Total Ionization Dose Effects on Charge Storage Capability of Al_2O_3/HfO_2/Al_2O_3-Based Charge Trapping Memory Cell

Because of the discrete charge storage mechanism, charge trapping memory(CTM) technique is a good candidate for aerospace and military missions. The total ionization dose(TID) effects on CTM cells with Al_2O_3/HfO_2/Al_2O_3(AHA) high-k gate stack structure under in-situ 10 keV x-rays are studied. The C-V characteristics at different radiation doses demonstrate that charge stored in the device continues to be leaked away during the irradiation,thereby inducing the shift of flat band voltage(V_(fb)). The dc memory window shows insignificant changes, suggesting the existence of good P/E ability. Furthermore, the physical mechanisms of TID induced radiation damages in AHA-based CTM are analyzed.     

Physical analysis of normally-off ALD Al2O3/GaN MOSFET with different substrates using self-terminating thermal oxidation-assisted wet etching technique

Based on the self-terminating thermal oxidation-assisted wet etching technique, two kinds of enhancement mode Al$_{2}$O$_{3}$/GaN MOSFETs (metal-oxide-semiconductor field-effect transistors) separately with sapphire substrate and Si substrate are prepared. It is found that the performance of sapphire substrate device is better than that of silicon substrate. Comparing these two devices, the maximum drain current of sapphire substrate device (401 mA/mm) is 1.76 times that of silicon substrate device (228 mA/mm), and the field-effect mobility ($\mu_{\rm FEmax}$) of sapphire substrate device (176 cm$^{2}$/V$\cdot$s) is 1.83 times that of silicon substrate device (96 cm$^{2}$/V$\cdot$s). The conductive resistance of silicon substrate device is 21.2 $\Omega {\cdot }$mm, while that of sapphire substrate device is only 15.2 $\Omega {\cdot }$mm, which is 61% that of silicon substrate device. The significant difference in performance between sapphire substrate and Si substrate is related to the differences in interface and border trap near Al$_{2}$O$_{3}$/GaN interface. Experimental studies show that (i) interface/border trap density in the sapphire substrate device is one order of magnitude lower than in the Si substrate device, (ii) Both the border traps in Al$_{2}$O$_{3}$ dielectric near Al$_{2}$O$_{3}$/GaN and the interface traps in Al$_{2}$O$_{3}$/GaN interface have a significantly effect on device channel mobility, and (iii) the properties of gallium nitride materials on different substrates are different due to wet etching. The research results in this work provide a reference for further optimizing the performances of silicon substrate devices.     

First-principles calculations of F-, Cl-, and N-related defects of amorphous SiO_2 and their impacts on carrier trapping and proton release

The first-principles calculations based on density functional theory are performed to study F-,Cl-,and N-related defects of amorphous SiO2(a-SiO2) and their impacts on carrier trapping and proton release.The possible geometric configurations of the impurity-related defects,the formation energies,the hole or electron trapping of the neutral defects,and the mechanisms to suppress proton diffusion by doping N are investigated.It is demonstrated by the calculations that the impurity atoms can interact with the oxygen vacancies and result in impurity-related defects.The reactions can be utilized to saturate oxygen vacancies that will cause ionization damage to the semiconducting devices.Moreover,the calculated formation energy indicates that the F-or Cl-related oxygen vacancy defect is a deep hole trap,which can trap holes and prevent them from diffusing to the a-SiO2/Si interface.However,three N-related defects,namely N(2)o-H,N(2)o=O,and N(3)o-Vo,tend to act as shallow hole traps to facilitate hole transportation during device operation.The N(2)o and N(3)o configurations can be negatively charged as deep electron traps during the oxide charge buildup after ionization radiation.In addition,the nudged elastic band(NEB) calculations show that four N-related defects,namely N(2)o,N(2)o-H,N(2)o=O,and N(3)o are capable of capturing protons and preventing them from diffusing to and de-passivating the interface.This research reveals the fundamental properties of the F-,Cl-,and N-related defects in amorphous silica and the details of the reactions of the carrier trapping and proton release.The findings help to understand the microscopic mechanisms that alleviate ionization damage of semiconducting devices by doping a-SiO2.     

Research on total-dose hardening for H-gate PD NMOSFET/SIMOX by ion implanting into buried oxide

In this work,we investigate the back-gate I-V characteristics for two kinds of NMOSFET/SIMOX transistors with H gate structure fabricated on two different SOI wafers.A transistors are made on the wafer implanted with Si+ and then annealed in N2,and B transistors are made on the wafer without implantation and annealing.It is demonstrated experimentally that A transistors have much less back-gate threshold voltage shift AVth than B transistors under X-ray total dose irradiation.Subthreshold charge separation technique is employed to estimate the build-up of oxide charge and interface traps during irradiation,showing that the reduced △Vth for A transistors is mainly due to its less build-up of oxide charge than B transistors.Photoluminescence (PL) research indicates that Si implantation results in the formation of silicon nanocrystalline (nanocluster) whose size increases with the implant dose.This structure can trap electrons to compensate the positive charge build-up in the buried oxide during irradiation,and thus reduce the threshold voltage negative shift.     

具有HfN/HfO2栅结构的p型MOSFET中的负偏置-温度不稳定性研究

研究了HfN/HfO₂高K栅结构p型金属-氧化物-半导体(MOS)晶体管(MOSFET)中，负 偏置-温度应力引起的阈值电压不稳定性(NBTI)特征.HfN/HfO₂高K栅结构的等效 氧化层厚度(EOT)为1.3nm，内含原生缺陷密度较低.研究表明，由于所制备的HfN/HfO₂ 高K栅结构具有低的原生缺陷密度，因此在p-MOSFET器件中观察到的NBTI属HfN/HfO2高K栅结构的本征特征，而非工艺缺陷引起的；进一步研究表明，该HfN/HfO₂高K栅结构中观察到的NBTI与传统的SiO₂基栅介质p-MOSFET器件中观察 到的NBTI具有类似的特征，可以被所谓的反应-扩散(R-D)模型表征： HfN/HfO₂ 栅结构p-MOSFET器件的NBTI效应的起源可以归为衬底注入空穴诱导的界面反应机理，即在负 偏置和温度应力作用下，从Si衬底注入的空穴诱导了Si衬底界面Si-H键断裂这一化学反应的 发生，并由此产生了Si^＋陷阱在Si衬底界面的积累和H原子在介质层内部的扩散 ，这种Si^＋陷阱的界面积累和H原子的扩散导致了器件NBTI效应的发生. 关键词： 高K栅介质 负偏置-温度不稳定性(NBTI) 反应-扩散(R-D)模型     

LaON/SiO2和HfON/SiO2双隧穿层MONOS存储器存储特性的比较

本文对比研究了LaON/SiO₂和HfON/SiO₂双隧穿层MONOS存储器的存储特性. 实验结果表明,LaON/SiO₂双隧穿层MONOS存储器具有较大的存储窗口,快的编程/擦除速度及好的疲劳和保持特性. 其机理在于LaON较大的介电常数有效提高了编程/擦除过程中载流子的注入效率,较小的O 扩散系数减少了界面陷阱,从而减少了保持期间存储电荷通过陷阱辅助隧穿的泄漏. 而且N的结合在界面附近形成了强的La-N,Hf-N 和O-N键,可有效降低编程/擦除循环应力对界面的损伤,使器件具有好的疲劳特性. 此外,研究了退火温度对存储特性的影响,结果表明800 ℃退火样品的存储特性比700 ℃退火的好,这是因为800 ℃时NO退火可在LaON（HfON）中引入更多的N,且能更好释放应力,使介质中缺陷减少. 关键词： MONOS 双隧穿层 LaON HfON     

Interface modification and trap-type transformation in Al-doped CdO/Si-nanowire arrays/p-type Si devices by nanowire surface passivation

The present work reports the fabrication and detailed electrical properties of Al-doped CdO/Si-nanowire (SiNW) arrays/p-type Si Schottky diodes with and without SiNW surface passivation. It is shown that the interfacial trap states influence the electronic conduction through the device. The experimental results demonstrate that the effects of the dangling bonds at the SiNW surface and Si vacancies at the SiO_x/SiNW interface which can be changed by the Si–O bonding on the energy barrier lowering and the charge transport property. The induced dominance transformation from electron traps to hole traps in the SiNWs by controlling the passivation treatment time is found in this study.     

Investigating the effects of the interface defects on the gate leakage current in MOSFETs

The effects of the interface defects on the gate leakage current have been numerically modeled. The results demonstrate that the shallow and deep traps have different effects on the dependence relation of the stress-induced leakage current on the oxide electric field in the regime of direct tunneling, whereas both traps keep the same dependence relation in the regime of Fowler-Nordheim tunneling. The results also shows that the stress-induced leakage current will be the largest at a moderate oxide voltage for the electron interface traps but it increases with the decreasing oxide voltage for the hole interface traps. The results illustrate that the stress-induced leakage current strongly depends on the location of the electron interface traps but it weakly depends on the location of the hole interface traps. The increase in the gate leakage current caused by the electron interface traps can predict the increase, then decrease in the stress-induced leakage current, with decreasing oxide thickness, which is observed experimentally. And the electron interface trap level will have a large effect on the peak height and position.     

The effects of deep trap population on the thermoluminescence of Al2O3:C

The influence of deep traps on the 450 K thermoluminescence (TL) peak of Al₂O₃:C is studied. Depending upon the sample and on the degree of deep trap filling, features such as the TL width, area and height can vary considerably. These effects are interpreted to be due to: (a) sensitivity changes introduced by competition mechanisms involving deep electron and hole traps, and (b) the multiple component nature of the 450 K TL peak. The influence of the deep traps on the TL was studied using different excitation sources (beta irradiation or UV illumination), and step annealing procedures. Optical absorption measurements were used to monitor the concentration of F- and F⁺-centers. The data lead to the suggestion that the competing deep traps which become unstable at 800–875 K are hole traps, and that the competing deep traps which become unstable at 1100–1200 K are electron traps. Both the dose response of the TL signal and the TL sensitivity are shown to be influenced by sensitization and desensitization processes caused by the filling of deep electron and hole traps, respectively. Changes in the TL peak at low doses were also shown to be connected to the degree of filling of deep traps, emphasizing the influence of deep trap concentration and dose history of each sample in determining the TL properties of the material. Implications of these results for the optically stimulated luminescence properties are also discussed.     

Influence of Si/SiO2 interface properties on electrical performance and breakdown characteristics of ultrathin stacked oxide/nitride dielectric films

In this work, the influence of Si/SiO₂ interface properties, interface nitridation and remote-plasma-assisted oxidation (RPAO) thickness (<1 nm), on electrical performance and TDDB characteristics of sub-2 nm stacked oxide/nitride gate dielectrics has been investigated using a constant voltage stress (CVS). It is demonstrated that interfacial plasma nitridation improves the breakdown and electrical characteristics. In the case of PMOSFETs stressed in accumulation, interface nitridation suppresses the hole traps at the Si/SiO₂ interface evidenced by less negative V_t shifts. Interface nitridation also retards hole tunneling between the gate and drain, resulting in reduced off-state drain leakage. In addition, the RPAO thickness of stacked gate dielectrics shows a profound effect in device performance and TDDB reliability. Also, it is demonstrated that TDDB characteristics are improved for both PMOS and NMOS devices with the 0.6 nm-RPAO layer using Weibull analysis. The maximum operating voltage is projected to be improved by 0.3 V difference for a 10-year lifetime. However, physical breakdown mechanism and effective defect radius during stress appear to be independent of RPAO thickness from the observation of the Weibull slopes. A correlation between trap generation and dielectric thickness changes based on the C-V distortion and oxide thinning model is presented to clarify the trapping behavior in the RPAO and bulk nitride layer during CVS stress.     

Direct-current and radio-frequency characteristics of passivated AlGaN/GaN/Si high electron mobility transistors

AlGaN/GaN/Si HEMTs grown by molecular beam epitaxy have been investigated using spectroscopy capacitance, direct and pulse current–voltage and small-signal microwave measurements. Passivation of the HEMT devices by SiO₂/SiN with NH₃ and N₂O pretreatments is made in order to reduce the trapping effects. As has been found from DLTS data, some of electron traps are eliminated after passivation. This has led to an improvement in the drain current. To describe the electron transport, we have developed a charge-control model by including the deep traps observed from DLTS experiments. The thermal and trapping effects have been, on the other hand, studied from a comparison between direct-current and pulsed conditions. As a result, a gate-lag and a drain-lag were revealed indicating the presence of deep lying centers in the gate-drain spacing. Finally, small-signal microwave results have shown that the radio-frequency parameters of the AlGaN/GaN/Si transistors are improved by SiO₂/SiN passivation and more increasingly with N₂O pretreatment.     

Near-surface and bulk deep trap states in AlxGa1-xAs/GaAs

We have measured the field-effect deep-level transient spectra of Al_xGa_1-xAs/GaAs (where x=0.385) at different reverse-bias fields to probe the near-surface deep trap and bulk deep trap states. In the temperature range 77 to 380 K and for a reverse-bias field -1 to -5 V/cm, four major deep traps were identified. The results of our investigation indicate a distinct effect on the deep-level spectra. Three of the deep trap states E1, E2 and E3 showed definite peak enhancement with the applied reverse-bias field and were identified as bulk deep trap states. The fourth deep trap state E4 was a very weak deep trap state and it showed a decrease of the peak height with the applied reverse-bias field. It was labeled as a near-surface deep trap state. PACS 73.60.Fw     

基于Ni电极和ZrO_2/SiO_2/ZrO_2介质的MIM电容的导电机理研究

研究了基于Ni电极和原子层淀积的ZrO_2/SiO_2/ZrO_2对称叠层介质金属-绝缘体-金属(MIM)电容的电学性能.当叠层介质的厚度固定在14nm时,随着SiO_2层厚度从0增加到2nm,所得电容密度从13.1 fF/μm~2逐渐减小到9.3fF/μm~2,耗散因子从0.025逐渐减小到0.02.比较MIM电容的电流-电压(I-V)曲线,发现在高压下电流密度随着SiO_2厚度的增加而减小,在低压下电流密度的变化不明显,还观察到电容在正、负偏压下表现出完全不同的导电特性,在正偏压下表现出不同的高、低场I-V特性,而在负偏压下则以单一的I-V特性为主导.进一步对该电容在高、低场下以及电子顶部和底部注入时的导电机理进行了研究.结果表明,当电子从底部注入时,在高场和低场下分别表现出普尔-法兰克(PF)发射和陷阱辅助隧穿(TAT)的导电机理;当电子从顶部注入时,在高、低场下均表现出TAT导电机理.主要原因在于底电极Ni与ZrO_2之间存在镍的氧化层(NiO_x),且ZrO_2介质层中含有深浅两种能级陷阱(分别为0.9和2.3 eV),当电子注入的模式和外电场不同时,不同能级的陷阱对电子的传导产生作用.     

Combined effects of cycling endurance and total ionizing dose on floating gate memory cells

The combined effects of cycling endurance and radiation on floating gate memory cell are investigated in detail, and the obtained results are listed below. (i) The programmed flash cells with a prior appropriate number of program and easing cycling stress exhibit much smaller threshold voltage shift than without those in response to radiation, which is ascribed mainly to the recombination of trapped electrons (introduced by cycling stress) and trapped holes (introduced by irradiation) in the oxide surrounding the floating gate. (ii) The radiation induced transconductance degradation in prior cycled flash cell is more severe than those without cycling stress in the programmed state or erased state. (iii) Radiation is more likely to set up the interface generation in programmed state than in erased state. This paper will be useful in understanding the issues involved in cycling endurance and radiation effects as well as in designing radiation hardened floating gate memory cells.     

Detailed study of NBTI characterization in 40-nm CMOS process using comprehensive models

The impact of negative bias temperature instability(NBTI) can be ascribed to three mutually uncorrelated factors, including hole trapping by pre-existing traps(?V_(HT)) in gate insulator, generated traps(?V_(OT)) in bulk insulator, and interface trap generation(?V_(IT)). In this paper, we have experimentally investigated the NBTI characteristic for a 40-nm complementary metal–oxide semiconductor(CMOS) process. The power-law time dependence, temperature activation, and field acceleration have also been explored based on the physical reaction–diffusion model. Moreover, the end-of-life of stressed device dependent on the variation of stress field and temperature have been evaluated. With the consideration of locking effect, the recovery characteristics have been modelled and discussed.     

Dispersion effect on the current voltage characteristic of AlGaN/GaN high electron mobility transistors

The current voltage (IV) characteristics are greatly influenced by the dispersion effects in AlGaN/GaN high electron mobility transistors. The direct current (DC) IV and pulsed IV measurements are performed to give a deep investigation into the dispersion effects, which are mainly related to the trap and self-heating mechanisms. The results show that traps play an important role in the kink effects, and high stress can introduce more traps and defects in the device. With the help of the pulsed IV measurements, the trapping effects and self-heating effects can be separated. The impact of time constants on the dispersion effects is also discussed. In order to achieve an accurate static DC IV measurement, the steady state of the bias points must be considered carefully to avoid the dispersion effects.     

BaMg2Si2O7:Eu3+和BaMg2Si2O7:Tb3+发光材料的合成及发光特性的研究

本文报道了首次合成的稀土离子激活的BaMg2Si2O7:Eu3+和BaMg2Si2O7:Tb3+光致发光材料,通过正交设计实验,确定了基质的最佳配比、烧结温度,探讨了影响材料发射强度的一些因素,测定了两种材料的发射光谱和激发光谱,对其发光性能也进行了分析和研究。     

150?快速热氮化SiO2膜的击穿特性

对具有器件质量的150?厚SiO₂膜经传统的长时间热氮化和高温快速热氮化后,研究了其击穿特性及其在高场强下的耐久力。研究结果表明,氮化后击穿场强的分布变窄,对栅电极面积的依赖性减弱,最大击穿场强略微下降。热氮化对高电场下SiO₂/Si界面稳定性和决定于时间的介质击穿均有改善。这种改善既取决于所加栅电压的极性,又强烈依赖于氮化工艺条件。根据电流传输机构,本文提出一种考虑了电荷积累、陷阱密度及其重心位置的击穿模型。 关键词：     

A first-principles calculation on the electronic properties of Si/N-codoped TiO2

To deeply understand the effects of Si/N-codoping on the electronic structures of TiO₂ and confirm their photocatalytic performance, a comparison theoretical study of their energetic and electronic properties was carried out involving single N-doping, single Si-doping and three models of Si/N-codoping based on first-principles. As for N-doped TiO₂, an isolated N 2p state locates above the top of valence band and mixes with O 2p states, resulting in band gap narrowing. However, the unoccupied N 2p state acts as electrons traps to promote the electron-hole recombination. Using Si-doping, the band gap has a decrease of 0.24 eV and the valence band broadens about 0.30 eV. These two factors cause a better performance of photocatalyst. The special Si/N-codoped TiO₂ model with one O atom replaced by a N atom and its adjacent Ti atom replaced by a Si atom, has the smallest defect formation energy in three codoping models, suggesting the model is the most energetic favorable. The calculated energy results also indicate that the Si incorporation increases the N concentration in Si/N-codoped TiO₂. This model obtains the most narrowed band gap of 1.63 eV in comparison with the other two models. The dopant states hybridize with O 2p states, leading to the valence band broadening and then improving the mobility of photo-generated hole; the N 2p states are occupied simultaneously. The significantly narrowed band gap and the absence of recombination center can give a reasonable explanation for the high photocatalytic activity under visible light.     

甲烷部分氧化制合成气Pt/Al_2O_3催化剂的表征及其反应性能评价

采用浸渍法制备了3种不同负载量的Pt/Al2O3催化剂,考察了催化剂的甲烷选择氧化性能,并用程序升温还原技术,程序升温脱附技术以及微型脉冲催化色谱技术对催化剂进行表征。结果表明,随着Pt的负载量升高,甲烷催化氧化的性能也越好,对CO与H2的选择性也越高。其中,在750℃原料气组成CH4/O2为2∶1,4%Pt负载量的催化剂,甲烷转化率达到98%以上。