Reliability and degradation behaviors of semi-insulating Fe-dopedInP buried heterostructure lasers fabricated by RIE and MOVPE

We clarified the degradation behaviors of semi-insulating buried heterostructure lasers in which mesa structures were fabricated by reactive ion etching (RIE) and then buried in semi-insulating Fe-doped InP grown by metal organic vapor phase epitaxy (MOVPE). The degradation rate and mode correlated with the quality of the buried heterostructure (BH) interface. Based on the correlation, a condition for highly stable semi-insulating Fe-doped InP buried heterostructure (SIBH) lasers was demonstrated and confirmed experimentally and statistically     

1.5 ?m region InP/GaInAsP buried heterostructure lasers on semi-insulating substrates

InP/GaInAsP buried heterostructure (BH) lasers for the 1.5 ?m region have been fabricated on semi-insulating InP substrates. The threshold current of the lasers is as low as 38 mA under CW operation at 25°C, which is nearly the same as for BH lasers fabricated on n-type InP substrates.     

Fe-doped InP semi-insulating buried heterostructure for high speed and high power operations in directly modulated semiconductor laser

A buried heterostructure based on Fe-doped InP semi-insulating layers is optimised for both high output power and large modulation bandwidth operations up to 70/spl deg/C in a 10 Gbit/s directly modulated 1.3 /spl mu/m InGaAsP/InP distributed feedback laser. The slope efficiency of 0.19 W/A and -3 dB bandwidth of 10 GHz at 1.5 times threshold current is demonstrated experimentally.     

Single-mode low-loss buried optical waveguide bends in GaInAsP/InP fabricated by dry etching

Low-loss single-mode buried optical waveguide bends in MOVPE-grown InP-based materials are reported. Reactive ion etching (RIE) was used to fabricate the curves which were subsequently buried in InP to reduce optical losses and to control the number of lateral guided modes. Losses as low as 1.1 dB for 200 mu m radius of curvature and 0.3 dB for 300 mu m radius of curvature have been measured using TE-polarised light at 1.553 mu m wavelength.<>     

Reliability in InGaAsP/InP buried heterostructure 1.3 µm lasers

A study was conducted of aging-induced Sn whisker growth at the surface of Au-Sn bonding solder layers around a laser chip, as well as metallurgical reactions, especially in p-side down lasers, at the interface of the solder and laser crystal just below the active layer. These phenomena cause electrical shorts in InGaAsP/InP laser diodes, which occur suddenly in devices operated for long periods without any previous symptoms having appeared in their aging characteristics. To completely eliminate such failures, a novel assembling method in which chips were mounted p-side up on semiinsulating SiC submounts using Pb-Sn solder, was applied to InGaAsP/InP buried heterostructure (BH) lasers emitting at 1.3 μm. BH lasers assembled by this method do not suffer any shorting failure even after 8000 h operation under 60°C and 5 mW/facet output conditions. The small degradation rates obtained, for example, 3 percent/kh (median) at 60°C, certify the reliability of these improved lasers. As long as the stripe width of the active layer was optimized to be in the range of1.5-2.5 mum necessary for obtaining kink-free light output versus current properties, no detrimental changes in laser characteristics, including transverse and longitudinal modes and dynamic output response, were observed in aged lasers. In this paper, the long-term degradation modes observed are presented, and possible causes are discussed.     

Planar buried heterostructure InP/GaInAs lasers grown entirely by OMVPE

GaInAs/InP planar buried heterostructure (PBH) lasers with semi-insulating blocking layers were grown in an `all? atmospheric OMVPE system. These layers had current thresholds as low as 35 mA and differential quantum efficiencies of ?16% at a wavelength of 1.64 ?m. The maximum power output was 80 mW pulsed and 8mWCW.     

Low pressure MOCVD growth of buried heterostructure laser wafers using high quality semi-insulating InP

Semi-insulating Fe doped InP has been grown by low pressure MOCVD at 100 mbar and 630° C. Complete activation of Fe below the solubility limit of 5 × 10₁₆ cm^-3 has been achieved by reducing the PH₃ concentration during crystal growth to the lowest value required to maintain good surface morphology of the layer. Diffusion of the Fe dopant and dopant spikes at the interface between the substrate and grown layer can be minimized by ensuring that the total Fe concentration in the layer does not exceed the diffusion threshold of 2 × 10¹⁷ cm⁻³. Growth of Fe doped InP around a double heterostructure mesa formed by reactive ion etching produces a structure without either growth of InP on the mesa or notches at the mesa sidewalls, even with minimal overhang of the dielectric mask. Examination of regrown heterostructures shows no evidence of interdiffusion of Fe and Zn, indicating that Fe diffusion has been successfully prevented. Completed lasers have threshold current densities of 2.5 kA/cm² at 20° C and initial aging results which indicate that these devices have good lasing characteristics and potentially high reliability.     

Integratable, high speed buried ridge DFB lasers fabricated on semi-insulating substrates

The fabrication of buried ridge DFB lasers on semi-insulating substrates is described. A novel contacting mechanism was employed to give a series resistance of less than 4 Omega . Devices were fabricated at both 1.3 and 1.53 mu m with lasing thresholds as low as 16 mA. Single longitudinal mode operation was achieved with SMSR greater than 30 dB at both wavelengths. The structure gives an inherently low capacitance, which together with low threshold currents, low series resistance and fabrication on SI substrates makes these devices suitable for integration and high speed applications.<>     

MOVPE growth and characteristics of Fe-doped semi-insulating InP layers

Semi-insulating Fe-doped InP layers have been grown by atmospheric-pressure MOVPE using ferrocene [Fe(C5H5)2], trimethylindium (TMI) and phosphine (PH3) as source materials. Resistivities at 294K of more than 8 × 108?cm with a highest value of 1.5 × 109 have been achieved.     

Suppression of interface degradation in InGaAsP inP buried heterostructure lasers

In InGaAsP/InP buried heterostructure (BH) lasers, the degradation of BH interface between first- and second-growth step layers can be suppressed by employing the melt back process just before the second-step layer growth. It is confirmed this burying process give more reliable BH lasers than the conventional burying process. From the viewpoint of BH interface degradation, lasers lasing at 1.5 μm, where the melt back process naturally occurs during BH formation, are found to be more reliable than those lasing at 1.3 μm.     

InGaAsP InP current confinement mesa substrate buried heterostructure laser diode fabricated by one-step liquid-phase epitaxy

New InGaAsP/InP buried heterostructure laser diodes fabricated by one-step liquid-phase epitaxy are described, in which the InGaAsP active region completely embedded in InP is grown on the top of the mesa stripe formed on the InP substrate while, simultaneously, current confinement structure is automatically formed on both sides of the mesa stripe. These current confinement mesa substrate buried heterostructure laser diodes (CCM-LD's) have current confinement structure which very effectively blocks unwanted leakage current bypassing the light emitting region which has enabled laser operation with a threshold current as low as 20 mA, 70-mW maximum CW output at room temperature, and 125°C maximum CW operation temperature. Life tests over 6000-h CW operation at 70°C and 5 mW/facet have confirmed good reliability of these devices.     

InGaAsP/InP distributed feedback buried heterostructure lasers with both facets cleaved structure

Feasibilities of InGaAsP/InP distributed feedback buried heterostructure lasers in the 1.3 and 1.5 μm wavelength regions with two cleaved facets are shown. Theoretical and experimental examinations show that the kL values ranging between 1 and 2 are sufficient for high-performance operation with the stable single longitudinal mode in a temperature range wider than 100 degrees. Distribution of lasing characteristics is investigated for 140 randomly chosen LD's from two wafers. Approximately 65 percent of the devices are found to be operable in the single longitudinal mode. A CW single longitudinal mode operation power of 20 mW at 25°C for a 1.5 μm device, and that of 40 mW (60 mW with AR coating) at 25°C for a 1.3 μm device with low threshold current are achieved. These characteristics are attained by both first- and second-order grating devices fabricated by the PH3addition LPE technique. The results of the aging test at 70°C and 110 mA in the automatic current control condition are also presented.     

The properties of MOVPE grown 1.3 μm DFB MQW lasers infilled with semi-insulating InP fabricated on semi-insulating substrates

The use of optoelectronic integrated circuits (OEICs) is now emerging as a practical technology for a variety of applications, particularly in advanced telecommunications. OEICs consist of a range of devices such as lasers, waveguides, modulators, amplifiers, transistors, detectors, etc. fabricated on the same substrate. When a semi-insulating substrate is used, these devices can be electrically isolated by channel etching, resulting in a low capacitance structure with reduced electrical interference between the subcomponents. One of the devices which is particularly advantageous for this type of integration scheme is the distributed feedback (DFB) laser. The laser can be made to function more efficiently by minimizing the current flowing outside the active region. This can be achieved by surrounding the active region with semi-insulating iron doped InP. This work describes for the first time, the MOVPE growth, fabrication, and device characterization of 1.3 um buried heterostructure DFB MQW lasers, which combine the advantages of using both a semi-insulating substrate and a semi-insulating infill region in the same device structure. The potential advantage of this design scheme is improved OEIC performance as a result of, reduced capacitance and electrical crosstalk, enhanced laser output power, higher speed, increased efficiency, wider operating temperature and reduced threshold current. The laser active region consists of 8 x 140 Å quantum wells of GalnAsP (λ = 1.3 μm) and 110 Åbarriers of GalnAsP (λ= 1.07 μm). Single mode 1.3 urn devices of length 250 μm operating at room temperature produced threshold currents of 8 mA, efficiencies of up to 25%, output powers of 18 mW at 80 mA (pulsed), and a frequency response greater than 12GHz. The parasitic capacitance was estimated to be less than 3 pF.     

Suppression of leakage current in InGaAsP/InP buried heterostructure lasers by InAlAs strained current-blocking layers

InGaAsP/InP buried heterostructure (BH) lasers with InAlAs strained current-blocking layers are proposed. For use as a current-blocking material with a bandgap energy larger than that of InP, InAlAs is superior to InGaP. This is because a wide bandgap can be obtained in the InAlAs without large bandgap shrinkage caused by tensile strain. A two-dimensional simulation shows that the leakage current in BH lasers with thin pnpn blocking layers is suppressed up to 85 degrees C by employing 100 AA In/sub 1-x/Al/sub x/As(x>or=0.54) layers.<>     

GaInAsP/InP lasers with monolithically integrated monitoring photodiodes fabricated by inclined reactive ion etching

Monolithic fabrication of a GaInAsP/InP laser (LD) with a monitoring photodiode (PD) is described. LDs and PDs have etched facets fabricated by inclined reactive ion etching (RIE). The etched LD facing facet PD is perpendicular to the junction plane and the etched PD facet facing LD is inclined by 55 degrees to the plane by the 'windward-leeward effect' of the inclined RIE. Therefore, coupling efficiencies between LDs and PDs are uniform because the multireflection effect of double mirrors does not exist for the LD-PD devices with inclined PD facets. Typical CW threshold current ranges from 20 to 30 mA and light output power from a single facet exceeds 15 mW at 25 degrees C. A PD can detect about 2% of the light beam emitted from an LD facing it.<>     

Fabrication of InGaAsP/InP buried heterostructure laser usingreactive ion etching and metalorganic chemical vapor deposition

1.3-μm InGaAsP/InP buried heterostructure lasers were fabricated using Ch₄/H₂ reactive ion etching (RIE) for mesa definition and metalorganic chemical vapor deposition for blocking laser growth. Results show that high-quality lasers can be made using RIE, with threshold current as low as 10 mA. It was also found that a slight chemical etching of the RIE mesas was necessary to obtain lasers with as high quality as those fabricated entirely by wet etching     

Single mode operation of buried heterostructure lasers by loss stabilization

A loss-stabilized buried heterostructure (LSBH) laser is reported that is much simpler to grow than conventional BH lasers, but has similar, near ideal, laser characteristics. Typical lasers, which incorporate an optical guide have active stripe widthsapprox 2.5 mum determined by the initial mesa etching, have a laser threshold of 25 mA, and exhibit stable single transverse mode operations up to 60 mA and higher currents. The simplicity in growth results from not attempting to grow a single mode guide by carefully choosing the composition of the regrown burying layers, but instead simply forming a multiple mode guide by growing a cladding layer with a high aluminum composition. The large index discontinuity between the layer and the central mesa and the roughness of the etched mesa walls cause losses when interface scattering couples light from the initial mode into other modes. The losses rapidly increase with the mode number and, we believe, provide the selection mechanism which causes the laser to operate in the lowest mode. Calculations show that the observed variations in mesa width of 0.3 μm over distances of 10μm are adequate to explain the observed lowest mode stability.     

InGaAsP/InP double heterostructure lasers grown by atmospheric-pressure MOCVD

Room-temperature operation of InGaAsP-InP double-heterostructure lasers grown by atmospheric pressure metalorganic chemical vapour deposition is reported. Optically pumped laser operation at 1.36 ?m and 1.45 ?m has been achieved and broad-area injection lasers operating at 1.37 ?m with threshold current densities as low as 3.6 kA/cm2 have been demonstrated.     

OEICs for WDM transceiver modules fabricated by reactive ion etching on semi-insulating substrates

The design and fabrication of OEICs on semi-insulating InP substrates comprising 1300 nm DFB lasers, 1300/1530 nm wavelength duplexers and monitor photodiodes is described. OEIC lasing thresholds were as low as 20 mA. The through-state crosstalk for the integrated duplexer was typically -12 dB. Linear tracking of the laser output by the monitor photodiode was achieved with sensitivities in the region of 70 mu A/mW. The OEICs operated successfully in a 622 Mbit/s bidirectional optical link.<>     

Direct modulation of InGaAsP/InP double heterostructure lasers

Direct modulation of an InGaAsP/InP double heterostructure laser was investigated experimentally. Sinusoidal modulation up to 2.5 GHz was achieved with almost constant modulation efficiency. Pulse responses showed that the damped relaxation oscillation in light output was well suppressed.