Removal mechanisms of micro-scale particles by surface wave in laser cleaning

This paper is to investigate the mechanisms of micro-scale particle removal by surface wave, which was induced by a short pulse laser in a cleaning process. The authors analyzed the adhesive forces of particles on substrate surface and the clearance force produced by surface wave in laser cleaning. The physical model of particle removal by laser-induced surface wave was established to predict the removal area and the processing conditions of laser cleaning. In this research, a KrF excimer laser was applied to irradiate 304 stainless steel specimen distributed with copper particles to generate surface wave for copper particle removal. Considering that a time-varying and uniformly distributed heat source irradiates on material surface with thermao-elastic behavior, the displacement and acceleration of substrate induced by a pulsed laser were solved by an uncoupled thermal–mechanical analysis based on the finite element method. The processing parameters such as laser energy, laser spot size are discussed, respectively. A series of laser cleaning experiments were designed to compare with computation results. The results show that the removal area by surface wave beyond the laser spot increases with the laser energy and that, the surface acceleration decreases with the increase of the laser spot size.     

Enhanced laser cleaning via direct line beam irradiation

A fluence advantage was achieved in dry/damp laser cleaning by reduction of the laser beam dimensions. 0.1 m Al₂O₃ particles were removed from glass slides using a KrF excimer laser (248 nm). As the width of the rectangular beam was reduced, a decrease in the threshold fluence required for particle removal was observed. Modelling based on the simplified thermal–mechanical response of the substrate and particle to the laser pulse does not describe the experimental results presented here. The case of dynamic expansion must be further considered, but it is believed that other mechanisms are involved in a full explanation. PACS 42.62.Cf     

Removal of submicron particles from nickel-phosphorus surfaces by pulsed laser irradiation

Pulsed laser cleaning was demonstrated to be an efficient way for removing submicron particles from the nickel-phosphorus (NiP) surface both experimentally and theoretically. Experimentally, it is found that using KrF excimer laser with a pulse width of 23 ns the cleaning threshold is about 20 mJ / cm² for removing quartz particles from the NiP surface and laser cleaning efficiency increases rapidly with increasing laser fluence. The theoretical analysis shows that the peak cleaning force (per unit area) is larger than the adhesion force (per unit area) for submicron quartz particles on the NiP surface when it is irradiated by excimer laser with a fluence above 10 mJ / cm². Therefore, it is possible to remove submicron quartz particles from NiP surfaces by laser irradiation. The difference between the cleaning force (per unit area) and the adhesion force (per unit area) increases with increasing laser fluence, leading to a higher cleaning efficency for quartz particles on the NiP surface.     

Time-of-flight measurements of ejected particles during dry laser cleaning

We propose an experimental approach which allows the characterization of the dynamics of the ejected particles in dry laser cleaning. Submicron silica particles on silicon substrates were illuminated by single nanosecond laser pulses at fluences which lead to particle removal. Time- and space-resolved scattered signal detection was demonstrated as a suitable technique to perform time-of-flight analyses of the ejected particles. The determination of the resulting detachment velocity at the particle removal threshold fluence contributes to a better understanding of mechanisms involved in dry laser cleaning. In particular, the present study evidences that the removal efficiency of the laser process is not based on the thermal expansion of materials. PACS 42.62.b; 42.15.Eq     

Ultraviolet laser removal of small metallic particles from silicon wafers

Laser removal of small 1 μm sized copper, gold and tungsten particles from silicon wafer surfaces was carried out using ultraviolet radiation at 266 nm generated by Nd:YAG harmonic generation. Successful removal of both copper and gold particles from the surface was achieved whereas tungsten particles proved to be difficult to remove. The cleaning efficiency was increased with an increase of laser fluence. The optimum processing window for safe cleaning of the surface without any substrate damage was determined by measuring the damage threshold laser fluence on the silicon substrate and the required fluence for complete removal of the particles. The different cleaning efficiencies with particle type are discussed by considering the adhesion force of the particle on the surface and the laser-induced cleaning force for the three different particles.     

Matrix laser cleaning: a new technique for the removal of nanometer sized particles from semiconductors

In this paper a new laser-based technique for the removal of nanoparticles from silicon wafers, called matrix laser cleaning, is introduced. In contrast to the already existing technique dry laser cleaning damages of the substrate can be avoided. Furthermore no liquids are used, avoiding problems that occur, e.g. in steam laser cleaning and other wet cleaning techniques. We show that damage free particle removal of polystyrene particles with diameters of at least down to 50 nm is possible with a cleaning efficiency very close to 100% within a single shot experiment. Furthermore the cleaning threshold is independent of the particle size. PACS 64.70.Hz; 68.43.Vx; 81.65.Cf     

激光等离子体去除微纳颗粒的热力学研究

微杂质污染一直是影响精密器件制造质量和使用寿命的关键因素之一.对于微纳米杂质颗粒用传统的清洗方式(超声清洗等)难以去除,而激光等离子体冲击波具有高压特性,可以实现纳米量级杂质颗粒的去除,具有很大的应用潜力.本文主要研究了激光等离子体去除微纳米颗粒过程中的热力学效应:实验研究了激光等离子体在不同脉冲数下对Si基底上Al颗粒去除后的颗粒形貌变化,发现大颗粒会发生破碎而转变成小颗粒,一些颗粒达到熔点后发生相变形成光滑球体,这源于等离子体的热力学效应共同作用的结果.为了研究微粒物态转化过程,基于冲击波传播理论研究,得到冲击波压强与温度特性的演化规律;同时,利用有限元模拟方式研究激光等离子冲击波压强和温度对微粒作用规律,得到了颗粒内随时间变化的应力分布和温度分布,并在此基础上得到等离子体对颗粒的热力学作用机制.     

Acoustic substrate expansion in modelling dry laser cleaning of low absorbing substrates

Acoustic expressions have been derived for the thermal expansion of substrate surfaces due to irradiation by an exponential laser pulse. The result of acoustic effects on three substrates (silicon, glass and silica) with different absorptions has been calculated.It has been shown that for substrates having relatively low absorptions, like silica and glass, acoustic considerations substantially reduce thermal expansion of the substrate caused by irradiation by nanosecond laser pulses relative to a quasi-static expansion model. In particular, the expansion of the substrate occurs over a much longer time frame than when the quasi-static approximation holds. Consequently, acceleration of the substrate surface is greatly reduced and laser cleaning threshold fluences for particle removal are increased.The predictions of the model of Arnold et al. when developed for acoustic considerations give reasonable agreement with experimentally found threshold fluences for alumina particles on silica and glass substrates although it underestimates the ratio of the threshold cleaning fluences of silica and glass. This could be due to the model underestimating the contribution of surface expansion to the laser cleaning process. The influence of multiple reflections in the substrate and departure from one dimensionality in the heat conduction on the threshold fluence was found to be insignificant. Thermal contact between the particle and the substrate was also found to have little effect on laser cleaning threshold fluences. Another mechanism that may enhance surface expansion is the 3D focussing of radiation by the particles. PACS 42.62.Cf; 81.65.Cf; 42.55.Lt     

KrF excimer laser dry and steam cleaning of silicon surfaces with metallic particulate contaminants

KrF excimer laser-assisted dry and steam cleaning of single-crystal silicon wafers contaminated with three different types of metallic particles was studied. The laser fluence used was 0.3 J/cm². In the dry process, for samples cleaned with 100 laser pulses the cleaning efficiency was 91, 71 and 59% for Au, Cu and W particles, respectively, whilst in steam cleaning the efficiency is about 100% after 5 laser pulses, independently of the type of contaminant. The effects of laser irradiation on the Si surface are investigated by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). Laser processing at 0.3 J/cm² does not deteriorate the Si-wafer surface, either in dry or steam cleaning. However, the measured XPS intensity coming from the metallic component is greater on the cleaned surfaces than in the initial condition. Quantification of the XPS results, assuming a stratified overlayer model for the detected species and accounting for the presence of the metallic particles on the surface, showed that the obtained results can be explained by the formation of a fractional metallic monolayer on the cleaned surfaces, due to partial vaporisation of small particles initially present on the sample surface. This contamination of the substrate could be considered excessive for some applications and it shows that the process requires careful optimisation for the required efficiency to be achieved without degradation of the substrate. Received: 14 January 2001 / Accepted: 19 February 2001 / Published online: 20 June 2001     

Laser plasma shockwave cleaning of SiO2 particles on gold film

A Nd:YAG laser (1064 nm) induces optical breakdown of the airborne above the gold-coated K9 glass surface and the created shockwave removes the SiO₂ particles contaminated on the gold films. The laser cleaning efficiency has been characterized by optical microscopy, dark field imaging, ultraviolet-visible-near infrared spectroscopy, Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy and the Image-pro software. The relationships between removal ratio and particle position and laser gap distance have been studied in the case of single pulse laser cleaning. The results show that the 1064 nm laser induced plasma shockwave can effectively remove the SiO₂ particles. The removal ratio can reach above 90%. The effects of particle position and laser gap distance on the cleaning efficiency are simulated for the single pulse laser cleaning. The simulated results are consistent with the experimental ones.     

Influence of laser fluence and irradiation timing of F2 laser on ablation properties of fused silica in F2-KrF excimer laser multi-wavelength excitation process

A collinear irradiation system of F₂ and KrF excimer lasers for high-quality and high-efficiency ablation of hard materials by the F₂ and KrF excimer lasers’ multi-wavelength excitation process has been developed. This system achieves well-defined micropatterning of fused silica with little thermal influence and little debris deposition. In addition, the dependence of ablation rate on various conditions such as laser fluence, irradiation timing of each laser beam, and pulse number is examined to investigate the role of the F₂ laser in this process. The multi-wavelength excitation effect is strongly affected by the irradiation timing, and an extremely high ablation rate of over 30 nm/pulse is obtained between -10 ns and 10 ns of the delay time of F₂ laser irradiation. The KrF excimer laser ablation threshold decreases and its effective absorption coefficient increases with increasing F₂ laser fluence. Moreover, the ablation rate shows a linear increase with the logarithm of KrF excimer laser fluence when the F₂ laser is simultaneously irradiated, while single KrF excimer laser ablation shows a nonlinear increase. The ablation mechanism is discussed based on these results. Received: 16 July 2001 / Accepted: 27 July 2001 / Published online: 2 October 2001     

Conditions for laser-induced plasma to effectively remove nano-particles on silicon surfaces

Particles can be removed from a silicon surface by means of irradiation and a laser plasma shock wave.The particles and silicon are heated by the irradiation and they will expand differently due to their different expansion coefficients,making the particles easier to be removed.Laser plasma can ionize and even vaporize particles more significantly than an incident laser and,therefore,it can remove the particles more efficiently.The laser plasma shock wave plays a dominant role in removing particles,which is attributed to its strong burst force.The pressure of the laser plasma shock wave is determined by the laser pulse energy and the gap between the focus of laser and substrate surface.In order to obtain the working conditions for particle removal,the removal mechanism,as well as the temporal and spatial characteristics of velocity,propagation distance and pressure of shock wave have been researched.On the basis of our results,the conditions for nano-particle removal are achieved.     

Limit analysis for laser removal of micron contaminant colloidal silicon dioxide particles from the super-smooth optical glass substrate by pulse Nd:YAG laser

Multimode Nd:YAG pulse laser was applied to remove micron and submicron particles by vaporizing a thin paint film pre-coated on super-smooth optical substrate surface. By analyzing the poor absorption of the optical glass substrate to the irradiative Nd:YAG pulse laser, the removal mechanism of contaminated colloidal particles from the super-smooth surface through vaporization of a volatile solid film is described. A limit analysis was proposed to determine the lower and the upper threshold of laser fluence for cleaning the SiO₂ contaminants from super-smooth K8 optical substrate. Relevant experiments on laser cleaning of micron-polishing particles from super-smooth K8 optical substrate confirmed the usefulness of this method in assisting the selection of effective cleaning fluence for accomplishing high cleanliness, which was in a range of 80–90% of the predicted upper threshold.     

In situ monitoring of laser cleaning by coupling a pulsed laser beam with a scanning electron microscope

Lasers have proved to be effective tools for material processing at the micron and nanometer scales. In particular, laser interaction with nanostructures offers the unique advantage of highly localized excitation and heating. In this study, a short-pulsed laser beam is coupled to a scanning electron microscope, without disturbing the microscopy function, in order to study in situ laser cleaning of individual submicron particles from a silicon substrate. The substrate conditions before and after particle removal were inspected by electron microscopy. The mechanisms of particle removal and the underlying dynamic coupling of the laser radiation associated with particle cleaning are investigated. PACS 42.62.Cf; 42.82.Gw; 81.65.Cf; 07.78.+s     

XeCl准分子激光能量提取研究

在高功率准分子激光系统建设中,希望能获得较短的脉冲宽度和尽量多的激光能量。实验研究了不同注入水平下,脉冲时间间隔对脉冲链放大波形和放大器提取效率的影响;基于四能级速率方程和准分子反应动力学建立了准分子激光放大模型,计算了多种注入方式下种子光的放大过程,对关键参数给出了量化描述,得到与实验相符的计算结果。研究结果显示:脉冲序列间隔为9.3ns时,可获得约95%的连续注入情形下放大能量;对该准分子激光系统来讲,9.3ns是比较合适的脉冲间隔。     

准分子激光等离子体开关控制脉宽研究

 利用准分子激光等离子体技术，在紫外预电离XeCl准分子激光器上获得了最短1.58 ns的短脉冲激光输出。实验中分析了聚焦到薄膜表面的光束能量密度对所产生的等离子体密度的影响，并对不同等离子体密度及维持时间情况下脉冲压缩效果进行了讨论，给出了激光器谐振腔在稳定腔及非稳腔两种工作方式下的实验结果。激光器在稳定腔工作时，脉宽可压缩至2.87 ns；采用非稳腔结构时，在脉冲能量不变情况下减小聚焦光斑面积，提高入射到薄膜表面的能量密度，得到了最短1.58 ns的短脉冲激光输出。该技术适用于任何其它准分子器件。     

Photochemical welding of silica microspheres to silicone rubber by ArF excimer laser

Transparent fused silica (SiO₂) microspheres 2.5 μm in diameter were photochemically welded to transparent, flexible silicone rubber ([SiO(CH₃)₂]_n) substrate by 193 nm ArF excimer laser induced photochemical modification of silicone into silicon oxide. Single layer of silica microspheres was easily formed on an adhesive silicone rubber before laser irradiation after dropping of silica microspheres dispersed in ethanol and subsequent tape peeling. The welding rate, the percentage of welded microspheres tested by ultrasonic cleaning with ethanol, was examined by varying the single pulse fluence and irradiation time of ArF excimer laser. The welding layer underneath microsphere, silicon oxide, was also found to emit white light of strong intensity under UV light illumination.     

Removal of graffiti from the mortar by using Q-switched Nd:YAG laser

This paper presents part of the larger study on microstructural features of mortars and it's effects on laser cleaning process. It focuses on the influence of surface roughness, porosity and moisture content of mortars on the removal of graffiti by Nd:YAG laser. The properties of this laser are as follows: wavelength (λ) 1.06 μm, energy: 500 mJ per pulse, pulse duration: 10 ns. The investigation shows that the variation of laser fluence with the number of pulses required for the laser cleaning can be divided into two zones, namely effective zone and ineffective zone. There is a linear relationship observed between number of pulses required for laser cleaning and the laser fluence in the effective zone, while the number of pulses required for the laser cleaning is almost constant even though the laser fluence increases in the ineffective zone. Moreover, surface roughness, porosity and moisture content of mortar samples have influence on the laser cleaning process. The effect of these parameters become however negligible at the high level of laser fluence. The number of pulses required for the laser cleaning is low for smooth surface or less porous mortar. Furthermore, the wetness of the samples facilitates the cleaning process.     

Ion synthesis and laser annealing of Cu nanoparticles in Al2O3

Al₂O₃ samples with Cu nanoparticles, synthesised by ion implantation at 40 keV with a dose of 1×10¹⁷ ion/cm² and a current density from 2.5 to 12.5 μA/cm², were annealed using ten pulses from a KrF excimer laser with a single pulse fluence of 0.3 J/cm². The copper depth distribution, formation and modification of metal nanoparticles under the ion implantation and laser treatment were studied by Rutherford backscattering (RBS), energy dispersive X-ray (EDX) analysis, atomic force microscopy (AFM) and optical spectroscopy. It was found that laser annealing leads to a reduction in the nanoparticle size without diffusion of metal atoms into the bulk. The change in particle size and the possibility for oxidation of the copper particles are examined in the framework of Mie theory. Calculations presented show that under excimer laser treatment, Cu nanoparticles are more likely to be reduced in size than to undergo oxidation. Received: 19 April 2001 / Accepted: 7 November 2001 / Published online: 23 January 2002     

CO2 laser cleaning of black deposits formed during the excimer laser etching of polyimide in air

Pulsed CO₂ laser cleaning of black debris formed during the excimer laser ablation of polyimide in air is demonstrated. The 10.6 m CO₂ laser radiation is strongly absorbed in the debris but only weakly absorbed in polyimide thus enabling the clean removal of the debris without damaging the polyimide.