A Green's function method of determining the residual stresses in cylindrical glass shells

We propose a way of modifying the mathematical model of the nondestructive theoretical-experimental method of determining the residual stresses for a specific collection of technological conditions for welding two cylindrical glass shells. The method is based on the general theory of boundary-value problems for ordinary differential equations.Translated fromMatematicheskie Metody i Fiziko-Mekhanicheskie Polya, Issue 33, 1991, pp. 69–73.     

Experimental study of the effect of technological parameters on the residual stresses in thin-walled coiled parts

The effect of the parameters of heat treatment and programmed winding under tension on the residual stresses in thin-walled coiled parts made from glass plastic by the "dry" winding of a heated glass strip on an unheated mandrel is studied experimentally. The effect of the thickness of the parts on the maximum radial residual stresses is considered. A method is proposed for regulating the residual stresses in parts with very thick walls.Translated from Mekhanika Polimerov, No. 1, pp. 75–80, January–February, 1972.     

玻壳成型过程诱导残余应力的数值预测

建立了玻壳压制成型固化过程中残余应力预测的数值模拟模型,采用平行平板间玻璃熔体的固化问题来描述成型过程中残余应力形成的机理,并假定材料为热流变简单粘弹性材料．基于板壳理论,将产品视为平板单元的组合,并采用有限元法来求解,这种方法可以象全三维计算一样一层层地计算残余应力,非常适合复杂形状的薄压制成型产品．最后通过实验比较验证了所提出的模型和方法．     

Determination of residual stresses in glass shells by a computational-experimental method

A method is proposed for determining the technological residual stresses in glass shells of revolution based on the solution of inverse problems of shell theory with proper stresses and the use of experimental data obtained by the photoelastic method. Translated fromMatematicheskie Metody i Fiziko-Mekhanicheskie Polya, Issue 35, 1992, pp. 100–105.     

On the Incorporation of Residual Stresses in Arterial Walls

The present work deals with the incorporation of residual stresses existing in circumferential direction of arterial walls. For the consideration of the residual stresses a novel model will be presented. This model is based on the assumption that residual stresses decrease the stress gradients through the thickness of the arterial wall. Since arterial walls exhibit a pronounced material behavior in fiber direction, the radial gradients of the fiber stresses are considered for the definition of the residual stresses. (© 2011 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim)     

The Sensitivity of Residual Stresses of Cross-Ply Laminates to Manufacturing and Material Parameters

By using a finite-element model elaborated, the sensitivity of residual stresses of polyester/glass cross-ply laminates to manufacturing and material parameters is investigated. The development of residual stresses in the laminates and the significance of the parameters for the problem are discussed. It is found that the main attention in calculating residual stresses should be focused on the properties of resin, which must be measured with care. The most important parameters related to the resin are, of course, its stiffness, thermal expansion, and chemical shrinkage, while the properties of fibers can be obtained from material handbooks with a sufficient accuracy. In curing a thin laminate in an autoclave, the simulation of chemical reactions and the parameters needed in thermal analysis are quite insignificant, because, in practice, the autoclave temperature and the properties of the mold determine the laminate temperature history.     

The axisymmetric problem of determining the residual stresses in thick plates

We propose a method of determining the residual (technological) stresses in structural elements that can be regarded as plates in a computational model. The initial data are the equations of mechanics for bodies with initial stresses and experimental information obtained using nondestructive physical testing.Translated fromMatematichni Metodi ta Fiziko-Mekhanichni Polya, Vol. 40, No. 3, 1997, pp. 113–119.     

Influence of initial stresses on fracture of composite materials containing interacting cracks

Considered in this study are the axially-symmetric problems of fracture of composite materials with interacting cracks, which are subjected to initial (residual) stresses acting along the cracks planes. An analytical approach within the framework of three-dimensional linearized mechanics of solids is used. Two geometric schemes of cracks location are studied: a circular crack is located parallel to the surface of a semi-infinite composite with initial stresses, and two parallel co-axial penny-shaped cracks are contained in an infinite composite material with initial stresses. The cracks are assumed to be under a normal or a radial shear load. Analysis involves reducing the problems to systems of second-kind Fredholm integral equations, where the solutions are identified with harmonic potential functions. Representations of the stress intensity factors near the cracks edges are obtained. These stress intensity factors are influenced by the initial stresses. The presence of the free boundary and the interaction between cracks has a significant effect on the stress intensity factors as well. The parameters of fracture for two types of composites (a laminar composite made of aluminum/boron/silicate glass with epoxy-maleic resin and a carbon/plastic composite with stochastic reinforcement by short ellipsoidal carbon fibers) are analyzed numerically. The dependence of the stress intensity factors on the initial stresses, physical-mechanical parameters of the composites, and the geometric parameters of the problem are investigated.     

Delamination of Grain-Interfaces in Silicon Nitride

Intergranular cracking due to delamination of grain interfaces along with the development of bridging grains is the most important mechanism for the high fracture toughness of silicon nitride. In this line, an interface behavior, which is extending the Coulomb friction concept into the tensile domain has been implemented into a thermodynamical consistent frame work of Helmholtz free energy and dissipation. The model is used to describe the fracture process in a simple model geometry with a β-Si₃N₄ grain embedded into a precracked matrix of oxynitride glass. The material model considers the thermoelastic anisotropy of the grain and the thermal residual stresses, which evolve during the cooling of the model from the glass transition temperature to room temperature. (© 2011 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim)     

A study of glass reinforced polyethylene

The effect of dressing a fiber on the wetting of it by a polyethylene melt is studied. The interconnection between the value of the adhesive strength and the residual stresses at the boundary between the glass fiber and polymer is analyzed. The role of the residual stresses during use of the glass-reinforced material and the part played by the chemical interaction between the polyethylene and the fiber in the water-resistant composition obtained in this way is analyzed.D. I. Mendeleev Moscow Chemicotechnical Institute. Translated from Mekhanika Polimerov, No. 6, pp. 1048–1052, November–December, 1972.     

Residual stresses in plastic rings reinforced with glass and manufactured with consolidation of the various layers

The residual stresses in thin-wall plastic rings reinforced with glass and prepared by the method of consolidating the layers in combination with various winding regimes have been studied experimentally. It is shown that variation of the winding regime from one layer to another can change the distribution of the stresses through the thickness of the ring.Moscow Energy Institute. Translated from Mekhanika Polimerov, No. 1, pp. 174–176, January–February, 1972.     

Temperature reversal of the reinforcing effect of fillers

A previous investigation [4] of the tear strength of filled systems based on SKS-85 butadiene-styrene copolymer over a broad temperature interval revealed a reversal of the reinforcing effect of fillers with a coefficient of thermal expansion different from that of the filled polymer. At Tg the strength of mixtures containing polymer fillers [Kapron (polycaprolactam) and cellophane powder] exceeds that of mixtures containing chalk and carbon black. The temperature reversal effect is attributed to the severe weakening of the adhesion of the polymer to the surface of the filler particles as a result of the concentration of shrinkage stresses in the polymer-filler contact zone. The presence of shrinkage stresses around the filler particles at Tg is qualitatively demonstrated on model systems using a photoelastic technique. Moreover, it is shown that the unbalance, and hence the residual stresses, in filled systems at temperatures below the glass transition temperature of the filled polymer is determined by the difference in the coefficients of thermal expansion.Moscow Technological Institute of the Meat and Dairy Industry. Translated from Mekhanika Polimerov, No. 4, pp. 579–583, July–August, 1969.     

Microsopic Simulation of Thermally-Induced 2nd Order Eigenstresses in AlSi-Alloys

Due to the different coefficients of thermal expansion of aluminium and silicon, high residual stresses of second order occur in Al-Si alloys depending on the cooling rate during the molding process. In products as for example crank cases made of Al-Si alloys these residual stresses may cause microcracks. In the work at hand measurements of the eigenstresses in the single phases (i.e. residual stresses of second kind) performed via neutron diffractometry are compared to numerical simulations for a specific cooling rate. To this end a three-phase model is presented, which considers the α aluminium, the eutectic aluminium, and the silicon particles. The presented model is able to predict the residual stresses in the single phases within an elastoplastic framework. The simulation of tensile loadings of these structures are compared to experiments. The numerical computations are carried on stochastic geometry models by using a fast solver [1] for the Lippmann-Schwinger integral equation, which is based on the fast Fourier transformation. (© 2014 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim)     

Computation of thermal residual stresses in optic fibers

We propose an analytic method of determining all the components of the residual stress tensor in optic fibers. The method is based on solving a plane problem for a cylindrical structure with singular stresses. We obtain closed-form solutions of the problem in the case of a piecewise-constant distribution of free deformations that model the presence of inclusions in the fiber with different values of the thermal coefficient of expansion. We also consider inclusions with cross sections in the shape of a circle, a central ellipse and a central annular sector. We describe the results obtained on this basis in the computation of residual thermal stresses.Translated fromMatematicheskie Metody i Fiziko-Mekhanicheskie Polya, Issue 34, 1991, pp. 79–83.     

Residual stresses in a closed cylindrical shell with a longitudinal crack

We study the influence of the residual stresses on the size and character of the variations in the strain intensity and moment intensity coefficients in a closed cylindrical shell welded together from two parts and under the action of axisymmetric loads. We perform a numerical analysis in the case when the shell with residual stresses is acted on by internal pressure.Translated fromMatematicheskie Metody i Fiziko-Mekhanicheskie Polya, Issue 27, 1988, pp. 40–45.     

The thermally stressed state of the glass shell of a kinescope under heating by electromagnetic radiation

We give the results of theoretical and experimental studies of the temperature and stresses in the glass shell of a kinescope under heat treatment using electromagnetic radiation. We propose a combined regime for thermal treatment.Translated fromMatematicheskie Metody i Fiziko-Mekhanicheskie Polya, Issue 33, 1991, pp. 31–35.     

Experimental study of the effect of the technological factor of rolling-in (packing) on the physicomechanical properties of glass plastic

Conclusions 1. The rolling-in (packing) of wound glass-plastic objects is a favorable technological factor, improving the homogeneity of the material, increasing the elastic and strength characteristics of the glass plastic, and reducing the thermal expansion coefficients and macroscopic residual stresses due to the thermal shrinkage of the objects.2. However, extremely large packing forces may reduce certain of the mechanical characteristics of the material, chiefly the strength and modulus relating to interlayer shear.Moscow Power Institute. Translated from Mekhanika Polimerov, No. 6, pp. 1043–1047, November–December, 1976.     

Study of the residual (internal) stresses in reinforced epoxy resin

An optical polarization method has been used to study the residual (internal) stresses in reinforced ED-6 epoxy resin cured with maleic anhydride. The effects of "chemical" shrinkage, volume change relaxation during during curing, and the difference linear coefficients of thermal expansion for reinforcement and resin are elucidated. It is shown that adjacent reinforcing elements interact. The stress state is investigated with reference to a model of the elementary cell of the regular structure of a unidirectional glass-reinforced plastic. The residual stresses are found as a function of the resin/reinforcement ratio.Mekhanika Polimerov, Vol. 1, No. 4, pp. 76–80, 1965     

Modeling and numerical study of thermal-compression bonding in the packaging process using NCA

Packaging technology used in liquid crystal displays (LCDs) faces the critical issues such as high density interconnects, thinner packaging size, and environmental safety. In order to reduce the packaging size, driver integrated circuit (IC) chips are directly attached to LCD panels using flip chip technology with adhesives, which is called chip on glass (COG) packaging processes. To investigate the effects of the bonding force and bonding temperature on the flip chip thermal-compression packaging, this study established a compression model to analyze the flip chip packaging processes with non-conductive adhesives (NCAs). The plastic deformation of bumps and the NCA flow dynamics between chip and substrate were taken into account in this model. The gap height, bump deformation, bump contact area, and residual stresses after bonding can be estimated with this model.According to the simulation in this work, the best tactic for the flip chip packaging process using NCA is bonded at a lower temperature. This reduces the maximum warpage and only slightly decreases the average compressive residual stress in the bottom of bumps. A larger bonding force results in a larger bump contact area with the substrate, but has a lower compressive residual stress at the contact areas. The bonding force during the flip chip thermal bonding process will affect the contact resistance and reliability of packaging at the same time.     

Numerical analysis of micro-stress evolution in dual phase polycrystals

Diffraction methods gain much attention in nondestructive residual stress analysis. While the determination of macroscopic residual stresses is of main interest, the presence of microscopic residual stresses arising from microstructural characteristics of the material can influence the analysis of the acquired data. The residual stress measurements by neutron diffraction on IN718 pancake forgings are analyzed in this work. We present a simple mechanical model supporting the hypothesis that the phase average of the microscopic residual stress accumulated during the forging process is anisotropic causing anisotropy of the macro stress free reference lattice parameter. (© 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)