基于旋转式反射镜的飞行视觉系统设计

在MEMS麦克风贴片工艺中,真空吸嘴吸取MEMS芯片以后需要进行芯片位姿的精确校正。为实现高速高精度贴片功能,提出了一种基于旋转式反射镜的飞行视觉系统,该方案利用齿轮齿条将吸嘴的升降运动转化为反射镜的旋转运动,通过设计齿轮参数,实现反射镜不干涉吸嘴的拾放功能。当反射镜旋转到与水平位置夹角呈45°时,视觉系统可以获得MEMS芯片的静止的清晰图像,CCD相机采集一幅图像后,在贴片头飞行的过程中,控制系统完成MEMS芯片的位置和角度的校正。实验结果表明,该系统可以获取高质量MEMS芯片图像。该系统结构简单紧凑,成像无失真,不限制贴片头的运动轨迹,显著提高了MEMS芯片的贴片质量和贴片效率,可广泛地应用于贴片机系统中。     

Carbon-Based Materials: Growth,Properties, MEMS/NEMS Technologies,and MEM/NEM Switches

Micro- or nanoelectromechanical system (MEMS/NEMS) is a multidisciplinary field, which has witnessed explosive growth during the past decades. The current materials for MEMS are dominated by Si thanks to the fully based technology for CMOS. However, Si has its own intrinsic limitations such as poor mechanical or tribological properties and poor thermal stability. Carbon-based materials such as diamond, carbon nanotube, and graphene possess excellent properties such as low mass, high Young's modulus, high thermal conductivity, hydrophobic surface, and tailorable electronic configuration, which make these materials promising for MEMS/NEMS applications with diverse and much better performance than Si. In this review, we describe the recent progress of carbon-based materials for MEMS/NEMS with focus on diamond, carbon nanotube, and graphene. The growth of these carbon materials is briefly described and only selected properties are discussed with respect to MEMS/NEMS applications. The fabrication process for suspended structures of these materials toward MEMS/NEMS is comprehensively reviewed from the recent literatures. Special attention is devoted to the state-of-the-art of MEM/NEM switches based on these carbon materials, one of the most important fields in MEMS/NEMS. Finally, the application of carbon-based MEM/NEM switches to microwave field is critically analyzed.     

基于MEMS微镜技术的近红外光谱仪的研究

针对传统近红外光谱仪的不足,设计了基于MEMS微镜技术的近红外光路,并对其电路和处理软件做出简要描述,最后用标准样品进行实验,实验结果表明,该光谱仪在重复性和稳定性得到保证的前提下可以做到小型化、便携化.     

Design and characterization of a 3D encapsulation with silicon vias for radio frequency micro-electromechanical system resonator

In this paper, we present a three-dimensional(3D) vacuum packaging technique at a wafer level for a radio frequency micro-electromechanical system(RF MEMS) resonator, in which low-loss silicon vias is used to transmit RF signals.Au–Sn solder bonding is adopted to provide a vacuum encapsulation as well as electrical conductions. A RF model of the encapsulation cap is established to evaluate the parasitic effect of the packaging, which provides an effective design solution of 3D RF MEMS encapsulation. With the proposed packaging structure, the signal-to-background ratio(SBR) of 24 dB is achieved, as well as the quality factor(Q-factor) of the resonator increases from 8000 to 10400 after packaging.The packaged resonator has a linear frequency–temperature( f –T) characteristic in a temperature range between 0℃ and 100℃. And the package shows favorable long-term stability of the Q-factor over 200 days, which indicates that the package has excellent hermeticity. Furthermore, the average shear strength is measured to be 43.58 MPa among 10 samples.     

Evaluation of current and temperature effects on optical performance of InGaAlP thin-film SMD LED mounted on different substrate packages

The relationship between the photometric, electric, and thermal parameters of light-emitting diodes(LEDs) is important for optimizing the LED illumination design. Indium gallium aluminium phosphide(InGaAlP)-based thin-film surface-mounted device(SMD) LEDs have attracted wide attention in research and development due to their portability and miniaturization. We report the optical characterization of InGaAlP thin-film SMD LED mounted on FR4, 2 W, and 5 W aluminum(Al) packages. The optical and thermal parameters of LED are determined at different injection currents and ambient temperatures by combining the T3ster(thermal transient tester) and TeraL ED(thermal and radiometric characterization of power LEDs) systems. Analysis shows that LED on a 5 W Al substrate package obtains the highest luminous and optical efficiency.     

Bragg Grating Tuning Package Based on a Clamped Beam Structure

It is reported that simple beam structure used for FBG tuning can cause FBG chirping. A novel tuning method utilizing the clamped beam structure under pure bending is introduced. In this paper, we experimentally and theoretically demonstrate that new method can tune the Bragg wavelength without chirp. Further integration of this package can be used for FBG athermal/MEMS packaging.     

基于微机电系统技术的投影型微光学编码器

对投影型微光学编码器的原理进行了分析，结合微机电系统集成技术，提出并实现了投影型微光学编码器。它是利用微机电系统集成技术将标尺光栅、指示光栅、光电二极管集成化构成投影型光栅微编码器。它具有体积小、光路调整容易的特点。实验结果表明，利用微细加工制作微光学编码器是完全可行的。该器件较之传统的光学编码器在经济性及小型化等方面具有非常明显的优势。     

ME MS的光学检测方法和仪器

随着微电子机械系统(MEMS,MicroElectroMechanicalSystem)研究的深入和产业化的需求,其检测在MEMS中的重要性越来越大。光学检测方法以其非接触、快速、高精度等优点得到了大量的应用。分析和介绍了国内外采用光学检测法进行MEMS检测的方法及相关检测仪器在测量中的应用。尤其是Nanosurf测量仪器,它是一种独立的三维非接触测量系统,扫描共焦显微镜是基于白光共焦技术,强大且友好的软件控制使所需获得的数据不仅速度快,而且精度很高,并且提供了多种不同的表面分析方法。     

ZnO薄膜硅微压电矢量水听器

提出了一种基于ZnO压电薄膜的硅微压电矢量水听器,其核心部件是利用微电子机械系统(MEMS)技术制作的悬臂梁结构压电加速度计。由近似解析和有限元分析,得出加速度计的灵敏度和谐振频率,并在此基础上对其进行了优化设计。研制了MEMS压电加速度计,并装配后构成MEMS矢量水听器。测试结果表明:加速度灵敏度在20~1,200 Hz范围内约为0.83 mV/(m/s2)。经过液柱法测量,在1 kHz时,MEMS矢量水听器等效声压灵敏度为-229.5 dB (ref.1V/μPa),比同类型压阻式MEMS矢量水听器的灵敏度高17 dB以上。      

Reconfigurable MEMS OADM Systems

This paper proposes a serial reconfigurable OADM consisting of optical circulator and 2 × 2 MEMS optical switch and tunable FBG. Based on MEMS technology, the OADM is demonstrated to increase the flexibility, decrease the cost andimprove the reliability.     

同步辐射讲座第五讲微电子机械系统加工新方法--LIGA技术

简述了微电子机械系统的起源和特点，介绍了LIGA技术的基本原理以及一些相关技术，对同步辐射深度光刻的技术要求进行了详细地说明，并介绍了国内外利用LIGA技术进行微电子机械系统研发的现状。     

MEMS与MEMS光开关

微机电系统(MEMS)技术是一种新型制造技术,在光通信的发展中得到广泛的应用,有极大的市场价值.在整个光通信中,光开关是较为重要的光无源器件,在光网络系统中可对光信号进行选择性操作.随着光通信的日益发展,对光开关的技术要求也日益提高,利用MEMS技术制作的新型光开关具有体积小、重量轻、能耗低、集成化程度高等特点,从而日益成为研究的热点.本文简单介绍了MEMS技术和其主要特点,并较详细地阐述了MEMS技术在光通信中的应用,以及MEMS光开关的结构、发展趋势和目前存在的主要问题.     

微米尺度结构最大抗扭强度的在线测试和研究

提出了一种新型的测试结构，对面积为微米量级下键合的最大抗扭强度进行了测试.实验设计一系列的单晶硅悬臂梁结构测试键合面积在微米量级时的最大剪切力，键合面为常用的矩形其边长从6μm到120μm，并根据实际移动距离计算得出的最大剪切力.并实验实际得出最大剪切扭矩和相应的键合面积的曲线，以及最大扭转剪切破坏应力与悬臂梁加载距离的关系，并针对60μm×60μm的矩形键合结构进行了加载和位移的重复性实验测量，两次测量结果符合较好.微电子机械系统(microelectromechanical system, MEMS)器件的设计人员可以根据结论曲线，针对所需的抗扭强度设计相应的键合面积，为MEMS器件工艺的在线定量测试与设计提供参考. 关键词： 阳极键合 硅深刻蚀 键合强度 最大抗扭强度     

MEMS-based optical beam steering system for quantum information processing in two-dimensional atomic systems

To provide scalability to quantum information processors utilizing trapped atoms or ions as quantum bits (qubits), the capability to address multiple individual qubits in a large array is needed. Microelectromechanical systems (MEMS) technology can be used to create a flexible and scalable optical system to direct the necessary laser beams to multiple qubit locations. We developed beam steering optics using controllable MEMS mirrors that enable one laser beam to address multiple qubit locations in a two-dimensional trap lattice. MEMS mirror settling times of approximately 10 micros were demonstrated, which allow for fast access time between qubits.     

Semiconductor cw laser packages with full hermeticity integral power monitoring and direct fibre optic launching

In recent years a large number of papers have been presented describing both the physics of semiconductor lasers and the design of fibre optic systems. The interface between these two areas of technology however has largely been ignored. This paper aims to describe a high launched power, hermetic cw laser package with integral photodetector for feedback control, designed to meet the needs of the fibre optic market. It is believed that this cw packaged device bridges the gap by providing the system designer with a component which can be incorporated with ease and confidence in his fibre optic system. The laser source is described with the design concepts of the package, its construction and performance.     

光纤光栅边孔封装技术

提出了一种新型的光纤光栅压力增敏封装技术——边孔封装技术,它通过改变封装体的几何结构实现了高倍数的压力增敏效果,较大程度减小了压力增敏倍数对聚合物材料参量的依赖性。采用有限元理论建立了边孔封装结构的压力传感模型,分析了封装体几何结构变化对封装后压力灵敏度的影响。采用聚合物材料进行了封装制作实验,测量结果表明封装后光纤光栅的压力灵敏度为5251 pm/MPa,是封装前压力灵敏度的1750倍,并将交叉敏感问题改善了近三个数量级,可满足高精度水下压力测量的应用要求。     

Dynamic characterization of MEMS diaphragm using time averaged in-line digital holography

In this paper dynamic characterization of a MEMS diaphragm is investigated using lens-less time averaged in-line digital holography. The analysis and capability of the numerically reconstructed amplitude and phase information from in-line time averaged holograms as applied to MEMS vibration are presented. Particularly the effect of mean static state on the phase in time averaged digital holography is explored. A novel double exposure method is also demonstrated using a diverging object wave suitable for dynamic characterization of small size objects. A phase jump in the static deformation fringes in the vibrating regions is observed and described and can be used for precise analysis of vibration mode shape under simultaneous presence of mean static deformation. A simple and robust tool for dynamic optical metrology of MEMS devices and micro-objects using time averaged in-line digital holography is thus proposed.     

基于扩展卡尔曼滤波的吊钩姿态估计技术研究 

针对吊钩运动不定且易受大风、雾气等影响其作业效率问题,提出并实现基于MEMS传感器的吊钩姿态估计系统。建立吊钩三维空间运动模型,消除吊钩扭转影响;通过四元数的扩展卡尔曼滤波算法,对MEMS陀螺仪、加速度计与磁强计进行数据融合,解算得到吊钩三维姿态、摆角与摆向;采用基于视觉检测的吊钩空间姿态为参考基准,对起重机吊钩进行姿态估计验证。实验结果表明：该系统能有效融合MEMS传感器数据,获得高精度的吊钩姿态,实现姿态的实时检测。     

Avoiding silicon/glass bonding damage with fusion bonding method

A novel fusion bonding method between silicon and glass with Nd:YAG laser is described.This method overcomes the movable mechanical parts damage caused by the electrostatics force in micro-electronic machine-system(MEMS)device during the anodic bonding. The diameter of laser spot is 300 μm,the power of laser is 100 W,the laser velocity for bonding is 0.05 m/s,the average bonding tension is 6.3 MPa.It could distinctly reduce and eliminate the defects and damage,especially in movable sensitive mechanical parts of MEMS device.     

Fabrication of pellicle beam splitters for optical bus application

The optical bus architecture for on-board applications requires a number of optical splitters with precise split ratios to route part of the input signal. Since hollow metal waveguide provides well collimated beams with very small gap loss, it opens the possibility of inserting discrete optical beam splitters (taps). The optical tap requires low excess loss, polarization insensitivity, temperature stability, minimized walk-off of the propagating beam, and cost effective manufacturing. By benefiting from the mature interference coating technology for polarization insensitivity and temperature stability, we design a pellicle beam splitter based on a static microelec tro-mechanical system (MEMS) and develop processes to fabricate pellicle splitters using wafer level bonding of silicon and glass substrates, with subsequent thinning to 20 μm. With the approaches described in this paper, we have demonstrated optical beam splitters with excess loss of less than 0.17 dB that operate at a data rate of 10 Gb/s showing a clean eye diagram while providing controlled split ratio and polarization insensitivity. We have demonstrated a high yielding MEMS based silicon processing platform which has the potential to provide a cost effective manufacturing solution for optical beam splitters.