Dielectric and Pyroelectric Properties of Compositionally Graded Pb(Zr1-xTix)O3 Thin Films Prepared by Sol-gel Process

"Compositionally graded ferroelectric lead zirconate titanate Pb(Zr1-xTix)O3 (PZT) thin films were grown on Pt/Ti/SiO2/Si substrates by using a sol-gel process. The final structure consists of six layers, up-graded graded films starting from PbZrO3 on the Pt electrode to the top PZT(50) layer, it consists of no Ti, 10%Ti, 20%Ti, 30%Ti, 40%Ti, and 50%Ti respectively. Whereas films with opposite gradient are called down-graded graded films. Structure and dielectric properties of the graded films was investigated by X-ray diffraction, Auger electron spectroscopy and by impedance analysis. The up-graded and down-graded PZT films annealed at 600 o, exhibited the remanent polarization values of 18.0 and 24.2 1C/cm2, respectively. The typical small signal dielectric constants and loss tanffi at a frequency of 100 Hz were 523 and 0.018, 544, and 0.020, respectively, for up-graded and down-graded PZT thin films. The temperature dependence of pyroelectric coeoients of the graded PZT films was measured by a dynamic technique. From 20 o to 82 o, the pyroelectric coeoients of the up-graded and down-graded PZT films up to 374 and 407 1C/m2K, respectively."     

Preparation of PZT Film and Powder by Sol-Gel Technique Using Ti- and Zr-Alkoxides and a Novel Pb-Precursor; Pb(NO3)2 1.5EO3

PZT (PbZr0.53Ti0.47O3) films and powders have been prepared by a precursor mixture containing Pb(NO3)1.5EO3 (EO3=triethylene glycol) and Zr- and Ti-methoxy ethanolates. The gel films have been deposited on Si/Ti/Pt substrates and on glass substrates from which they can easily be removed. The PZT films on the Si/Ti/Pt substrates were prepared with thicknesses up to 200 nm per layer after heating to 700°C. The phase development on heat-treatment of loose gel films to yield PZT was investigated by Powder-XRD, FT-IR, SEM-EDS, TEM-EDS, thermo-mass spectroscopy and DSC and the PZT was found to form in the region 550–700°C. PZT powders of 50–5000 nm sizes were prepared by hydrolysis under basic conditions and washing with water followed by heat-treatment to 650°C.     

无机盐溶液源溶胶-凝胶法制备锶铋钽铁电陶瓷薄膜过程研究

采用可溶性无机盐Sr(NO₃)₂,Bi(NO₃)₃及HTaF6为原料,以柠檬酸、乙二醇及乙二胺四乙酸(EDTA)为络合剂,利用溶胶-凝胶旋转涂覆工艺,分别在Al₂O₃和Pt/Ti/SiO₂/Si的衬底上制备了SrBi₂Ta₂O₉(SBT)铁电陶瓷薄膜.采用SEM,XRD及FTIR等微观分析手段,对制备的SBT溶胶与薄膜过程机理进行了实验研究.结果表明,由无机盐溶液原料络合合成SBT溶胶是此方法制膜的关键,其中络合剂的种类、用量和pH值的控制等是重要的影响因素.制备了相组成均一、薄膜表面致密、均匀、无开裂、晶粒尺寸为150nm的多晶膜,获得了剩余极化(2P_r)与矫顽电场强度(2E_c)分别为9.6μC/cm²与76kV/cm铁电性能较好的薄膜材料.     

Preparation of highly (111)-oriented (Pb,La)(Zr,Sn,Ti)O<Subscript>3</Subscript> (PLZST) antiferroelectric thin films by modified sol-gel process using a novel tin source,dibutyloxide of tin

Highly (111)-oriented Pb_0.97La_0.02Zr_0.85Sn_0.13 Ti_0.02O₃(PLZST) antiferroelectric thin films were deposited on Pt(111)/Ti/SiO₂/Si(100) substrates through a modified sol-gel process technique. The electric field-induced antiferroelectric-to-ferroelectric (AFE‐FE) phase transformation behaviour was examined by C-V measurement. The results indicated that antiferroelectric (AFE) to ferrroelectric (FE) switching field , FE to AFE switching field were 315 kV/cm and 240 kV/cm respectively. The temperature dependence of the dielectric constant showed that the Curie temperature (T _c) of the PLZST antiferroelectric thin films was 171°C. The voltage dependent current density of the highly (111)-oriented PLZST film was less than 1.3 × 10⁻⁶ A/cm² over electric field range from 0 to ± 427 kV/cm.     

Electric-field-induced antiferroelectric to ferroelectric and ferroelectric to paraelectric phase transition at various temperatures in (Pb,La)(Zr,Ti)O<Subscript>3</Subscript> antiferroelectric thick films

(Pb, La)(Zr, Ti)O₃ antiferroelectric thick films with (100)-preferred orientation were fabricated on Pt(111)/Ti/SiO₂/Si(100) substrates via a sol–gel method. The electric-field-induced antiferroelectric (AFE) to ferroelectric (FE) phase transition characteristics were studied by C (capacitance)–E (electric field) measurements at different temperature. The films were in AFE state under 0 kV/cm below 122 °C, and the switching field values decreased, with increasing temperature. The films were in FE state between 122 and 135 °C, and when the temperature above 135 °C, the films were in PE state. The temperature-dependent dielectric parameters were deconvoluted using a Gaussian fit multi-peaks showed that two typical phase transitions were discovered. The first peak is the AFE-to-FE phase transition and the second peak is the FE-to-PE phase transition which has been verified by C–E tests.     

Structure and dielectric properties of 80%Pb(Zn1/3Nb2/3)O3–20%PbTiO3 thin films prepared by modified sol–gel process

80%Pb(Zn_1/3Nb_2/3)O₃–20%PbTiO₃ (PZN–PT) thin films have been prepared on Pt/Ti/SiO₂/Si substrates using a modified sol–gel method. In our method, niobium pentaoxide is used as a substitution instead of niobium ethoxide which is moisture-sensitivity and much more expensive. Microstructure and electrical properties of PZN–PT thin films have been investigated. X-ray diffraction analysis shows that proper annealing temperature of PZN–PT thin films is 600 °C. The PZN–PT thin films annealed at 600 °C are polycrystalline with (111)-preferential orientations. Field-emissiom scanning electron microscope analysis revealed PZN–PT thin films possess well-defined and crack-free microstructure. The thickness of thin films is 290 nm. The Pt/PZN–PT/Pt capacitors have been fabricated and it presents ferroelectric nature. The remanent polarization (Pr), spontaneous polarization (Ps), and the coercive electric field (Ec) are 8.71 μC/cm², 43.06 μC/cm², and 109 kV/cm at 1 MHz, respectively. The dielectric constant (ε_r) and the dissipation factor (tan δ) are about 500.3 and 0.1 at 1 kHz, respectively.     

Chemical solution-deposited PbZr 0.53 Ti 0.47 O3 on La 0.5 Sr 0.5 Co O3. SIMS investigation of the effect of different precursor additives on the layer structure

Chemical solution-deposited thin films of PbZr(0.53)Ti(0.47)O(3)/La(0.5)Sr(0.5)CoO(3) on Pt/TiO(2)/SiO(2)/Si substrates have been investigated by dynamic SIMS. The PbZr(0.53)Ti(0.47)O(3) (PZT) is intended to serve as a ferroelectric layer for microelectronic or microelectromechanical applications; conducting La(0.5)Sr(0.5)CoO(3) (LSCO) is a buffer layer intended to eliminate fatigue effects which usually occur at the Pt/PZT interface. Depth profiles of the main components were obtained and revealed that significant diffusion occurred during the deposition and crystallisation processes. Two types of sample, with different thickness of PZT and different types of poly(vinyl alcohol) (PVA) added to the LSCO precursor, were investigated.     

Microstructure and electrical properties of lead zirconate titanate thin films deposited by sol-gel method on La<Subscript>0.7</Subscript>Sr<Subscript>0.3</Subscript>MnO<Subscript>3</Subscript>/SiO<Subscript>2</Subscript>/Si substrate

(La_0.7Sr_0.3)MnO₃ thin films were deposited on SiO₂/Si substrates by a metal-organic decomposition (MOD) method, and then Pb(Zr_0.52Ti_0.48)O₃ (PZT) thin films were grown on (La_0.7Sr_0.3)MnO₃-coated SiO₂/Si substrates by a sol-gel method. The effects of annealing temperature on the crystalline phases, microstructures and electrical properties of the PZT films were investigated. X-ray diffraction analysis results indicated that the PZT films with a perovskite single phase could be obtained by annealing at 650°C. The dielectric constant and the remnant polarization of the PZT films increased with increasing annealing temperature. The remnant polarization and the coercive field of the films annealed at 650°C were 18.3 μC/cm² and 35.5 kV/cm, respectively, whereas the dielectric constant and loss value measured at 1 kHz were approximately 1100 and 0.81, respectively.     

Microstructure and ferroelectric properties of r.f. magnetron sputtering derived PZT thin films deposited on interlayer (PbO/TiO2)

Lead zirconate titanate (PZT) thin films were deposited on Pt/Ti/SiO₂/Si and interlayer/Pt/Ti/SiO₂/Si substrate by radio frequency (r.f.) magnetron sputtering with a Pb_1.1Zr_0.53Ti_0.47O₃ target. The crystallization of the PZT thin films was formed only by substrate temperature. When interlayer (PbO/TiO₂) was inserted between the PZT thin film and the Pt electrode, the grain growth and processing temperature of the PZT thin films were considerably improved. Compared to PZT/Pt structure, the dielectric constant and polarization properties of the PZT/interlayer/Pt structure were fairly improved. In particular, PZT/interlayer/Pt at the substrate temperature of 400 °C showed prevalent ferroelectric properties (_r=475.97, tanδ=0.0591, P_r=23 μC/cm²). As a result of an X-ray photoelectron spectroscopy (XPS) depth-profile analysis, it was found that PZT/interlayer/Pt deposited only by substrate temperature without the post-annealing process via r.f. magnetron sputtering method remained independent of each other regardless of substrate temperatures.     

PZT铁电薄膜底电极制备工艺的研究

利用磁控溅射方法在Si(001)基片上制备Ti/Pt底电极,其厚度大概分别为20、100 nm,其中Ti电极作为缓冲层,随后在上面溅射PZT铁电薄膜.研究了不同电极的制备工艺对电极形貌、取向以及对PZT铁电薄膜的制备带来的影响.结果表明,底电极的溅射温度以及退火温度对于底电极起着至关重要的作用,同时具有良好(111)取向的、致密性较好的底电极对于PZT铁电薄膜的生长具有重要的影响.     

Investigating Pb diffusion across buried interfaces in Pb(Zr0.2Ti0.8)O3 thin films via time‐of‐flight secondary ion mass spectrometry depth profiling

The diffusion of Pb through Pb(Zr_0.2Ti_0.8)O₃(PZT)/Pt/Ti/SiO₂/Si thin film heterostructures is studied by using time‐of‐flight secondary ion mass spectrometry depth profiling. The as‐deposited films initially contained 10 mol% Pb excess and were thermally processed at temperatures ranging from 325 to 700°C to promote Pb diffusion. The time‐of‐flight secondary ion mass spectrometry depth profiles show that increasing processing temperature promoted Pb diffusion from the PZT top film into the buried heterostructure layers. After processing at low temperatures (eg, 325°C), Pb⁺ counts were low in the Pt region. After processing at elevated temperatures (eg, 700°C), significant Pb⁺ counts were seen throughout the Pt layer and into the Ti and SiO₂ layers. Intermediate processing temperatures (400, 475, and 500°C) resulted in Pb⁺ profiles consistent with this overall trend. Films processed at 400°C show a sharp peak in PtPb⁺ intensity at the PZT/Pt interface, consistent with prior reports of a Pt₃Pb phase at this interface after processing at similar temperatures.     

Recent advances in characterization of CaCu3Ti4O12 thin films by spectroscopic ellipsometric metrology

CaCu3Ti4O12 (CCTO) thin films were successfully grown on LaAlO3(100) and Pt/TiO2/SiO2/Si(100) substrates by a novel MOCVD approach. Epitaxial CCTO(001) thin films have been obtained on LaAlO3(100) substrates, while polycrystalline CCTO films have been grown on Pt/TiO2/SiO2/Si(100) substrates. Surface morphology and grain size of the different nanostructured deposited films were examined by AFM, and spectroscopic ellipsometry has been used to investigate the electronic part of the dielectric constant (epsilon2). Looking at the epsilon2 curves, it can be seen that by increasing the film structural order, a greater dielectric response has been obtained. The measured dielectric properties accounted for the ratio between grain volumes and grain boundary areas, which is very different in the different structured films.     

Influence of Thermal Treatments on In-depth Compositional Uniformity of CuIn(S,Se)2 Thin Films

CuIn(S,Se)₂ thin films were prepared by thermal crystallization of co-sputtered Cu-In alloy precursors in S/Se atmosphere. In-depth compositional uniformity is an important prereq-uisite for obtaining device-quality CuIn(S,Se)₂ absorber thin films. In order to figure out the influence of heat treatments on in-depth composition uniformity of CuIn(S,Se)₂ thin films, two kinds of reaction temperature profiles were investigated. One process is "one step profile", referring to formation of CuIn(S,Se)₂ thin films just at elevated temperature (e.g. 500 oC). The other is "two step profile", which allows for slow diffusion of S and Se elements into the alloy precursors at a low temperature before the formation and re-crystallization of CuIn(S,Se)₂ thin films at higher temperature (e.g. first 250 oC then 500 oC). X-ray diffrac-tion studies reveal that there is a discrepancy in the shape of (112) peak. Samples annealed with "one step profile" have splits on (112) peaks, while samples annealed with "two step profile" have relatively symmetrical (112) peaks. Grazing incident X-ray diffraction and en-ergy dispersive spectrum measurements of samples successively etched in bromine methanol show that CuIn(S,Se)₂ thin films have better in-depth composition uniformity after "twostep profile" annealing. The reaction mechanism during the two thermal processing was also investigated by X-ray diffraction and Raman spectra.     

Preparation and Refractive Index of Nano BST Thin Films

"Radio frequency magnetron sputtering technique is used to deposit Ba0:65Sr0:35TiO3 (BST) thin films on fused quartz substrates. In order to prepare the high quality BST thin films, the crystallization and microstructure of the films were characterized by X-ray diffraction, field emission scanning electron microscopy and atom force microstructure. The more intense characteristic diffraction peaks and better crystallization can be observed in BST thin films deposited at 600 oC and subsequently annealed at 700 oC. The refractive index of the films is determined from the measured transmission spectra. The dependences of the refractive index on the deposition parameters of BST thin films are different. The refractive index of the films increases with the substrate temperature. At lower sputtering pressure, the refractive index increases from 1.797 to 2.179 with the pressure increase. However, when the pressure increases up to 3.9 Pa, the refractive index instead reduces to 1.860. The oxygen to argon ratio also plays an important effect on the refractive index of the films. It has been found that the refractive index increases with the ratio of oxygen to argon increasing. The refractive index of BST thin films is strongly dependent on the annealing temperature, which also increases as the annealing temperature ascends. In one word, the refractive index of BST thin films is finally affected by the films microstructure and texture."     

Enhanced ferroelectric,dielectric and leakage properties in Ce and Ti co-doping BiFeO3 thin films

Pure BiFeO₃ (BFO), Ce and Ti individual doping and co-doping BiFeO₃ thin films were fabricated via sol–gel process on Pt/Ti/SiO₂/Si substrates. The microstructure, surface morphology, ferroelectric and dielectric properties of BFO and doped thin films were investigated in detail. X-ray diffraction reveal that all thin films are confirmed the formation of the distorted rhombohedral perovskite structure. No impure phase is identified in all the films. The Ce and Ti co-doping BiFeO₃ (BCFTO) thin films exhibited the enhanced ferroelectricity with a large remnant polarization (2P _r) of 130 μC/cm², and low leakage current density of 9.10 × 10^?6 A/cm² which is more than two orders of magnitude lower than that of pure BFO films at 100 kV/cm. The dielectric constant (364 at 1 kHz) of the BCFTO thin films is much larger than that of pure BFO thin films. These results suggest that the introductions of Ce and Ti provides an effective route for improving the ferroelectric, dielectric and leakage properties of BFO thin films.     

SrBi2Nb2O9 Ferroelectric Powders and Thin Films Prepared by Sol-Gel

Pure SrBi2Nb2O9 powders and thin films were obtained using sol-gel synthesis from mixtures of niobium ethoxide, bismuth and strontium 2-ethylhexanoates. Powders crystallized for 2 hours at 700°C had grain sizes of about 100–150 nm. SrBi2Nb2O9 thin films were prepared by spin-coating a stable precursor solution onto Si/SiO2/TiO2/Pt substrates. Crystallization of pure SrBi2Nb2O9 phase occurred at about 500–550°C. Randomly oriented 0.3 m-thick crack-free films were obtained after 10 successive depositions and heating at 700°C for 2 hours. P-E hysteresis loops have confirmed the ferroelectric behavior of the films: they show a remanent polarization of 2.5 C/cm2 (5 V, 8 ms). No fatigue was observed up to 109 full switchings.     

Microstructure and properties of sol-gel derived Pb(Zr<Subscript>0.3</Subscript>Ti<Subscript>0.7</Subscript>)O<Subscript>3</Subscript> thin films on GaN/sapphire for nanoelectromechanical systems

Highly (111) oriented, phase-pure perovskite Pb(Zr_0.3Ti_0.7)O₃ (or PZT 30/70) thin films were deposited on single-crystal, (0001) wurtzite GaN/sapphire substrates using the sol-gel process and rapid thermal annealing. The phase, crystallinity, and stoichiometry of annealed PZT films were evaluated by X-ray diffraction and Rutherford backscattering spectroscopy. The atomic force microscopy revealed a smooth PZT surface (rms roughness ∼1.5 nm) with striations and undulations possibly influenced by the nature of the underlying GaN surface. The cross-sectional field-emission scanning electron microscopic images indicated a sharper PZT/GaN interface compared to that of sol-gel derived PZT on (111) Pt/TiO₂/SiO₂/(100) Si substrates. The capacitance-voltage (C-V) characteristics for PZT in the Pt/PZT/GaN (metal-ferroelectric-semiconductor or MFS) configuration were evaluated as a function of annealing temperature and applied voltage. The observed C-V hysteresis stemmed from trapped charge at defect sites within PZT. Also, the lower capacitance density (C/A = 0.35 μF/cm², where A is the area of an electrode) and remnant polarization (P _r ∼ 4 μC/cm²) for PZT in the MFS configuration, compared to the values for PZT in the MFM configuration (Pt/PZT/Pt), were attributed to the high depolarization field within PZT.     

Barium Sodium Niobate Powders and Thin Films: Preparation and Ferroelectric Behavior

Powders and thin films of barium sodium niobate, Ba₄Na₂Nb₁₀O₃₀, of filled tungsten bronze type ferroelectric were processed by a sol-gel route using barium metal, niobium ethoxide and sodium methoxide as precursors. Polycrystalline powder resulted after heat treating the gel powder at or above 650°C. Thin films of Ba₄Na₂Nb₁₀O₃₀ showed no preferred orientation on Si(100), Pt/Si(100) and sapphire substrates. Hysteresis measurements at 1 kHz for the thin films annealed at 750°C, obtained using a prehydrolyzed precursor solution, and gave remanent polarization of 17.34 µC/cm² and coercive field of 62.5 kV/cm. Microstructural investigation of surface morphology of these films revealed grains about 0.3 µm in size. Prehydrolysis of the precursor solution was found to be necessary to achieve dense films with ferroelectric properties.     

Phase transformation behavior of (Pb,La)(Zr,Sn,Ti)O<Subscript>3</Subscript> and Pb (Nb,Zr,Sn,Ti)O<Subscript>3</Subscript> antiferroelectric thin films deposited on LaNiO<Subscript>3</Subscript>-buffered silicon substrates by sol-gel processing

Antiferroelectric (Pb,La)(Zr,Sn,Ti)O₃ (PLZST) and Pb(Nb,Zr,Sn,Ti)O₃ (PNZST) thin films have been fabricated on LaNiO₃/Pt/Ti/SiO₂/Si substrates by a sol-gel processing. These films showed highly preferred (100) orientation due to the grain-on-grain local epitaxial growth. The PLZST films close to the AFE-FE phase boundary showed the electric-field-induced ferroelectric (FE) state, which could return back to its original AFE state only when the thermal activation was high enough. The AFE to FE phase transformation in PNZST films can be adjusted by the dc bias field in temperature. Phase transformation behavior of PNZST and PLZST antiferroelectric thin films were investigated as a function of temperature and dc bias field.     

Studies on structural and electrical properties of transition metal ions (Mn, Co and Cu) co-doped Bi0.9Dy0.1FeO3 thin films

Effects of rare earth Dy and transition metal (TM = Cu, Co and Mn) ions co-doping on the structural, electrical and ferroelectric properties of the BiFeO₃ thin films prepared on Pt(111)/Ti/SiO₂/Si(100) substrates by using a chemical solution deposition method were investigated. All thin films formed as randomly oriented polycrystalline, with no detectable impurity or secondary phases. Among the thin films, the (Bi_0.9Dy_0.1)(Fe_0.975Mn_0.025)O₃ thin film exhibited well saturated hysteresis loops with remnant polarization (2P _r ) of 51 μC/cm² and low coercive electric field (2E _c ) of 685 at 935 kV/cm and low leakage current density of 1.4 × 10^?5 A/cm² at 100 kV/cm. The enhanced properties observed in the co-doped thin films could be considered as being the results of the suppression of ionic defects and of the modified microstructure.