution stability.     

Preparation of Poly(amic acid) and Polyimide via Microwave-Assisted Polycondensation of Aromatic Dianhydrides and Diamines

Summary: A copolycondesation-type poly (amic acid) (PAA) was synthesized using pyromellitic dianhydride (PMDA) and 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) as dianhydride monomers, and 4,4′-oxydianiline (ODA) as a diamine monomer under microwave irradiation in dimethylformamide (DMF). PAA was then converted into a polyimide (PI) by an imidization. The structure and performance of the polymer were characterized by Fourier-transform infrared (FT-IR) spectroscopy, Proton nuclear magnetic resonance (¹H NMR) spectrometry, viscosity, X-ray diffraction (XRD), and thermogravimetric (TG) analyses. The results showed that under microwave irradiation, the intrinsic viscosity and the yield of PAA were increases, and the reaction time was shortened. The FT-IR spectra of the polymer revealed characteristic peaks for PI around 1778^– and 1723 cm^–1. TG curves indicated that the obtained PI began to lose weight at 535 °C, and its 10% thermal decomposition temperature under N₂ was 587 °C.     

Soluble copolyimides with high modulus and low moisture absorption

A series of transparent copolyimides were prepared from PMDA-ODPA-TFDB via chemical imidization of the corresponding poly(amic acid)s. Copolyimides containing less than 70% PMDA were completely soluble in DMAc and other amide solvents and gave ductile films with unexpectedly high tensile moduli (up to 8.9 GPa). Water absorption, after boiling in water for 72 h, were less than 1 % for the copolymer with 67% PMDA and less than 0.5% for copolymers with less PMDA. Thermooxidative stability was comparable to a commercial polyimide film up to 325°C. A copolyimide containing 34% PMDA had the best overall properties based on the above tests. Additional evaluations revealed a coefficient of linear expansion of about 6 X 10^?6/°C, an essentially frequency independent dielectric constant of 2.8, a dissipation factor of about 0.004–0.01 over the range of 1–1000 kHz, and complete retention of tensile properties after exposure to a humid environment for 16 weeks. A model compound study suggests the probable presence of short blocks in these copolymers. © 1993 John Wiley & Sons, Inc.     

Dielectric properties of oxydianiline‐based polyimide thin films according to the water uptake

For polyimide thin films, the dielectric properties were investigated with the capacitance and optical methods. The dielectric constants of the 4,4′‐oxydianiline (ODA)‐based polyimide thin films varied from 2.49 to 3.10 and were in the following decreasing order: 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA)–ODA > 1,2,4,5‐benzenetetracarboxylic dianhydride (PMDA)–ODA > 4,4′‐hexafluoroisopropylidene diphthalic dianhydride (6FDA)–ODA. According to the absorption of water, the diffusion coefficients in the films varied from 4.8 × 10^?10 to 7.2 × 10^?10 cm²/s and were in the following increasing order: BPDA–ODA < PMDA–ODA < 6FDA–ODA. The dielectric constants and diffusion coefficients of the polyimides were affected by the morphological structures, including the molecular packing order. However, because of the water uptake, the changes in the dielectric constants in the polyimide thin films varied from 0.49 to 1.01 and were in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. Surprisingly, 6FDA–ODA with bulky hexafluoroisopropylidene groups showed less of a change in its dielectric constant than PMDA–ODA. The total water uptake for the polyimide thin films varied from 1.43 to 3.19 wt % and was in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. This means that the changes in the dielectric constants in the polyimide thin films were significantly related to the morphological structure and hydrophobicity of hexafluoroisopropylidene groups. Therefore, the morphological structure and chemical affinity in the polyimide thin films were important factors in controlling the dielectric properties. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 40: 2190–2198, 2002