Control of acceptor doping in MOCVD HgCdTe epilayers

The acceptor doping of mercury cadmium telluride (HgCdTe) layers grown by MOCVD are investigated. (111)HgCdTe layers were grown on (100)GaAs substrates at 350°C using horizontal reactor and interdiffused multilayer process (IMP). TDMAAs and AsH3 were alternatively used as effective p-type doping precursors. Incorporation and activation rates of arsenic have been studied. Over a wide range of Hg_1−xCd_xTe compositions (0.17 < x < 0.4), arsenic doping concentration in the range from 5×10¹⁵ cm⁻³ to 5×10¹⁷ cm⁻³ was obtained without postgrowth annealing. The electrical and chemical properties of epitaxial layers are specified by measurements of SIMS profiles, Hall effect and minority carrier lifetimes. It is confirmed that the Auger-7 mechanism has decisive influence on carrier lifetime in p-type HgCdTe epilayers.     

Electrical properties of tellurium clusters on the void sublattice of an opal crystal: The important role played by the Te-SiO2 interface

The temperature dependences of electrical resistivity and of the Hall effect of nanocluster tellurium crystals obtained by filling the voids in a dielectric (opal) matrix with a melt of pure and doped Te were studied. The Hall hole concentration p _eff was found to increase anomalously (by more than two orders of magnitude) in a sample prepared from pure Te and cooled to helium temperatures. At T=1.45 K, the hole concentration in this sample was p _eff?6×10¹⁷ cm^?3. At the same time, the Hall effect in this sample was observed to reverse sign at T?200 K from positive for T<200 K to negative at higher temperatures. This implies a low impurity concentration (N _A is less than at least 10¹⁵ cm^?3). A nanocluster crystal of doped Te does not exhibit this anomaly; here, we have p _eff?6×10¹⁷ cm^?3 throughout the temperature region covered, as in the original Te. These features are assigned to the formation of a two-dimensional conducting accumulation layer near the Te-amorphous SiO₂ (the opal material) interface at low temperatures; such a layer determines the low-temperature properties of nanocluster crystals prepared from pure Te. Actually, we obtained a model of a three-dimensional structure formed from a two-dimensional film.     

Solubility and point defect-dopant interactions in GaAs —I: Tellurium doping

The point defect model described in the companion paper is used to construct solubility relations, predict the effects of heat treatment and account for the large lattice dilations in tellurium doped GaAs.The complexing of Te donors with gallium vacancies is shown to be very important and can be used to explain electrical compensation, the formation of interstitial dislocation loops and the “superdilation” of n⁺ material.     

Lattice site location and electronic structure of Te in GaAs

High purity <100> wafers of GaAs were implanted with radioactive^129mTe and stable¹²⁸Te at 110 keV to total doses of 2×10¹⁴ and 2×10¹⁵ Te/cm² respectively and studied with RBS/ channeling and Mössbauer spectroscopy on the 27.8 keV level of¹²⁹I. After implantation and/or annealing at temperatures between 200–300°C the Mössbauer spectra are dominated by a single line. Channeling reveals an appreciable residual damage in the host lattice, but also points to a substitutional position of the Te atoms. After annealing above ≌500°C, where nearly complete lattice damage recovery is obtained, the Te atoms become defect-associated. The results clearly point to the formation of Te_As?V_Ga complexes.     

Tellurium delta‐doped InGaP layers grown by metalorganic vapour phase epitaxy

Heavily n‐type doped and several nanometres thick In_0.485Ga_0.515P layers are necessary for various devices. We studied the delta‐doping of this ternary with tellurium; the layers were grown by metalorganic vapour phase epitaxy (MOVPE), and diethyltelluride was used as the precursor. A maximum Hall sheet concentration of 2.75 × 10¹³ cm^–2 was achieved in our samples grown at 560 °C. The Te profiles were analyzed with secondary ion mass spectrometry (SIMS), and a very narrow spectrum with a full width at half maximum of 7.5 nm was measured. This value indicates that the memory effect, referred to in the literature, was practically eliminated with appropriate growth conditions. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

CW CO2-laser annealing of arsenic implanted silicon

CW CO₂-laser annealing of arsenic implanted silicon was investigated in comparison with thermal annealing. Ion channeling, ellipsometry, and Hall effect measurements were performed to characterize the annealed layers and a correlation among the different methods was made. The laser annealing was done with power densities of 100 to 640 W cm⁻² for 1 to 20 s. It was found that the lattice disorder produced during implantation can be completely annealed out by laser annealing with a power density of 500 W cm⁻² and the arsenic atoms are brought on lattice sites up to 96±2%. The maximum sheet carrier concentration of 6×10¹⁵ cm⁻² was obtained for 1×10¹⁶ cm⁻² implantation after laser annealing, which was up to 33% higher than that after thermal annealing at 600 to 900°C for 30 min.     

Type III - Type I transition and strain-effect in Hg1−xCdxTeCdTe and Hg1−xZnxTeCdTe superlattices

In this paper, the results of Hg_1−xZn_xTeCdTe strained layer superlattices grown by MBE are reported, and compared to Hg_1−xCd_xTeCdTe superlattices. Both Type III and Type I Hg_1−xZn_xTeCdTe superlattices with different strain have been grown on CdTe(111)B/GaAs(100) and CdTe(100)/GaAs(100) substrates and characterized by electron, X-ray diffraction, infrared transmission and Hall measurements. The values of hole mobility between 5×10³ up to 2×10⁴cm²v⁻¹s⁻¹ at T = 23K along (111)B growth orientation and up to 4.9×10⁴cm²v⁻¹s⁻¹ at T = 5K along (100) growth orientation are obtained for Type III superlattices whereas in Type I superlattices, the hole mobility is between 200–300cm²v⁻¹s⁻¹. This drastic change in the hole mobility between Type III and Type I superlattices along with the role of the strain are discussed in this paper.     

Role of beryllium doping in strain changes in II-type InAs/GaSb superlattice investigated by high resolution X-ray diffraction method

We have studied the influence of the beryllium doping on strain in the II-type InAs/GaSb superlattices (SLs) by means of high-resolution X-ray diffraction (HRXRD). Three analyzed superlattices were grown by molecular beam epitaxy. One of the examined superlattices was undoped. Two others structures, called doped SLs, composed of two superlattices: Be-doped and undoped which were grown one on the top of each other. The doping concentration was determined by secondary ion mass spectroscopy. The doping level was 1×10¹⁷ cm^?3 and 2×10¹⁹ cm^?3. For doped superlattices, the HRXRD measurements showed splitting of satellite (ST) peaks. Furthermore, the separation of ST peaks increase with doping level. In contrast, for undoped superlattice, the splitting of the ST peaks was not observed. Sometimes the separation of ST peaks can be caused by change of thickness period of superlattice or partial relaxation of the structure. However, we claim that in our experiment the splitting is caused by another mechanism: The presence of Be atoms in SL causes the change of average lattice constant of the superlattice. The influence of Be dopant on lattice parameter of superlattice was confirmed by theoretical simulations. Furthermore, the change of the lattice constant (Δa/a) of the GaSb:Be buffer was examined. The reduction of lattice parameter of GaSb was noticed. It was caused by the presence of Be doping and unintentionally incorporated As-atoms in the GaSb layer. It is very important to know that even very small Be concentration (1×10¹⁷ cm^?3) causes the change of average lattice parameter of SL.     

Characterization of GaN/AlGaN epitaxial layers grown by metalorganic chemical vapour deposition for high electron mobility transistor applications

GaN and AlGaN epitaxial layers are grown by a metalorganic chemical vapour deposition (MOCVD) system. The crystalline quality of these epitaxially grown layers is studied by different characterization techniques. PL measurements indicate band edge emission peak at 363.8 nm and 312 nm for GaN and AlGaN layers respectively. High resolution XRD (HRXRD) peaks show FWHM of 272 and 296 arcsec for the (0 0 0 2) plane of GaN and GaN in GaN/AlGaN respectively. For GaN buffer layer, the Hall mobility is 346 cm²/V-s and carrier concentration is 4.5 × 10¹⁶/cm³. AFM studies on GaN buffer layer show a dislocation density of 2 × 10⁸/cm² by wet etching in hot phosphoric acid. The refractive indices of GaN buffer layer on sapphire at 633 nm are 2.3544 and 2.1515 for TE and TM modes respectively.     

Concentration dependence of the solid-phase epitaxial growth rate in Te implanted Si

The growth rate during solid-phase epitaxy of Te implanted (100) silicon has been measured at 520°C as a function of the Te concentration in the range of 4×10¹⁹–10²¹ atoms/cm³. With increasing concentration the velocity decreases from about 50 Å/min to about 1 Å/min and it equals the value corresponding to undoped amorphous Si at 7×10¹⁹ atoms/cm³. This result and previous date on B, P, As, O, and C implantation, imply that the growth rate reaches a maximum value in a broad range of concentration close to the solid solubility limit of the considered dopant.     

Diffusion studies of Be-implanted GaAs by SIMS and electrical profiling

Secondary ion mass spectrometry (SIMS) has been used with differential resistivity and Hall effect measurements to study the 900°C diffusion of implanted Be in GaAs. Some outdiffusion of Be into the Si₃N₄ encapsulant occurs for surface Be concentrations above 1 × 10¹⁸cm^?3. However, excellent agreement between the electrical and atomic profiles indicates that 85–100% of the Be remaining after annealing is electrically active. The concentration-dependent diffusion observed for implanted Be in GaAs was not significantly altered in experiments using hot substrate implants, two-step anneals, or annealing with Ga and As overpressure.     

Investigations on the effect of argon ion bombardment on the structural and optical properties of crystalline gallium antimonide

The effects of bombardment of 250 keV argon ions in n-type GaSb at fluences 2×10¹⁵ and 5×10¹⁵ ions cm^?2 were investigated by high-resolution X-ray diffraction (HRXRD), Fourier transform infrared (FTIR) and scanning electron microscopy (SEM). HRXRD studies revealed the presence of radiation-damaged layer (strained) peak in addition to the substrate peak. The variation in the lattice constant indicates the strain in the bombarded region. The out-of-plane (?_⊥) and in-plane strains (?_|) determined from the profiles of several symmetric and asymmetric Bragg reflections, respectively, were found to change with the ion fluence. Simulations of XRD patterns using dynamical theory of X-ray scattering (single-layer model) for the damaged layer yielded good fits to the recorded profiles. FTIR transmission studies showed that the optical density (α·d) of GaSb bombarded with different fluences increases near the band edge with increase in ion fluence, indicating the increase in the defect concentration. The density of the defects in the samples bombarded with different fluences was in the range of 3.20×10²¹–3.80×10²¹ cm^?3. The tailing energy estimated from the transmission spectra was found to change from 12.0 to 58.0 meV with increasing ion fluences, indicating the decrease of crystallinity at higher fluences. SEM micrographs showed the swelling of the bombarded surface of about 0.33 μm for the fluence of 2×10¹⁵ ions cm^?2, which increased to 0.57 μm for the fluence of 5×10¹⁵ ions cm^?2.     

CdS/CdTe薄膜太阳电池的深能级瞬态谱和光致发光研究

用深能级瞬态谱和光致发光研究了无背接触层的CdS/CdTe薄膜太阳电池的杂质分布和深能级中心.得到了净掺杂浓度在器件中的分布.确定了两个能级位置分别在E_V+0365 eV和E_V+0282 eV的深中心,它们的浓度分别为167×10¹² cm^-3和386×10¹¹ cm^-2,俘获截面分别为143×10^-14cm²和153×10^-16cm².它们来源于以化学杂质形式存在的Au和（或）Te_Cd^-复合体,或与氩氧气氛下沉积CdTe时的氧原子相关. 关键词： 深能级瞬态谱 光致发光 CdS/CdTe太阳电池     

Simulation of diffusion instability of a mercury atomic distribution in the cadmium-mercury-tellurium alloy

The formation of inhomogeneities in Cd_xHg_1-x Te alloys upon post-growth cooling or upon low-temperature annealing is simulated numerically. The mechanism of the formation of inhomogeneities is based on the diffusion instability in a system involving mercury atoms located at lattice sites, interstitial mercury atoms, and cation vacancies. It is revealed that, upon prolonged annealing of the Cd_xHg_1-x Te alloys with a cadmium content x = 0.2 at a temperature of ∼200°C, the concentrations of mercury atoms at lattice sites, interstitial mercury atoms, and vacancies are characterized by an inhomogeneous nearly periodical distribution arising from a small fluctuation when the initial equilibrium concentration of interstitial mercury atoms exceeds a threshold value (∼3 × 10¹⁷ cm⁻³). The spatial and time scales of the concentration distribution are determined primarily by the equilibrium concentration of vacancies and do not depend on the type of fluctuation involved. The spatial period of the concentration distribution increases linearly from 0.01 to 3.00 μm as the equilibrium concentration of vacancies changes from 10¹⁹ to 10¹⁴ cm⁻³. At lower concentrations of vacancies, the periodic structure is formed for a considerably longer time.     

Leed,aes and photoemission measurements of epitaxially grown GaAs(001), (111)A and (1̄1̄1̄)B surfaces and their behaviour upon cs adsorption

Epitaxially grown GaAs(001), (111) and (1?1?1?) surfaces and their behaviour on Cs adsorption are studied by LEED, AES and photoemission. Upon heat treatment the clean GaAs(001) surface shows all the structures of the As-stabilized to the Ga-stabilized surface. By careful annealing it is also possible to obtain the As-stabilized surface from the Ga-stabilized surface, which must be due to the diffusion of As from the bulk to the surface. The As-stabilized surface can be recovered from the Ga-stabilized surface by treating the surface at 400°C in an AsH₃ atmosphere. The Cs coverage of all these surfaces is linear with the dosage and shows a sharp breakpoint at 5.3 × 10¹⁴ atoms cm^?2. The photoemission reaches a maximum precisely at the dosage of this break point for the GaAs(001) and GaAs(1?1?1?) surface, whereas for the GaAs(111) surface the maximum in the photoemission is reached at a higher dosage of 6.5 × 10¹⁴ atoms cm^?2. The maximum photoemission from all surfaces is in the order of 50μA Im^?1 for white light (T = 2850 K). LEED measurements show that Cs adsorbs as an amorphous layer on these surfaces at room temperature. Heat treatment of the Cs-activated GaAs (001) surface shows a stability region of 4.7 × 10¹⁴ atoms cm^?2 at 260dgC and one of 2.7 × 10¹⁴ atoms cm^?2 at 340°C without any ordering of the Cs atoms. Heat treatment of the Cs-activated GaAs(111) crystal shows a gradual desorption of Cs up to a coverage of 1 × 10¹⁴ atoms cm^?2, which is stable at 360°C and where LEED shows the formation of the GaAs(111) (√7 × √7)Cs structure. Heat treatment of the Cs-activated GaAs(1?1?1?) crystal shows a stability region at 260°C with a coverage of 3.8 × 10¹⁴ atoms cm^?2 with ordering of the Cs atoms in a GaAs(1?1?1?) (4 × 4)Cs structure and at 340°C a further stability region with a coverage of 1 × 10¹⁴ at cm^?2 with the formation of a GaAs(1?1?1?) (√21 × √21)Cs structure. Possible models of the GaAs(1?1?1?) (4 × 4)Cs, GaAs(1?1?1?)(√21 × √21)Cs and GaAs(111) (√7 × √7)Cs structures are given.     

Modification of the properties of ferromagnetic layers based on A<Superscript>3</Superscript>B<Superscript>5</Superscript> compounds by pulsed laser annealing

Laser annealing experiments were performed in order to increase the concentration of electrically active manganese in the layers of A³B⁵: Mn semiconductors. An LPX-200 KrF excimer laser with a wavelength of 248 nm and a pulse duration of ~30 ns was used. It is shown experimentally that at a pulse energy of an excimer laser of >230 mJ/cm², the hole concentration in GaAs: Mn layers increases to 3 × 10²⁰ cm^–3. The negative magnetoresistance and the anomalous Hall effect with a hysteresis loop for annealed GaAs: Mn samples remain the same up to 80–100 K. Similar changes are observed for InAs: Mn layers as a result of laser annealing.     

硅的低温电学性质

本文在20°—300°K研究了室温载流子浓度2×10¹²—1×10²⁰cm^-3含硼或磷(砷)Si的电学性质。对一些p-Si样品用弱场横向磁阻法及杂质激活能法进行了补偿度的测定,并进行了比较。从霍尔系数与温度关系的分析指出,对于较纯样品,硼受主能级的电离能为0.045eV,磷施主能级为0.045eV,在载流子浓度为10¹⁸—10¹⁹cm^-3时发现了费米简并,对载流子浓度为2×10¹⁷—1×10¹⁸cm^-3的p-Si及5×10¹⁷—4×10¹⁸cm^-3的n-Si观察到了杂质电导行为。从霍尔系数与电导率计算了非本征的霍尔迁移率。在100°—300°K间,晶格散射迁移率μ满足关系式AT^-a,其中A=2.1×10⁹,α=2.7(对空穴);或A=1.2×10⁸,α=2.0(对电子)。另外,根据我们的材料(载流子浓度在5×10¹¹—5×10²⁰cm^-3间),分别建立了一条电阻率与载流子浓度及电阻率与迁移率的关系曲线,以提供制备材料时参考之用。     

Beam transport

Abstract

Dopant distribution, electrical activity and damage annealing of high-dose (～5 × 10¹⁵ cm²) Ga-implanted silicon samples annealed by conventional thermal annealing have been studied by alpha particle back-scattering, differential Hall effect and ellipsometry measurements. Back-scattering spectra show that there is no long tail of Ga atoms in the as-implanted samples. Upon annealing these samples the damaged amorphous layer recrystallizes at about 570°C by solid phase epitaxy. During the epitaxial regrowth the dopant atom distribution seems to be modified. Further, very high levels of electrical activaton of Ga-atoms (～3 × 10²⁰ cm^?3), much higher than the maximum solubility limit of Ga in Si (4.5 × 10¹⁹ cm^?3), is achieved by thermal annealing of the sample at ～570°C. This is comparable to the doping achieved by laser annealing of the Ga implanted Si. All the above three measurements show that there is residual damage in the high dose (?10¹⁵cm^?2) implanted samples after the recrystallization at about 570°C. This may be related to strain in the lattice at the high concentrations of metastable substitutional Ga atoms. Annealing at higher temperature reduces the electrical activity of Ga atoms, possibly by driving out the metastably high substitutional concentrations of Ga-atoms into electrically inactive clusters or precipitates.     

Formation of p-type layer by KrF excimer laser doping of carbon into GaAs in CH4 gas ambient

Carbon doping of GaAs using a KrF excimer laser to form a p-type active layer is described. Methane gas (CH₄) was used as a source of the C acceptor. Various quantities such as sheet resistance, surface carrier density, Hall mobility, and depth profile of C-doped GaAs are measured as the functions of laser fluence and laser pulse. It is shown that C atoms are doped only within a limited depth as shallow as 50 nm or less and with extremely high concentration exceeding 1×10²¹ cm^–3. The maximum activation efficiency is found to be 69.0%. Laser induced changes of surface morphologies and electron diffraction patterns are also discussed. Furthermore, non-alloyed ohmic contacts using laser-doped p-type GaAs are demonstrated.     

GaSb/GaAs复合应力缓冲层上自组装InAs量子点的生长

研究了GaSb/GaAs复合应力缓冲层上自组装生长的InAs量子点.在2ML GaSb/1ML GaAs复合应力缓冲层上获得了高密度的、沿［100］方向择优分布量子点.随着复合应力缓冲层中GaAs层厚度的不同,量子点的密度可以在1.2×10¹⁰cm^-2和8×10¹⁰cm^-2进行调控.适当增加GaAs层的厚度至5ML,量子点的发光波长红移了约25nm,室温下PL光谱波长接近1300nm. 关键词： 自组装量子点 分子束外延 Ⅲ-Ⅴ族化合物半导体