Diethylphosphonate‐containing benzoxazine compound as a thermally latent catalyst and a reactive property modifier for polybenzoxazine‐based resins

A diethylphosphonate‐containing benzoxazine compound (DEP‐Bz) to be used as a multi‐functional reaction agent for preparation of high performance polybenzoxazine thermosetting resins has been reported. The chemical structure of DEP‐Bz has been characterized with FTIR, ¹H NMR, and elemental analysis. The phosphonate groups of DEP‐Bz could convert into phosphonic acid groups which could catalyze the ring‐opening addition reaction of benzoxazines, to demonstrate the thermally latent catalytic effect of DEP‐Bz on the polymerization of benzoxazine compounds. Moreover, DEP‐Bz could also serve as a reactive‐type modifier for polybenzoxazines and other thermosets. DEP‐Bz modified polybenzoxazine resins have shown relatively low reaction temperature (about 190 °C), high mechanical strength with a storage modulus of about 3.0 GPa, and high flame retardancy with a limit oxygen index of about 32. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2013 , 51, 3523–3530     

Imidazole‐type thermal latent curing agents with high miscibility for one‐component epoxy thermosetting resins

Epoxy resins are important thermosetting resins widely employed in industrial fields. Although the epoxy–imidazole curing system has attracted attention because of its reactivity, solidification of a liquid epoxy resin containing imidazoles proceeds gradually even at room temperature. This makes it difficult to use them for one‐component epoxy resin materials. Though powder‐type latent curing agents have been used for one‐component epoxy resin materials, they are difficult to apply for fabrication of fine industrial products due to their poor miscibility. To overcome this situation and to improve the shelf life of epoxy–imidazole compositions, we have developed a liquid‐type thermal latent curing agent 1 , generating an imidazole with a thermal trigger via a retro‐Michael addition reaction. The latent curing agent 1 has superior miscibility toward epoxy resins; in addition, it was confirmed that the epoxy resin composition has both high reactivity at 150 °C, and long‐term storage stability at room temperature. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 2680–2688     

Isothermal cure kinetics of epoxy/phenol‐novolac resin blend system initiated by cationic latent thermal catalyst

The investigation of the cure kinetics of a diglycidyl ether of bisphenol A (DGEBA)/phenol‐novolac blend system with different phenolic contents initiated by a cationic latent thermal catalyst [N‐benzylpyrazinium hexafluoroantimonate (BPH)] was performed by means of the analysis of isothermal experiments using a differential scanning calorimetry (DSC). Latent properties were investigated by measuring the conversion as a function of curing temperature using a dynamic DSC method. The results indicated that the BPH in this system for cure is a significant thermal latent initiator and has good latent thermal properties. The cure reaction of the blend system using BPH as a curing agent was strongly dependent on the cure temperature and proceeded through an autocatalytic kinetic mechanism that was accelerated by the hydroxyl group produced through the reaction between DGEBA and BPH. At a specific conversion region, once vitrification took place, the cure reaction of the epoxy/phenol‐novolac/BPH blend system was controlled by a diffusion‐control cure reaction rather than by an autocatalytic reaction. The kinetic constants k₁ and k₂ and the cure activation energies E₁ and E₂ obtained by the Arrhenius temperature dependence equation of the epoxy/phenol‐novolac/BPH blend system were mainly discussed as increasing the content of the phenol‐novolac resin to the epoxy neat resin. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2945–2956, 2000     

Novel,environmentally friendly crosslinking system of an epoxy using an amino acid: Tryptophan‐cured diglycidyl ether of bisphenol A epoxy

Tryptophan, an amino acid, has been used as a novel, environmentally friendly curing agent instead of toxic curing agents to crosslink the diglycidyl ether of bisphenol A (DGEBA) epoxy resin. The curing reaction of tryptophan/DGEBA mixtures of different ratios and the effect of the imidazole catalyst on the reaction have been evaluated. The optimum reaction ratio of DGEBA to tryptophan has been determined to be 3:1 with 1 wt % catalyst, and the curing mechanism of the novel reaction system has been studied and elucidated. In situ Fourier transform infrared spectra indicate that with the extraction of a hydrogen from NH₃⁺ in zwitterions from tryptophan, the formed nucleophilic primary amine and carboxylate anions of the tryptophan can readily participate in the ring‐opening reaction with epoxy. The secondary amine, formed from the primary amine, can further participate in the ring‐opening reaction with epoxy and form the crosslinked network. The crosslinked structure exhibits a reasonably high glass‐transition temperature and thermal stability. A catalyst‐initiated chain reaction mechanism is proposed for the curing reaction of the epoxy with zwitterion amino acid hardeners. The replacement of toxic curing agents with this novel, environmentally friendly curing agent is an important step toward a next‐generation green electronics industry. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 181–190, 2007     

Novel approach to preparing epoxy/polyhedral oligometric silsesquioxane hybrid materials possessing high mass fractions of polyhedral oligometric silsesquioxane and good homogeneity

Epoxy/polyhedral oligometric silsesquioxane (POSS) hybrid materials, containing 50 wt % POSS and exhibiting good homogeneity, were obtained in a two‐step preparation. Monoamine‐functionalized POSS was first reacted with diglycidyl ether of bisphenol A to form an epoxy POSS precursor, which was then cured. Curing agents such as 4,4′‐diaminodiphenylmethane, dicyandiamide (DICY), and diethylphosphite (DEP) were used for the synthesis of the epoxy–POSS hybrid materials. The use of small‐molecule curing agents, such as DICY and DEP, efficiently avoided macrophase separations and enhanced the thermal properties of the hybrid materials. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 1869–1876, 2006     

Thermal properties and fracture toughness of epoxy resins cured by phosphonium and pyrazinium salts as latent cationic initiators

In this work, the latent thermal cationic initiators triphenyl benzyl phosphonium hexafluoroantimonate (TBPH) and benzyl‐2‐methylpyrazinium hexafluoroantimonate (BMPH) were newly synthesized and characterized with IR, ¹H NMR, and P NMR spectroscopy. The thermal and mechanical properties of difunctional epoxy [diglycidyl ether of bisphenol A (DGEBA)] resins cured by 1 phr of either TBPH or BMPH were investigated. The DGEBA/TBPH system showed a higher curing temperature and a higher critical stress intensity factor than the epoxy/BMPH system. This could be interpreted in terms of the slow thermal diffusion rate and bulk structure of the four phenyl groups in TBPH. However, the decomposition activation energy derived from the Coats–Redfern method was lower for epoxy/TBPH. This result was probably due to the fact that a broken short‐chain structure was developed by the steric hindrance of TBPH in the difunctional epoxy resin. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2393–2403, 2003     

A flame‐retardant phosphate and cyclotriphosphazene‐containing epoxy resin: Synthesis and properties

A novel flame‐retardant epoxy resin, (4‐diethoxyphosphoryloxyphenoxy)(4‐glycidoxyphenoxy)cyclotriphosphazene (PPCTP), was prepared by the reaction of epichlorohydrin with (4‐diethoxyphosphoryloxyphenoxy)(4‐hydroxyphenoxy)cyclotriphosphazene and was characterized by Fourier transform infrared, ³¹P NMR, and ¹H NMR analyses. The epoxy resin was further cured with diamine curing agents, 4,4′‐diaminodiphenylmethane (DDM), 4,4′‐diaminodiphenylsulfone (DDS), dicyanodiamide (DICY), and 3,4′‐oxydianiline (ODA), to obtain the corresponding epoxy polymers. The curing reactions of the PPCTP resin with the diamines were studied by differential scanning calorimetry. The reactivities of the four curing agents toward PPCTP were in the following order: DDM > ODA > DICY > DDS. In addition, the thermal properties of the cured epoxy polymers were studied by thermogravimetric analysis, and the flame retardancies were estimated by measurement of the limiting oxygen index (LOI). Compared to a corresponding Epon 828‐based epoxy polymer, the PPCTP‐based epoxy polymers showed lower weight‐loss temperatures, higher char yields, and higher LOI values, indicating that the epoxy resin prepared could be useful as a flame retardant. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 972–981, 2000     

Near‐infrared spectroscopic studies on the cure behaviors of the CAE/DGEBA blend system initiated by a thermal latent catalyst

The latent properties and cure behaviors of an epoxy blend system based on cycloaliphatic epoxy (CAE) and diglycidyl ether of bisphenol A (DGEBA) epoxy containing N‐benzylpyrazinium hexafluoroantimonate (BPH) as a thermal latent initiator were investigated with near‐infrared (N‐IR) spectroscopy. The assignments of the latent properties and cure kinetics were performed by the measurements of the N‐IR reflectance for epoxide and hydroxyl functional groups at different temperatures and compositions. As a result, this system showed more than one type of reaction, and BPH was an excellent thermal latent catalyst without any coinitiator. The cure behaviors were identified by the changes in the absorption intensity of the hydroxyl groups at 7100 cm⁻¹ with different composition ratios. Moreover, characteristic N‐IR band assignments were used to evaluate the reactive kinetics and were shown to be an appropriate method for studying the cure behaviors of the CAE/DGEBA blend system containing a thermal latent catalyst. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 39: 326–331, 2001     

A fully biobased epoxy resin from vegetable oils: From the synthesis of the precursors by thiol‐ene reaction to the study of the final material

A novel vegetable oil‐based polyamine issued from grapeseed oil (GSO) was prepared using cysteamine chloride (CAHC) by thiol‐ene coupling (TEC). The structure of the polyamine oil (AGSO) was carefully examined using a large range of chemical analyses (FTIR, ¹H NMR and ¹³C NMR, LC‐MS…). The effects of the amination of GSO on the vegetable oil properties were also studied using viscosimetry. Then, AGSO was employed as a novel curing agent for bio‐based epoxy resin. The thermal crosslinking reaction between AGSO and epoxidized linseed oil (ELO) was studied by DSC and rheology. This study also dealt with the definition of the thermomechanical properties of the final material obtained by the mixing and curing of AGSO with ELO in stoichiometric proportions. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2011     

Preparation,thermal properties,and flame retardance of epoxy–silica hybrid resins

A novel epoxy system was developed through the in situ curing of bisphenol A type epoxy and 4,4′‐diaminodiphenylmethane with the sol–gel reaction of a phosphorus‐containing trimethoxysilane (DOPO–GPTMS), which was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) with 3‐glycidoxypropyltrimethoxysilane (GPTMS). The preparation of DOPO–GPTMS was confirmed with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. The resulting organic–inorganic hybrid epoxy resins exhibited a high glass‐transition temperature (167 °C), good thermal stability over 320 °C, and a high limited oxygen index of 28.5. The synergism of phosphorus and silicon on flame retardance was observed. Moreover, the kinetics of the thermal oxidative degradation of the hybrid epoxy resins were studied. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2354–2367, 2003     

Curing of liquid crystalline epoxy resins with a biguanide

This work extends the authors' investigations on liquid crystalline epoxy resins prepared from diglycidyl ether of 4,4′-dihydroxybiphenyl (DGE-DHBP) and aliphatic dicarboxylic compounds (ADC) or difunctional aromatic compounds. Syntheses and properties of these liquid crystalline epoxy resins are described elsewhere. In this paper a study on the curing reaction of the above mentioned liquid crystalline epoxy resins is presented. Ortho-tolylbiguanide was applied as the curing agent. The curing reactions were investigated by differential scanning calorimetry, microscopic observations and IR spectroscopy. Depending upon the temperature program of curing, it was possible to obtain polymeric networks with liquid crystalline order. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35 : 2739–2745, 1997     

Synthesis of a novel epoxy resin containing diphenylether moiety and thermal properties of its cured polymer with phenol novolac

A new type of epoxy resin containing 4,4′-diphenylether moiety in the backbone (2) was synthesized, and was confirmed by gel permeation chromatography, infrared spectroscopy, and ¹H nuclear magnetic resonance spectroscopy. In addition, in order to evaluate the influence of 4,4′-diphenylether moiety in the structure, epoxy resins having 4,4′-biphenylene moiety (4) and having 1,4-phenylene moiety (6) in place of 4,4′-diphenylether moiety were synthesized. The cured polymer obtained through the curing reaction between the new diphenylether-containing epoxy resin and phenol novolac was used for making a comparison of its thermal and physical properties with those obtained from 4, 6, and bisphenol-A (4,4′-isopropylidenediphenol) type epoxy resin. The cured polymer obtained from 2 showed markedly higher anaerobic char yield at 700°C of 44.0 wt %, higher fracture toughness, and higher mechanical strength and modulus. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 3687–3693, 1999     

Synthesis of a novel epoxy resin containing naphthalene moiety and properties of its cured polymer with phenol novolac

A new epoxy resin (Bis-ENA) containing naphthalene structure linked with a 1,4-bis(isopropylidene)phenylene was synthesized and was confirmed by elemental analysis, infrared spectroscopy, and ¹H nuclear magnetic resonance spectroscopy. To estimate the effect of naphthalene moiety on the cured polymer, an epoxy resin (Bis-EP) having phenyl moiety was synthesized, and curing behaviors of Bis-ENA and Bis-EP with phenol novolac were evaluated by differential scanning calorimetry. The incorporation of naphthalene structure into the resin backbone increased the curing temperature and reduced the curing reactivity. Thermal properties of the cured polymers obtained from Bis-ENA and Bis-EP with phenol novolac were examined by thermomechanical analysis and dynamic mechanical analysis. Mechanical properties and moisture resistance were evaluated by flexural strength, flexural modulus, and moisture absorption measurements. The cured polymer obtained from Bis-ENA showed higher glass transition temperature, higher flexural modulus, lower thermal expansion, and lower moisture absorption than that from Bis-EP. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 3063–3069, 1999     

Synthesis and curing of liquid crystalline epoxy resin based on naphthalene mesogen

Aromatic liquid crystalline epoxy resin (LCE) based on naphthalene mesogen was synthesized and cured with aromatic diamines to prepare heat‐resistant LCE networks. Diaminodiphenylester (DDE) and diaminodiphenylsulfone (DDS) were used as curing agents. The curing reaction and liquid crystalline phase of LCE were monitored, and mechanical and thermal properties of cured LCE network were also investigated. Curing and postcuring peaks were observed in dynamic DSC thermogram. LCE network cured with DDE displayed liquid crystalline phase in the curing temperature range between 183 and 260°C, while that cured with DDS formed one between 182 and 230°C. Glass transition temperature of cured LCE network was above 240°C, and crosslinked network was thermally stable up to 330°C. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 419–425, 1999     

Role of cyclic dithiocarbonate as a promoter in the reaction of epoxide and imine in the presence of water

It was demonstrated that the reaction of epoxide and imine as a latent initiator under highly humid conditions was accelerated by addition of 5‐phenoxymethyl‐1,3‐oxathiolane‐2‐thione ( 1 ). When 1 was added to a mixture of glycidyl phenyl ether and an imine, the reaction of the epoxide with an amine released from the imine became faster than was the case without 1 , that is, 1 worked as a promoter of the reaction. The curing rate and initial adhesive strength of epoxy resin increased compared with that without 1 . © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 4276–4283, 2004     

Synthesis and characterization of nano‐sized epoxy oligosiloxanes for fabrication of transparent nano hybrid materials

Nano‐sized epoxy oligosiloxanes (EO) were prepared by condensation reaction between 3‐glycidoxypropyltrimethoxysilane (GPTS) and Diphenylsilandiol (DPSD). Through a composition change of GPTS and DPSD, EO of various structure and sizes were obtained. The molecular structure and size of EO synthesized were investigated by experimental measurements. Regardless of their composition, molecular structure of EO was linear or branch. The amount of species of high molecular weight and their molecular size increased with addition of DPSD. We confirmed that epoxy groups of EO were thermally cured using a thermal initiator and curing agent. Finally, we fabricated transparent epoxy‐based hybrimer films by thermal curing of EO resins. © 2009 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 47: 756–763, 2009     

Storage stability and curing behavior of epoxy‐dicyandiamide systems with carbonyldiimidazole‐Cu (II) complexes as the accelerator

The reaction between carbonyldiimidazole (CDI) and copper (II) nitrate produces a new Cu (II) complex with nitrate as the counter anion. TGA, UV, and FTIR analyses confirmed that the coordination number of CDI in this complex is two. The acceleration effect of the complex in epoxy‐dicyandiamide (DICY) curing systems has been evaluated by DSC and TMA, and the increasing viscosity of the mixture was monitored during the storage. The results revealed that the complex is not only very effective for the acceleration of epoxy‐DICY systems, leading to a rapid gelation within 21 min at 120 °C, but it is also chemically stable at ambient temperature. This is reflected by the slow increase of viscosity of the accelerated curing systems stored at 35 °C, even over 56 days. In addition, the effects of the [Cu(CDI)₂]²⁺ complex with different counter anions, that is, bromide, chloride, nitrate, sulfate, phthalate, and acetate, were compared using a series of tests. By comparing with N,N‐dimethyl‐N′‐phenylurea (fenuron), the widely used latent accelerator for DICY‐epoxy curing systems, the complexes with bromide and nitride were found to be better, both regarding storage stability and for their acceleration effect. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2013 , 51, 3470–3476     

Thermomechanical properties and phase structure of epoxy/silica nano‐hybrid materials constructed from a linear silicone oligomer

Epoxy‐grafted silicone oligomer (ESO), which has a linear silicone chain in the backbone moiety, was synthesized from a trifunctional alkoxysilane via a sol–gel reaction. Characterization of ESO was performed with ¹H and ²⁹Si NMR, Fourier transform infrared, and gel permeation chromatography. The number‐average molecular weight of ESO was 3300. By adding the silicone oligomer as the inorganic source in the curing process of the epoxy resin, novel epoxy/silica hybrid materials were prepared. It was observed by transmission electron microscope that fine silica‐rich domains of about 5‐nm diameter were uniformly dispersed in the cured epoxy matrix. Thermomechanical properties of the hybrid materials were also investigated. The storage modulus in the rubbery region and the peak area of the tan δ curve at the glass‐transition region increased and decreased, respectively, with the hybridization of the silica network. The mobility of the epoxy network chains should be considerably suppressed by the hybridization with the silica network. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 1631–1639, 2005     

Cure behavior of diglycidylether of bisphenol A/trimethylolpropane triglycidylether epoxy blends initiated by thermal latent catalyst

Cure behaviors of diglycidylether of bisphenol A (DGEBA)/trimethylolpropane triglycidylether (TMP) epoxy blends initiated by 1 wt % N‐benzylpyrazinium hexafluoroantimonate (BPH) as a cationic latent catalyst were investigated using DSC and rheometer. This system showed more than one type of reaction and BPH could be excellent thermal latent catalyst without any co‐initiator. The cure activation energy (E_a) obtained from Kissinger method using dynamic DSC data was higher in DGEBA/TMP mixtures than in pure DGEBA. Rheological properties of the blend system were investigated under isothermal condition using a rheometer. The gel time was obtained from the analysis of storage modulus (G′), loss modulus (G″) and damping factor (tanδ). The crosslinking activation energy (E_c) was also determined from the Arrhenius equation based on the gel time and curing temperature. As a result, the crosslinking activation energy showed a similar behavior with that obtained from Kissinger method. And the gel time decreased with increasing TMP content, which could be resulted from increasing the activated sites by trifunctional epoxide groups and decreasing the viscosity of DGEBA/TMP epoxy blend in the presence of TMP. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2114–2123, 2000     

Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120–150°C. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between T_g and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 773–783, 1998