A route to continuous ultra-thin cerium oxide films on Cu(1 1 1)

The growth and morphology of ultra-thin CeO₂(1 1 1) films on a Cu(1 1 1) substrate were investigated by means of low energy electron diffraction (LEED) and scanning tunneling microscopy (STM). The films were grown by physical vapor deposition of cerium in an oxygen atmosphere at different sample temperatures. The preparation procedure is based on a modification of a previous method suggested by Matolin and co-workers [1], involving growth at elevated temperature (520 K). Here, LEED shows good long range ordering with a “(1.5 × 1.5)” superstructure, but STM reveals a three-dimensional growth mode (Vollmer-Weber) with formation of a closed film only at larger thickness. Using a kinetically limited growth process by reactive deposition at low sample temperatures (100 K) and subsequent annealing, we show that closed layers of ceria with atomically flat terraces can be prepared even in the regime of ultra-thin films (1.5 ML). Closed and atomically flat ceria films of larger thickness (3 ML) are obtained by applying a multistep preparation procedure, in which successive ceria layers are homoepitaxially grown on this initial film. The resulting overlayers show strong similarities with the morphology of CeO₂(1 1 1) single crystal surfaces, suggesting the possibility to model bulk ceria by thin film systems.     

Morphology and defect structure of the CeO2(1 1 1) films grown on Ru(0 0 0 1) as studied by scanning tunneling microscopy

The morphology of ceria films grown on a Ru(0 0 0 1) substrate was studied by scanning tunneling microscopy in combination with low-energy electron diffraction and Auger electron spectroscopy. The preparation conditions were determined for the growth of nm-thick, well-ordered CeO₂(1 1 1) films covering the entire surface. The recipe has been adopted from the one suggested by Mullins et al. [D.R. Mullins, P.V. Radulovic, S.H. Overbury, Surf. Sci. 429 (1999) 186] and modified in that significantly higher oxidation temperatures are required to form atomically flat terraces, up to 500 Å in width, with a low density of the point defects assigned to oxygen vacancies. The terraces often consist of several rotational domains. A circular shape of terraces suggest a large variety of undercoordinated sites at the step edges which preferentially nucleate gold particles deposited onto these films. The results show that reactivity studies over ceria and metal/ceria surfaces should be complemented with STM studies, which provide direct information on the film morphology and surface defects, which are usually considered as active sites for catalysis over ceria.     

Stoichiometry, contamination and microstructure of MnSb(0 0 0 1) surfaces

The stoichiometry, microstructure and surface composition of MnSb have been investigated using X-ray photoelectron spectroscopy, electron diffraction and microscopy. Epitaxially grown samples were exposed to ambient air for several weeks and methods for preparing clean, stoichiometric and smooth surfaces were investigated. Air-stored sample surfaces are chemically stratified but dominated by Mn oxides 4-5 nm thick. These oxides are difficult to remove by ion bombardment and annealing (IBA), but a brief etch in HCl removes them very efficiently. It leaves the surface Sb-rich, and clean, smooth and stoichiometric surfaces are then readily recovered by IBA. These surfaces exhibit a (2 × 2) surface reconstruction with atomically flat terraces. This reconstruction can be reversibly changed to a (1 × 1) by Sb deposition and annealing.     

Heteroepitaxial growth of gallium nitride on muscovite mica plates by pulsed laser deposition

We have grown GaN films on mica substrates using pulsed laser deposition for the first time and investigated their structural properties using electron beam and X-ray diffraction. We found that GaN (000-1) grows on mica (001) with an in-plane alignment of [11-20] GaN//[010] mica. Despite the large lattice mismatch between GaN and mica, 6 and 43% along the [100] mica and [010] mica directions, respectively, cubic GaN phase or 30° rotated domains are scarcely observed in the film. This phenomenon can be attributed to the enhanced surface migration of film precursors due to the large atomically flat terraces and the weak Van der Waals bonding on the mica surface.     

Normal incidence X-ray standing wave analysis of thin gold films

Normal incidence X-ray standing wave (NIXSW) analysis has been successfully performed on epitaxial gold films on mica substrates using reflection from the (1 1 1) planes parallel to the surface. We show that NIXSW can be used to monitor the decrease in order within the gold film caused by annealing, and the position of sulfur within a monolayer of methyl thiolate (CH₃S-) on the surface. The Au-S layer spacing was found to be 2.54 ± 0.05 Å, in close agreement with previous work on a single crystal system.     

Growth and morphology of the epitaxial Fe(1 1 0)/MgO(1 1 1)/Fe(1 1 0) Trilayers

Growth and surface morphology of epitaxial Fe(1 1 0)/MgO(1 1 1)/Fe(1 1 0) trilayers constituting a magnetic tunnel junction were investigated by low-energy electron diffraction (LEED) and scanning tunneling microscopy (STM). STM reveals a grain-like growth mode of MgO on Fe(1 1 0) resulting in dense MgO(1 1 1) films at room temperature as well as at 250 °C. As observed by STM, initial deposition of MgO leads to a partial oxidation of the Fe(1 1 0) surface which is confirmed by Auger electron spectroscopy. The top Fe layer deposited on MgO(1 1 1) at room temperature is relatively rough consisting of clusters which can be transformed by annealing to an atomically flat epitaxial Fe(1 1 0) film.     

Vanadium nanoclusters on Si(1 1 1) 7 × 7 surface studied by scanning tunneling microscopy

The size distribution and shape transition of self-assembled vanadium silicide clusters on Si(1 1 1) 7 × 7 have been investigated by scanning tunneling microscopy. Nanoclusters were formed by submonolayer vanadium deposition at room temperature followed by subsequent annealing (solid phase epitaxy - SPE). At room temperature, initially V-nanoclusters are formed which occupy sites avoiding the corner hole parts of the unit cells in the Si(1 1 1) 7 × 7 surface. Upon annealing, strong metal-silicon reaction occur leading to the formation of vanadium silicide nanoclusters. As a function of temperature, both, flat (2D) and three dimensional (3D) clusters have been obtained. After annealing at temperatures around 900 K many faceted clusters are created, whereas at higher annealing temperature, around 1300 K, predominantly 3D clusters are formed. The size distribution of SPE grown clusters could be well controlled in the range of 3-10 nm. The cluster size depends on the annealing temperature as well as on the initial vanadium coverage. Based on high resolution STM images a structure model for one kind of vanadium disilicide clusters exposing atomically flat surfaces was proposed.     

Surface termination of the NdGaO3(1 1 0)

Auger electron spectroscopy using excitation via grazing impact of protons was applied to determine the elemental composition of the topmost and near-surface layers of a NdGaO₃(1 1 0) substrate. The preparation conditions of vicinal NdGaO₃ substrates were optimized by varying the annealing temperature, time, and gas atmosphere. Well prepared surfaces show regularly arranged, atomically smooth terraces with single-atomic steps. The surfaces were always NdO terminated with a small amount of Ga (2-4%) atoms on the surface. A Ga and O depletion layer with a thickness of about 4 nm has been detected at optimized preparation conditions.     

Controlling molecular orientation of OMBE grown 6P thin films on mica(0 0 1)

The growth of para-sexiphenyl thin films by organic molecular beam epitaxy (OMBE) on mica(0 0 1) was investigated. The morphology of the films was qualitatively and quantitatively analyzed by atomic-force microscopy. Synchrotron radiation was used in order to extract information about orientation of the individual molecules with respect to the substrate. Controlling the growth environment inside the growth chamber allowed to reproduce one-dimensional film morphologies with partially oriented crystallite chains usually obtained by hot wall epitaxy (HWE). Following a dedicated pregrowth procedure results in terraces of upright standing molecules so far not obtained. Phase imaging was used to clearly distinguish film and substrate.     

Flattening of micro-structured Si surfaces by hydrogen annealing

We report atomic scale flattening of surfaces of microstructures formed on Si wafers by furnace annealing. To avoid thermal deformation of the fabricated structures, advantage was taken of hydrogen annealing, which enables us to decrease the relaxation rate of Si surfaces due to surface hydrogenation. We examined cross-sectional shape and sidewall morphology of 3 μm deep trenches on Si(0 0 1) substrates after annealing at 1000 °C under various H₂ pressures of 40-760 Torr. We successfully formed Si trenches with flat surfaces composed of terraces and steps while preserving the designed trench profile by increasing H₂ pressure to 760 Torr.     

Temperature- and coverage-dependent evolution of the Au/Pd(1 1 0) surface structure

The morphology and the atomic scale structure of thin gold films (up to 2.5 ML) on Pd(1 1 0) were studied by means of scanning tunneling microscopy and surface X-ray diffraction. At room temperature the films exhibit a multilayer growth mode accompanied by the formation of highly anisotropic islands. Annealing above 500 K significantly increases the smoothness of the gold films, which are in registry with the substrate. Above a critical threshold of two monolayers a (1 × 2) missing-row reconstructed film is found. This reconstructed surface is well ordered after annealing at temperatures above 580 K. The specific gold film morphology is envisaged as a way to relax the strain caused by the mismatch between gold and palladium.     

Growth of atomically flat ultra-thin Ag films on Si surfaces

A two-step growth with deposition at low temperature and subsequent slow annealing to room temperature (RT) has been widely used to obtain atomically flat metal thin films on semiconductor substrates. In the case of Ag films, almost atomically flat films were obtained at a thickness of six monolayers (ML) on Si and GaAs. The flatness then gradually degraded with an increase in thickness. The existence of the critical thickness has been well explained by the “electronic growth theory”, which considers thickness-dependent change of vertically quantized electrons and their spilling out at the interfaces. However, several questions remain unanswered. How does the electronically grown Ag flat film accommodate the large misfit energy between the film and substrate? Up to what deposition temperature is the two-step growth effective to obtain atomically flat films? In this article, we review previous studies on the electronic growth of Ag films on Si(1 1 1) substrates, paying special attention to these two points. In addition, we also discuss the possibility of engineering electronic growth for artificial control of the critical thickness.     

Nano-structures in YSZ(1 0 0) surfaces: Implications for metal deposition experiments

The surface morphology of yttria stabilized zirconia (YSZ)(1 0 0) single crystals are examined by AFM and XPS before and after thermal annealing in air to 1000 °C. The surfaces show a large variability in topography which can be categorized in three types: (1) surfaces with well defined terraces, (2) surfaces with etch pits and no visible terraces, (3) surfaces with large square or rectangular holes with flat bottoms. All three types of surfaces show a large number of defects (pits, adatoms, steps) originating from the manufacturing process, and certain samples show large nano-structured arrays of self-organized lines at step edges. The evolution of the surfaces with time at 1000 °C and with higher temperatures was studied. Terraces are ultimately obtained for all sample types at 1300 °C, but the terrace shape is affected by the original defect structure. This history dependence is attributed to defect interactions modifying the annealing process. This is true even for UHV samples prepared using sputter-anneal cycles. The surface type is found to affect the nucleation, growth and sintering behaviour of palladium deposited by electron beam evaporation. For type 3 samples the metal nucleates at step edges outside the holes to particles 6 Å in height, following heating to 135 °C the particles move inside the holes forming agglomerates up to 20 Å.     

Nanoscale dislocation patterning in Bi(1 1 1)/Si(0 0 1) heteroepitaxy

Continuous, atomically flat, and epitaxial Bi(1 1 1) films could be grown on Si(0 0 1). The inherent strain of 2.3% between the Bi(1 1 1) and Si(0 0 1) lattices is relieved by the formation of a grating like one-dimensional misfit dislocation array at the heterointerface. The lattice distortions around each dislocation give rise to a pronounced height depression Δh = 0.12 nm of the surface, which results in a spot splitting in low-energy electron diffraction and a height contrast in scanning tunneling microscopy (STM). Using STM surface profiles across these depressions, the Burgers vector of the underlying isolated non-interacting dislocations is estimated to be 0.377 nm. For thicker Bi films the ordering of the dislocation network is increased. This reflects an increase of repulsive interaction between neighboring dislocations.     

Electron and lattice structure of ultra thin Ag films on Si(1 1 1) and Si(0 0 1)

We studied the low temperature (T ? 130 K) growth of Ag on Si(0 0 1) and Si(1 1 1) flat surfaces prepared by Si homo epitaxy with the aim to achieve thin metallic films. The band structure and morphology of the Ag overlayers have been investigated by means of XPS, UPS, LEED, STM and STS. Surprisingly a (√3 × √3)R30° LEED structure for Ag films has been observed after deposition of 2-6 ML Ag onto a Si(1 1 1)(√3 × √3)R30°Ag surface at low temperatures. XPS investigations showed that these films are solid, and UPS measurements indicate that they are metallic. However, after closer STM studies we found that these films consists of sharp Ag islands and (√3 × √3)R30°Ag flat terraces in between. On Si(0 0 1) the low-temperature deposition yields an epitaxial growth of Ag on clean Si(0 0 1)-2 × 1 with a twinned Ag(1 1 1) structure at coverage’s as low as 10 ML. Furthermore the conductivity of few monolayer Ag films on Si(1 0 0) surfaces has been studied as a function of temperature (40-300 K).     

Preferred orientations in nano-gold/silica/silicon interfaces

Gold in contact with silicon substrates Si(1 0 0), Si(1 1 1), and SiO₂ is studied by thermal evaporation and annealing in N₂ using the modified sphere-plate technique. The final orientation distribution of crystalline Au films grown on Si substrate systems that incorporate a native amorphous oxide layer of silica and Au on amorphous silica (SiO₂ glass) substrates is influenced by preferred orientations and twinning. Experimental evidence suggests that the orientation of Au{1 1 1} close packed planes (multiply twinned) was found to be of low-energy as the annealing temperature was increased to 530 °C and 920 °C. Additional orientations were observed for Au{1 0 0} on Si(1 0 0) substrates and Au{1 0 0}, {1 1 0}, and {3 1 1} on SiO₂ substrates. After annealing at 920 °C the size distribution of the gold particles was determined to be within the range of 20-800 nm while the morphology of gold surface appears spherical to faceted in character. These results show similarities to recent findings for smaller nano-size 1D particles, islands and thin Au films on silicon annealed over lower temperature ranges.     

Epitaxial growth of uniform NiSi2 layers with atomically flat silicide/Si interface by solid-phase reaction in Ni-P/Si(1 0 0) systems

As metal-oxide-semiconductor field-effect transistor (MOSFET) devices are shrunk to the nanometer scale, flat shallow metal/Si electrical contacts must be formed in the source/drain region. This work demonstrates a method for the formation of epitaxial NiSi₂ layers by a solid-phase reaction in Ni-P(8 nm)/Si(1 0 0) samples. The results show that the sheet resistance remained low when the samples were annealed at temperatures from 400 to 700 °C. P atoms can be regarded as diffusion barriers against the supply of Ni to the Si substrate, which caused the formation of Si-rich silicide (NiSi₂) at low temperature. Furthermore, elemental P formed a stable capping layer with O, Ni and Si during the annealing process. A uniform NiSi₂ layer with an atomically flat interface was formed by annealing at 700 °C because of the formation of a Si-Ni-P-O capping layer and a reduction in the total interface area.     

Surface morphology of metal films deposited on mica at various temperatures observed by atomic force microscopy

Thin films of eight metals with a thickness of 150 nm were deposited on mica substrates by thermal evaporation at various temperatures in a high vacuum. The surface morphology of the metal films was observed by atomic force microscopy (AFM) and the images were characterized quantitatively by a roughness analysis and a bearing analysis (surface height analysis). The films of Au, Ag, Cu, and Al with the high melting points were prepared at homologous temperatures T/T_m = 0.22-0.32, 0.40, and 0.56. The films of In, Sn, Bi, and Pb with the low melting points were prepared at T/T_m = 0.55-0.70, where T and T_m are the absolute temperatures of the mica substrate and the melting point of the metal, respectively. The surface morphology of these metal films was studied based on a structure zone model. The film surfaces of Au, Ag, and Cu prepared at the low temperatures (T/T_m = 0.22-0.24) consist of small round grains with diameters of 30-60 nm and heights of 2-7 nm. The surface heights of these metal films distribute randomly around the surface height at 0 nm and the morphology is caused by self-shadowing during the deposition. The grain size becomes large due to surface diffusion of adatoms and the film surfaces have individual characteristic morphology and roughnesses as T increases. The surface of the Al film becomes very smooth as T increases and the atomically smooth surface is obtained at T/T_m = 0.56-0.67 (250-350 °C). On the other hand, the atomically smooth surface of the Au film is obtained at T/T_m = 0.56 (473 ± 3 °C). The films of In, Sn, Bi, and Pb prepared at T/T_m = 0.55-0.70 also show the individual characteristic surface morphology.     

Size-dependent electrical conduction of thin nickel films

The electrical resistivity of thin nickel films, thermally evaporated on freshly cleaved mica and smooth glass at 160 °C is studied. The measurements were taken in situ before and after annealing at 420 °C.The values of resistivity of thinner films are reduced by few orders of magnitude after annealing. A sharp reduction in the resistivity is noticed for films prepared on mica compared with those prepared on glass under the same conditions. The resistivity of films with thickness less than 200 Å on glass is irreversible with reduction, while on mica it is reversible. A tunnelling mechanism in the absence of Fuchs theory is adapted to explain the abrupt increase in resistivity of the island-films. The data recorded for thicker films was fitted to Fuchs theory withp=0.The authors would like to acknowledge Prof. Dr. K. R.Wassif for his kind cooperation and interest.     

Influence of Si substrate preparation on surface chemistry and morphology of L-CVD SnO2 thin films studied by XPS and AFM

Results of experimental studies of the influence of substrate preparation on the surface chemistry and surface morphology of the laser-assisted chemical vapour deposition (L-CVD) SnO₂ thin films are presented in this paper. The native Si(1 0 0) substrate cleaned by UHV thermal annealing (TA) as well as thermally oxidized Si(1 0 0) substrate cleaned by ion bombardment (IBA) have been used as the substrates. X-ray photoemission spectroscopy (XPS) has been used for the control of surface chemistry of the substrates as well as of deposited films. Atomic force microscopy (AFM) has been used to control the surface morphology of the L-CVD SnO₂ thin films deposited on differently prepared substrates. Our XPS shows that the L-CVD SnO₂ thin films deposited on thermally oxidized Si(1 0 0) substrate after cleaning with ion bombardment exhibit the same stoichiometry, i.e. ratio [O]/[Sn] = 1.30 as that of the layers deposited on Si(1 0 0) substrate previously cleaned by UHV prolonged heating. AFM shows that L-CVD SnO₂ thin films deposited on thermally oxidized Si(1 0 0) substrate after cleaning with ion bombardment exhibit evidently increasing rough surface topography with respect to roughness, grain size range and maximum grain height as the L-CVD SnO₂ thin films deposited on atomically clean Si substrate at the same surface chemistry (nonstoichiometry) reflect the higher substrate roughness after cleaning with ion bombardment.