Controlled gold doping of silicon by using ion implantation

A new technology is suggested to dope silicon devices with gold for carrier life time adjustment with high accuracy and reproducibility. Ion implantation is used to dope the sample with a well defined total amount of gold. This gold dose is redistributed by high temperature anneal. A computer simulation of gold diffusion and experimental radio tracer results show that highly accurate gold doping can be obtained in bulk material when temperatures around 1000 C are applied during the redistribution anneal. Damage free surfaces must be used to reduce the gold content gettered in surfaces.     

Effect of hydrogen introduced by channelling implantation on the microstructures in silicon wafers

High-resolution transmission electron microscopy has been employed to study the platelet defects before annealing and the extended defects generated by annealing in the channelling-implanted silicon wafers. It has been found that there apparently appear platelet defects of quite great size and spacing at the maximum projected range of ions (R _max). Additionally, the cracks induced by annealing at 550 °C are generated around R _max instead of the average projected range of ions (R _p) as it is in the non-channelling-implanted samples. Moreover, after annealing at 1000 °C, cracks without branches and cavities arranging in a single array, different from the forked cracks and cavities arranged in several arrays in the non-channelling-implanted samples, are observed in the channelling-implanted silicon wafers. It is suggested that those special microstructure characteristics are ascribed to the channelling effect of implanted hydrogen ions.     

XPS study of silicon surface after ultra-low-energy ion implantation

Ultra-low-energy ion implantation of silicon with a hydrogen-terminated (0 0 1) surface was carried out using a mass-separated ³¹P⁺ ion beam. The ion energy was 30 eV, the displacement energy of silicon, and the ion doses were 6 × 10¹³ ions/cm². Annealing after the implantation was not carried out. The effects of ion implantation on the surface electrical state of silicon were investigated using X-ray photoelectron spectroscopy (XPS). The Si 2p peak position using XPS depends on the doping conditions because the Fermi level of the hydrogen-terminated silicon surface is unpinned. The Si 2p peak position of the specimen after ion implantation at a vacuum pressure of 3 × 10⁻⁷ Pa was shifted to the higher energy region. It suggested the possibility of phosphorus doping in silicon without annealing. In the case of ion implantation at 5 × 10⁻⁵ Pa, the Si 2p peak position was not shifted, and the peak was broadened because of the damage by the fast neutrals. Ultra-low-energy ion doping can be achieved at ultra-high-vacuum conditions.     

Enhancement of saturation magnetization in Cr-ion implanted silicon by high temperature annealing

Magnetic properties and microstructure of Cr-implanted Si have been investigated by alternating gradient magnetometer (AGM), superconducting quantum interference device (SQUID) magnetometer, and transmission electron microscopy (TEM). p-Type (1 0 0) Si wafers were implanted at 200 keV at room temperature with a dosage of 1 × 10¹⁶ cm⁻² Cr ions and then annealed at 600-900 °C for 5 min. The effect of annealing on the structure and magnetic properties of Cr-implanted Si is studied. The as-implanted sample shows a square M-H loop at low temperature. Magnetic signal becomes weaker after short time annealing of the as-implanted sample at 600 °C, 700 °C, and 800 °C. However, the 900 °C annealed sample exhibits large saturation magnetization at room temperature. TEM images reveal that the implanting process caused amorphization of Si, while annealing at 900 °C led to partial recovery of the crystal. The enhancement of saturation magnetization can be explained by the redistribution and accumulation of Cr atoms in the vacancy-rich region of Si during annealing.     

Double optical waveguide in Cu-doped KNSBN crystal formed by MeV boron ion implantation

We reported for what is to be believed the first time a double optical waveguide in a Cu-doped potassium sodium strontium barium niobate (KNSBN) crystal formed by double boron ion implantation. The energy and dose of B⁺ and B³⁺ ions were (3+6) MeV and (2+2)×10¹⁴ ions/cm², respectively. The refractive index profile of the waveguide showed a double-barrier confined shape, which suggested the formation of a two-layer waveguide structure. The two waveguide layers were with thickness of 2.6 and 2 μm, respectively, which was in a good agreement with the parameters obtained from transport and range of ions in matter 98 (TRIM) code simulation. The nuclear energy loss distribution of the MeV B ions implanted into this crystal had a similar shape to that of the waveguide index profile, which means an inherent relationship between the waveguide formation and the energetic energy deposition.     

Excess Si concentration dependence of the photoluminescence of Si nanoclusters in SiO2 fabricated by ion implantation

A method for the fabrication of luminescent Si nanoclusters in an amorphous SiO₂ matrix by ion implantation and annealing, and the detailed mechanisms for the photoluminescence are reported. We have measured the implanted ion dose, annealing time and excitation energy dependence of the photoluminescence from implanted layers. The samples were fabricated by Si ion implantation into SiO₂ and subsequent high-temperature annealing. After annealing, a photoluminescence band below 1.7 eV has been observed. The peak energy of the photoluminescence is found to be independent of annealing time and excitation energy, while the intensity of the luminescence increases as the annealing time and excitation energy increase. Moreover, we found that the peak energy of the luminescence is strongly affected by the dose of implanted Si ions especially in the high dose range. These results indicate that the photons are absorbed by Si nanoclusters, for which the band-gap energy is modified by the quantum confinement effects, and the emission is not simply due to direct electron–hole recombination inside Si nanoclusters, but is related to defects probably at the interface between Si nanoclusters and SiO₂, for which the energy state is affected by Si cluster–cluster interactions. It seems that Si nanoclusters react via a thin oxide interface and the local concentrations of Si nanoclusters play an important role in the peak energy of the photoluminescence.     

Light emitting diode structure based on Si nanocrystals formed by implantation into thermal oxide

Light emitting diodes (LED), continuously operable at room temperature, have been fabricated by Si⁺ ion implantation into SiO₂ and subsequent annealing in order to form Si nanocrystals. A highly doped poly-Si layer was used to enhance injection into nanocrystals. Visible electroluminescence (EL) was observed from the LEDs with oxide thickness 180 Å for bias voltages above 8 V. The EL decay transient was similar to stretched-exponential decays observed for photoluminescence (PL) from Si nanocrystals.     

Comparison between MeV Ni and He ion-implanted planar optical waveguides in quartz

Optically polished crystalline quartz samples were implanted at room temperature by 2.6 MeV Ni⁺ ions with a dose of 9×10¹⁴ ions/cm² and 2.0 MeV He⁺ ions with a dose of 1.5×10¹⁶ ions/cm², respectively. A comparison of the MeV Ni⁺ ion-implanted planar waveguide formation was made with the MeV He⁺ ion-implanted one. The prism-coupling method was carried out to measure the dark modes in the quartz waveguides by using model 2010 prism coupler. Five modes were observed in the Ni⁺ implanted waveguide while 15 modes were found in the He⁺ ion-implanted one. Reflectivity calculation method was applied to fitting the refractive index profile. TRIM’98 (transport of ions in matter) code was used to simulate the damage profile in quartz by MeV Ni⁺ and He⁺ ions implantation, respectively. It is found that the refractive index profile in MeV Ni⁺ ions implanted waveguide is somewhat different in shape from that in MeV He⁺ ions implanted waveguide.     

Effect of oxygen implantation on ionoluminescence of porous silicon

We report on ionoluminescence investigations of porous Si prepared from the p⁺-type Si, which exhibited, after prolonged ambient air exposure, moderate photon emission with a maximum in the red–orange region. In an attempt to activate a shorter wavelength emission, the samples were implanted with 225 keV O⁺ ions at the dose of 1×10¹⁷ cm⁻². The strong blue band at 2.7 eV, well known in silica, has emerged in the ionoluminescence spectra following the oxygen implantation. The results of the comparative ionoluminescence experiments, performed on both porous Si and two forms of silica, show the important role of SiO₂ defect-related states in ion-induced optical emission from porous Si.     

X-ray reflectivity study of hydrogen implanted silicon

The X-ray reflectivity (XRR) technique was used to study monocrystalline silicon samples implanted with H₂ ions at an energy of 31 keV and to the dose of 2 × 10¹⁶ hydrogen atoms/cm². All samples were subsequently isochronally annealed in vacuum at different temperatures in the range from 100 to 900 °C. Although the hydrogen depth distribution was expected to be smooth initially, fringes in the XRR spectra were observed already in the implanted but not annealed sample, revealing the presence of a well-defined film-like structure. Annealing enhances the film top to bottom interface correlation due to structural relaxation, resulting in the appearance of fringes in the larger angular range, already at low annealing temperatures. The thickness of the film decreases slowly up to 350 °C where substantial changes in the roughness are observed, probably due to the onset of larger clusters formation. Further annealing at higher temperatures restores the high correlation of the film interfaces, while the thickness decreases with the temperature more rapidly.     

A technique for positron spectroscopy of monovacancies formed by low-temperature ion implantation of silicon

A system for positron beam-based Doppler broadening spectroscopy of the formation and evolution of monovacancy defects in silicon is described. The apparatus allows in situ ion implantation at low temperatures (∼50 K) followed by positron beam assay. First measurements for 6 keV He implantation, at post-implant temperatures between 60 and 300 K are presented. Benefits and drawbacks of this system are discussed.     

Structural and photoluminescence properties of Si nanoclusters obtained by ion implantation into Si3N4 films

In the present paper we report structural and photoluminescence (PL) results from samples obtained by Si implantation into stoichiometric silicon nitride (Si₃N₄) films. The Si excess was introduced in the matrix by 170 keV Si implantation performed at different temperatures with a fluence of Φ=1×10¹⁷ Si/cm². The annealing temperature was varied between 350 and 900 °C in order to form the Si precipitates. PL measurements, with a 488 nm Ar laser as an excitation source, show two superimposed broad PL bands centered around 760 and 900 nm. The maximum PL yield is achieved for the samples annealed at 475 °C. Transmission electron microscopy (TEM) measurements show the formation of amorphous nanoclusters and their evolution with the annealing temperature.     

Wetting modifications of uhmwpe surfaces induced by ion implantation

Ultra-high-molecular-weight-polyethylene (UHMWPE) surfaces are characterized in terms of roughness and wetting. Changes in the surface morphology of the polymer were induced macroscopically by mechanical friction and microscopically by ion implantation. The ion irradiation was obtained by using 300?keV Xe⁺ beams with doses ranging between 10¹⁴ and 10¹⁵?ions/cm².

Roughness and wetting measurements were performed in order to investigate the UHMWPE surface properties before and after the surface treatments. The wetting angle of the polymeric surface increases with the decrease of the roughness and with the increase of the absorbed dose. Results are discussed from the point of view of the biological reactions that could degrade the UHMWPE biocompatible surfaces employed in different mobile prostheses.     

A comparative study of donor formation in dysprosium, holmium, and erbium implanted silicon

Formation of donor centers in Czochralski grown silicon doped with dysprosium, holmium, and erbium is discussed. Donor states of three kinds are introduced in the implanted layers after annealing at T=700°C. Shallow donor states with ionization energies between 20 and 40 meV are attributed to oxygen -related thermal donors. Other donor centers in the energy range of E_C−(60…70) meV and E_C−(100…120) meV appear to be dependent on dopants. After a 900°C anneal strong changes in the donor formation are observed only in silicon doped with erbium. Instead of donors at E_C−(118±5) meV, new donor centres at E_C−(145±5) meV are formed. Reportedly, the latter ones are involved in the excitation process of the Er³⁺ ions with a characteristic luminescence line at ≈1.54 μm.     

Modification of silicon waveguide structures using ion implantation induced defects

The structure of re-crystallized silicon films is investigated using transmission electron microscopy, spectroscopic ellipsometry and positron annihilation spectroscopy. Samples were prepared via amorphization of the silicon overlayer of silicon-on-insulator substrates, and subsequent thermal annealing. For an annealing temperature of 650 °C we show that the silicon film has a poly-crystalline structure. Its refractive index measured at 1550 nm is comparable to that of crystalline silicon following re-crystallization at 750 °C. Positron measurements indicate a high concentration of open-volume point defects in the re-crystallized films. We discuss the potential importance of these structures with regard to defect engineering for silicon photonic devices.     

Modifications induced in the polycarbonate Makrofol KG polymer by Li (50 MeV) ion irradiation

Swift heavy ions interact predominantly through inelastic scattering while traversing any polymer medium and produce excited/ionized atoms. Here samples of the polycarbonate Makrofol of approximate thickness 20 μm, spin coated on GaAs substrate were irradiated with 50 MeV Li ion (+3 charge state). Build-in modifications due to irradiation were studied using FTIR and XRD characterizations. Considerable changes have been observed in the polymer while varying the fluence from 1E11 ion/cm² to 1E13 ion/cm² Li ions. AFM images of the surface modifications caused by ion irradiation on the polymer are also presented.      

Ion implantation induced by Cu ablation at high laser fluence

High energy laser plasma-produced Cu ions have been implanted in silicon substrates placed at different distances and angles with respect to the normal to the surface of the ablated target. The implanted samples have been produced using the iodine high power Prague Asterix Laser System (PALS) using 438 nm wavelength irradiating in vacuum a Cu target. The high laser pulse energy (up to 230 J) and the short pulse duration (400 ps) produced a non-equilibrium plasma expanding mainly along the normal to the Cu target surface. Time-of-flight (TOF) technique was employed, through an electrostatic ion energy analyzer (IEA) placed along the target normal, in order to measure the ion energy, the ion charge state, the energy distribution and the charge state distribution. Ions had a Boltzmann energy distributions with an energy increasing with the charge state. At a laser fluence of the order of 6 × 10⁶ J/cm², the maximum ion energy was about 600 keV and the maximum charge state was about 27+.In order to investigate the implantation processes, Cu depth profiles have been performed with Rutherford backscattering spectrometry (RBS) of 1.5 MeV helium ions, Auger electron spectroscopy (AES) with 3 keV electron beam and 1 keV Ar sputtering ions in combination with scanning electron microscopy (SEM). Surface analysis results indicate that Cu ions are implanted within the first surface layers and that the ion penetration ranges are in agreement with the ion energy measured with IEA analysis.     

Initial stage of nitridation on Si(1 0 0) surface using low-energy nitrogen ion implantation

The initial stage of the thermal nitridation on Si (1 0 0)-2 × 1 surface with the low-energy nitrogen ion (200 eV) implantation was studied by photoemission spectroscopy (PES). The formation of nitride was shown the different characteristics depending on the annealing temperature. The disordered surface at room temperature was changed to 2 × 1 periodicity with the low-energy electron diffraction (LEED) as increasing the nitridation temperature. By decomposition of Si 2p spectrum, we can identify the three subnitrides (Si¹⁺, Si²⁺, and Si³⁺). By changing the take-off angle of the Si 2p, we can increase surface sensitivity and estimate that Si¹⁺, Si²⁺ and Si³⁺ are the interface states.     

Measurements of hall-effect and sheet resistivity as a function of temperature on hot,phosphorous implants in silicon

Abstract

Results of Hall-effect measurements as a function of temperature on a layer formed by hot, phosphorous (P³¹) implant in Si at 400 keV energy in a random direction are presented; the dose used was 10¹⁵ ions cm^?2. The electrical behaviour of the layer as a function of isochronal annealing was examined.

A detailed analysis of the measured quantities n _8eff, the effective surface density of free carriers, and μ_eff, the effective mobility, down to 4.2°K is presented using the integral equations:

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These formulae were solved numerically, the input data viz: the distribution of donor centres and compensating damage centres being assumed from the current literature.

Results from this analysis indicate a rather complicated distribution of current flow in the layer as a function of temperature, indicating that the traditional interpretation of Hall measurements based on a homogeneous distribution model is of questionable validity.     

Influence of nitrogen ion implantation fluences on surface structure and tribological properties of SiC ceramics in water-lubrication

Nitrogen ions were implanted into SiC ceramics by using ion implantation technology (N⁺-SiC). The surface structure and chemical bonds of N⁺-SiC ceramics were determined by X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS), and their nanohardness was measured by nanoindenter. The friction and wear properties of the N⁺-SiC/SiC tribo-pairs were investigated and compared with those of SiC/SiC tribo-pairs in water using ball-on-disk tribo-meters. The wear tracks on the N⁺-SiC ceramics were observed by non-contact surface profilometer and scanning electron microscope (SEM) and their wear volumes were determined by non-contact surface profilometer. The results show that the N⁺-SiC ceramics were mainly composed of SiC and SiCN phase and SiN, CC, CN and CN bonds were formed in the implantation layer. The highest hardness of 22.3 GPa was obtained as the N⁺-SiC ceramics implanted at 50 keV and 1 × 10¹⁷ ions/cm². With an increase in nitrogen ion fluence, the running-in period of N⁺-SiC/SiC tribo-pairs decreased, and the mean stable friction coefficient decreased from 0.049 to 0.024. The N⁺-SiC ceramics implanted at 50 keV and 5 × 10¹⁷ ions/cm² exhibited the excellent tribological properties in water. In comparison of SiC/SiC ceramic tribo-pairs, the lower friction coefficient and lower wear rate for the N⁺-SiC/SiC tribo-pairs were acquired.