AlN插入层对AlGaN/GaN外延材料电学性能影响

采用MOCVD制备了带有MN插入层AlGaN/GaN异质结构外延材料,对外延材料分别进行了原子力显微镜AFM、双晶XRD以及变温HALL测试.测试结果表明:具有AlN插入层的外延材料表面非常平整,10 μm × 10 μm范围样品的表面均方根粗糙度RMS仅为0.302 nm,AlGaN势垒层衍射峰更尖锐,材料结构特性良好,大大提高了AlGaN/GaN异质结的2DEG面密度和迁移率,280 K和300 K时沟道电子迁移率分别为4736 cm2/V·s和1785 cm2/V·s,比无MN插入层的传统结构得到的结果分别提高了45.7;和23.4;.     

InP纳米线场效应晶体管的制备及其电学性能的研究

利用化学气相沉积法在Si/SiO2衬底上生长出了InP纳米线,制备了基于InP纳米线的底栅场效应晶体管并研究了其电输运特性.对不同生长温度器件的阈值电压、亚阈值斜率、场效应迁移率以及载流子浓度等参数进行了计算和比较.结果表明,生长温度对InP纳米线的形貌影响较大.800℃生长温度的InP纳米线性能较好,该器件阈值电压约为-8.5V,亚阈值斜率为142.4 mV/decade,跨导为258.6 nS,开关比＞106,场效应迁移率高达177.8cm2/(V·s),载流子浓度达2.1×101s cm-3.     

100 mm GaAs PHEMT外延材料生长稳定性控制研究

研究了100 mm GaAs赝配高电子迁移率晶体管(PHEMT)外延材料量产的稳定性控制.通过选择控制参数和控制周期,提高了外延材料性能的重复性和稳定性.12个样品方阻的标准差为0.53;,全部偏差1.66;.通过优化生长工艺有效的降低了样品表面颗粒,样品表面颗粒数量减小到612/片,这些参数均达到或超过国外主流外延厂商水平.     

InP同质外延的不稳定生长:小丘的形成

用原子力显微镜研究了在不同的条件下采用固态磷源分子束外延技术生长的InP同质外延薄膜的表面形貌。在样品的表面观察到不稳定三维岛状生长。其主要原因有两种,第一种是生长温度较低时,由于吸附原子受到附加的ES台阶边垒的阻碍作用,使扩散运动不能向台阶下面运动,而在台阶上面形成小丘,第二种是生长温度较高或V/III较低时,因生长中缺磷造成In的堆积而产生。在合适的生长条件下,可获得了光滑的2D层状生长。     

固态源分子束外延法生长InGaP/GaAs异质结构的热力学分析

本文建立了采用分子束外延法制备InGaP/GaAs异质结构的热力学模型,其中考虑了两个重要的因素,由晶格失配引起的内在应力和InP的脱附.所得到的模型与现有实验结果匹配较好.该模型的实验结果表明在InGaP的生长过程中,生长温度,In/Ga束流比及合金组分之间的相互关系,同时也与实验数据相吻合.该模型对于其他气相沉积生长方式也具有一定的适用性.     

昆明物理研究所分子束外延碲镉汞薄膜技术进展

碲镉汞(MCT)自从问世以来一直是高端红外(IR)探测器领域的首选材料,分子束外延碲镉汞技术具有低成本异质外延、材料能带精准调控、原位成结等优势,是第三代红外焦平面陈列(FPA)器件研制的重要手段。本文报道了昆明物理研究所分子束外延(MBE)MCT薄膜技术进展,包括材料结构、晶体质量、表面缺陷、材料均匀性、掺杂浓度等参数优化控制的研究结果。异质衬底、碲锌镉衬底上MCT薄膜尺寸分别为4英寸(10.16 cm)及2.5 cm×2.5 cm,材料EPD值分别在1×10⁶ cm^-2附近及(3~30)×10⁴ cm^-2范围,表面宏观缺陷密度分别在30 cm^-2附近及100~300 cm^-2范围,薄膜质量与国内外先进水平相当。采用分子束外延MCT薄膜实现了2 048×2 048中波红外(MWIR)、2 048×2 048短波甚高分辨率红外(SWIR)焦平面、640×512中短双色红外(S-MWIR)、320×256中中双色红外(M-MWIR)FPA探测器的研制和验证。     

GaSb/GaAs异质结热光伏电池材料的MBE生长

利用分子束外延方法(MBE)在GaAs (001)衬底上外延生长了GaSb薄膜,并对GaSb薄膜进行了高温退火研究,利用高分辨透射电子显微镜(HRTEM)、原子力显微镜(AFM)、Hall效应(Hall Effect)和低温光荧光谱(LTPL)等手段对薄膜的晶体质量、电学性质和光学性质进行了研究.发现直接生长的GaSb膜表面平整,空穴迁移率较高.研究发现30 s、650℃的快速热退火可消除位错等缺陷,显著提高GaSb薄膜的光学质量.     

半导体所在纳米线量子结构材料研究方面取得新进展

<正>中国科学院半导体研究所超晶格国家重点实验室研究员牛智川课题组近年来深入系统地研究了In(Ga)As量子点、量子环、纳米线中量子点、纳米线中量子环的自组织外延生长、液滴外延生长方法。最近,课题组查国伟、喻颖等在研究中发现:通过优化GaAs纳米线侧壁淀积Ga液滴成核温度与晶化条件等参数,可以生长出密度与形貌可控量子点、量子环等新奇量子结构,首次发现单根纳米线侧壁形成单个"方形"量子环且具有高品质发光特性。(Nanoscale,10.1039(2013))。他们进一步生长了GaAs/AlGaAs纳米线中的GaAs量子点,以及置于AlGaAs量子环中心并覆盖AlGaAs     

利用Al/AlAs中间层调控GaAs在Si(111)上外延生长的研究

为了实现Ⅲ-V器件在硅基平台上单片集成,近年来Ⅲ-V半导体在硅衬底上的异质外延得到了广泛研究。由于Ⅲ-V半导体与Si之间大的晶格失配以及晶格结构不同,在Si上生长的Ⅲ-V半导体中存在较多的失配位错及反相畴,对器件性能造成严重影响。而Si(111)表面的双原子台阶可以避免Ⅲ-V异质外延过程中形成反相畴。本文利用分子束外延技术通过Al/AlAs作为中间层首次在Si(111)衬底上外延生长了GaAs(111)薄膜。通过一系列对比实验验证了Al/AlAs中间层的插入对GaAs薄膜质量的调控作用,并在此基础上通过低温-高温两步法优化了GaAs的生长条件。结果表明Al/AlAs插层可以为GaAs外延生长提供模板,并在一定程度上释放GaAs与Si之间的失配应力,从而使GaAs薄膜的晶体质量得到提高。以上工作为Ⅲ-V半导体在硅上的生长提供了新思路。     

半导体纳米结构的可控生长

应用MBE技术和SK生长模式,通过对研究材料体系的应力分布设计,生长动力学研究和生长工艺优化,实现了In(Ga)As/GaAs,InAlAs/AlGaAs/GaAs和InAs/InAl(Ga)As/InP无缺陷量子点(线)的尺寸、形状、密度和分布有序性的可控生长,这对进一步的器件应用特别重要.讨论了半导体纳米结构的空间有序性分布物理起因和退火的机制.     

Highly uniform AlGaAs/GaAs and InGaAs(P)/InP structures grown in a multiwafer vertical rotating susceptor MOVPE reactor

Highly uniform AlGaAs/GaAs and InGaAs(P)/InP epitaxial layers have been grown in a vertical rotating susceptor MOVPE reactor capable of accommodating three 2′ wafers. The unique water-cooled “showerhead”-type injection distributor which is located 1.5 cm above the substrates ensures a uniform reactant distribution, resulting in uniform growth over a wide range of growth conditions. Periodic multilayer and single layer structures have been used to investigate the thickness and compositional uniformities. The thickness variations over a radial distance of 48 mm for three wafers grown in the same run are within ± 2% for both AlGaAs and InGaAs layers, resulting in a standard deviation of only 0.9%. The gallium concentration of an InGaAs layer varies from 46.88% to 47.01% over the same radial distance with the standard deviation of 0.043%. Measurements of InGaAsP layers grown onto 2′ InP wafers with different alloy compositions show good compositional uniformity yielding standard deviations within 4.4 nm in PL wavelength and 135 ppm in lattice mismatch over a 46 mm radial distance.     

Dependence of InP and GaAs chemical beam epitaxy growth rate on substrate orientations; applications to selective area epitaxy

In order to optimize the shape of chemical beam epitaxy (CBE) selective area growth, growth rates on (100), (111)B, (111)A and (110) substrate orientations have been examined for GaAs and InP materials. (111)B GaAs growth rate appears to be drastically enhanced at low V/III ratio, which has been applied to grow selective GaAs patterns limited by vertical sidewalls. Concerning InP, high growth rates were obtained on all orientations. This was used to perfectly fill a rectangular groove by selective embedded InP growth.     

Modeling analysis of liquid encapsulated Czochralski growth of GaAs and InP crystals

The results of three‐dimensional unsteady modeling of melt turbulent convection with prediction of the crystallization front geometry in liquid encapsulated Czochralski growth of InP bulk crystals and vapor pressure controlled Czochralski growth of GaAs bulk crystals are presented. The three‐dimensional model is combined with axisymmetric calculations of heat and mass transfer in the entire furnace. A comprehensive numerical analysis using various two‐dimensional steady and three‐dimensional unsteady models is also performed to explore their possibilities in predicting the melt/crystal interface geometry. The results obtained with different numerical approaches are analyzed and compared with available experimental data. It has been found that three‐dimensional unsteady consideration of heat and mass transfer in the crystallization zone provides a good reproduction of the solidification front geometry for both GaAs and InP crystal growth.     

The Properties of Undoped InP and GaP Bulk Crystals Prepared by Floating Zone Melting

Undoped GaP and InP crystals which are produced by floating zone melting without a crucible were investigated. The background concentration was 10¹⁵cm⁻³ after several passages of the molten zone. The fundamental residual impurities are carbon and silicon penetrating into the crystals during the crystallization process. After purification, the electron mobility of GaP was 200 cm²/V. s, and for InP – 4000 cm²/Vs. The compensation decreased to 20%. A very effective purification was observed with respect to the carbon atoms, but for silicon this result is observed only after several passages of the molten zone. GaP and InP are basic materials for optoelectronic devices and it is important to investigate the possibility for production of pure bulk crystals. A proper method for this aim is the floating zone melting, where the crucible effect is removed and the influence of residual impurities is observed. In this work the influence of the number of floating zone passages on the electrical and luminescence properties of InP and GAP bulk crystals has been investigated.     

Effects of phosphorous beam equivalent pressure on GaInAsP/GaAs grown by solid source molecular beam epitaxy with a valve phosphorous cracker cell

We report the growth and characterization of GaInAsP films on GaAs substrates by solid source molecular beam epitaxy (SSMBE) using a valve phosphorous cracker cell at varied white phosphorous beam equivalent pressure (BEP). It is found that the GaInAsP/GaAs can be easily grown with the solid sources, and the incorporated phosphorous composition as a function of the beam equivalent pressure ratio, R=f_P/(f_P+f_As), can be well described by a parabolic relationship. With the increase of the incorporated phosphorous composition, the GaP-, InP-, InAs- and GaAs-like phonon modes shift towards opposite directions and their emission intensities also change. The first three modes shift to larger wave numbers while the last one shifts to smaller wave number. The lattice mismatch, Δa/a, of the materials grown with varied phosphorous BEP follows a linear relationship. Photoluminescence (PL) measurements reveal that as the phosphorous BEP ratio increases, the peak position or energy band gap of the material shifts towards higher energy; the full-width at half-maximum (FWHM) becomes narrower, and the luminescence intensity becomes higher. In addition, the materials also show smooth surfaces that do not change significantly with phosphorous beam equivalent pressure.     

Deposition of InP on GaAs Substrates in the InP/PCl3/H2 System

Vapour phase epitaxial layers of InP were deposited onto (111)A-, (111)B-, (001)-, and (110)-oriented GaAs substrates in the InP/PCl₃/H₂ system using a close-space technique. It is shown that the dependence of the layer quality on the substrate orientation is due to differences in the initial growth stages. Results on the growth rates and the electrical properties of the layers are reported.     

InP/GaP晶格失配界面的电特性

本文研究了InP/GaP晶格失配界面的电特性。HRTEM图象表明在界面存在90°位错缺陷的应变缓释。ECV表明界面存在高密度载流子层。AFM图象表明本研究中获得了粗糙度为2.48nm的良好InP异质外延层。并对于InP界面给出了一个基于费米能级钉扎的模型来解释观察到的电性质。     

LPE-growth of InP on GaAs

LPE growth of InP on GaAs is shown to be possible from indium or tin as a solvent, respectively. Only growth on (1 1 1 ) B faces yields acceptable smooth layers. From In/InP-melts layers with inclusions near the heterojunctions are obtained. No such microscopically small inclusions were observed in layers grown from Sn/InP-melts. – The grown layers were characterized by means of etching and electron beam microprobe analysis.     

Se-doped AlGaAs grown on GaAs(111)A by molecular beam epitaxy

The electrical properties of Se-doped Al_0.3Ga_0.7As layers grown by molecular beam epitaxy (MBE) on GaAs(111)A substrates have been investigated by Hall-effect and deep level transient spectroscopy (DLTS) measurements. In Se-doped GaAs layers, the carrier concentration depends on the misorientation angle of the substrates; it decreases drastically on the exact (111)A surface due to the re-evaporation of Se atoms. By contrast, in Se-doped AlGaAs layers, the decrease is not observed even on exact oriented (111)A. This is caused by the suppression of the re-evaporation of Se atoms, by Se---Al bonds formed during the Se-doped AlGaAs growth. An AlGaAs/GaAs high electron mobility transistor (HEMT) structure has been grown. The Hall mobility of the sample on a (111)A 5° off substrate is 5.9×10⁴ cm²/V·s at 77 K. This result shows that using Se as the n-type dopant is effective in fabricating devices on GaAs(111)A.