TiAl3 和Ti/TiAl3 非合金化电极n型GaN欧姆接触的实现

在不进行合金化的情况下,首次直接采用TiAl3合金材料作为金属接触电极.在蓝宝石衬底上生长的n型载流子浓度为2×1018 cm-3的GaN上,成功地得到低接触电阻的欧姆接触,并由环形传输线模型方法测得比接触电阻率为3×10-5 Ω*cm2.与通常n型欧姆接触采用的Ti/Al双层结构比较,TiAl3合金结构更容易形成非合金化的n型欧姆接触.在此实验基础上,进一步分析了N空位和界面层处的TiAl3在形成非合金化或低温退火欧姆接触中发挥的作用,由此设计的Ti/TiAl3/Ni/Au接触结构,在TiAl3合金结构基础上明显地降低了接触电阻率.     

硅衬底GaN基LED N极性n型欧姆接触研究

在Si衬底GaN基垂直结构LED的N极性n型面上,利用电子束蒸发的方法制作了Ti/Al电极,通过了I-V曲线研究了有无AlN缓冲层对这种芯片欧姆接触的影响.结果显示,去除AlN缓冲层后的N极性n型面与Ti/Al电极在500到600 ℃范围内退火才能形成欧姆接触.而保留AlN缓冲层的N极性n型面与Ti/Al电极未退火时就表现为较好的欧姆接触,比接触电阻率为2×10^-5 Ω·cm²,即使退火温度升高至600 ℃,也始终保持着欧姆接触特性.因此,AlN缓冲层的存在是Si衬底GaN基垂直结构LED获得高热稳定性n型欧姆接触的关键. 关键词： 硅衬底 N极性 AlN缓冲层 欧姆接触     

多层Ti/Al电极结构对Ga N/AlGaN HEMT欧姆接触特性的影响

研究了多层Ti/Al结构电极对GaN/AlGaN HEMT欧姆接触特性及表面形态的影响。采用传输线模型对各结构电极的比接触电阻率进行了测量,采用扫描电子显微镜对电极表面形态进行扫描。实验结果显示,在同样的退火条件下,随着Ti/Al层数的增加,比接触电阻率逐渐减小,表面形态趋于光滑;降低Ti/Al层的厚度会加剧Au向内扩散而增加比接触电阻率,但能稍微改善表面形态;Ti比例过高会影响Ti N的形成导致比接触电阻率增加,但能明显改善表面形态。     

感应耦合等离子体刻蚀p-GaN的表面特性

研究了p-GaN材料经感应耦合等离子体(ICP)刻蚀后的表面特性,并用不同的方法对刻蚀表面进行处理.利用原子力显微镜(AFM)和X射线光电子能谱(XPS)对刻蚀样品进行分析,并在样品表面制作Ni/Au电极,进行欧姆接触特性的测试.实验结果表明了NaOH溶液处理表面对改善材料表面和欧姆接触特性是比较有效的. 关键词： GaN 感应耦合等离子刻蚀 表面处理 欧姆接触     

Ni/Ag/Ti/Au与p-GaN的欧姆接触性能及光反射率

研究了不同Ni厚度的Ni/Ag/Ti/Au电极在不同退火温度和退火气氛下与p-GaN之间的欧姆接触性能以及电极的光反射率的变化.采用矩形传输线模型对各电极的比接触电阻率进行测算,利用分光光度计对电极在不同波长下的反射率进行测量.结果表明,Ni金属层的厚度越小,电极的光反射率越高,而Ni层厚度对比接触电阻率的影响较小;当退火温度高于400℃后,电极的光反射率降低,在氧气氛围中退火后光反射率比在氮气中退火后下降更加明显.但在氧气氛围中退火有利于减小比接触电阻率.综合考虑接触电阻和光反射率,电极Ni(1 nm)/Ag/Ti/Au在400℃氧气中快速退火后得到了较好的结果,其比接触电阻率为5.5×10-3Ω·cm2,在450 nm处反射率为85%.利用此电极制作了垂直结构发光二极管(LED)器件,LED在350 mA注入电流下,工作电压为3.2 V,发光功率为270 mW,电光转换效率达到24%.     

GaN HEMT欧姆接触模式对电学特性的影响

本文制备了AlGaN/GaN HEMT器件中常规结构与带有纵向接触孔结构的两种接触电极,研究了该两种源欧姆接触模式对器件电学特性的影响.在相同条件下进行快速退火,发现在750?C下退火30 s后,常规结构还没有形成欧姆接触,而带有纵向欧姆接触孔的接触电极与外延片已经形成了良好的欧姆接触.同时,比较了Ti/Al/Ti/Au和Ti/Al/Ni/Au电极退火后表面形态,Ti/Al/Ni/Au具有更好的表面形貌.通过测试两种结构的HEMT器件后,发现采用纵向欧姆接触孔结构器件具有更高的跨导和饱和电流,但是也会在栅极电压为0.5—2 V之间产生严重的电流崩塌现象.     

热退火处理对AuGeNi/n-AlGaInP欧姆接触性能的影响

本文在n-(Al0.27Ga0.73)0.5In0.5P表面通过电子束蒸发Ni/Au/Ge/Ni/Au叠层金属并优化退火工艺成功制备了具有较低接触电阻的欧姆接触,其比接触电阻率在445℃退火600 s时达到1.4×10–4 W·cm2.二次离子质谱仪测试表明,叠层金属Ni/Au/Ge/Ni/Au与n-AlGaInP界面发生固相反应,Ga,In原子由于热分解发生外扩散并在晶格中留下Ⅲ族空位.本文把欧姆接触形成的原因归结为Ge原子内扩散占据Ga空位和In空位作为施主提高N型掺杂浓度.优化退火工艺对低掺杂浓度n-(Al0.27Ga0.73)0.5In0.5P的欧姆接触性能有显著改善效果,但随着n-(Al0.27Ga0.73)0.5In0.5P掺杂浓度提高,比接触电阻率与退火工艺没有明显关系.本文为n面出光的AlGaInP薄膜发光二极管芯片的n电极制备提供了一种新的方法,有望大幅简化制备工艺,降低制造成本.     

退火温度和退火气氛对Ni/Au与p-GaN之间欧姆接触性能的影响

研究了不同退火温度和气氛对Ni/Au与p-GaN之间欧姆接触性能的影响. 采用圆形传输线模型方法得到不同退火温度和不同退火气氛下的比接触电阻率. 结果表明, 较适宜的退火温度为500 ℃左右, 退火温度太高或太低都会导致比接触电阻率的增大; 较适宜的退火气氛为适量含氧的氮气气氛, 且氧气含量对比接触电阻率大小的影响并不显著. 经过对退火条件的优化, 得到的比接触电阻率可达7.65×10^-4 Ω·cm². 关键词： p-GaN 欧姆接触 圆形传输线模型 快速热退火     

Ni/Au与N掺杂p型ZnO的欧姆接触

研究了Au,In,Ni/Au三种不同金属膜与N掺杂p型ZnO的接触特性,发现Ni/Au双层膜更适合作为其欧姆电极材料,并比较了不同气氛和不同温度退火对Ni/Au电极的影响.发现在O₂中退火电极性能发生蜕变,而在N₂中退火性能得到改善.指出即使在N₂中退火,退火温度的选择也是至关重要的,本实验在400℃,氮气气氛下退火150s,得到了较好的欧姆接触特性.     

低接触电阻率Ni/Ag/Ti/Au反射镜电极的研究

研究了Ag的厚度、退火时间、沉积温度对于Ni/Ag/Ti/Au电极的反射率及与p-GaN欧姆接触性能的影响. 利用分光光度计测量反射率, 采用圆形传输线模型计算比接触电阻率. 结果表明: 随着Ag厚度的增加, Ni/Ag/Ti/Au电极的反射率逐渐增大; 在氧气氛围中, 随着退火时间从1 min增至10 min, 300 ℃退火时, 比接触电阻率持续下降, 而对于400-600 ℃退火, 比接触电阻率先减小后增大; 在300和400 ℃氧气中进行1-10 min 的退火后, Ni/Ag/Ti/Au的反射率变化较小, 退火温度高于400 ℃时, 随着退火时间的增加, 反射率急剧下降; 在400 ℃氧气中3 min退火后, 比接触电阻率可以达到3.6×10^-3 Ω·cm². 此外, 适当提高沉积温度可以增加Ni/Ag/Ti/Au的反射率并降低比接触电阻率, 沉积温度为120 ℃条件下的Ni/Ag/Ti/Au电极在450 nm处反射率达到90.1%, 比接触电阻率为6.4×10^-3 Ω·cm². 综合考虑电学和光学性能, 在沉积温度为120 ℃下蒸镀Ni/Ag/Ti/Au (1/200/100/100 nm)并在400 ℃氧气中进行3 min退火可以得到较优化的电极. 利用此电极制作的垂直结构发光二极管在350 mA电流下的工作电压为2.95 V, 输出光功率为387.1 mW, 电光转换效率达到37.5%.     

Electrical properties of the CdTe back contact: A new chemically etching process based on nitric acid/acetic acid mixtures

The performance of the back contact is one of the major issues of CdTe solar cell research. Standard nitric-phosphoric (NP) acid chemical etching before metallization is widely used to improve contact formation. However, previous studies of this traditional etching method indicated a blocking Schottky barrier at the back contact, and a roll-over phenomenon was found in the J-V curves of the CdTe solar cells. In this work, a new etching solution, i.e. a nitric-acetic (NA) acid was employed. The etching rate was slow and a Te-rich layer was formed on the surface, which was less than 1 nm. The CdTe solar cell with this new etching method showed no roll-over phenomenon and displayed a good ohmic back contact performance. XPS analysis demonstrated that the back contact barrier height was close to those of CdTe with standard NP etching. A possible mechanism was presented for the improvement of back contact properties.     

Superstructure in chemically etched poly(ethylene terephthalate)

The new technique of contact etching has been utilized to study the bulk morphology of polyethylene terephthalate by the echant, n-propylamine. A variety of films and fibers with different mechanical and thermal histories have been subjected to contact etching. The sample surfaces have been studied principally by scanning electron microscopy. A network superstructure with its characteristic dimension (thickness) of from 700 to 3000 Å, depending on sample history, has been observed. In the oriented samples the network superstructure aligns perpendicular to the direction of sample orientation. A simple model is proposed to describe the network superstructure which is believed to be moderately crystalline.     

Surface modification of a polyamide 6 film by He/CF4 plasma using atmospheric pressure plasma jet

Polyamide 6 (PA 6) films are treated with helium(He)/CF₄ plasma at atmospheric pressure. The samples are treated at different treatment times. The surface modification of the PA 6 films is evaluated by water contact angle, atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS). The etching rate is used to study the etching effect of He/CF₄ plasma on the PA 6 films. The T-peel strengths of the control and plasma treated films are measured to show the surface adhesion properties of the films. As the treatment time increases, the etching rate decreases steadily, the contact angle decreases initially and then increases, while the T-peel strength increases first and then decreases. AFM analyses show that the surface roughness increases after the plasma treatment. XPS analyses reveal substantial incorporation of fluorine and/or oxygen atoms to the polymer chains on the film surfaces.     

光致电化学法提高垂直结构发光二极管出光效率的研究

研究了在垂直结构发光二极管(VLED)器件中, 光致电化学法(PEC)刻蚀N极性n-GaN的速率受不同刻蚀条件(刻蚀浓度、刻蚀时间和光照强度)的影响. 并选择N极性n-GaN表面含有较理想六角金字塔结构(侧壁角为31°)的样品制成器件, 研究PEC刻蚀对VLED的欧姆接触和光电性能的影响. 结果表明, 与未粗化样品相比, PEC刻蚀后的样品接触电阻率明显降低, 形成更好的欧姆接触; 其电学特性有较好的改善, 光输出功率有明显提高, 在20 mA电流下光输出功率增强了86.1%. 对不同金字塔侧壁角度的光提取效率用时域有限差分法(FDTD)模拟, 结果显示光提取效率在侧壁角度为20°– 40°有显著提高, 在23.6° (GaN-空气界面的全反射角)时达到最大.     

Effects of Different Plasma Energy Treatments on n-Type Al0.4Ga0.6N Material

El3ctronic properties, surface chemistry and surface morphology of plasma-treated n-Al0.4Ga0.6N material are studied by electrical contact measurements, atomic force microscopy and x-ray photoemission spectroscopy. Although excessive etching can cause the surface roughness to significantly increase, the nitrogen vacancies VN produced by the excessive etching can be compensated for by the negative effects of the rougher surface. Thus, VN produced by excessive etching plays a key role in Ohmic contact of high-A1 content AIGaN and it can reduce Ohmic contact resistance. The effect of rapid thermal annealing on the performance of n-Al0.4Ga0.6N can significantly reduce the etching damage caused by excessive etching.     

氢氟酸刻蚀对Ni/6H-SiC接触性质的作用

采用浓度为10%的氢氟酸（HF）刻蚀6H-SiC单晶片,研究了HF刻蚀时间对Ni/6H-SiC接触性质的影响．经24?h刻蚀的SiC基片在溅射Ni层后,其接触表现良好线性的电流-电压（I-V）曲线．低于这个腐蚀时间的接触具有明显的势垒,但在大于1000℃快速退火后,也得到了良好线性的I-V曲线．X射线衍射（XRD）和俄歇能谱（AES）深度元素分析表明Ni₂Si和C是快速退火后的主要产物．XRD和低能反射电子能量损失谱表明表层的C 关键词： 欧姆接触 SiC 富碳层 互扩散     

制备扫描近场光学显微镜光纤探针的自动化腐蚀方法

提出了一种制备扫描近场光学显微镜光纤探针的自动化腐蚀方案.该方案利用静态腐蚀过程中光纤所形成的特殊结构,及动态腐蚀过程中光纤在氢氟酸中的移动所带来的新月形弯液面在光纤表面接触位置的变化,通过合理控制腐蚀时间来制备尖端锐利、大锥角或多锥体角等各种结构的探针.设计方案采用计算机控制整个装置实现了探针制备过程的自动化,保持了腐蚀光纤探针实验条件的一致性.实验结果表明,采用此方案可以制备出尖端孔径小于100 nm且锥体角高达70°的光纤探针,且重复性高.此外,该方案的装置结构简单,实现容易.     

Elucidating surface properties of dry-etched ZnO using H2/CH4 and H2/CH4/Ar plasma

This paper reports a study of reactive ion etching (RIE) of n-ZnO in H₂/CH₄ and H₂/CH₄/Ar gas mixtures. Variables in the experiment were gas flow ratios, radio-frequency (rf) plasma power, and total pressure. Structural and electrical parameters of the etched surfaces and films were determined. Both the highest surface roughness and highest etching rate of ZnO films were obtained with a maximum rf power of 300 W, but at different gas flow ratios and working pressures. These results were expected because increasing the rf power increased the bond-breaking efficiency of ZnO. The highest degree of surface roughness was a result of pure physical etching by H₂ gas without mixed CH₄ gas. The highest etching rate was obtained from physical etching of H₂/Ar species associated with chemical reaction of CH₄ species. Additionally, the H₂/CH₄/Ar plasma treatment drastically decreased the specific contact and sheet resistance of the ZnO films. These results indicated that etching the ZnO film had roughened the surface and reduced its resistivity to ohmic contact, supporting the application of a roughened transparent contact layer (TCL) in light-emitting diodes (LEDs).     

同步辐射光激励的二氧化硅薄膜刻蚀研究

利用热氧化法在硅晶片上生长SiO₂薄膜，结合光刻和磁控溅射技术在SiO₂薄膜表面制备接触型钴掩模，通过掩模方法在硅表面开展了同步辐射光激励的表面刻蚀研究，在室温下制备了SiO₂薄膜的刻蚀图样.实验结果表明：在同步辐射光照射下，通入SF₆气体可以有效地对SiO₂薄膜进行各向异性刻蚀，并在一定的气压范围内，刻蚀率随SF₆气体浓度的增加而增加，随样品温度的下降而升高；如果在同步辐射光照射下，用SF₆和O₂的混合气体作为反应气体，刻蚀过程将停止在SiO₂/Si界面，即不对硅刻蚀，实现了同步辐射对硅和二氧化硅两种材料的选择性刻蚀；另外，钴表现出强的抗刻蚀能力，是一种理想的同步辐射光掩模材料. 关键词： 同步辐射刻蚀 接触型钴掩模 二氧化硅薄膜     

软X射线相位型聚焦波带片的研制

软X射线波带片是软X射线光学中聚焦、色散和成像的重要元件。以激光全息-离子束刻蚀技术制作金的振幅型软X射线聚焦波带片,以此为掩模,利用接触式同步辐射光刻和离子束刻蚀技术在聚酰亚胺衬底上,分别制作出了镍和锗的软X射线相位型聚焦波带片。