Thermal annealing effects on a compositionally graded SiGe layer fabricated by oxidizing a strained SiGe layer

Thermal annealing effects on a thin compositionally graded SiGe buffer layer on silicon substrate fabricated by oxidizing a strained SiGe layer are investigated with X-ray diffraction, ultraviolet Raman spectra and atomic force microscopy. Interestingly, we found that the surface roughness and the threading dislocation densities are kept low during the whole annealing processes, while the Ge concentration at the oxidizing interface decreases exponentially with annealing time and the strain in the layer is only relaxed about 66% even at 1000 °C for 180 min. We realized that the strain relaxation of such a compositionally graded SiGe buffer layer is dominated by Si-Ge intermixing, rather than generation and propagation of misfit dislocations or surface undulation.     

Effect of strain relaxation of oxidation-treated SiGe epitaxial thin films and its nanomechanical characteristics

In this study, we examined the effect of high-temperature oxidation treatment on the SiGe epitaxial thin films deposited on Si substrates. The X-ray diffraction (XRD), atomic force microscopy (AFM), and nanoindentation techniques were employed to investigate the crystallographic structure, surface roughness, and hardness (H) of the SiGe thin films, respectively. The high-temperature oxidation treatment led to Ge pileup at the surface of the SiGe thin films. In addition, strain relaxation occurred through the propagation of misfit dislocations and could be observed through the cross-hatch pattern (800-900 °C) and SiGe islands (1000 °C) at the surface of the SiGe thin films. Subsequent hardness (H) measurement on the SiGe thin films by continuous penetration depth method indicated that the phenomenon of Ge pileup caused a slightly reduced H (below 50 nm penetration depth), while relaxation-induced defects caused an enhanced H (above 50 nm penetration depth). This reveals the influence of composition and defects on the structure strength of high-temperature oxidation-treated SiGe thin films.     

A comparative microstructural study of compositionally up- and down-graded (Ba,Sr)TiO3 thin films epitaxially grown on (La,Sr)CoO3-covered MgO(100) substrates by pulsed laser deposition

We report a comparative study of the microstructure of compositionally graded (Ba_1-xSr_x)TiO₃ (BST) films with two compositionally graded directions, up and down, with respect to the substrate, which were deposited epitaxially on (La,Sr)CoO₃ (LSCO)-covered MgO(100) single-crystal substrates by pulsed laser deposition. Cross-sectional transmission electron microscopy (TEM) images and electron diffraction show that the graded films grow epitaxially with their (100) plane parallel to the (100) surface of the MgO single-crystal substrate, and with an in-plane orientation relationship of 〈001〉_BST//〈001〉_LSCO//〈001〉_MgO. The crystalline quality and surface morphology of the graded films are closely related to the direction of the compositional gradient built into the graded films. Down-graded films (starting with a BaTiO₃ layer at the film/substrate interface) have a much better crystalline quality and a smoother surface than the up-graded films (starting with a (Ba_0.75Sr_0.25)TiO₃ layer at the film/substrate interface). Obviously, the BaTiO₃ bottom layer in the down-graded film acts not only as a part of the graded film but also as an excellent seeding layer to enhance the crystallization of the subsequent film layers, resulting in a high crystalline quality of the down-graded film and an enhanced dielectric behavior. Planar (high-resolution) TEM images also demonstrate that down-graded films have a larger, and more uniform, grain size than up-graded films, and that the latter contain voids. PACS 81.15.-z; 77.55.+f; 68.37.Lp; 61.14.-x     

Thin strain-relaxed SiGe grown by ultrahigh vacuum chemical vapor deposition

Large-scale preparation of thin strain-relaxed SiGe is achieved by combining ion implantation and ultrahigh vacuum chemical vapor deposition. The resulting materials were analyzed by double crystal X-ray diffraction, micro-Raman spectroscopy, and tapping mode atomic force microscope. Results revealed that 100-nm-thick Si_0.7Ge_0.3 layers with the diameter of 125 mm and full strain relaxation are successfully prepared by pre-modifying the Si substrates using 50 keV Ar⁺ ions. The strain relaxation is also disclosed to change with both ion species and energy. However, post-modification of SiGe by ion implantation will cause serious damage to the crystal structures, and result in the formation of poly-crystal SiGe.     

Multilayer Au/TiO2Composite Films with Ultrafast Third-Order Nonlinear Optical Properties

We report on the ultrafast third-order optical nonlinearity in multilayer Au/TiO2 composite films fabricated on quartz substrates by pulsed laser deposition technique. The linear optical properties of the films are determined and optical absorption peaks due to surface plasmon resonance of Au particles are observed at about 590hm. The third-order optical nonlinearities of the films are investigated by z-scan method using a femtosecond laser （50 fs） at the wavelength of 800 nm. The sample showed fast nonlinear optical responses with nonlinear absorption coefficient and nonlinear refractive index being -3.66 × 10^-10 m/W and -2.95 × 10^-17 m^2/W, respectively. The results also show that the nonlinear optical effects increase with the increasing Au concentration in the composite films.     

Epitaxial growth of fully relaxed Si0.75Ge0.25 on SOI substrate

A fully relaxed Si_0.75Ge_0.25 film with low dislocation densities is fabricated by epitaxial growth on SOI substrate without depositing graded buffers. The relaxation mechanism of the SiGe layer directly grown on SOI substrate is also analyzed. For SiGe grown on SOI with low Ge content, the strain is redistributed between SiGe and the top Si of SOI substrate, and the strain residing in SiGe layer can be fully relaxed by the formation and expansion of dislocation half-loops near the SiGe/Si interface. The surface morphology and crystal quality of all samples are analyzed by optical microscopy and transmission electron microscopy (TEM), respectively. Compared to the Si_0.75Ge_0.25 layer epitaxially grown on graded buffer, the Si_0.75Ge_0.25 directly grown on SOI substrate appears good surface morphology and perfect crystal quality.     

Evolution of Ge and SiGe Quantum Dots under Excimer Laser Annealing

We present different relaxation mechanisms of Ge and SiGe quantum dots under excimer laser annealing. Investigation of the coarsening and relaxation of the dots shows that the strain in Ge dots on Ge films is relaxed by dislocation since there is no interface between the Ge dots and the Ge layer, while the SiGe dots on Si0.77Ge0.23 film relax by lattice distortion to coherent dots, which results from the obvious interface between the SiGe dots and the Si0.77Ge0.23 film. The results are suggested and sustained by Vanderbilt and Wickham＇s theory, and also demonstrate that no bulk diffusion occurs during the excimer laser annealing.     

Effect of Pretreatment of TaN Substrates on Atomic Layer Deposition Growth of Ru Thin Films

The polycrystalline ruthenium films are grown on TaN substrates by atomic layer deposition （ALD） using bis（cyclopentadienyl） ruthenium [RuCp2] and oxygen as ruthenium precursor and reactant respectively at a deposition temperature of 330℃. The low-energy Ar ion bombardment and Ru pre-deposition are performed to the underlying TaN substrates before ALD process in order to improve the Ru nucleation. X-ray diffraction, x-ray photoelectron spectroscopy, scanning electron microscopy and atomic force microscopy are carried out to characterize the properties of ALD Ru films. The results show that the nucleation density of Ru films with Ar^＋ bombardment to the underlying TaN substrates is much higher than that of the ones without any pretreatment. The possible reasons are discussed.     

Room-Temperature Ferromagnetism in Zn1-xMnxO Thin Films Deposited by Pulsed Laser Deposition

Zn1-xMnxO （x = O.Olq3.1） thin films with a Curie temperature above 300K are deposited on Al2O3 （0001） substrates by pulsed laser deposition. X-ray diffraction （XRD）, ultraviolet （UV）-visible transmission and Raman spectroscopy are employed to characterize the microstructural properties of these films. Room temperature ferromagnetism is observed by superconducting quantum interference device （SQUID）. The results indicate that Mn doping introduces the incorporation of Mn^2＋ ions into the ZnO host matrix and the insertion of Mn^2＋ ions increases the lattice defects, which is correlated with the ferromagnetism of the obtained films. The doping concentration is also proven to be a crucial factor for obtaining highly ferromagnetic Zn1-xMnxO films.     

Preparation and characterization of PbTiO3–epoxy resin compositionally graded thick films

The preparation and properties of compositionally graded PbTiO₃ (PT)–epoxy resin (EPR) composite thick films are reported in this study. Various graded specimens were prepared using gravity casting method by embedding PT powders into the EPR matrix. The existence of a graded structure with two distinct phases, a good intermixing, some air pores, and different morphologies, was confirmed by scanning electron microscopy micrographs. The dielectric constants of these composites have values in the range 5–12 at the frequency of ～10⁴?Hz and about 3–13 at ～5?×?10^8?Hz. The composites with permittivity gradient act as a natural impedance match system in the frequency range 2–4?GHz, resulting in very low reflections. Therefore, the compositionally graded PT–EPR composite thick films are suitable as adapting impedance materials for microwave applications.     

Epitaxial Properties of Co-Doped ZnO Thin Films Grown by Plasma Assisted Molecular Beam Epitaxy

High quality Co-doped ZnO thin films are grown on single crystalline Al2O3（0001） and ZnO（0001） substrates by oxygen plasma assisted molecular beam epitaxy at a relatively lower substrate temperature of 450℃. The epitaxial conditions are examined with in-situ reflection high energy electron diffraction （RHEED） and ex-situ high resolution x-ray diffraction （HRXRD）. The epitaxial thin films are single crystal at film thickness smaller than 500nm and nominal concentration of Co dopant up to 20%. It is indicated that the Co cation is incorporated into the ZnO matrix as Co^2＋ substituting Zn^2＋ ions. Atomic force microscopy shows smooth surfaces with rms roughness of 1.9 nm. Room-temperature magnetization measurements reveal that the Co-doped ZnO thin films are ferromagnetic with Curie temperatures Tc above room temperature.     

Formation of relaxed SiGe on the buffer consists of modified SiGe stacked layers by Si pre-intermixing

High-quality relaxed SiGe films on Si (0 0 1) have been demonstrated with a buffer layer containing modified SiGe (m-SiGe) islands in ultra-high vacuum chemical vapor deposition (UHV/CVD) system. The m-SiGe islands are smoothened by capping an appropriate amount of Si and the subsequent annealing for 10 min. This process leads to the formation of a smooth buffer layer with non-uniform Ge content. With the m-SiGe-dot multilayer as a buffer layer, the 500-nm-thick uniform Si_0.8Ge_0.2 layers were then grown. These m-SiGe islands can serve as effective nucleation centers for misfit dislocations to relax the SiGe overlayer. Surface roughness, strain relaxation, and crystalline quality of the relaxed SiGe overlayer were found to be a function of period's number of the m-SiGe-dot multilayer. By optimizing period number in the buffer, the relaxed Si_0.8Ge_0.2 film on the 10-period m-SiGe-dot multilayer was demonstrated to have a threading dislocation density of 2.0 × 10⁵ cm⁻² and a strain relaxation of 89%.     

Growth and Characteristics of Freestanding Hemispherical Diamond Films by Microwave Plasma Chemical Vapor Deposition

Freestanding hemispherical diamond films have been fabricated by microwave plasma chemical vapor deposition using graphite and molybdenum （Mo） as substrates. Characterized by Raman spectroscopy and scanning electron microscopy, the crystalline quality of the films deposited on Mo is higher than that on graphite, which is attributed to the difference in intrinsic properties of the two substrates. By decreasing the methane concentration, the diamond films grown on the Mo substrate vary from black to white, and the optical transparency is enhanced. After polishing the growth side, the diamond films show an infrared transmittance of 35-60% in the range 400-4000 cm^- 1.     

Influence of ambient oxygen pressure on the preferred orientation, microstructures, and dielectric properties of (Ba1-xSrx)TiO3 thin films with compositionally graded structures

Compositionally graded (Ba_1-xSr_x)TiO₃ (BST) thin films, with x decreasing from 0.25 to 0.0, were deposited on Pt(111)/Ti/SiO₂/Si(100) substrates by pulsed-laser ablation at 600 °C and under ambient oxygen pressures ranging from 50 to 400 mTorr. The influence of the ambient gas pressure on the preferred orientation, microstructures, and dielectric properties of compositionally graded BST films was investigated by X-ray diffraction, scanning electron microscopy, and dielectric frequency spectra, respectively. As the ambient oxygen pressure was increased, the preferred orientation evolved in the order: (100)+(110)(110)+(111) random orientation, and the surface roughness of the graded BST films also increased. The graded BST films deposited at high ambient oxygen pressures (300400 mTorr) exhibited a grainy structure with polycrystalline grains throughout the film thickness, whereas the graded films deposited at low ambient oxygen pressures (50200 mTorr) possessed a columnar structure. The evolution of the microstructure was ascribed to the different physical and chemical properties of the species that were incident onto the substrates at the various oxygen pressures. The dielectric properties of the graded BST films were dependent upon the ambient oxygen pressures. The graded BST films deposited at 200 mTorr exhibited the highest dielectric constant. PACS 77.55.+f; 77.22.Ch; 81.15.Fg     

Optical characterization of band gap graded ZnMgO films

We investigated the optical properties of compositionally graded Zn_1?xMg_xO (g-ZnMgO) films using spectroscopic ellipsometry. The g-ZnMgO and ZnO films were grown on Pt/Ti/SiO₂/Si substrates by ultrasonic spray pyrolysis. We simulated a uniformly graded optical band gap layer on the Pt substrate to reproduce the experimental result. The band gap of the bottommost layer of the g-ZnMgO film was estimated to be ～3.22 eV, the same as the undoped ZnO film. Then we considered a linearly increasing band gap with the film composition, and obtained a band gap of ～3.56 eV for the topmost layer of the film. In addition, the exciton peak showed a strong increase for the topmost layer of the film suggesting an important role of doping.     

Electrical Studies on Pentacene Thin Film Transistors with Different Channel Widths

In order to conduct electrical studies on organic thin film transistors, top-contact devices are fabricated by growing polycrystalline films of freshly synthesized pentacene over Si/SiO2 substrates with two different channel widths under identical conditions. Reasonable field effect mobilities in order of 10^-2-10^-3 cm^2V^-1s^-1 are obtained in these devices. An elaborative electrical characterization of all the devices is undertaken to study the variance in output saturation current, field effect mobility, and leakage current with aging under ambient conditions. As compared to the devices with longer channel width, the devices with shorter channel width exhibit better electrical performance initially. However, the former devices sustain the moderate performance much longer than the latter ones.     

Nanoscratch studies of SiGe epitaxial layer damage on the Si substrate

The present study evaluates the wear performance of silicon-germanium (SiGe) epitaxial growth of thin films, in which the in situ scratch profile is followed by ex situ atomic force microscopy (AFM) examinations. The wear evaluation of SiGe films was carried out at different constant loads (2000, 4000, and 6000 μN) with the same sliding speeds. The microstructural morphology was observed by means of transmission electron microscopy (TEM)Findings show that annealing treatments of SiGe films exhibit the highest scratch resistance at 400 °C compared to that of the as-deposited sample. The main characteristic of SiGe film is its ability to withstand wear resistance; observations show that moderate compressive residual is beneficial to the film, since it can suppress crack initiation. The annealing treatments of SiGe films revealed the resultant adhesive and cohesive failure mechanism.     

Room-Temperature Ferromagnetic ZnMnO Thin Films Synthesized by Plasma Enhanced Chemical Vapour Deposition Method

Room-temperature ferromagnetic Mn-doped ZnO films are grown on Si （001） substrates by plasma enhanced chemical vapour deposition （PECVD）. X-ray diffraction measurements reveal that the Znl-xMn.O films have the single-phase wurtzite structure. X-ray photoelectron spectroscopy indicates the existence of Mn^2＋ ions in Mndoped ZnO films. Furthermore, the decreasing additional Raman peak with increasing Mn-doping is considered to relate to the substitution of Mn ions for the Zn ions in ZnO lattice. Superconducting quantum interference device （SQUID） measurements demonstrate that Mn-doped ZnO films have ferromagnetic behaviour at room temperature.     

Growth and Characterization of InN Thin Films on Sapphire by MOCVD

Indium nitride thin films are grown on sapphire substrates by metal-organic chemical vapour deposition （MOCVD） By employing three-step layer buffers, the mirror-like layers on two-inch sapphire wafers have been obtained. The structural, optical and electrical characteristics of InN are investigated by x-ray diffraction, scanning electron microscopy, atomic force microscopy, photoluminescence and infrared optical absorption. The photoluminescence and the absorption studies of the materials reveal a marked energy bandgap structure around 0.70eV at room temperature. The room-temperature Hall mobility and carrier concentration of the film are typically 939 cm^2 /Vs, and 3.9 × 1018cm^-3, respectively.     

Evolution of stress and strain relaxation of Ge and SiGe alloy films on Si(0 0 1)

The growth of Ge and SiGe alloy films on Si substrates has attracted considerable interest in the last years because of their importance for optoelectronic devices as well as Si-based high speed transistors. Here we give a short overview on our recent real time stress measurements of Ge and SiGe alloy films on Si(0 0 1) performed with a sensitive cantilever beam technique and accompanied by structural investigations with atomic force microscopy. Characteristic features in the stress curves provide detailed insight into the development and relief of the misfit strain. For the Stranski–Krastanow system Ge/Si(0 0 1) as well as for SiGe films with Si contents below 20%, the strain relaxation proceeds mainly into two steps: (i) by the formation of 3D islands on top of the Ge wetting layer; (ii) via misfit dislocations in larger 3D islands and upon their percolation.