电子束、离子辅助和离子束溅射三种工艺对光学薄膜性能的影响

 运用电子束、离子辅助和离子束溅射三种镀膜工艺分别制备光学薄膜,包括单层氧化物薄膜和增透膜,然后采取一系列测试手段,如Zygo轮廓仪、原子力显微镜、表面热透镜技术和X射线衍射等技术,来分析和研究不同的工艺对这些薄膜性能的不同影响,以判断合理的沉积工艺。     

离子束刻蚀技术研究

本文介绍了离子束刻蚀技术的原理,讨论了刻蚀速率与离子束流密度、离子能量和离子束入射角度的关系。实验结果与理论分析有较好的一致性。     

Ag-N doped ZnO film and its p-n junction fabricated by ion beam assisted deposition

Ag-N doped ZnO film was synthesized by ion beam assisted deposition and its electrical properties and annealing property were investigated. The films remained p-type even after annealing at 400 °C in air for 10 min. While the annealing temperature went up to 500 °C, the conduction type of these films shifted from p-type to n-type. The p-type ZnO film revealed low resistivity (0.0016 Ω cm), low Hall mobility (0.65 cm² V⁻¹ s⁻¹) and high carrier concentration (5.8 × 10²⁰ cm⁻³). ZnO p-n homojunction consisting of a p-type layer (Ag-N doped ZnO film) and an n-type layer (In-doped ZnO film) had been fabricated by ion beam assisted deposition. With electrical measurement, its current-voltage curve had a typical rectifying characteristic with current rectification ratio of 25 at bias ±5 V and a reverse current of 0.01 mA at −5 V. The depletion width was estimated 3.8 nm by using p-n junction equation.     

离子束刻蚀软X射线透射光栅实验研究

利用全息-离子束刻蚀方法研制出了聚酰亚胺薄膜为衬底的金软X射线透射光栅.研究了光栅制作中曝光量、显影条件和离子束刻蚀工艺等因素对光栅参数的影响,并给出了在惯性约束激光核聚变实验研究中的应用结果,     

多层介质膜光谱调制反射镜的反应离子束刻蚀误差容限

 在千焦拍瓦高功率放大系统设计中,激光脉冲的时空和光谱整形技术一直受到人们的广泛关注。利用反应离子束刻蚀等微纳超精细加工而成的多层电介质结构反射镜可在高功率条件下实现啁啾脉冲的光谱整形。在光谱整形介质结构反射镜的设计与制造中,需要根据要求的反射率来合理提出反应离子束刻蚀误差容限指标。推导出反应离子束刻蚀误差容限的解析表达式。针对神光Ⅱ千焦拍瓦高功率放大系统设计中提出的多层介质光谱调制反射镜,分析了调制结构反射镜各层加工的容许误差,确定了反应离子束刻蚀误差容限指标。研究表明：刻蚀高折射率介质的加工误差容限为35 nm;刻蚀低折射率介质的加工误差容限为62 nm。此外,还从使用需要和加工难易的角度,对刻蚀方案进行了讨论。就加工难易程度而言,优选反应离子束刻蚀方案,且采用刻蚀并残留低折射率介质的方案更容易实现。     

Characterization of hydrogenated amorphous carbon thin films by end-Hall ion beam deposition

Pure hydrogenated amorphous carbon (α-C:H) and nitrogen doped hydrogenated amorphous carbon (α-C:H:N) thin films were prepared using end-Hall (EH) ion beam deposition with a beam energy ranging from 24 eV to 48 eV. The composition, microstructure and mechanical properties of the films were characterized by Fourier transform infrared spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS), Raman spectroscopy, scanning probe microscopy (SPM), and nano-scratch tests. The films are uniform and smooth with root mean square roughness values of 0.5-0.8 nm for α-C:H and 0.35 nm for α-C:H:N films. When the ion energy was increased from 24 eV to 48 eV, the fraction of sp³ bonding in the α-C:H films increased from 36% to 55%, the hardness increased from 8 GPa to 12.5 GPa, and the Young's modulus increased from 100 GPa to 130 GPa. In the α-C:H:N films, N/C atomic ratio, the hardness and Young's modulus of the α-C:H:N films are, 0.087, 15 and 145 GPa, respectively. The results indicate that both higher ion energy and a small amount of N doping improve the mechanical properties of the films. The results have demonstrated that smooth and uniform α-C:H and α-C:H:N films with large area and reasonably high hardness and Young's modulus can be synthesized by EH ion source.     

Native oxidation of ultra high purity Cu bulk and thin films

The effect of microstructure and purity on the native oxidation of Cu was studied by using angle-resolved X-ray photoelectron spectroscopy (AR-XPS) and spectroscopic ellipsometry (SE). A high quality copper film prepared by ion beam deposition under a substrate bias voltage of −50 V (IBD Cu film at V_s = −50 V) showed an oxidation resistance as high as an ultra high purity copper (UHP Cu) bulk, whereas a Cu film deposited without substrate bias voltage (IBD Cu film at V_s = 0 V) showed lower oxidation resistance. The growth of Cu₂O layer on the UHP Cu bulk and both types of the films obeyed in principle a logarithmic rate law. However, the growth of oxide layer on the IBD Cu films at V_s = 0 and −50 V deviated upward from the logarithmic rate law after the exposure time of 320 and 800 h, respectively. The deviation from the logarithmic law is due to the formation of CuO on the Cu₂O layer after a critical time.     

Molecular dynamics and experimental studies on deposition mechanisms of ion beam sputtering

Molecular dynamics (MD) simulation and experimental methods are used to study the deposition mechanism of ionic beam sputtering (IBS), including the effects of incident energy, incident angle and deposition temperature on the growth process of nickel nanofilms. According to the simulation, the results showed that increasing the temperature of substrate decreases the surface roughness, average grain size and density. Increasing the incident angle increases the surface roughness and the average grain size of thin film, while decreasing its density. In addition, increasing the incident energy decreases the surface roughness and the average grain size of thin film, while increasing its density. For the cases of simulation, with the substrate temperature of 500 K, normal incident angle and 14.6 × 10⁻¹⁷ J are appropriate, in order to obtain a smoother surface, a small grain size and a higher density of thin film. From the experimental results, the surface roughness of thin film deposited on the substrates of Si(1 0 0) and indium tin oxide (ITO) decreases with the increasing sputtering power, while the thickness of thin film shows an approximately linear increase with the increase of sputtering power.     

Electrical and piezoresistive properties of ion beam deposited DLC films

In present study diamond like carbon (DLC) films were deposited by closed drift ion source from the acetylene gas. The electrical and piezoresistive properties of ion beam synthesized DLC films were investigated. Diode-like current–voltage characteristics were observed both for DLC/nSi and DLC/pSi heterostructures. This fact was explained by high density of the irradiation-induced defects at the DLC/Si interface. Ohmic conductivity was observed for DLC/nSi heterostructure and metal/DLC/metal structure at low electric fields. At higher electric fields forward current transport was explained by Schottky emission and Poole–Frenkel emission for the DLC/nSi heterostructures and by Schottky emission and/or space charge limited currents for the DLC/pSi heterostructures. Strong dependence of the diamond like carbon film resistivity on temperature has been observed. Variable range hopping current transport mechanism at low electric field was revealed. Diamond like carbon piezoresistive elements with a gauge factor in 12–19 range were fabricated.     

Argon-dominated plasma beam generated by filtered vacuum arc and its substrate etching

A new technique to etch a substrate as a pre-treatment prior to functional film deposition was developed using a filtered vacuum arc plasma. An Ar-dominated plasma beam was generated from filtered carbon arc plasma by introducing appropriate flow rate of Ar gas in a T-shape filtered arc deposition (T-FAD) system. The radiation spectra emitted from the filtered plasma beam in front of a substrate table were measured. The substrate was etched by the Ar-dominated plasma beam. The principal results are summarized as follows. At a high flow rate of Ar gas (50 ml/min), when the bias was applied to the substrate, the plasma was attracted toward the substrate table and the substrate was well etched without film formation on the substrate. Super hard alloy (WC), bearing steel (SUJ2), and Si wafer were etched by the Ar-dominated plasma beam. The etching rate was dependent on the kind of substrate. The roughness of the substrate increased, when the etching rate was high. A pulse bias etched the substrate without roughening the substrate surface excessively.     

高温超导滤波器两种刻蚀方法的研究

在高温超导滤波器的制备过程中,针对所使用的高温超导薄膜的特点,采用了两种刻蚀方法——湿化学刻蚀法和离子束刻蚀法,设计对比了两种刻蚀的制作流程及其优缺点,并用两种方法分别制备了高温超导滤波器,对微波特性做了对比分析。得出离子束刻蚀对超导薄膜的性能影响要小一些,用此方法制备的高温超导滤波器具有更好的微波特性。     

Stabilization of organic thin film transistors by ion implantation

We report on the effects of low energy ion implantation (N and Ne) in the reduction and control of the degradation of pentacene organic thin film transistors (OTFTs) due to the exposure to atmosphere (i.e. oxygen and water). We have observed that a controlled damage depth distribution preserves the functionality of the devices, even if ion implantation induces significant molecular structure modifications, in particular a combination of dehydrogenation and carbonification effects. No relevant changes in the pentacene thin film thickness have been observed. The two major transport parameters that characterize OTFT performance are the carrier mobility and the threshold voltage. We have monitored the effectiveness of this process in stabilizing the device by monitoring the carrier mobility and the threshold voltage over a long time (over 2000 h). Finally, we have assessed by depth resolved X-ray Photoemission Spectroscopy analyses that, by selectively implanting with ions that can react with the hydrocarbon matrix (e.g. N⁺), it is possible to locally modify the charge distribution within the organic layer.     

Biaxial stresses, surface roughness and microstructure in evaporated TiO2 films with different deposition geometries

The residual stresses, surface roughness and microstructure in titanium oxide films prepared by electron-beam evaporation and deposited with different geometries were investigated, with particular focus on the in-plane anisotropy of the biaxial stresses and microstructures. Thin films were deposited with various deposition angles on B270 glass substrates and silicon wafers. Two different types of deposition geometries were studied. The residual stress in the thin films was examined by a phase-shifting Twyman-Green interferometer. The optical constants, biaxial stress and surface roughness were found to be related to the evolution of the anisotropic microstructures in the films. The results revealed that the anisotropic stresses that developed in the evaporated titanium oxide films were dependent upon the deposition geometry and microstructure of the films.     

离子束清洗在激光薄膜中的应用

介绍了在激光薄膜中End Hall型离子源离子束清洗的应用。通过实验验证了基片的二次污染和离子束的清洗效果,观测了离子束清洗前后基片的表面形貌变化。研究了用离子束清洗基片时对薄膜抗激光损伤阈值的作用。分析了用离子束清洗基片时其基片表面的性质,如清洁度、表面能、接触角、表面形貌的变化机理。指出了杂质微粒的去除和附着力的增加是如何使薄膜抗激光损伤阈值显著提高的。     

Zirconium nitrides deposited by dual ion beam sputtering: physical properties and growth modelling

Zirconium nitrides reveal interesting optical and electrical properties which highly depend on the nitrogen stoichiometry. Indeed, the material exhibits a transition from the stable metallic ZrN (optical index for bulk at 633 nm: N=0.5−i3.2) to the metastable semi-transparent insulating Zr₃N₄ (N=3.2−i0.4). This work deals with the elaboration of homogeneous ZrN-like and Zr₃N₄-like coatings. These have been prepared using reactive Dual Ion Beam Sputtering (DIBS) using a Zr target and N₂ or N₂+Ar reactive gas. The influence of different elaboration parameters (ion energy, gas composition of the reactive beam and substrate temperature) on the nitrides composition and on their optical and electrical properties was particularly studied. A model was proposed to explain the influence of energy and temperature on the nitrogen composition. The nitrogen stoichiometry was shown to be controlled by a competitive mechanism between implantation of excess nitrogen amount in the subsurface and their elimination by exodiffusion. The first phenomenon is mainly controlled by the ion energy whereas the second one is enhanced by a high temperature and a high irradiation defects density. Therefore, the Zr₃N₄-like nitrides were obtained with low temperature and high energy (200 eV) conditions whereas high temperature and low energy led to ZrN-like materials.     

Highly flexible transparent and conductive ZnS/Ag/ZnS multilayer films prepared by ion beam assisted deposition

ZnS/Ag/ZnS (ZAZ) multilayer films were prepared on polyethene terephthalate (PET) by ion beam assisted deposition at room temperature. The structural, optical and electrical characteristics of ZAZ multilayers dependent on the thickness of silver layer were investigated. The ZAZ multilayers exhibit a low sheet resistance of about 10 Ω/sq., a high transmittance of 92.1%, and the improved resistance stabilities when subjected to bending. When the inserted Ag thickness is over 12 nm, the ZAZ multilayers show good resistance stabilities due to the existence of a ductile Ag metal layer. The results suggest that ZAZ film has better optoelectrical and anti-deflection characteristics than conventional indium tin oxide (ITO) single layer.     

Electron scattering characteristics of polycrystalline metal transition films by in-situ electrical resistance measurements

In-situ electrical resistance measurements were performed to obtain the scattering characteristics of very thin polycrystalline metal transition magnetic alloys grown by ion beam deposition (IBD) on specific underlayers. The experimental curves show size effects at small film thicknesses and important differences between Co₈₅Fe₁₅ and Ni₈₁Fe₁₉ thin layers grown on identical underlayers of Ta70 Å/Ru13 Å. The largest difference was observed in Ni₈₁Fe₁₉ films grown on underlayers of amorphous Ta70 Å. The experimental curves of electrical resistivity/conductivity variation with layer thickness were well fit within the Mayadas and Shatzkes (M-S) model, assuming specific formulations for grain growth with layer thickness.     

离子束平动刻蚀工艺衍射光学元件的设计及制作

提出了一种用于制作二维光束整形衍射光学元件的新方法———离子束平动刻蚀工艺。分别介绍了利用这种新方法设计衍射光学元件的原理、设计过程以及刻蚀工艺系统的构成和掩模板的设计方法。结果表明 ,这种新的工艺方法不拘泥于圆对称系统 ,不但继承了离子束旋转刻蚀工艺的位相真正连续分布的优势 ,而且所制作出的衍射光学元件 ,即使对于半导体激光器所产生的两个方向发散角不同的激光束来说也仍然可以进行整形 ,并最终能得到矩形焦斑。这种工艺方法的理论设计也可以从二维化简为两个一维的设计 ,从而大大简化了设计计算的复杂程度     

热蒸发与离子束溅射制备LaF3薄膜的光学特性

研究了钼舟热蒸发工艺和离子束溅射方法制备的单层LaF₃薄膜的特性。首先,采用分光光度计测量了LaF₃薄膜的透射率和反射率光谱,使用不同模型拟合得出薄膜的折射率和消光系数。然后,采用应力仪测量了加热和降温过程中LaF₃薄膜的应力-温度曲线。最后,采用X射线衍射仪测试了薄膜的晶体结构。实验结果表明,热蒸发制备的LaF₃（RH LaF₃）存在折射率的不均匀性,在193 nm,其折射率和消光系数分别为1.687和5×10^-4,而离子束溅射制备的LaF₃（IBS LaF₃）折射率和消光系数分别为1.714和9×10^-4。两种薄膜表现出相反的应力状态,RH LaF₃薄膜具有张应力,而IBS LaF₃具有压应力,退火之后其压应力减小。热蒸发制备的MgF₂/LaF₃减反膜在193 nm透过率为99.4%,反射率为0.04%,离子束溅射制备的AlF₃/LaF₃减反膜透过率为99.2%,反射率为0.1%。     

Mesoporosity in silica films studied by a slow positron beam and ellipsometry

Porous silica films were synthesized via a sol–gel method using a nonionic amphiphilic triblock copolymer F127 as the structural template. Mesoporosities of the prepared silica films were investigated by Doppler broadening of positron annihilation radiation (DBAR) spectroscopy, positron annihilation gamma-ray energy spectroscopy based on a slow positron beam, and ellipsometry. For the mesoporous silica films, the variation of positron annihilation line shape parameter reveals that the porosity of the silica films increases with loading more F127, which is also confirmed by a decrease of refractive index n. Little variation in positron 3γ-annihilation fraction is found for the silica films prepared with F127 loading less than 15 wt%, whereas a remarkable increment is seen for the films with higher loading. This indicates the pore percolation in porous silica films occurs around a loading of F127 with 15 wt%.