Synergistic effect of hybrid graphene and boron nitride on the cure kinetics and thermal conductivity of epoxy adhesives

In the present study, the synergistic effect of hybrid boron nitride (BN) with graphene on the thermal conductivity of epoxy adhesives has been reported. Graphene was prepared by chemical reduction of graphite oxide (GO) in a mixture of concentrated H₂SO₄/H₃PO₄ acid. The particle size distribution of GO was found to be ~10 μm and a low contact angle of 54° with water indicated a hydrophilic surface. The structure of prepared graphene was characterized by Fourier transform infrared (FTIR), X‐ray diffraction (XRD), Raman spectroscopy and atomic force microscopy (AFM). The thermal conductivity of adhesives was measured using guarded hot plate technique. Test results indicated an improvement in the thermal conductivity up to 1.65 W/mK, which was about ninefold increase over pristine epoxy. Mechanical properties of different epoxy formulations were also measured employing lap shear test. The surface characterization of different epoxy adhesive systems was characterized through XRD, scanning electron microscopy (SEM) and transmission electron microscopy (TEM) studies. Fourier transform infrared also served to determine the nature of interactions between filler particles and epoxy resin. Non‐isothermal differential scanning calorimetric (DSC) technique was used to investigate the effects of graphene and BN particles on the cure kinetics and cross‐linking reaction of epoxy cured with amine curing agent. The Kissinger equation, the model‐free isoconversional Flynn–Wall–Ozawa method and the Ozawa model were used to analyze the kinetic parameter. Copyright © 2017 John Wiley & Sons, Ltd.     

Electrically conductive epoxy‐based nanocomposite adhesives loaded with silver‐coated copper and silver‐coated reduced graphene oxide nanoparticles

In this research, a conductive adhesive based on epoxy resin as the polymer matrix and silver‐coated copper powder and silver‐coated reduced graphene oxide as conductive fillers was synthesized. Graphene oxide was synthesized by modified Hummer's method. It was reduced and modified by silver powder. Copper particles were coated with silver using the electroless plating method. Finally, conductive nanocomposite adhesives were prepared using conductive fillers with different weight fractions. The structural properties of fillers were identified by Fourier‐transform infrared (FTIR) and induced coupled plasma (ICP) analysis and the morphology of the samples by scanning electron microscopy (SEM). Finally, conductive properties, lap shear strength, and thermal stability of adhesive were evaluated. The conductive adhesive prepared with optimized properties have 70% weight percentage silver‐coated copper powder and 1% weight percentage silver‐coated reduced graphene oxide. The bulk resistivity of the optimum sample was 1.6 × 10^‐2 Ω.cm, and the lap shear strength was 7.10 MPa. Also, thermogravimetric analysis showed that the weight loss of adhesive decreased from 88.72% to 30.55% during heating, which showed the addition of fillers improves the thermal stability of adhesive.     

Thermally conductive cyanate ester nanocomposites filled with graphene nanosheets and multiwalled carbon nanotubes

In this work, dodecylamine‐modified graphene nanosheets (DA‐GNSs) and γ‐aminopropyl‐triethoxysilane‐treated multiwalled carbon nanotubes (f‐MWCNTs) are employed to prepare cyanate ester (CE) thermally conductive composites. By adding 5 wt% DA‐GNSs or f‐MWCNTs to the CE resin, the thermal conductivities of the composites became 3.2 and 2.5 times that of the CE resin, respectively. To further improve the thermal conductivity, a mixture of the two fillers was utilized. A remarkable synergetic effect between the DA‐GNSs and f‐MWCNTs on improving the thermal conductivity of CE resin composites was demonstrated. The composite containing 3 wt% hybrid filler exhibited a 185% increase in thermal conductivity compared with pure CE resin, whereas composites with individual DA‐GNSs and f‐MWCNTs exhibited increases of 158 and 108%, respectively. Moreover, the composite with hybrid filler retained high electrical resistivity. Scanning electron microscopy images of the composite morphologies showed that the modified graphene nanosheets (GNSs) and multiwalled carbon nanotubes (MWCNTs) were uniformly dispersed in the CE matrix, and a number of junction points among MWCNTs and between MWCNTs and GNSs formed in the composites with hybrid fillers. Generally, we can conclude that these composites filled with hybrid fillers may be promising materials of further improving the thermal conductivity of CE composites. Copyright © 2014 John Wiley & Sons, Ltd.     

Synergetic effect of thermal conductivity and flame retardancy of cyanate ester composites containing DOPO and BN with great dielectric properties

DOPO and boron nitride (BN) fillers with different particle sizes and several loadings were employed to improve the properties of cyanate ester (CE) resin. The effects of BN content and particle size on the thermal conductivity of the BN‐DOPO/CE ternary composites were discussed. The influence of enhancing the thermal conductivity of the ternary composites on their flame retardancy was studied. The consequences showed that increasing the thermal conductivity of BN‐DOPO/CE composites had an active impact on their flame retardancy. Approving flame retardancy of the ternary composites was certified by the high limiting oxygen index (LOI), UL‐94 rating of V‐0, and low heat release rate (HRR) and total heat release (THR). For instance, in contrast with pure CE matrix, peak of HRR (pk‐HRR), average of HRR (av‐HRR), THR, and average of effective heat of combustion (av‐EHC) of CEP/BN_{0.5 μm}/10 composite were decreased by 51.7%, 33.8%, 18.7%, and 18.9%, respectively. Thermal gravimetry analysis (TGA) showed that the addition of BN fillers improves the thermal stability of the composites. Moreover, the ternary composites possess good dielectric properties. Their dielectric constants (ε) are less than 3, and dielectric loss tangent (tgδ) values are lower than neat CE resin.     

银包玻珠核壳复合粒子的表面处理及环氧导电胶的电性能

以化学还原法合成的银包玻珠核壳复合粒子(Ag/GM)为原料, 乙二胺为表面处理剂, 制备了表面吸附有乙二胺的Ag/GM, 并用它作为导电填料组成了导电胶. 与化学还原法直接合成或沸水处理的Ag/GM相比, 乙二胺处理的Ag/GM能更有效地分散在环氧树脂胶黏剂中, 且能与环氧树脂基体产生化学键合, 降低Ag/GM和环氧树脂基体间的界面能, 用其制备的导电胶的导电率较高, 导电渗滤阈值较低. 同时, 结合导电网络理论和等效电路图, 阐明了用乙二胺处理的Ag/GM作填料制备的导电胶具有较低体积电阻率的原因.     

Enhanced thermal conductivity of epoxy–matrix composites with hybrid fillers

The results of thermal conductivity study of epoxy–matrix composites filled with different type of powders are reported. Boron nitride and aluminum nitride micro‐powders with different size distribution and surface modification were used. A representative set of samples has been prepared with different contents of the fillers. The microstructure was investigated by SEM observations. Thermal conductivity measurements have been performed at room temperature and for selected samples it was also measured as a function of temperature from 300 K down to liquid helium temperatures. The most spectacular enhancement of the thermal conductivity was obtained for composites filled with hybrid fillers of boron nitride–silica and aluminum nitride–silica. In the case of sample with 31 vol.% of boron nitride–silica hybrid filler it amounts to 114% and for the sample with 45 vol.% of hybrid filler by 65% as compared with the reference composite with silica filler. However, in the case of small aluminum nitride grains application, large interfacial areas were introduced, promoting creation of thermal resistance barriers and causing phonon scattering more effective. As a result, no thermal conductivity improvement was obtained. Different characters of temperature dependencies are observed for hybrid filler composites which allowed identifying the component filler of the dominant contribution to the thermal conductivity in each case. The data show a good agreement with predictions of Agari‐Uno model, indicating the importance of conductive paths forming effect already at low filler contents. Copyright © 2014 John Wiley & Sons, Ltd.     

Effect of nano/micro‐mixed ceramic fillers on the dielectric and thermal properties of epoxy polymer composites

Nano/micro ceramic‐filled epoxy composite materials have been processed with various percentage additions of SiO₂, Al₂O₃ ceramic fillers as reinforcements selected from the nano and micro origin sources. Different types of filler combinations, viz. only nano, only micro, nano/micro, and micro/micro particles, were designed to investigate their influence on the thermal expansion, thermal conductivity, and dielectric properties of epoxy polymers. Thermal expansion studies were conducted using thermomechanical analysis that revealed a two‐step expansion pattern consecutively before and after vitreous transition temperatures. The presence of micro fillers have shown vitreous transition temperature in the range 70–80°C compared with that of nano structured composites in which the same was observed as ~90°C. Similarly, the bulk thermal conductivity is found to increase with increasing percentage of micron‐size Al₂O₃. It was established that the addition of micro fillers lead to epoxy composite materials that exhibited lower thermal expansion and higher thermal conductivity compared with nano fillers. Moreover, nano fillers have a significantly decisive role in having low bulk dielectric permittivity. In this study, epoxy composites with a thermal expansion coefficient of 2.5 × 10^?5/K, thermal conductivity of 1.18 W/m · K and dielectric permittivity in the range 4–5 at 1 kHz have been obtained. The study confirms that although the micro fillers seem to exhibit good thermal conductivity and low expansion coefficient, the nano‐size ceramic fillers are candidate as cofillers for low dielectric permittivity. However, a suitable proportion of nano/micro‐mixed fillers is necessary for achieving epoxy composites with promising thermal conductivity, controlled coefficient of thermal expansion and dielectric permittivity. Copyright © 2013 John Wiley & Sons, Ltd.     

Thermal properties and moisture absorption of nanofillers‐filled epoxy composite thin film for electronic application

This current study aimed to enhance the thermal conductivity of thin film composites without compromising other polymer qualities. The effect of adding high thermal conductivity nanoparticles on the thermal properties and moisture absorption of thin film epoxy composites was investigated. Three types of fillers in nanosize with high thermal conductivity properties, boron nitride (BN), synthetic diamond (SD), and silicon nitride (Si₃N₄) were studied. SN was later used as an abbreviation for Si₃N₄. The contents of fillers varied between 0 and 2 vol.%. An epoxy nanocomposite solution filled with high thermal conductivity fillers was spun at 1500–2000 rpm to produce thin film 40–60 µm thick. The effects of the fillers on thermal properties and moisture absorption were studied. The addition of 2 vol.% SD produced the largest improvement with 78% increment in thermal conductivity compared with the unfilled epoxy. SD‐filled epoxy thin film also showed good thermal stability with the lowest coefficients of thermal expansion, 19 and 124 ppm, before and after T_g, respectively, which are much lower compared with SN‐filled and BN‐filled epoxy thin film composites. However the SD‐filled epoxy film has its drawback as it absorbs more moisture compared with BN‐filled and SN‐filled epoxy film. Copyright © 2012 John Wiley & Sons, Ltd.     

Effect of nano‐modified SiO2/Al2O3 mixed‐matrix micro‐composite fillers on thermal,mechanical, and tribological properties of epoxy polymers

Thermo‐mechanically durable industrial polymer nanocomposites have great demand as structural components. In this work, highly competent filler design is processed via nano‐modified of micronic SiO₂/Al₂O₃ particulate ceramics and studied its influence on the rheology, glass transition temperature, composite microstructure, thermal conductivity, mechanical strength, micro hardness, and tribology properties. Composites were fabricated with different proportions of nano‐modified micro‐composite fillers in epoxy matrix at as much possible filler loadings. Results revealed that nano‐modified SiO₂/Al₂O₃ micro‐composite fillers enhanced inter‐particle network and offer benefits like homogeneous microstructures and increased thermal conductivity. Epoxy composites attained thermal conductivity of 0.8 W/mK at 46% filler loading. Mechanical strength and bulk hardness were reached to higher values on the incorporation of nano‐modified fillers. Tribology study revealed an increased specific wear rate and decreased friction coefficient in such fillers. The study is significant in a way that the design of nano‐modified mixed‐matrix micro‐composite fillers are effective where a high loading is much easier, which is critical for achieving desired thermal and mechanical properties for any engineering applications. Copyright © 2016 John Wiley & Sons, Ltd.     

Conductivity and electromagnetic shielding effectiveness of flaky Ni/Ni-Cu-coated glass fiber/epoxy resin composite coating

Flaky Ni/Ni-Cu-coated glass fiber/epoxy resin composite coatings were prepared using the glass fibers and flaky nickel powders as fillers and epoxy resin as binder. The conductivity and electromagnetic shielding effectiveness of the coatings are as follows: (1) the appropriate content of Ni-Cu-coated glass fibers is 6 wt % in the composite filler and the optimum ratio of the filler to epoxy resin is 4: 1; (2) electrical conductivity of the coating with a thickness of 300 μm has a minimum value of 0.72 Ω cm; (3) shielding effectiveness of the coatings is up to 50.21–55.43 dB in the frequency range of 0.3–1000 MHz. This offers a new idea to enhance the added value of the glass fibers and raise the level of electromagnetic radiation protection.     

Preparation of nylon MXD6/EG/CNTs ternary composites with excellent thermal conductivity and electromagnetic interference shielding effectiveness

In this article,hybrid fillers with different dimensions,namely,2-dimensional (2-D) expanded graphite (EG) and 1-dimensional (1-D) multi-walled carbon nanotubes (CNTs),were added to aromatic nylon MXD6 matrix via melt-blending,to enhance its thermal and electrical conductivity as well as electromagnetic interference shielding effectiveness (EMI SE).For ternary composites of MXD6/EG/CNTs,the electrical conductivity reaches up nine orders of magnitude higher compared to that of the neat MXD6 sample,which tumed the polymer-based composites from an insulator to a conductor,and the thermal conductivity has been enhanced by 477％ compared with that of neat MXD6 sample.Meanwhile,the EMI SE of ternary composite reaches ～50 dB at the overall filler loading of only 18 wt％.This work can provide guidance for the preparation of polymer composites with excellent thermal and electrical conductivity via using hybrid filler.     

Polymer/boron nitride nanosheet composite with high thermal conductivity and sufficient dielectric strength

An efficient method was reported to fabricate boron nitride (BN) nanosheets using a sonication–centrifugation technique in DMF solvent. Then non‐covalent functionalization and covalent functionalization of BN nanosheets were performed by octadecylamine (ODA) and hyperbranched aromatic polyamide (HBP), respectively. Then, three different types of epoxy composites were fabricated by incorporation of BN nanosheets, BN‐ODA, and BN‐HBP. Among all three epoxy composites, the thermal conductivity and dielectric strength of epoxy composites using BN‐HBP nanosheets display the highest value, efficiently enhancing to 9.81 W/m K at 50 vol% and 34.8 kV/mm at 2.7 vol% (increase by 4057% and 9.4% compared with the neat epoxy), respectively. The significantly improved thermal conductivity and dielectric strength are attributed to the large surface area, which increases the contact area between nanosheets and nanosheets, as well as enhancement of the interfacial interaction between nanosheets and epoxy matrix. Copyright © 2015 John Wiley & Sons, Ltd.     

聚乙二醇/氮化硼复合材料相变导热性能及其结晶行为

本文采用熔融共混浇筑的方法制备了聚乙二醇/氮化硼(PEG/BN)相变复合材料,并研究了不同尺度片状BN对相变复合材料导热性能和结晶行为的影响。 通过扫描电子显微镜(SEM)、热常数分析仪、红外热成像分析仪和差示扫描量热仪(DSC)研究了相变复合材料的微观形貌、导热系数和相变过程,并利用莫志深法对DSC结果进行了非等温结晶动力学分析。 结果表明,较大片状直径(50 μm)的BN可以更有效地提高聚乙二醇的导热系数,当BN填料质量分数为40%时,相变复合材料的导热系数可达到5.04 W/(m·K)。 在快速降温条件下,片径为50 μm的BN填料可以缩短PEG的半结晶时间,提高结晶速率,使相变复合材料具有较大的相变焓。     

Epoxy composites with ceramic core–shell fillers for thermal management in electrical devices

In this work, a novel core–shell material has been manufactured in order to enhance the thermal conductivity of epoxy‐based composites. The polymer derived ceramics technique has been used to produce fillers whose core is composed of a standard material – silica, and whose outer layer consists of a boron nitride or silicon nitride shell. The synthesized filler was characterized by infrared spectroscopy, X‐ray diffraction, and scanning electron microscopy coupled with an energy dispersive spectroscopy analysis. The successful formation of core–shell structure was proven. Composite samples based on an epoxy resin filled with 31 vol% of synthetized core–shell filler have been investigated in order to determine the effective thermal conductivity of the modified system. The resulting core–shell composite samples exhibited improvements in thermal conductivity of almost 30% in relation to standard systems, making them a promising material for heat management applications. Additionally, the temperature dependence of the thermal conductivity was investigated over a broad temperature range indicating that the thermal behavior of the composite with incorporated core–shell filler is stable. This stability is a crucial factor when considering the potential of using this technology in applications such as electronics and power systems. Copyright © 2017 John Wiley & Sons, Ltd.     

Preparation and Characterization of Epoxy/Inorganic Anti‐electrostatic Nanocomposites Using Submicrometer Al(OH)3 and Colloid Al2O3

New organic‐inorganic hybrid materials and their anti‐electrostatic hybrid membranes are prepared via sol‐gel process. The polycondensation of epoxy oligomers and AEAPS/Al₂O₃ complexes which are organically surface modified submicrometer aluminum trihydroxide inorganic fillers with an active aminoterminal silane coupling agent, N‐(2‐aminoethyl)‐3‐aminopropyltrimethoxysilane (AEAPS), are performed. AEAPS enhances the interfacial interactions between the inorganic fillers and epoxy polymers. Meanwhile, this coupling agent maintains well dispersion of fillers in these composites. To improve the mechanical strength and thermal stability, pyromellitic dianhydride (PMDA) is used as curing agent. These hybrid films prepared from this method have excellent physical properties, such as UV‐shielding, high transmission in visible resign (> 85%), high hardness (7～8H) , high adhesive force (7～8) and low relative surface resistance (9.71 × 10¹¹～1.26 × 10¹⁰ Ω/cm²) with anti‐electrostatic characters. For thermal resistance, the best Td value of epoxy/PMDA/AEAPS/Al₂O₃ is 378.6 °C which is 85.4 °C higher than that of neat epoxy resin. Physical properties of these materials are almost the same as those of the nanocomposites prepared from expensive colloid Al₂O₃. Evidences from TEM micrograph show that the inorganic additives are dispersed evenly in organic matrix with nanometer scale.     

Highly thermal conductive benzoxazine‐epoxy interpenetrating polymer networks containing liquid crystalline structures

A diamine‐based benzoxazine monomer (Bz) and a liquid crystalline epoxy monomer (LCE) are synthesized, respectively. Subsequently, a benzoxazine‐epoxy interpenetrating polymer network (PBEI) containing liquid crystalline structures is obtained by sequential curing of the LCE and the Bz in the presence of imidazole. The results show that the preferential curing of LCE plays a key role in the formation mechanism of liquid crystalline phase. Due to the introduction of liquid crystalline structures, the thermal conductivity of PBEI increases with increasing content of LCE. When the content of LCE is 80 wt %, the thermal conductivity reaches 0.32 W m^?1 K^?1. Additionally, the heat‐resistance of PBEI is superior to liquid crystalline epoxy resin. Among them, PBEI55 containing equal weight of Bz and LCE has better comprehensive performance. Its thermal conductivity, glass transition temperature, and the 5 % weight loss temperature are 0.28 W m^?1 K^?1, 160 °C, and 339 °C, respectively. By introducing boron nitride (BN) fillers into PBEI55, a composite of PBEI/BN with the highest thermal conductivity of 3.00 W m^?1 K^?1 is obtained. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2017 , 55 , 1813–1821     

含磷有机硅杂化环氧树脂固化体系性能研究

通过磷酸与γ-环氧丙氧基三甲氧基硅烷反应得到含磷有机硅氧烷,并加入到环氧树脂/4,4'-二氨基二苯基甲烷体系中混合,通过溶胶-凝胶的方法制备了含磷有机硅杂化环氧树脂固化物.对固化体系进行了玻璃化转变温度、热失重、阻燃、拉伸强度、冲击强度测试分析.结果表明,该固化体系的阻燃性得到提高,极限氧指数在25.8～29.3,玻璃化转变温度得到提高,在161～179℃;虽然初始分解温度比纯环氧树脂固化物低,但800℃残炭率可以达到26.5%,提高了36%;拉伸强度得到提高,在71～94 MPa,冲击强度可以达到14.36 kJ/m2,提高了14%.该固化体系具有较好的阻燃性能和热性能,同时具有较好的力学性能.     

Synergy effects of multi-walled carbon nanotube and graphene nanoplate filled epoxy adhesive on the shear properties of unidirectional composite bonded joints

In this paper, multi-walled carbon nanotubes (MWCNTs) and graphene nanoplates (GNPs) were dispersed into epoxy adhesive by sonication method to investigate their synergy effects on the shear properties of unidirectional composite bonded single lap joints (SLJs). The effect of the viscosity of epoxy resin and hardener on the dispersion process was studied. Testing results showed that the incorporation of MWCNTs and GNPs significantly improved the shear strength and elongation of SLJs at failure. 0.75 wt% MWCNTs/GNPs hybrids reached the highest enhancement of shear strength and elongation by 36.6% and 33.2%, respectively. In addition, the thermal stability of epoxy adhesive was improved by nanofillers in some extent. Finally, the failure mode of SLJs and fracture surfaces of the bonding area as well as the damage mechanism of nanofillers were analyzed.     

Thermal and mechanical properties of particulate fillers filled epoxy composites for electronic packaging application

Epoxy composites containing particulate fillers‐fused silica, glass powder, and mineral silica were investigated to be used as substrate materials in electronic packaging application. The content of fillers were varied between 0 and 40 vol%. The effects of the fillers on the thermal properties—thermal stability, thermal expansion and dynamic mechanical properties of the epoxy composites were studied, and it was found that fused silica, glass powder, and mineral silica increase the thermal stability and dynamic thermal mechanical properties and reduce the coefficient of thermal expansion (CTE). The lowest CTE value was observed at a fused silica content of 40 vol% for the epoxy composites, which was traced to the effect of its nature of low intrinsic CTE value of the fillers. The mechanical properties of the epoxy composites were determined in both flexural and single‐edge notch (SEN‐T) fracture toughness properties. Highest flexural strength, stiffness, and toughness values were observed at fillers content of 40 vol% for all the filled epoxy composites. Scanning electron microscopy (SEM) micrograph showed poor filler–matrix interaction in glass powder filled epoxy composites at 40 vol%. Copyright © 2007 John Wiley & Sons, Ltd.     

Determination of Water Diffusion Coefficients and Dynamics in Adhesive/ Carbon Fiber Reinforced Epoxy Resin Composite Joints

To determinate the water diffusion coefficients and dynamics in adhesive/carbon fiber reinforced epoxy resin composite joints,energy dispersive X-ray spectroscopy analysis(EDX)is used to establish the content change of oxygen in the adhesive in adhesive/carbon fiber reinforced epoxy resin composite joints.As water is made up of oxygen and hydrogen,the water diffusion coefficients and dynamics in adhesive/carbon fiber reinforced epoxy resin composite joints can be obtained from the change in the content of oxygen in the adhesive during humidity aging,via EDX analysis.The authors have calculated the water diffusion coefficients and dynamics in the adhesive/carbon fiber reinforced epoxy resin composite joints with the aid of both energy dispersive X-ray spectroscopy and elemental analysis.The determined results with EDX analysis are almost the same as those determined with elemental analysis and the results also show that the durability of the adhesive/carbon fiber reinforced epoxy resin composite joints subjected to silane coupling agent treatment is better than those subjected to sand paper burnishing treatment and chemical oxidation treatment.