Photoluminescence of nanostructured cubic-lattice silicon carbide films grown on a silicon wafer

The light-emitting properties of cubic-lattice silicon carbide SiC films grown on Si(100) and Si(111) substrates with VPE at low temperatures (T _gr ∼ 700°C) are discussed. Investigations of the grown films reveal a homogeneous nanocrystalline structure involving only the 3C-SiC phase. When the electron subsystem of the structure is excited by a He-Cd laser emitting at λ_exit = 325 nm, the photoluminescence (PL) spectra contain a rather strong emission band shifted by about 3 eV toward a short-wave spectral region. At low temperatures, the PL integral curve is split into a set of Lorentz components. The relation between these components and the peculiarities of the energy spectrum of electrons in the nanocrystalline grains of the silicon carbide layers is discussed.     

Synthesis of epitaxial silicon carbide films through the substitution of atoms in the silicon crystal lattice: A review

A review of recent advances in the field of epitaxial growth of SiC films on Si by means of a new method of epitaxial substitution of film atoms for substrate atoms has been presented. The basic statements of the theory of the new method used for synthesizing SiC on Si have been considered and extensive experimental data have been reported. The elastic energy relaxation mechanism implemented during the growth of epitaxial SiC films on Si by means of the new method of substitution of atoms has been described. This method consists in substituting a part of carbon atoms for silicon matrix atoms with the formation of silicon carbide molecules. It has been found experimentally that the substitution for matrix atoms occurs gradually without destroying the crystalline structure of the matrix. The orientation of the film is determined by the “old” crystalline structure of the initial silicon matrix rather than by the silicon substrate surface only, as is the case where conventional methods are used for growing the films. The new growth method has been compared with the classical mechanisms of thin film growth. The structure and composition of the grown SiC layers have been described in detail. A new mechanism of first-order phase transformations in solids with a chemical reaction through an intermediate state promoting the formation of a new-phase nuclei has been discussed. The mechanism providing the occurrence of a wide class of heterogeneous chemical reactions between the gas phase and a solid has been elucidated using the example of the chemical interaction of the CO gas with the single-crystal Si matrix. It has been shown that this mechanism makes it possible to grow a new type of templates, i.e., substrates with buffer transition layers for growing wide-band-gap semiconductor films on silicon. A number of heteroepitaxial films of wide-band-gap semiconductors, such as SiC, AlN, GaN, and AlGaN on silicon, whose quality is sufficient for the fabrication of a wide class of micro- and optoelectronic devices, have been grown on the SiC/Si substrate grown by solid-phase epitaxy.     

Specific features and mechanisms of photoluminescence of nanostructured silicon carbide films grown on silicon in vacuum

The light-emitting properties of cubic silicon carbide films grown by vacuum vapor phase epitaxy on Si(100) and Si(111) substrates under conditions of decreased growth temperatures (T _gr ∼ 900–700°C) have been discussed. Structural investigations have revealed a nanocrystalline structure and, simultaneously, a homogeneity of the phase composition of the grown 3C-SiC films. Photoluminescence spectra of these structures under excitation of the electronic subsystem by a helium-cadmium laser (λ_excit = 325 nm) are characterized by a rather intense luminescence band with the maximum shifted toward the ultraviolet (∼3 eV) region of the spectral range. It has been found that the integral curve of photoluminescence at low temperatures of measurements is split into a set of Lorentzian components. The correlation between these components and the specific features of the crystal structure of the grown silicon carbide layers has been analyzed.     

Growth of silicon carbide films via C60 precursors

Epitaxial silicon carbide films are grown on Si(100) and Si(111) substrates at surface temperatures between 950 and 1250 K via c₆₀ precursors. Films have been grown up to thicknesses greater than 1 μm. The growth rate of the SiC film is not limited by the surface reaction rate of C₆₀ with silicon at these temperatures, rather by the arrival rate of the reactants Si (by diffusion) or C₆₀. This results in rapid film growth. Films have been characterized by low energy electron diffraction, X-ray diffraction, and Auger depth profiling. X-ray diffraction suggests the growth of β-SiC in the temperature range investigated. Auger depth profiling shows the film is stoichiometric. Selective crystalline silicon carbide growth is achieved on patterned silicon-silicon oxide samples.     

Vibrational spectroscopy of SiC thin films deposited by excimer laser ablation

A large number of thin SiC films, prepared at different conditions by KrF excimer laser ablation of solid SiC targets and deposition onto Si substrates (some onto quartz glass (QG) and yttrium-stabilized zirconia (YSZ)) were characterized by infrared and Raman spectroscopy. The films consisted of nano- and microcrystalline SiC and contained nanocrystalline carbon in the case of QG or YSZ substrates. Raman spectra of nanocrystalline SiC (grains <30 nm) reflect the phonon density-of-state function of SiC by broad scattering effects at 220–600 and 650–950 cm⁻¹. Medium-size crystallites are represented by a relatively narrow asymmetric band at 790 cm⁻¹ and crystallites >200 nm by an additional asymmetric band at 960 cm⁻¹. Small satellite bands at 760 and 940 cm⁻¹, attributed to SiC surface layers, were resolved in some well-ordered samples. Optical modelling was needed to interpret the IR spectra. SiC films could be represented by an effective medium model containing a SiC host phase and embedded particles with free charge carriers. The crystalline order of SiC films can be estimated from the parameters of the SiC oscillators. Received: 5 October 1998 / Accepted: 8 January 1999 / Published online: 5 May 1999     

Amorphous silicon carbide thin films doped with P or B for the photoelectrochemical water splitting devices

Photoelectrochemical water splitting devices require semiconductor photoelectrode material fulfilling a number of primary requirements such as band gap, band edge alignment and corrosion resistance to electrolyte. Amorphous silicon carbide films, undoped and doped (P or B), were deposited on Si substrates by PECVD technology. The concentration of elements in the films was determined by RBS and ERD analytical method. Raman spectroscopy study of the SiC films were performed by using a Raman microscope and chemical compositions were analyzed by FTIR, before and after immersion of samples to aqueous pH 2.0 and pH 1.0 sulphuric acid electrolyte. Electrical properties of SiC films before and after immersion of samples to aqueous pH 2.0 and pH 1.0 sulphuric acid electrolyte were studied by measurement of the I–V characteristics on structure Al/SiC/Si/Al. Differences between Raman spectra, FTIR spectra and I–V characteristics before and after immersion to electrolyte are discussed.     

High-resolution transmission electron microscopy on silicon carbide whiskers

SiC whiskers were grown from the reaction of silicon monoxide (SiO) with activated carbon containing iron impurities. Growth proceeds through a VLS growth mechanism with SiO and CO as reacting gases. HRTEM combined with EDS shows that the SiC whisker is topped by a Fe₃Si catalyst droplet. The SiC whisker is found to be one-dimensionally disordered along the [111] growth direction of an fcc crystal structure. Although the catalyst droplet is usually larger than the top face of the whisker, we observed a number of situations where the diameter of the droplet was smaller. The study of the SiC-Fe₃Si interface showed that the growth is nucleated from the edges.     

Raman scattering in mosaic silicon carbide films

The Raman spectra of mosaic silicon carbide films grown on silicon substrates by solid-state epitaxy have been studied. The main polytypes forming the film material have been determined. It has been experimentally revealed that the properties of the silicon carbide film are changed after an aluminum nitride film is deposited on the former film. This has been interpreted as a manifestation of good damping properties of the SiC film when layers of other semiconductors are grown on it.     

Luminescence spectra of hexagonal forms of silicon carbide in mosaic films grown by solid-state epitaxy

The luminescence spectra of silicon carbide films grown on silicon by solid-state epitaxy have been studied. It has been shown that, depending on the growth conditions, one can obtain films of different SiC polytypes, including the cubic and hexagonal ones. In many cases, the films thus grown display a mixture of various polytypes, but it is possible to prepare films of predominantly hexagonal symmetry (the coexistence of the 4H and 2H hexagonal phases, which are close in properties, is also possible). It thus has been demonstrated that the silicon carbide films grown on silicon by solid-state epitaxy are promising for application as damping layers in fabrication of wide-band-gap hexagonal semiconductors on silicon substrates.     

Heteroepitaxial GaN films on silicon substrates with porous buffer layers

New complex buffer layers based on a porous material have been developed for epitaxial growth of GaN films on Si substrates. The characteristics of gallium nitride heteroepitaxial layers grown on silicon substrates with new buffer layers by metal-organic vapor phase epitaxy are investigated. It is shown that the porous buffer layers improve the electric homogeneity and increase the photoluminescence intensity of epitaxial GaN films on Si substrates to the values comparable with those for reference GaN films on Al₂O₃ substrates. It is found that a fianite layer in a complex buffer is a barrier for silicon diffusion from the substrate into a GaN film.     

Development of epitaxial silicon lattice-matched insulators: silicon heterostructures for quantum confinement

Epitaxial films of the wide-bandgap II–VI beryllium chalcogenide semiconductors, BeTe, BeSe, and BeSeTe were grown on arsenic-terminated silicon substrates by MBE. Silicon was also epitaxially regrown on Be-chalcogenide films. Initial structural characterization revealed the desired smooth two-dimensional nature of the layer growth. The composition of BeSeTe ternary films was governed by the Be/Se flux ratio during deposition rather than by the Se/Te flux ratio. The variation in Be/Se flux ratio or in the sticking coefficients due to temperature gradients led to radial compositional inhomogeneity. Current versus temperature measurements of the Be-chalcogenide films at elevated temperatures analyzed assuming thermionic emission over the heterojunction barrier, showed conduction band offsets of 1.2 eV for the BeSe_0.41Te_0.59/As/Si and 1.3 eV for the BeSe/As/Si heterostructures. At room temperature, current density through BeSe/Si and BeSe_0.41Te_0.59/Si films was mid-10 ^{− 9}A cm ^{− 2}at 0.1 MV cm ^{− 1}, similar to previously reported values for ZnS/Si, while BeTe/Si films had orders of magnitude higher current density, possibly due to interfacial recombination.     

Effects of sic buffer layer on the optical properties of ZnO films grown on Si (1 1 1) substrates

ZnO films have been grown by a sol-gel process on Si (1 1 1) substrates with and without SiC buffer layers. The influence of SiC buffer layer on the optical properties of ZnO films grown on Si (1 1 1) substrates was investigated. The intensity of the E₂ (high) phonon peak in the micro-Raman spectrum of ZnO film with the SiC buffer layer is stronger than that of the sample without the SiC buffer layer, and the breadth of E₂ (high) phonon peak of ZnO film with the SiC buffer layer is narrower than that of the sample without the SiC buffer layer. These results indicated that the crystalline quality of the sample with the SiC buffer layer is better than that of the sample without the SiC buffer layer. In photoluminescence spectra, the intensity of free exciton emission from ZnO films with the SiC buffer was much stronger than that from ZnO film without the SiC buffer layer, while the intensity of deep level emission from sample with the SiC buffer layer was about half of that of sample without the SiC buffer layer. The results indicate the SiC buffer layer improves optical qualities of ZnO films on Si (1 1 1) substrates.     

Effects of substrate on surface morphology, crystallinity, and photoluminescence properties of sputtered ZnO nano films

Effects of substrate on crystallinity, surface morphology, and luminescence properties of radio frequency sputtered zinc oxide (ZnO) thin films were investigated. A variety of materials such as Si (100), Si (111), Al₂O₃, quartz, and silicon carbide (SiC) wafers were examined as substrates for deposition of ZnO thin films. The results showed smooth and uniform growth of c-axis orientation films. The thickness of the layers was about 50 nm. The average grain sizes of films were about 10, 13, and 12 nm for Si (111), quartz, and SiC samples, respectively. The deposited film on Al₂O₃ showed the largest grain size, about 500 nm. Grazing incidence x-ray diffraction patterns of the samples revealed that sputtered layers on Al₂O₃ and quartz had better crystallinity with higher peak at (002) orientation compared to Si and SiC substrates. Moreover, the Al₂O₃ sample exhibited a weak peak at position of (100) planes of ZnO too. The photoluminescence spectra of the samples showed a typical luminescence behavior with a broad UV band, including a main peak at around 388 nm and a weak shoulder peak at around 381 nm, corresponding with bound excitonic recombination and free excitonic recombination, respectively. The luminescence peak revealed that the intensity of UV emission is not necessarily dependent on the grain sizes and the micro-structural quality of ZnO films.     

Pulsed CO2 laser-driven production of ultrafine silicon,silicon carbide,silicon nitride and silicon oxynitride powders

Summary Ultrafine Si, Si₃N₄, SiC and silicon oxynitride powders have been produced by irradiating gas-phase reactants by means of a CO₂ laser. The mechanism of SiH₄ CO₂ laser-induced absorption and dissociation is discussed on the basis of the results of the spectral and time-resolved measurement of fragment chemiluminescence. The role played by the SiH₂ radical in the powder formation is investigated. The quality of Si, Si₃N₄, SiC and silicon oxynitride powders is checked by means of several off-line diagnostics (IR spectroscopy, X-ray diffraction at wide and small angle, BET analysis). The possibility of controlling powder stoichiometry and doping from the gas-phase reactant concentration is discussed.     

Improving the tribological performances of graphite-like carbon films on Si3N4 and SiC by using Si interlayers

Si interlayers were used to obtain the excellent tribological performances of graphite-like carbon (GLC) film on silicon nitride (Si₃N₄) and silicon carbide (SiC). The microstructure and mechanical characteristics of the as-prepared GLC films with Si interlayers were investigated by scanning electron microscopy, Raman spectroscopy, nanoindention and scratch test. The tribological behaviors of GLC-coated and uncoated Si₃N₄ and SiC were comparatively studied by a ball-on-disc tribo-meter in both dry and water environments. Results showed that the Si interlayers were dense and bonded well with both the substrates and GLC layers. The as-prepared GLC films exhibited excellent tribological performances in both dry and water environments. More importantly, the stably mild wear without any delamination was obtained in water by using Si interlayer. The mechanisms of friction reduction and anti-wear performances of GLC films on the two ceramics with Si interlayers under different environmental conditions were discussed, as well as the corresponding models were deduced.     

SiC based Si/SiC heterojunction and its rectifying characteristics

The Si on SiC heterojunction is still poorly understood, although it has a number of potential applications in electronic and optoelectronic devices, for example, light-activated SiC power switches where Si may play the role of an light absorbing layer. This paper reports on Si films heteroepitaxially grown on the Si face of (0001) n-type 6H-SiC substrates and the use of B₂H_6 as a dopant for p-Si grown at temperatures in a range of 700--950~\du. X-ray diffraction (XRD) analysis and transmission electron microscopy (TEM) tests have demonstrated that the samples prepared at the temperatures ranged from 850~℃ to 900~℃ are characterized as monocrystalline silicon. The rocking XRD curves show a well symmetry with FWHM of 0.4339° Omega. Twin crystals and stacking faults observed in the epitaxial layers might be responsible for widening of the rocking curves. Dependence of the crystal structure and surface topography on growth temperature is discussed based on the experimental results. The energy band structure and rectifying characteristics of the Si/SiC heterojunctions are also preliminarily tested.     

Synchrotron-radiation photoemission study of the ultrathin Ba/3C–SiC(111) interface

Electronic structure of the Ba/3C–SiC(111) interface has been detailed studied in situ in an ultrahigh vacuum using synchrotron radiation photoemission spectroscopy with photon energies in the range of 100–450 eV. The 3C–SiC(111) samples were grown by a new method of epitaxy of low-defect unstressed nanoscaled silicon carbide films on silicon substrates. Valence band photoemission and both the Si 2p, C 1s core level spectra have been investigated as a function of Ba submonolayer coverage. Under Ba adsorption two induced surface bands are found at binding energies of 2 eV and 6 eV. It is obtained that Ba/3C–SiC(111) interface can be characterized as metallic-like. Modification of both the Si 2p and C 1s surface-related components were ascertained and shown to be provided by redistribution effect of electron density between Ba adatoms and both the Si surface and C interface atoms.     

SrTiO3(110) thin films grown directly on different oriented silicon substrates

We have grown (110)-oriented SrTiO₃ (STO) thin films on silicon without any buffer layer, by means of pulsed laser deposition technique. The crystal structures of the grown films were examined by X-ray diffraction analysis including θ–2θ scan and rocking curve as well as Laue diffraction methods. STO films with single (110) out-of-plane orientation were formed on all (100), (110) and (111)-oriented Si substrates. The in-plane alignments for the epitaxial STO films grown directly on Si (100) were found as STO[001]//Si[001] and STO[11̄0]//Si[010]. The results should be of interest for better understanding of the growth of perovskite oxide thin films on silicon wafers. PACS 77.55.+f; 68.55.JK; 81.15Fg     

Atomic transport during growth of ultrathin dielectrics on silicon

Atomic transport in thermal growth of thin and ultrathin silicon oxide, nitride, and oxynitride films on Si is reviewed. These films constitute the gate dielectrics, the “heart” of silicon metal-oxide-semiconductor field-effect transistor (MOSFET) and dynamic random-access memory (DRAM) devices, which are usually thermally grown on the active region of the semiconductor Si substrate. The drive of ultra-large scale integration towards the 0.18 μm channel length and below requires gate dielectrics with thicknesses of 3–4 nm and less, establishing new and very strict material requirements. Knowledge on an atomic scale of dielectric film growth promoted by thermally activated transport mechanisms is essential to the engineering of this fabrication step. In the case of thermal growth of silicon oxide films on Si in dry O₂, the mobile species is O₂ and growth is essentially a diffusion–reaction phenomenon. The thermal growth of silicon nitride and oxynitride films on Si in NH₃, NO and N₂O, on the other hand, involves catalytic dissociation of the original gas molecules at the surfaces and interfaces and diffusion–reaction of different resulting species, like NH₂, NH, H, N, NO, O, and O₂. Hydrogen transport and incorporation is a crucial, ubiquitous issue in thermally grown dielectric films on Si which is also addressed here. A recall is made of the physico-chemical constitution of the involved surfaces and interfaces for each different dielectric material, as well as complementary studies of the gas, gas-surface, and solid phase chemistry. An outline of the unique tools of isotopic substitution and high resolution depth profiling is included.     

New method for growing silicon carbide on silicon by solid-phase epitaxy: Model and experiment

A new method of solid-state epitaxy of silicon carbide (SiC) on silicon (Si) is proposed theoretically and realized experimentally. Films of various polytypes of SiC on Si(111) grow through a chemical reaction (at T = 1100–1400°C) between single-crystal silicon and gaseous carbon oxide CO (at p = 10–300 Pa). Some silicon atoms transform into gaseous silicon oxide SiO and escape from the system, which brings about the formation of vacancies and pores in the silicon near the interface between the silicon and the silicon carbide. These pores provide significant relaxation of the elastic stresses caused by the lattice misfit between Si and SiC. X-ray diffraction, electron diffraction, and electron microscopy studies and luminescence analysis showed that the silicon carbide layers are epitaxial, homogeneous over the thickness, and can contain various polytypes and a mixture of them, depending on the growth conditions. The typical pore size is 1 to 5 μm at film thicknesses of ～20 to 100 nm. Thermodynamic nucleation theory is generalized to the case where a chemical reaction occurs. Kinetic and thermodynamic theories of this growth mechanism are constructed, and the time dependences of the number of new-phase nuclei, the concentrations of chemical components, and the film thickness are calculated. A model is proposed for relaxation of elastic stresses in a film favored by vacancies and pores in the substrate.